MX30LF1GE8AB-TI-TR - 1Gbit 3V SLC NAND Flash, x8, TSOP-48 | Macronix
N.º da peça: MX30LF1GE8AB-TI-TR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.95 | $2,95 |
| 10 | $2.66 | $26,60 |
| 100 | $2.36 | $236,00 |
| 500 | $2.12 | $1.060,00 |
| 1.000 | $1.89 | $1.890,00 |
MX30LF1GE8AB-TI-TR Visão geral
A NAND Flash is a non-volatile memory that stores data as charge on floating-gate cells arranged in pages and blocks, accessed through a command-driven protocol over a multiplexed 8-bit I/O bus. SLC NAND stores one bit per cell, offering the highest endurance and reliability within the NAND family (which itself is a class of non-volatile memory -> flash memory -> semiconductor memory -> IC). Compared with NOR flash, NAND provides higher density at lower cost-per-bit and faster write/erase, but requires sequential access and external ECC for data integrity in mission-critical applications.
Key features include a 2112-byte page size (2048 + 64 spare), 64 pages per block (128 KB + 4 KB spare), 1024 blocks, internal data-move / copy-back operations, hardware-ready/busy (R/B#) signaling, and command-set compatibility with the ONFI 1.0 baseline. ECC-Free means error correction is handled by the host, giving designers freedom to choose ECC strength (typically BCH or Hamming). The TSOP-I 48-pin package is the industry-standard footprint shared by most 1 Gbit to 4 Gbit parallel NAND parts.
The MX30LF1GE8AB architecture uses a 2-plane array that enables interleaved page program and block erase between planes for higher throughput. Plane interleaving can effectively double sequential write bandwidth by overlapping tPROG of one plane with tR of the other. Designers should size VCC decoupling (1 uF + 100 nF) close to the VCC/VSS pins and respect the 100 us R/B# power-on delay per the Macronix datasheet revision v1.3.
Typical applications include embedded Linux/OS boot + mass storage in industrial gateways, set-top box and smart-TV storage, automotive infotainment (non-safety), networking equipment logging, and IoT edge devices that need reliable code + data storage at 3 V. Designers migrating from the older MX30LF1G08AA should review Macronix application note AN0366V1, as the MX30LF1GE8AB has a longer Device ID and slightly longer tR.
When designing in this part, allow 1.5 us tRST after power-up before issuing the reset (0xFF) command. The R/B# pin is open-drain and requires an external pull-up. For long-term data retention, program/erase endurance is rated at 100 K cycles per block typical, with 10-year data retention.
This page synthesizes distributor pricing, drop-in and same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para MX30LF1GE8AB-TI-TR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MX30LF1GE8AB-TI-TR (mesmo formato e footprint) — diferindo em Block Size, Data Retention, Operating Temperature, Package, Page Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MX30LF1GE8AB-TI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30LF1G08AA-TI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30LF2GE8AB-TI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TC58BVG0S3HTAI0
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT29F1G08ABAEAWP-IT:E
✅ Drop-In✓ Em estoque
$1.6 / unidade
Ver ficha técnica →W29N01GVSIAA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30LF1GE8AB-TI-TR Classificações máximas e características elétricas
| Tipo de memória | Non-Volatile NAND Flash (SLC) |
| Memory Organization | 128 M x 8 |
| Density | 1 Gbit (1024 Mbit) |
| Tipo de interface | Parallel Asynchronous (ONFI 1.0) |
| Cell Technology | Single-Level Cell (SLC) |
| Page Size | 2112 bytes (2048 data + 64 spare) |
| Block Size | 64 pages (128 KB + 4 KB spare) |
| Number of Blocks | 1024 |
| Access Time (tR) | 20 ns / 25 ns (grade dependent) |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Active Read Current (ICC1) | 15 mA typical |
| Program / Erase Current (ICC2) | 15 mA typical |
| Program / Erase Endurance | 100 K cycles per block (typical) |
| Data Retention | 10 years (typical) |
| Temperatura de operação | -40 C to +85 C (industrial) |
| Encapsulamento | 48-pin TSOP-I (Type I) |
| Tipo de montagem | Surface Mount |
| ECC Architecture | ECC-Free (external host ECC required) |
| Compliance Standard | ONFI 1.0 |
| Bad Block Mark | 00h on 1st and 2nd page (per datasheet v1.3) |
| Status RoHS | Compliant |
| Bad Block Indicator | Marked at 1st and 2nd page (00h) per datasheet v1.3 |
