MPC860PCVR50D4 - PowerQUICC 32-Bit MPU, 50MHz, 357-BGA | NXP
N.º da peça: MPC860PCVR50D4 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $101.84 | $101,84 |
| 10 | $92.5 | $925,00 |
| 100 | $80.75 | $8.075,00 |
| 250 | $75.2 | $18.800,00 |
| 500 | $71.4 | $35.700,00 |
MPC860PCVR50D4 Visão geral
A PowerQUICC (pronounced "power-quick") is an integrated communications microprocessor that combines a PowerPC processor core with system integration units (SIU), a memory controller, and communications-specific peripherals such as serial channels, a Fast Ethernet MAC, and a CPM (Communications Processor Module). The MPC8xx family sits in the hierarchy MPU -> microprocessor -> embedded processor -> integrated circuit, designed primarily for networking and telecom infrastructure where deterministic peripheral handling matters.
Key features of the MPC860PCVR50D4 include the PowerPC core running at 50 MHz, the CPM for offloading communications tasks, a 32-bit data path, an integrated Fast Ethernet MAC, multiple serial communications controllers (SCCs), and a flexible memory controller supporting DRAM, SRAM, Flash, and ROM. The device is built on a 0.32-micron process and supports industrial operating temperature range.
Typical applications include 10/100 Mbps Ethernet routers and bridges, DSLAM line cards, ISDN terminal adapters, industrial control with networking, and legacy telecom equipment. The integrated peripherals reduce BOM cost and board area compared to discrete MPU-plus-comm-controller designs.
When designing with this MPU, allocate sufficient PCB area for the 357-ball BGA fanout and follow NXP's recommended decoupling scheme. Because the part is in End of Life, plan long-term production carefully or evaluate the MPC860SAR (successor) family.
Alternativas drop-in para MPC860PCVR50D4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC860PCVR50D4 (mesmo formato e footprint) — diferindo em Core Architecture, Process Technology, RoHS Status, Mounting Type, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC860PCZQ50D4
✅ Drop-In✓ Em estoque
$58.1 / unidade
Ver ficha técnica →MPC860PVR80D4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860ENCVR50D4
✅ Drop-In✓ Em estoque
$52.4 / unidade
Ver ficha técnica →MPC860TCZQ50D4
✅ Drop-In✓ Em estoque
$16.8 / unidade
Ver ficha técnica →MPC860SARVR50B
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
TSPC860MHMZPU50C1
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860PCVR50D4 Classificações máximas e características elétricas
| Processor Family | MPC8xx PowerQUICC |
| Core Architecture | PowerPC 32-bit |
| Number of Cores | 1 |
| Operating Frequency | 50 MHz |
| Tensão de alimentação | 3.3 V |
| Process Technology | 0.32 um CMOS |
| Encapsulamento | 357-PBGA (25x25 mm) |
| Tipo de montagem | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| Status RoHS | RoHS Compliant |
| Integrated Ethernet MAC | Yes (Fast Ethernet 10/100) |
| Memory Controller | Yes (DRAM/SRAM/Flash/ROM) |
| Communications Processor Module (CPM) | Yes |
Guia de Configuração de Pinos do MPC860PCVR50D4 357-pbga (25x25 mm)
Configuração de pinos para MPC860PCVR50D4 (pacote 357-pbga (25x25 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC860PCVR50D4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC860PCVR50D4 é adequado para 6 aplicaçãos: 10/100 Mbps Ethernet Router, DSLAM Line Card Controller, ISDN Terminal Adapter, Industrial Control Gateway, Legacy Telecom Equipment, Embedded Networking Print Server.
10/100 Mbps Ethernet Router
The MPC860PCVR50D4's integrated Fast Ethernet MAC and CPM offload make it ideal for low-port-count routers in legacy telecom and small-office networks. With 50 MHz PowerPC core performance and SCC/SMC channels for WAN serial links, the part can handle a 10/100 Mbps Ethernet LAN plus a single T1/E1 WAN interface without external peripherals. Placed as the system MPU with 16-32 MB DRAM and 4-8 MB Flash, it runs an embedded routing stack (e.g., pSOS+, VxWorks) at line rate. Unlike newer SoCs, it lacks gigabit support, so it targets edge router and bridge applications specifically.
Recomendado
DSLAM Line Card Controller
The MPC860PCVR50D4 suits DSLAM line card designs where deterministic serial communications and an integrated Ethernet MAC combine to simplify line termination. The CPM handles ATM cell processing or PPP/HDLC framing while the PowerPC core manages higher-layer protocols. Operating at 3.3 V with industrial temperature support, it integrates cleanly into CO (central office) equipment. Placed alongside a DSL PHY and line driver, it terminates subscriber lines and aggregates traffic onto the uplink. Compared to discrete MPU-plus-CPE designs, this integrated part reduces BOM cost and PCB area substantially.
