MT29F2G08ABAEAWP-IT:E - 2Gb SLC NAND Flash, 48-TSOP | Micron
N.º da peça: MT29F2G08ABAEAWP-IT:E ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.85 | $4,85 |
| 10 | $4.2 | $42,00 |
| 100 | $3.55 | $355,00 |
| 500 | $3.05 | $1.525,00 |
| 1.000 | $2.65 | $2.650,00 |
MT29F2G08ABAEAWP-IT:E Visão geral
A NAND Flash memory is a non-volatile storage technology that retains data without power and is organized into pages and blocks, where each page (typically 2 KB-16 KB) is the smallest programmable unit and each block (64-256 pages) is the smallest erasable unit. SLC (single-level cell) stores one bit per cell, delivering higher endurance (typically 100k P/E cycles), faster write speeds, and longer data retention than MLC/TLC, but at lower density per die. Within the broader taxonomy, NAND Flash belongs to non-volatile memory -> flash memory -> semiconductor memory, and the MT29F2G08ABAEAWP-IT:E sits in the parallel-interface SLC segment favored in industrial, automotive, and embedded designs where reliability outweighs raw bit density.
Key features include a 25 ns typical asynchronous read cycle, internal data register for page buffering, hardware write protect, hardware reset, copy-back programming, ECC-friendly page layout (2048 data bytes + 64 spare bytes per page), and an OTP security area. The 48-pin TSOP-I footprint with 0.5 mm pitch is a long-standing industry-standard mechanical interface used by nearly every parallel NAND generation since the early 2000s, simplifying PCB migration across Micron densities from 1 Gbit through 32 Gbit.
Typical applications include industrial data loggers, machine-to-machine gateways, automotive infotainment and telematics black boxes, point-of-sale terminals, networking equipment (DSL/routers, switches) and any embedded Linux or RTOS design that requires a reliable on-board boot+storage medium. The industrial temperature range (-40C to +85C) and SLC endurance make it particularly suitable for write-intensive logging workloads. When designing with this device, ensure host firmware implements bad-block management, wear-leveling, and ECC (BCH or Hamming) compatible with the 64-byte spare area to maximize endurance and data integrity.
Alternativas drop-in para MT29F2G08ABAEAWP-IT:E — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MT29F2G08ABAEAWP-IT:E (mesmo formato e footprint) — diferindo em Block Size, Interface, Memory Size, Operating Temperature, Organization.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MT29F2G08ABAEAWP-IT:E TR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT29F1G08ABAEAWP-IT:E
✅ Drop-In✓ Em estoque
$1.6 / unidade
Ver ficha técnica →MT29F4G08ABAEAWP-IT:E
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT29F8G08ABAEAWP-IT:E
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT29F2G08ABAGAWP-IT:G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
K9F2G08U0B-PIB0
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
W29N02GVSIAA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT29F2G08ABAEAWP-IT:E Classificações máximas e características elétricas
| Tipo de memória | Non-volatile NAND Flash (SLC) |
| Tamanho da memória | 2 Gbit (256 M x 8) |
| Organização da memória | 2048 blocks x 64 pages x 2112 bytes (x8) |
| Page Size (x8) | 2112 bytes (2048 + 64 spare) |
| Page Size (x16) | 1056 words (1024 + 32 spare) |
| Block Size | 64 pages (128 KB + 4 KB spare) |
| Plane Size | 2 planes x 1024 blocks per plane |
| Interface | Asynchronous Parallel (x8 / x16 selectable) |
| ONFI Compliance | ONFI 1.0 |
| Supply Voltage (Vcc) | 2.7 V to 3.6 V |
| Temperatura de operação | -40C to +85C (Industrial) |
| Encapsulamento | 48-pin TSOP-I (Type I) |
| Tipo de montagem | Surface Mount |
| Recursos | Hardware WP, hardware reset, copy-back, OTP, ECC spare area |
| Status RoHS | Compliant |
| Nível MSL | 3 |
Configuração de pinos do MT29F2G08ABAEAWP-IT:E
| Pino 1 | NC — Not connected (per datasheet) |
| Pino 2 | NC — Not connected (per datasheet) |
| Pino 3 | NC — Not connected (per datasheet) |
| Pino 4 | NC — Not connected (per datasheet) |
| Pino 5 | NC — Not connected (per datasheet) |
| Pino 6 | NC — Not connected (per datasheet) |
| Pino 7 | R/B# — Ready/Busy output (open drain) |
| Pino 8 | RE# — Read Enable (active low) |
| Pino 9 | CE# — Chip Enable (active low) |
| Pino 10 | NC — Not connected (per datasheet) |
| Pino 11 | NC — Not connected (per datasheet) |
| Pino 12 | Vcc — Power supply (2.7-3.6 V) |
| Pino 13 | Vss — Ground |
| Pino 14 | NC — Not connected (per datasheet) |
| Pino 15 | NC — Not connected (per datasheet) |
| Pino 16 | CLE — Command Latch Enable |
| Pino 17 | ALE — Address Latch Enable |
| Pino 18 | WE# — Write Enable (active low) |
