MK22DX256VMC5 - 50MHz Cortex-M4 MCU, 256KB Flash | NXP
Артикул: MK22DX256VMC5 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $8.92 | $8,92 |
| 10 | $7.95 | $79,50 |
| 100 | $6.78 | $678,00 |
| 500 | $5.92 | $2.960,00 |
| 1.000 | $5.21 | $5.210,00 |
MK22DX256VMC5 Обзор
What is a Cortex-M4 microcontroller? An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core designed for embedded applications that require deterministic real-time response, low power consumption, and rich digital signal processing capability via single-precision FPU and DSP instructions. Within the broader taxonomy, the MK22DX256VMC5 belongs to the Kinetis family of general-purpose MCUs, which itself sits under NXP's LPC/Kinetis portfolio of ARM-based microcontrollers for industrial and IoT use cases. The K22 sub-family specifically targets applications that need low-power operation, processing efficiency, and moderate memory density with integrated USB.
Key features include a 50 MHz Cortex-M4 core with single-precision FPU and DSP extensions, 256 KB Flash, 32 KB SRAM, full-speed USB 2.0 device/host/OTG controller, multiple low-power modes with sub-µA RTC operation, a 16-bit SAR ADC, 12-bit DAC, programmable delay block, multiple timers (FTM, PIT, LPTMR, RTC), and a wide operating voltage range of 1.71 V to 3.6 V. Peripherals include I2C, UART, SPI, I2S, and an on-chip 1 kHz LPO oscillator.
The MK22DX256VMC5 uses a Cortex-M4 core with a 3-stage pipeline, hardware multiply/divide, and a single-precision FPU. Flash is organized in a 256K x 8 array with 16-byte minimum erase sector, supporting in-application programming. The device integrates an 8-channel DMA controller for offloading CPU transfers and a memory protection unit for reliable RTOS operation.
Typical applications include USB HID peripherals, USB-to-UART bridges, low-power sensor hubs, fitness wearables, point-of-sale terminals, building automation controllers, and battery-powered industrial sensors. The integrated full-speed USB with on-chip transceiver simplifies USB device designs without an external PHY.
When designing with the MK22DX256VMC5, ensure proper decoupling on all VDD pins (typically 100 nF + bulk capacitors) and follow NXP's recommended 121-MAPBGA routing escape. The full-speed USB pins D+ and D require 33 ohm series termination and a 1.5 kohm pull-up on D+ for full-speed device operation. For low-power RTC retention, VBAT must be supplied when VDD is removed.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Аналоги без доработки для MK22DX256VMC5 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MK22DX256VMC5R
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MK22DX256VMC7
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MK22DX128VMC5
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MK22DN512VMC5
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MK22FX512VMC5
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MK22DX256VMC5 Максимальные параметры и электрические характеристики
| Core Architecture | ARM Cortex-M4 with FPU and DSP |
| Maximum CPU Frequency | 50 MHz |
| Program Flash | 256 KB (256K x 8) |
| SRAM | 32 KB |
| Корпус | 121-MAPBGA (8x8 mm) |
| Напряжение питания | 1.71 V to 3.6 V |
| I/O Voltage Rails | 1.8 V / 2.5 V / 3.3 V |
| USB Controller | USB 2.0 Full-Speed Device/Host/OTG with on-chip PHY |
| ADC | 16-bit SAR ADC |
| DAC | 12-bit DAC |
| Рабочая температура | -40C to +105C |
| DMA Channels | 8 channels |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
| Уровень MSL | 3 (168 hours) |
Руководство по цоколевке MK22DX256VMC5 в корпусе 121-mapbga (8x8 mm)
Цоколевка для MK22DX256VMC5 (корпус 121-mapbga (8x8 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для MK22DX256VMC5.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MK22DX256VMC5 подходит для 6 применениеs: USB HID Peripheral Devices, USB-to-UART Bridge Module, Low-Power Industrial Sensor Hub, Building Automation Controller, Point-of-Sale Terminal, Fitness Wearable Data Logger.
USB HID Peripheral Devices
The MK22DX256VMC5 fits USB HID applications because it integrates a USB 2.0 Full-Speed controller with on-chip transceiver, 50 MHz Cortex-M4 processing headroom, and 256 KB Flash to hold USB stacks plus application logic. Placed as the only MCU on the PCB with a USB connector, 33 ohm series termination, and 1.5 kohm pull-up on D+, the part eliminates the need for an external PHY. Compared to discrete USB controllers plus an 8-bit MCU, this part reduces BOM and PCB area while delivering 32 KB SRAM for HID report buffers.