Recomendado
ISDN Terminal Adapter
The MPC860PCVR50D4's serial communications controllers and integrated memory controller make it well-suited for ISDN terminal adapters bridging BRI/PRI interfaces to Ethernet or USB hosts. The CPM manages HDLC framing on the ISDN D-channel while SCCs handle B-channel data; the PowerPC core runs the upper-layer call control and routing logic. Operating from 3.3 V with the 357-BGA package, it fits compact adapter enclosures. Placed between the ISDN transceiver (e.g., Si3034) and an Ethernet PHY, it delivers reliable multi-channel ISDN connectivity. Compared to newer SoCs, it offers the legacy interfaces that ISDN deployments still require.
Recomendado
Industrial Control Gateway
The MPC860PCVR50D4 supports industrial control gateways that bridge fieldbus networks (Modbus, Profibus) to Ethernet. The combination of PowerPC core, multiple SCCs for fieldbus, integrated Ethernet MAC, and memory controller provides a single-chip solution. Industrial temperature variants (suffix Z) handle factory-floor conditions. Placed as the central processor with isolated RS-485 transceivers and an Ethernet PHY, it converts fieldbus traffic to TCP/IP for SCADA systems. Unlike newer Cortex-M gateways, it offers higher throughput for multi-protocol aggregation and proven long-term reliability in industrial environments.
Recomendado
Legacy Telecom Equipment
The MPC860PCVR50D4 was widely deployed in legacy telecom equipment including PBX systems, voice-over-IP gateways, and T1/E1 multiplexers. Its deterministic CPM-based peripheral handling and proven software ecosystem (pSOS+, VxWorks, Nucleus) make it ideal for maintaining these installations. Operating from 3.3 V with the 357-PBGA package, it integrates cleanly with T1/E1 framer ICs (e.g., DS2155) and SLICs. Placed as the central call processor, it handles signaling, switching, and call routing functions. Compared to newer SoCs, it preserves investment in existing telecom software stacks and regulatory certifications.
Recomendado
Embedded Networking Print Server
The MPC860PCVR50D4 integrates all peripherals needed for an embedded print server: Ethernet MAC for network connectivity, SCCs for parallel-port or serial-port printer interfaces, and a memory controller for DRAM/Flash storage. At 50 MHz, it handles TCP/IP stack, job queuing, and protocol translation (LPR, IPP) for small-office printers. Placed alongside a parallel-port transceiver and Ethernet PHY, it converts a USB/parallel printer into a network-connected device. Compared to newer Cortex-A SoCs, it offers a smaller footprint, lower power, and proven reliability for long-lifecycle print server designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC860PCVR50D4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC860PCZQ50D4 | MPC860PVR80D4 | MPC860ENCVR50D4 | TSPC860MHMZPU50C1 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | e2v technologies |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Operating Frequency | 50 MHz | 50 MHz | 80 MHz | 50 MHz | 50 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Core Architecture | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit |
| Integrated Ethernet MAC | Yes (Fast Ethernet) | Yes (Fast Ethernet) | Yes (Fast Ethernet) | Yes (Fast Ethernet) | Yes (Fast Ethernet) |
| Temperature Grade | Industrial (R suffix) | Extended (Z suffix) | Industrial (R suffix) | Industrial (R suffix) | Extended/Space (e2v) |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL (e2v) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Integrated Fast Ethernet MAC plus CPM in single chip (vs MPC860PVR80D4)
- Industrial temperature grade option in identical package (vs MPC860PCZQ50D4)
- Drop-in compatibility with legacy MPC860 family (vs MPC860SARVR50B)
Notas de projeto
The 357-PBGA at 25x25 mm requires a 4-6 layer PCB stack-up with microvia (or via-in-pad) technology for clean fanout. Use 0.4 mm pitch trace-and-space rules for breakout, and assign dedicated ground planes under the BGA to reduce inductance on the 3.3 V supply. Decoupling: place 100 nF X7R ceramic caps within 2 mm of each VCC/VSS pair, plus bulk 10-22 uF tantalum or polymer caps near the package edges. Match external memory bus trace lengths to within 25 mils (0.6 mm) to maintain timing margins at 50 MHz.
The MPC860PCVR50D4 dissipates approximately 1.5-2.5 W typical at 50 MHz with all peripherals active, per the MPC860 family datasheet thermal characteristics. The 357-PBGA package theta_JA is approximately 18-22 C/W with proper PCB layout (4-layer with internal ground plane). At industrial temperature range (R suffix, -40 to +85 C ambient), junction temperature should remain below 110 C worst case. For sealed enclosures with limited airflow, add thermal vias under the die-flag and consider attaching a small heatsink to the top of the BGA via thermal interface material.
Three pitfalls are common when designing with the MPC860PCVR50D4. First, the part is in End of Life (EOL) status per NXP's product change notice - new designs should select the MPC860SAR successor or migrate to PowerQUICC II. Second, the 0.32 um CMOS process requires strict power-on sequencing: 3.3 V core must be stable before 5 V tolerant I/O pins are driven. Third, the integrated Ethernet MAC requires a 25 MHz reference clock at the XTAL2 input - do not omit this crystal or use an unreliable oscillator. Plan for long lead times (often 12-26 weeks) on this EOL part.
Informações de conformidade
RoHS compliant and Lead Free per DigiKey (part 955025) and digchip.com listing. AEC-Q100 not applicable - this is a communications MPU, not an automotive-grade part. REACH status compliant per distributor listings.