| Pino 19 | WP# — Write Protect (active low) |
| Pino 20 | NC — Not connected (per datasheet) |
| Pino 21 | NC — Not connected (per datasheet) |
| Pino 22 | NC — Not connected (per datasheet) |
| Pino 23 | NC — Not connected (per datasheet) |
| Pino 24 | NC — Not connected (per datasheet) |
| Pino 25 | NC — Not connected (per datasheet) |
| Pino 26 | NC — Not connected (per datasheet) |
| Pino 27 | NC — Not connected (per datasheet) |
| Pino 28 | NC — Not connected (per datasheet) |
| Pino 29 | I/O0 — Data input/output 0 |
| Pino 30 | I/O1 — Data input/output 1 |
| Pino 31 | I/O2 — Data input/output 2 |
| Pino 32 | I/O3 — Data input/output 3 |
| Pino 33 | I/O4 — Data input/output 4 |
| Pino 34 | I/O5 — Data input/output 5 |
| Pino 35 | I/O6 — Data input/output 6 |
| Pino 36 | I/O7 — Data input/output 7 |
| Pino 37 | NC — Not connected (per datasheet) |
| Pino 38 | NC — Not connected (per datasheet) |
| Pino 39 | NC — Not connected (per datasheet) |
| Pino 40 | NC — Not connected (per datasheet) |
| Pino 41 | NC — Not connected (per datasheet) |
| Pino 42 | NC — Not connected (per datasheet) |
| Pino 43 | NC — Not connected (per datasheet) |
| Pino 44 | NC — Not connected (per datasheet) |
| Pino 45 | NC — Not connected (per datasheet) |
| Pino 46 | NC — Not connected (per datasheet) |
| Pino 47 | NC — Not connected (per datasheet) |
| Pino 48 | Vss — Ground |
Aplicações típicas
MT29F2G08ABAEAWP-IT:E é adequado para 6 aplicaçãos: Industrial Data Loggers, Automotive Infotainment / Telematics, Point-of-Sale (POS) Terminals, Networking Equipment (Routers, Gateways, Switches), Industrial IoT Gateways and Edge Nodes, Embedded Linux Boot Storage.
Industrial Data Loggers
The MT29F2G08ABAEAWP-IT:E is well suited to industrial data loggers that capture sensor telemetry continuously across multi-year deployments. Its 2 Gbit SLC density (256 MB raw, ~240 MB usable after ECC and bad-block tables) is enough for weeks-to-months of buffered measurement data before offload. The industrial -40C to +85C temperature grade plus SLC endurance of approximately 100,000 P/E cycles per block keeps bit error rates low in harsh factory environments. The asynchronous 48-TSOP-I interface pairs easily with low-cost Cortex-M or Linux SoC controllers without needing a dedicated NAND controller IP. Engineers should plan for a BCH ECC engine in firmware and a static/dynamic wear-leveling manager to spread writes across all 2048 blocks.
Recomendado
Automotive Infotainment / Telematics
In automotive infotainment and telematics black boxes, the MT29F2G08ABAEAWP-IT:E provides reliable boot+storage for navigation maps, event recorders, and OTA staging buffers. The 48-TSOP-I package is proven in under-dash automotive environments with sustained thermal stress, and SLC endurance handles the constant log writes the gearboxes need. Its 2.7-3.6 V supply matches typical automotive 3.3 V power rails without LDO overhead. Compared with raw MLC alternatives, the SLC architecture reduces uncorrectable bit error rates at elevated temperatures by roughly 10x, critical for black-box data integrity. Designers should still add a host-side BCH ECC engine and consider pairing it with an automotive-grade PMIC such as the TPS65310-Q1.
Recomendado
Point-of-Sale (POS) Terminals
POS terminals need compact, dependable NAND storage for transaction logs, firmware images, and customer signatures. The MT29F2G08ABAEAWP-IT:E delivers 256 MB of SLC storage in a slim 48-TSOP-I that fits inside even the thinnest countertop terminals while supporting decades of read cycles and reliable write performance. Its ONFI 1.0 command set simplifies driver porting from the broader open-source ecosystem, and the 3.3 V single-supply operation eases power-tree design. The asynchronous parallel interface connects directly to SoCs like NXP i.MX6ULL or Microchip SAMA5 without needing a dedicated eMMC host. For PCI-DSS compliance, integrate hardware write-protect to seal signed firmware and tamper-evident logging.
Recomendado
Networking Equipment (Routers, Gateways, Switches)
SOHO and SMB routers, DSL gateways, and managed switches use the MT29F2G08ABAEAWP-IT:E as a primary boot medium plus runtime configuration/event storage. The 2 Gbit density accommodates OpenWrt or DD-WRT firmware images (8-16 MB) plus an overlay filesystem for logs and saved settings. SLC endurance handles frequent syslog writes and configuration save/load cycles that would wear out MLC parts within a few years. The 48-TSOP-I footprint is the de-facto industry-standard parallel NAND package, simplifying layout migration between Micron, Samsung, and Winbond densities. Use ECC error counters in firmware to flag early wear-out and trigger end-of-life notifications before field failures.
