MPC860PCVR50D4 - PowerQUICC 32-Bit MPU, 50MHz, 357-BGA | NXP
Teilenummer: MPC860PCVR50D4 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $101.84 | $101,84 |
| 10 | $92.5 | $925,00 |
| 100 | $80.75 | $8.075,00 |
| 250 | $75.2 | $18.800,00 |
| 500 | $71.4 | $35.700,00 |
MPC860PCVR50D4 Übersicht
A PowerQUICC (pronounced "power-quick") is an integrated communications microprocessor that combines a PowerPC processor core with system integration units (SIU), a memory controller, and communications-specific peripherals such as serial channels, a Fast Ethernet MAC, and a CPM (Communications Processor Module). The MPC8xx family sits in the hierarchy MPU -> microprocessor -> embedded processor -> integrated circuit, designed primarily for networking and telecom infrastructure where deterministic peripheral handling matters.
Key features of the MPC860PCVR50D4 include the PowerPC core running at 50 MHz, the CPM for offloading communications tasks, a 32-bit data path, an integrated Fast Ethernet MAC, multiple serial communications controllers (SCCs), and a flexible memory controller supporting DRAM, SRAM, Flash, and ROM. The device is built on a 0.32-micron process and supports industrial operating temperature range.
Typical applications include 10/100 Mbps Ethernet routers and bridges, DSLAM line cards, ISDN terminal adapters, industrial control with networking, and legacy telecom equipment. The integrated peripherals reduce BOM cost and board area compared to discrete MPU-plus-comm-controller designs.
When designing with this MPU, allocate sufficient PCB area for the 357-ball BGA fanout and follow NXP's recommended decoupling scheme. Because the part is in End of Life, plan long-term production carefully or evaluate the MPC860SAR (successor) family.
Drop-in-Alternativen für MPC860PCVR50D4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC860PCVR50D4 (gleiche Bauform und Footprint) – abweichend in Core Architecture, Process Technology, RoHS Status, Mounting Type, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC860PCZQ50D4
✅ Drop-In✓ Auf Lager
$58.1 / Stück
Datenblatt ansehen →MPC860PVR80D4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC860ENCVR50D4
✅ Drop-In✓ Auf Lager
$52.4 / Stück
Datenblatt ansehen →MPC860TCZQ50D4
✅ Drop-In✓ Auf Lager
$16.8 / Stück
Datenblatt ansehen →MPC860SARVR50B
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
TSPC860MHMZPU50C1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC860PCVR50D4 Grenzwerte & elektrische Eigenschaften
| Processor Family | MPC8xx PowerQUICC |
| Core Architecture | PowerPC 32-bit |
| Number of Cores | 1 |
| Operating Frequency | 50 MHz |
| Versorgungsspannung | 3.3 V |
| Process Technology | 0.32 um CMOS |
| Gehäuse | 357-PBGA (25x25 mm) |
| Montageart | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| RoHS-Status | RoHS Compliant |
| Integrated Ethernet MAC | Yes (Fast Ethernet 10/100) |
| Memory Controller | Yes (DRAM/SRAM/Flash/ROM) |
| Communications Processor Module (CPM) | Yes |
MPC860PCVR50D4 357-pbga (25x25 mm) Pinbelegungsleitfaden
Pinbelegung für MPC860PCVR50D4 (357-pbga (25x25 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC860PCVR50D4.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC860PCVR50D4 ist geeignet für 6 Anwendungs: 10/100 Mbps Ethernet Router, DSLAM Line Card Controller, ISDN Terminal Adapter, Industrial Control Gateway, Legacy Telecom Equipment, Embedded Networking Print Server.
10/100 Mbps Ethernet Router
The MPC860PCVR50D4's integrated Fast Ethernet MAC and CPM offload make it ideal for low-port-count routers in legacy telecom and small-office networks. With 50 MHz PowerPC core performance and SCC/SMC channels for WAN serial links, the part can handle a 10/100 Mbps Ethernet LAN plus a single T1/E1 WAN interface without external peripherals. Placed as the system MPU with 16-32 MB DRAM and 4-8 MB Flash, it runs an embedded routing stack (e.g., pSOS+, VxWorks) at line rate. Unlike newer SoCs, it lacks gigabit support, so it targets edge router and bridge applications specifically.
Empfohlen
DSLAM Line Card Controller
The MPC860PCVR50D4 suits DSLAM line card designs where deterministic serial communications and an integrated Ethernet MAC combine to simplify line termination. The CPM handles ATM cell processing or PPP/HDLC framing while the PowerPC core manages higher-layer protocols. Operating at 3.3 V with industrial temperature support, it integrates cleanly into CO (central office) equipment. Placed alongside a DSL PHY and line driver, it terminates subscriber lines and aggregates traffic onto the uplink. Compared to discrete MPU-plus-CPE designs, this integrated part reduces BOM cost and PCB area substantially.
