MPC8349EVVAJFB - PowerQUICC II Pro 533MHz e300 MPU | NXP
N.º da peça: MPC8349EVVAJFB ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $85.5 | $85,50 |
| 10 | $78.2 | $782,00 |
| 100 | $68.4 | $6.840,00 |
| 250 | $61.75 | $15.437,50 |
| 500 | $56.9 | $28.450,00 |
MPC8349EVVAJFB Visão geral
An integrated communications processor (often abbreviated as comms processor or SoC MPU) is a high-integration system-on-chip that combines a CPU core, memory controller, and multiple communications peripherals (Ethernet MAC, PCI, USB, UART, I2C, SPI) on a single die. In the broader taxonomy, the MPC8349E sits at the intersection of microprocessor (MPU), network processor, and embedded SoC: MPU -> communications processor -> PowerQUICC family -> PowerQUICC II Pro -> MPC83xx series -> integrated SoC. This consolidation lets a single chip replace a CPU plus a separate Ethernet controller, security accelerator, and bus bridge.
Key features of the MPC8349EVVAJFB include a 533 MHz e300 core with 32 KB L1 instruction cache and 32 KB L1 data cache, hardware cryptography (SEC 2.0) with random number generator, dual 10/100/1000 Mb Ethernet MACs, two PCI interfaces (one 32-bit/66 MHz, one 32-bit/33 MHz), DDR1/DDR2 SDRAM controller up to 266 MHz, USB 2.0 full/low speed interface, two DUART ports, I2C, SPI, and a local bus controller. The 672-LBGA package is supplied in a tray and operates from 0C to 105C junction temperature with core voltages around 1.14V to 1.26V (per published specifications). It is RoHS compliant and uses a lead-free terminal finish.
Architecturally, the e300 core is a superset of the classic PowerPC 603e with deeper pipelining and improved MMU, while the system interface unit (SIU) and communications engine handle the IO and memory fabric. The integrated SEC 2.0 off-loads bulk cryptography (DES, 3DES, AES, SHA, MD5, RSA) at line rate, which is critical for VPN, SSL/TLS, and IPsec gateways. DDR1/DDR2 support up to 266 MHz data rate allows memory subsystems sized to multi-megabyte packet buffers.
Typical applications include industrial routers and secure gateways, DSLAM and PON line cards, networked printers and multifunction controllers, industrial automation controllers with Ethernet connectivity, IPsec/SSL VPN concentrators, and embedded networking appliances requiring integrated cryptography. The 533 MHz speed grade and dual GbE make it suitable for line-rate VPN termination at modest packet sizes. A specific design consideration is thermal management at high activity; the TBGA-672 package exposes a thermal pad that must be soldered to a sufficient copper pour (typically four-layer PCB with thermal vias) to keep junction temperature inside the 0C-105C operating range.
Alternativas drop-in para MPC8349EVVAJFB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8349EVVAJFB (mesmo formato e footprint) — diferindo em Ethernet, Memory Controller, Operating Temperature, USB, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8349ECVVAJFB
✅ Drop-In✓ Em estoque
$52.4 / unidade
Ver ficha técnica →MPC8347EVVAJFB
✅ Drop-In✓ Em estoque
$51.8 / unidade
Ver ficha técnica →MPC8347VVAJDB
✅ Drop-In✓ Em estoque
$58.95 / unidade
Ver ficha técnica →MPC8345EVVAJF
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8343EVVAJF
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8349EVVAJFB Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II Pro (MPC83xx) |
| Core Processor | PowerPC e300 |
| Core Architecture | 32-bit PowerPC |
| Number of Cores | 1 |
| Core Frequency | 533 MHz |
| L1 Cache (Instruction) | 32 KB |
| L1 Cache (Data) | 32 KB |
| Temperatura de operação | 0C to 105C (TA) |
| Core Voltage Range | 1.14 V to 1.26 V |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| Encapsulamento / Caixa | 672-LBGA (TBGA, 35x35 mm) |
| Tipo de montagem | Surface Mount |
| Supplier Device Package | 672-LBGA (35x35) |
| Ethernet | 1x 10/100/1000 MbE MAC |
| PCI | 2x PCI (one 32-bit/66 MHz, one 32-bit/33 MHz) |
| Memory Controller | DDR1 / DDR2 up to 266 MHz |
| USB | USB 2.0 full/low speed |
| Security Engine | SEC 2.0 with RNG (DES/3DES/AES/SHA/MD5/RSA) |
| Additional Interfaces | DUART, I2C, SPI, Local Bus |
| Lead-Free / RoHS | Lead-free, RoHS compliant |
| Packaging | Tray |
Guia de Configuração de Pinos do MPC8349EVVAJFB 672-lbga (35x35)
Configuração de pinos para MPC8349EVVAJFB (pacote 672-lbga (35x35)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8349EVVAJFB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8349EVVAJFB é adequado para 6 aplicaçãos: Industrial Secure Router / VPN Gateway, DSLAM / PON Line Card Controller, Networked Multifunction Printer Controller, Industrial Automation Controller with Ethernet, IPsec / SSL VPN Concentrator, Embedded Networking Appliance (Linux-based).
Industrial Secure Router / VPN Gateway
The MPC8349EVVAJFB fits industrial secure routers because its integrated SEC 2.0 engine performs DES/3DES/AES/SHA/RSA at line rate, off-loading IPsec and SSL/TLS from the 533 MHz e300 core. The single GbE MAC and dual PCI allow a WAN uplink plus expansion cards for cellular or fiber modems. Compared with a discrete CPU plus external crypto chip, this SoC cuts BOM and board area while keeping thermal rise manageable in a sealed enclosure.