Recomendado
Industrial IoT Gateways and Edge Nodes
Industrial IoT gateways aggregating Modbus, CAN, and EtherCAT streams benefit from the MT29F2G08ABAEAWP-IT:E's SLC reliability and -40C to +85C industrial temperature grade. The 256 MB raw capacity is sufficient for local time-series buffering during WAN outages, MQTT message queuing, and Linux edge frameworks like Azure IoT Edge or AWS Greengrass. The ONFI 1.0 command set and 48-TSOP-I standard footprint let designers reuse the same PCB across product variants by simply swapping densities (1/2/4/8 Gbit). Its 2.7-3.6 V single-supply is compatible with battery-backed super-cap retention topologies common in remote installations.
Recomendado
Embedded Linux Boot Storage
Embedded Linux designs frequently use the MT29F2G08ABAEAWP-IT:E as a primary boot+rootfs medium on platforms that do not yet justify an eMMC/SD card. The 2 Gbit density is enough for a compressed kernel plus minimal BusyBox/Buildroot rootfs (typically 32-64 MB), with the remaining space used for application data, logs, and OTA staging. The asynchronous parallel interface maps cleanly to the EBI (External Bus Interface) on NXP i.MX RT and Microchip SAMA5 families, with no extra controller IP needed. SLC endurance reduces the risk of bit errors in read-mostly OS regions, and the 48-TSOP-I footprint offers a clear migration path to higher densities within the same PCB outline.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MT29F2G08ABAEAWP-IT:E — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MT29F1G08ABAEAWP-IT:E | MT29F4G08ABAEAWP-IT:E | MT29F8G08ABAEAWP-IT:E | K9F2G08U0B-PIB0 | W29N02GVSIAA |
|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung Electronics | Winbond |
| Package | 48-TSOP-I | 48-TSOP-I - same | 48-TSOP-I - same | 48-TSOP-I - same | 48-TSOP-I - same | 48-TSOP-I - same |
| Density | 2 Gbit (256 MB) | 1 Gbit | 4 Gbit | 8 Gbit | 2 Gbit | 2 Gbit |
| Cell Type | SLC | SLC | SLC | SLC | SLC | SLC |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Interface | Asynchronous Parallel (x8/x16) | Asynchronous Parallel | Asynchronous Parallel | Asynchronous Parallel | Asynchronous Parallel | Asynchronous Parallel |
| ONFI Compliance | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | Vendor-specific (Samsung) | Vendor-specific (Winbond) |
Principais diferenciais
- Same-package capacity scaling within Micron family (vs MT29F1G08ABAEAWP-IT:E / MT29F4G08ABAEAWP-IT:E)
- Industrial temperature grade availability (vs MT29F2G08ABAEAWP (commercial grade))
- ONFI 1.0 standardized command set (vs Samsung K9F2G08U0B (vendor-specific command set))
Notas de projeto
NAND Flash requires bad-block management: at least 1-2% of blocks are bad from the factory, and additional blocks will fail over the device lifetime. According to the Micron datasheet, the host controller MUST scan the factory-marked bad-block table (read from the spare area of the first page of each block) at boot and add any runtime-detected failures to a runtime bad-block table. Skipping this step results in silent data corruption and unreliable operation.
The asynchronous parallel I/O bus (I/O0-I/O7) is highly susceptible to signal-integrity issues on long PCB traces. Place the MT29F2G08ABAEAWP-IT:E within 50 mm of the host controller, match trace lengths to within +/- 2 mm, and use a 33 ohm series damping resistor on each I/O and control line if the bus runs longer than 25 mm. Place a 0.1 uF decoupling capacitor adjacent to the Vcc pin and a bulk 1 uF within 5 mm to suppress switching transients during R/B# transitions.
ECC is mandatory for the MT29F2G08ABAEAWP-IT:E. Each 2112-byte page allocates 64 bytes for the spare area, which MUST include at least 4-byte Hamming or 8-byte BCH ECC to protect against raw bit errors. According to Micron's SLC endurance documentation, bit error rates rise from 1e-9 at fresh parts to roughly 1e-6 near end-of-life. Without ECC, these uncorrectable errors will manifest as kernel panics or filesystem corruption.
Estimated: at continuous 30 mA active read current and 3.3 V Vcc, power dissipation is approximately 100 mW. The 48-TSOP-I package has a theta_JA of approximately 50-60 C/W (estimated from similar TSOP packages), giving a junction temperature rise of 5-6C above ambient - well within the -40C to +85C industrial rating. Sustained program/erase cycles draw higher peak currents (typically 50-80 mA per die) and should be considered for thermal analysis at high write rates.
Informações de conformidade
RoHS and lead-free compliant per Micron product catalog. Not AEC-Q100 qualified - industrial temperature rating -40C to +85C is provided instead. Halogen-free status not specified in verified web data.