Empfohlen
ISDN Terminal Adapter
The MPC860PCVR50D4's serial communications controllers and integrated memory controller make it well-suited for ISDN terminal adapters bridging BRI/PRI interfaces to Ethernet or USB hosts. The CPM manages HDLC framing on the ISDN D-channel while SCCs handle B-channel data; the PowerPC core runs the upper-layer call control and routing logic. Operating from 3.3 V with the 357-BGA package, it fits compact adapter enclosures. Placed between the ISDN transceiver (e.g., Si3034) and an Ethernet PHY, it delivers reliable multi-channel ISDN connectivity. Compared to newer SoCs, it offers the legacy interfaces that ISDN deployments still require.
Empfohlen
Industrial Control Gateway
The MPC860PCVR50D4 supports industrial control gateways that bridge fieldbus networks (Modbus, Profibus) to Ethernet. The combination of PowerPC core, multiple SCCs for fieldbus, integrated Ethernet MAC, and memory controller provides a single-chip solution. Industrial temperature variants (suffix Z) handle factory-floor conditions. Placed as the central processor with isolated RS-485 transceivers and an Ethernet PHY, it converts fieldbus traffic to TCP/IP for SCADA systems. Unlike newer Cortex-M gateways, it offers higher throughput for multi-protocol aggregation and proven long-term reliability in industrial environments.
Empfohlen
Legacy Telecom Equipment
The MPC860PCVR50D4 was widely deployed in legacy telecom equipment including PBX systems, voice-over-IP gateways, and T1/E1 multiplexers. Its deterministic CPM-based peripheral handling and proven software ecosystem (pSOS+, VxWorks, Nucleus) make it ideal for maintaining these installations. Operating from 3.3 V with the 357-PBGA package, it integrates cleanly with T1/E1 framer ICs (e.g., DS2155) and SLICs. Placed as the central call processor, it handles signaling, switching, and call routing functions. Compared to newer SoCs, it preserves investment in existing telecom software stacks and regulatory certifications.
Empfohlen
Embedded Networking Print Server
The MPC860PCVR50D4 integrates all peripherals needed for an embedded print server: Ethernet MAC for network connectivity, SCCs for parallel-port or serial-port printer interfaces, and a memory controller for DRAM/Flash storage. At 50 MHz, it handles TCP/IP stack, job queuing, and protocol translation (LPR, IPP) for small-office printers. Placed alongside a parallel-port transceiver and Ethernet PHY, it converts a USB/parallel printer into a network-connected device. Compared to newer Cortex-A SoCs, it offers a smaller footprint, lower power, and proven reliability for long-lifecycle print server designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC860PCVR50D4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC860PCZQ50D4 | MPC860PVR80D4 | MPC860ENCVR50D4 | TSPC860MHMZPU50C1 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | e2v technologies |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Operating Frequency | 50 MHz | 50 MHz | 80 MHz | 50 MHz | 50 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Core Architecture | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit |
| Integrated Ethernet MAC | Yes (Fast Ethernet) | Yes (Fast Ethernet) | Yes (Fast Ethernet) | Yes (Fast Ethernet) | Yes (Fast Ethernet) |
| Temperature Grade | Industrial (R suffix) | Extended (Z suffix) | Industrial (R suffix) | Industrial (R suffix) | Extended/Space (e2v) |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL (e2v) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Integrated Fast Ethernet MAC plus CPM in single chip (vs. MPC860PVR80D4)
- Industrial temperature grade option in identical package (vs. MPC860PCZQ50D4)
- Drop-in compatibility with legacy MPC860 family (vs. MPC860SARVR50B)
Designhinweise
The 357-PBGA at 25x25 mm requires a 4-6 layer PCB stack-up with microvia (or via-in-pad) technology for clean fanout. Use 0.4 mm pitch trace-and-space rules for breakout, and assign dedicated ground planes under the BGA to reduce inductance on the 3.3 V supply. Decoupling: place 100 nF X7R ceramic caps within 2 mm of each VCC/VSS pair, plus bulk 10-22 uF tantalum or polymer caps near the package edges. Match external memory bus trace lengths to within 25 mils (0.6 mm) to maintain timing margins at 50 MHz.
The MPC860PCVR50D4 dissipates approximately 1.5-2.5 W typical at 50 MHz with all peripherals active, per the MPC860 family datasheet thermal characteristics. The 357-PBGA package theta_JA is approximately 18-22 C/W with proper PCB layout (4-layer with internal ground plane). At industrial temperature range (R suffix, -40 to +85 C ambient), junction temperature should remain below 110 C worst case. For sealed enclosures with limited airflow, add thermal vias under the die-flag and consider attaching a small heatsink to the top of the BGA via thermal interface material.
Three pitfalls are common when designing with the MPC860PCVR50D4. First, the part is in End of Life (EOL) status per NXP's product change notice - new designs should select the MPC860SAR successor or migrate to PowerQUICC II. Second, the 0.32 um CMOS process requires strict power-on sequencing: 3.3 V core must be stable before 5 V tolerant I/O pins are driven. Third, the integrated Ethernet MAC requires a 25 MHz reference clock at the XTAL2 input - do not omit this crystal or use an unreliable oscillator. Plan for long lead times (often 12-26 weeks) on this EOL part.
Compliance-Informationen
RoHS compliant and Lead Free per DigiKey (part 955025) and digchip.com listing. AEC-Q100 not applicable - this is a communications MPU, not an automotive-grade part. REACH status compliant per distributor listings.