Recomendado
DSLAM / PON Line Card Controller
The MPC8349EVVAJFB's DDR1/DDR2 controller up to 266 MHz, dual PCI (one 66 MHz, one 33 MHz), and GbE MAC suit DSLAM or PON line-card designs that need a fast host CPU plus high-throughput interconnect to PHY ASICs. The e300 core at 533 MHz handles ATM/Ethernet segmentation, IGMP, and queue management, while the second PCI can host a downstream switch fabric. The 672-TBGA 35x35 mm footprint allows dense line-card layouts.
Recomendado
Networked Multifunction Printer Controller
In networked printers and MFPs, the MPC8349EVVAJFB provides the embedded host CPU plus GbE networking and USB 2.0 for direct-print and scan-to-host. The local bus controller connects NAND/NOR flash and the engine ASIC, while DUART and I2C drive the operator panel. Hardware SEC 2.0 secures the embedded web admin interface. The 0C-105C range covers office environments without needing industrial-grade parts.
Recomendado
Industrial Automation Controller with Ethernet
Industrial automation controllers benefit from the MPC8349EVVAJFB's deterministic PCI bus for motion or IO cards, plus GbE for plant-network connectivity. The e300 core runs Linux or VxWorks for soft-PLC and HMI workloads. DDR1/DDR2 with ECC ensures reliable operation in electrically noisy factory environments. Designers should heatsink the TBGA-672 properly to keep junction temperature below 105C in sealed cabinets.
Recomendado
IPsec / SSL VPN Concentrator
The MPC8349EVVAJFB's SEC 2.0 engine performs bulk IPsec ESP and SSL/TLS record processing at multi-hundred-Mbps line rates. Combined with the 533 MHz e300 core handling IKE key exchange and routing-table updates, the SoC can terminate dozens of VPN tunnels per device. The single GbE MAC faces the WAN; the second PCI hosts a crypto co-processor or additional Ethernet ports. This is the canonical target use case for the MPC8349E family.
Recomendado
Embedded Networking Appliance (Linux-based)
Embedded Linux networking appliances (firewalls, NAS, intrusion-detection sensors) leverage the MPC8349EVVAJFB's MMU-enabled e300 core, DDR1/DDR2 controller with ECC, and Gigabit Ethernet. The dual PCI allows expansion cards for wireless radios or RAID controllers. The local bus supports boot NOR flash plus status LEDs. Compared with x86 designs, this SoC draws far less power and produces less heat, simplifying fan-less enclosures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8349EVVAJFB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8349ECVVAJFB | MPC8347EVVAJFB | MPC8347VVAJDB | MPC8345EVVAJF | MPC8343EVVAJF |
|---|---|---|---|---|---|---|
| Package | 672-LBGA (35x35) | 672-LBGA (35x35) - same | 672-LBGA (35x35) - same | 672-LBGA (35x35) - same | 672-LBGA (35x35) - same | 672-LBGA (35x35) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Security Engine (SEC) | SEC 2.0 + RNG | SEC 2.0 + RNG | No | No | No | No |
| PCI | 2x PCI | 2x PCI | 2x PCI | 2x PCI | 2x PCI | 2x PCI |
| Memory Controller | DDR1/DDR2 up to 266 MHz | DDR1/DDR2 up to 266 MHz | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 |
| Operating Temperature | 0C to 105C | -40C to 105C (extended) | 0C to 105C | 0C to 105C | 0C to 105C | 0C to 105C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Integrated SEC 2.0 hardware crypto engine (vs MPC8347EVVAJFB)
- Extended temperature grade option available (vs MPC8349ECVVAJFB)
- Dual PCI interfaces (one 66 MHz, one 33 MHz) (vs MPC8345EVVAJF)
Notas de projeto
The 672-LBGA (35x35 mm) package relies on the die-attached thermal pad to conduct heat from the e300 core. Use a four-layer PCB with at least 1 oz copper on inner and outer layers and an array of thermal vias (0.3 mm pitch, 0.5 mm drill) directly under the package thermal pad. Estimated: at 533 MHz full activity with core voltage 1.2V and a typical application power dissipation of 4-5W, junction-to-ambient thermal resistance must stay below 20 C/W to keep Tj under 105C at 25C ambient. Without a thermal pad soldered to the copper pour, junction temperature can exceed limits within seconds.
Power-supply decoupling is critical for an e300 PowerPC core. Place a 1 uF ceramic decoupling capacitor within 5 mm of each VDD/VSS pair on the top layer, and add bulk 10 uF tantalum or polymer capacitors near the package. The 1.14-1.26 V core rail must ramp monotonically under the sequencing requirement described in the NXP datasheet; failure to meet sequencing can latch-up the part. Use a supervisory circuit or PMIC with proper power-good signalling.
Route DDR1/DDR2 signals as matched-length pairs with controlled impedance (50 ohm single-ended, 100 ohm differential for clocks). Keep trace lengths matched within +/- 25 mil for byte lanes to avoid setup/hold violations at 266 MHz. The MPC8349E reference design in the NXP hardware specifications manual shows a 6-layer stack-up; staying close to that stack-up simplifies timing closure. Do not route PCI or Ethernet signals across split ground planes.
Do not assume the boot ROM configuration pins map directly between MPC8349E and MPC8347E - the SEC 2.0 register base differs and a bootloader copy-pasted from an MPC8347 reference design will not initialize SEC. Use the U-Boot or BDI configuration file specific to the MPC8349E Rev 2 silicon. Also note the JTAG TRST pin must be pulled low per the IEEE 1149.1 specification; leaving it floating causes debug-session failures.
Informações de conformidade
RoHS compliant and lead-free per the NXP product page and third-party listings. Not AEC-Q100 qualified (this is an industrial/communications part, not an automotive grade). Halogen-free status not stated in the verified data.
