MPC8358ZQAGDDA - PowerQUICC II Pro 400MHz CPU | NXP | BGA-668
부품 번호: MPC8358ZQAGDDA ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $42 | $420.00 |
| 100 | $38.5 | $3,850.00 |
| 500 | $35 | $17,500.00 |
| 1,000 | $32 | $32,000.00 |
MPC8358ZQAGDDA 개요
A PowerQUICC processor is a system-on-chip that combines a PowerPC CPU with communications peripherals and a hardware acceleration engine; the PowerQUICC II Pro family (an MPC83xx derivative of the original PowerQUICC II) targets mid-range wired networking where the device must terminate DDR memory, perform DMA on packet data, and present industry-standard I/O such as PCI, USB, Ethernet MACs, TDM, and ATM interfaces on a single die.
Key features include the e300 core with MMU and hardware cache coherency, an integrated DDR1/DDR2 memory controller with ECC, dual 10/100/1000 Ethernet MACs (one RGMII plus one GMII), a 32-bit PCI interface (up to 66MHz), USB 2.0 full-speed PHY, and multi-channel TDM/ATM glue for legacy telecom interconnects. The QUICC Engine datapath offers hardware acceleration for PPP, HDLC, ATM AAL, Ethernet bridging, and policing; this lets an OEM run multi-megabit aggregate traffic at line rate without consuming CPU cycles.
The architecture pairs the e300 core with the QUICC Engine block, which executes time-critical protocol processing in dedicated microcode. The 400MHz core supplies the control plane for routing tables, management plane tasks, and QoS queuing while the QUICC Engine manages the data plane. The 668-PBGA-PGE package provides a thermal pad tied to a copper pour for heat removal, but typical router designs of this era dissipate only a few watts, allowing passive cooling.
Typical applications include small-to-medium enterprise routers, business gateways, xDSL IADs, SOHO security appliances, and Industrial Ethernet bridges. Pin-to-pin compatible part variants such as MPC8358EVRAGDDA and MPC8358CVRAGDDA target different operating envelopes or feature sets within the same board layout.
When designing with this device, allocate adequate copper area under the exposed pad and follow the NXP application note for DDR2 termination to meet SI margins; reference the MPC8360E reference board where possible to shorten design cycles and reuse the QUICC Engine firmware framework.
This page consolidates distributor pricing (as of 2026-10-17), MPC83xx family alternative candidates, and design notes that go beyond the manufacturer datasheet summary to support procurement and board-level decisions.
드롭인 대체품: MPC8358ZQAGDDA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8358ZQAGDDA (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Mounting Type, RoHS Status, Core Architecture, Ethernet.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8358EVRAGDDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8358CVRAGDDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8358VRAGDDA
✅ 드롭인✓ 재고 있음
$47.85 / 개
데이터시트 보기 →MPC8358EZUAGDDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8360EZUAGDDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8309CVMAGDCA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8358ZQAGDDA 최대 정격 & 전기적 특성
| Processor Type | PowerPC e300 Microprocessor IC (PowerQUICC II Pro) |
| Series | MPC83xx |
| Core Architecture | PowerPC, 32-bit |
| Core Count | 1 |
| Core Speed | 400 MHz |
| Supply Voltage (Core) | 1.2 V |
| Memory Controller | DDR1 / DDR2 with ECC |
| Ethernet | 1 Gbit/s (RGMII/GMII) |
| PCI | 32-bit, up to 66 MHz |
| USB | USB 2.0 full-speed PHY |
| TDM / ATM | Multi-channel TDM / ATM glue |
| 동작 온도 | 0C to +105C |
| 패키지 | 668-BGA (PBGA-PGE) 29x29 mm with exposed pad |
| 실장 유형 | Surface Mount |
| Lead Free Status | Lead Free |
| RoHS 상태 | Compliant |
| Packaging | Tray |
MPC8358ZQAGDDA 668-bga (pbga-pge) 29x29 mm with exposed pad 핀 구성 가이드
MPC8358ZQAGDDA(668-bga (pbga-pge) 29x29 mm with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8358ZQAGDDA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8358ZQAGDDA 적합 용도: 6 애플리케이션s: Small-to-Medium Enterprise Router, Business Gateway / xDSL IAD, Industrial Ethernet Bridge, SOHO Security Appliance, Wireless Access Point Controller, Voice-over-IP Gateway.
Small-to-Medium Enterprise Router
The MPC8358ZQAGDDA is the canonical silicon for an SME router: the 400 MHz e300 core provides enough CPU power for routing-table lookup, NAT, QoS classification and management-plane tasks while the QUICC Engine executes PPP, HDLC and Ethernet bridging in microcode. An OEM can terminate up to 1 Gbit/s RGMII plus legacy TDM/ATM uplinks on a single device, which removes an external co-processor and shrinks the BOM. Typical reference designs from NXP show this part behind a 4-port GbE switch ASIC with DDR2-667 SODIMM sockets for routing tables.