Рекомендуется
USB-to-UART Bridge Module
For USB-to-UART bridges, the MK22DX256VMC5 provides integrated USB device controller plus three UART modules in a single chip. The 50 MHz Cortex-M4 easily handles USB CDC-ACM enumeration at Full-Speed and UART baud rates up to 1 Mbaud. With 256 KB Flash, manufacturers can include vendor-specific command sets and in-field DFU bootloaders without external memory. Compared to FTDI-style discrete bridges, this MCU enables firmware-customizable behavior at lower cost in moderate volumes.
Рекомендуется
Low-Power Industrial Sensor Hub
The MK22DX256VMC5 fits low-power sensor hubs because of its multiple low-power modes including VLLS0/1/3 with sub-µA RTC retention and VBAT domain backup. The 16-bit SAR ADC, 12-bit DAC, and multiple I2C/SPI instances allow direct connection to environmental sensors. With 32 KB SRAM, the part buffers sensor data while the Cortex-M4 sleeps between acquisitions. The 1.71-3.6 V supply range supports both 3.3 V and 1.8 V sensor rails without level shifters.
Рекомендуется
Building Automation Controller
For building automation, the MK22DX256VMC5 offers USB for commissioning, multiple UARTs for Modbus or KNX gateways, and 256 KB Flash to host application logic, wireless stacks, and OTA bootloaders. The 50 MHz core executes real-time control loops while DMA offloads peripheral transfers. The -40C to +105C industrial temperature range and integrated RTC with calendar function support unattended operation in basements, mechanical rooms, and outdoor enclosures.
Рекомендуется
Point-of-Sale Terminal
The MK22DX256VMC5 fits point-of-sale (POS) terminals because of its USB device port for PC tethering, multiple UART/SPI peripherals for barcode scanners and printers, and the 16-bit ADC for battery monitoring. The 50 MHz Cortex-M4 with FPU accelerates payment protocol parsing and LCD refresh tasks. The 256 KB Flash holds USB stack, application UI, and security primitives, while 32 KB SRAM supports display framebuffers and transaction buffers.
Рекомендуется
Fitness Wearable Data Logger
The MK22DX256VMC5 suits fitness wearables because of its low-power modes, 16-bit ADC for biometric sensor reading, integrated RTC for time-stamping, and 32 KB SRAM for sample buffering during sleep. The 50 MHz Cortex-M4 with DSP extensions handles real-time heart-rate and step-count algorithms. With 256 KB Flash, firmware can include proprietary algorithms and BLE-over-UART passthrough protocols without external storage. The VBAT domain enables RTC retention during battery swaps.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MK22DX256VMC5 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MK22DX256VMC5R | MK22DX256VMC7 | MK22DX128VMC5 | MK22DN512VMC5 | MK22FX512VMC5 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 121-MAPBGA (8x8 mm) | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same |
| Maximum CPU Frequency | 50 MHz | 50 MHz | 72 MHz | 50 MHz | 50 MHz | 120 MHz |
| Program Flash | 256 KB | 256 KB | 256 KB | 128 KB | 512 KB | 512 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 64 KB | 128 KB |
| USB Controller | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY | USB 2.0 FS/HS with on-chip PHY |
| Supply Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
| Core Architecture | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
Ключевые отличия
- Higher CPU speed grade option in same footprint (против MK22DX256VMC7)
- Larger memory variant for richer firmware (против MK22DN512VMC5)
- Pin-compatible cost-down variant (против MK22DX128VMC5)
Заметки по проектированию
The MK22DX256VMC5 has multiple VDD pins (VDD, VDDIO, VDDA) that each require a 100 nF decoupling capacitor placed as close to the pin as possible, plus a 4.7 uF bulk capacitor near the MCU. A separate 1 uF decoupling cap is recommended for VDDA to isolate analog reference noise from the digital supply. The VBAT pin powers the RTC domain and requires its own decoupling when battery backup is used.
The 121-MAPBGA package uses 0.5 mm ball pitch, which demands 4-layer PCB design with microvia or via-in-pad escape for reliable assembly. Per NXP hardware design guide, route high-speed USB differential pair (D+/D-) with 90 ohm differential impedance and length matching within 150 mil. Place the 33 ohm series termination resistors within 4 mm of the USB connector pins.
Do not skip the 1.5 kohm pull-up resistor on the USB D+ line, or the host will not detect the device at full-speed. Ensure the NMI pin has a defined state at reset - leaving it floating may cause unintended interrupts. The MAPBGA package is MSL3, so assembly must occur within 168 hours of opening the dry-pack bag, or rebaking is required per JEDEC J-STD-033.
Информация о соответствии
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - this part targets industrial and consumer applications, not automotive. MAPBGA package is MSL3 per JEDEC J-STD-033.