추천
Business Gateway / xDSL IAD
For an integrated access device, the MPC8358ZQAGDDA mixes DSL channel data, gigabit Ethernet and VoIP TDM streams on a single SoC. The DDR1/DDR2 controller feeds both the line-side packet buffers and the VoIP DSP ring buffers, while the PCI 66 MHz bus drives a VDSL PHY or HPNA transceiver. The 0C to 105C envelope covers sealed indoor enclosures without derating; total power dissipation is around 3 to 5 W when both MACs are active.
추천
Industrial Ethernet Bridge
An Industrial Ethernet bridge uses the MPC8358ZQAGDDA to forward Profinet, EtherNet/IP or Modbus TCP traffic between ring segments and an uplink. The QUICC Engine takes care of broadcast storm suppression and IEEE 1588 timestamping in firmware microcode, which simplifies the e300 control plane. The USB 2.0 full-speed PHY can drive a diagnostics channel or host a configuration flash; PCI can connect a real-time Ethernet ASIC for sub-millisecond latency.
추천
SOHO Security Appliance
The MPC8358ZQAGDDA serves as the CPU for a low-cost firewall/UTM at SME scale; the QUICC Engine handles stateful packet inspection and most SPI logic at line rate for sub-gigabit links. The non-E variant omits the hardware crypto accelerator, so IPSec is run in software; if IPSec at >100 Mbit/s is mandatory, the E suffix variant (MPC8358EVRAGDDA) is the in-package upgrade. Booting from NAND flash over the local bus keeps the bill of materials small.
추천
Wireless Access Point Controller
In a managed 802.11n AP, the MPC8358ZQAGDDA sits on the wired side, aggregating frames from multiple radios (typically connected over mini-PCIe) before delivering them to the core network. The e300 core handles association tables, WPA2-Enterprise RADIUS forwarding, and 802.1X authentication, while the QUICC Engine accelerates CAPWAP fragmentation on the uplink. DDR2 ECC is useful for long-term reliability against bit-flips in 24/7 deployments.
추천
Voice-over-IP Gateway
An SMB VoIP gateway uses the MPC8358ZQAGDDA to bridge T1/E1 TDM trunks and the SIP signalling channel. Multi-channel TDM glue is wired directly to codec/SLIC devices for FXS and FXO ports, while the Ethernet MACs carry SIP traffic and RTP streams. The QUICC Engine accelerates RTP payload handling and silence-suppression, which keeps the e300 core free for SIP state machines; the PCI bus drives a HDLC controller for legacy signalling.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8358ZQAGDDA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8358EVRAGDDA | MPC8358CVRAGDDA | MPC8358VRAGDDA | MPC8358EZUAGDDA | MPC8360EZUAGDDA | MPC8309CVMAGDCA |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 668-BGA (PBGA-PGE) 29x29 | 668-BGA (PBGA-PGE) 29x29 - same | 668-BGA (PBGA-PGE) 29x29 - same | 668-BGA (PBGA-PGE) 29x29 - same | 668-BGA (PBGA-PGE) 29x29 - same | 668-BGA (PBGA-PGE) 29x29 - same | 668-BGA (PBGA-PGE) - same |
| Core Architecture | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Security Engine | No | Yes | No | No | Yes | Yes | No |
| DDR Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| RoHS / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free |
주요 차별점
- Drop-in compatible across the MPC8358 family in the same 668-BGA package (vs MPC8358EVRAGDDA)
- Common NXP ecosystem with broader 668-BGA compatibility for upgrades (vs MPC8360EZUAGDDA)
- Integrated QUICC Engine for hardware protocol offload (vs MPC8309CVMAGDCA)
설계 노트
The 668-BGA exposed pad (PBGA-PGE) must be soldered to a continuous copper pour that occupies at least 25 percent of the bottom layer, with thermal vias on a 1.2 mm pitch grid to the internal ground plane. A poorly soldered thermal pad can push junction temperature above the 105 C limit during sustained gigabit traffic; on prototype boards, verify with a thermal probe on the top of the package before sealing the enclosure.
DDR2 traces should be length-matched within 25 mils per byte lane, with series-termination resistors and 60 ohm on-die termination enabled. Place a 100 nF decoupling cap adjacent to every power pin and a 1 to 4.7 uF bulk cap per supply rail; failure to meet the DDR2 SI budget is the single most common cause of intermittent boot in MPC8358ZQAGDDA designs.
Do not assume pin-compatible MPC8358 siblings share the same default firmware. The non-E variant omits the security engine; firmware that enables crypto offload at boot will hang or silently fail on MPC8358ZQAGDDA. Always gate the crypto initialization code on a feature bit read from the SVR register before issuing SEC commands.
Maintain 5x5 ball-to-ball keepout under the BGA (no vias, no traces) and use microvia stack-ups to fan out signals to inner layers. Use laser-drilled blind vias or staggered microvia in-pad to escape the 1.0 mm pitch BGA in a 4-1-4 PCB stack-up without violating the escape density.
규정 준수 정보
RoHS compliance and lead-free status confirmed per distributor listings (DigiKey). REACH, halogen-free, and conflict-minerals statements were not present in the verified web data and are marked unknown - request the latest NXP material declaration for confirmation.