| R/B# Power-On Delay | 100 us (per datasheet v1.3) |
Configuração de pinos do MX30LF1GE8AB-TI-TR
| Pino 1 | NC — Not connected |
| Pino 2 | NC — Not connected |
| Pino 3 | NC — Not connected |
| Pino 4 | NC — Not connected |
| Pino 5 | NC — Not connected |
| Pino 6 | NC — Not connected |
| Pino 7 | WE# — Write Enable (active low) |
| Pino 8 | RE# — Read Enable (active low) |
| Pino 9 | CLE — Command Latch Enable |
| Pino 10 | ALE — Address Latch Enable |
| Pino 11 | WP# — Write Protect (active low) |
| Pino 12 | CE# — Chip Enable (active low) |
| Pino 13 | R/B# — Ready/Busy (open-drain, active low) |
| Pino 14 | NC — Not connected |
| Pino 15 | NC — Not connected |
| Pino 16 | NC — Not connected |
| Pino 17 | NC — Not connected |
| Pino 18 | NC — Not connected |
| Pino 19 | NC — Not connected |
| Pino 20 | VSS — Ground |
| Pino 21 | NC — Not connected |
| Pino 22 | NC — Not connected |
| Pino 23 | NC — Not connected |
| Pino 24 | NC — Not connected |
| Pino 25 | NC — Not connected |
| Pino 26 | NC — Not connected |
| Pino 27 | NC — Not connected |
| Pino 28 | VCC — Power supply (2.7 V to 3.6 V) |
| Pino 29 | I/O0 — Data input/output 0 |
| Pino 30 | I/O1 — Data input/output 1 |
| Pino 31 | I/O2 — Data input/output 2 |
| Pino 32 | I/O3 — Data input/output 3 |
| Pino 33 | VSS — Ground |
| Pino 34 | I/O4 — Data input/output 4 |
| Pino 35 | I/O5 — Data input/output 5 |
| Pino 36 | I/O6 — Data input/output 6 |
| Pino 37 | I/O7 — Data input/output 7 |
| Pino 38 | VSS — Ground |
| Pino 39 | NC — Not connected |
| Pino 40 | NC — Not connected |
| Pino 41 | NC — Not connected |
| Pino 42 | NC — Not connected |
| Pino 43 | NC — Not connected |
| Pino 44 | NC — Not connected |
| Pino 45 | NC — Not connected |
| Pino 46 | NC — Not connected |
| Pino 47 | NC — Not connected |
| Pino 48 | VSS — Ground |
Aplicações típicas
MX30LF1GE8AB-TI-TR é adequado para 6 aplicaçãos: Industrial IoT Gateway Storage, Set-Top Box and Smart TV Firmware + Channel Storage, Automotive Infotainment (Non-Safety), Networking Equipment Event Logging, Linux Boot + Rootfs for Industrial HMI Panels, IoT Edge Devices and Sensor Hubs.
Industrial IoT Gateway Storage
The MX30LF1GE8AB-TI-TR fits industrial IoT gateways needing 1 Gbit of reliable on-board storage for Linux rootfs, configuration, and event logs. Its 3.0-3.6 V VCC matches typical 3.3 V system rails directly, while the 100 K cycle per block endurance comfortably handles daily write workloads typical of edge gateways. The x8 parallel interface pairs naturally with industrial SoCs that expose a NAND controller IP. Designers should enable host-side BCH ECC (typically 8-bit) and provision 5-10% over-provisioned blocks to extend endurance. The 10-year data retention rating supports long-life industrial deployments where the gateway may run unattended for 5-10 years before service.
Recomendado
Set-Top Box and Smart TV Firmware + Channel Storage
The MX30LF1GE8AB-TI-TR's 1 Gbit SLC NAND is well-sized for set-top box (STB) firmware plus channel/EPG data storage. Its 20 ns access time provides fast channel-zap performance in zapper/semi-smart STBs, and the ONFI 1.0 compliance ensures compatibility with mainstream STB SoCs from Broadcom, Realtek, and Ali. The 48-pin TSOP-I package sits cleanly on the main PCB next to the DRAM, simplifying layout. Designers can use plane-interleaved program operations to double write throughput during firmware updates, and the R/B# pin allows the host to poll for completion without busy-wait loops. Long 10-year retention aligns with the 7-10 year service life of consumer STBs.
Recomendado
Automotive Infotainment (Non-Safety)
The MX30LF1GE8AB-TI-TR is widely deployed in automotive infotainment head units and telematics control units where AEC-Q100 is not required. Its industrial -40 C to +85 C temperature range handles cabin and behind-dash thermal environments, and the 100 K cycle endurance easily covers map-data refresh and OTA update workloads over a 10-year vehicle service life. The 3.3 V VCC matches typical automotive PMIC outputs, simplifying power tree design. For safety-critical ECUs (airbag, ADAS) or AEC-Q100 mandated modules, designers should select the dedicated automotive-grade Macronix SLC NAND variant instead.
Recomendado
Networking Equipment Event Logging
In routers, switches, and small-cell base stations, the MX30LF1GE8AB-TI-TR stores system logs, configuration snapshots, and firmware A/B images. The 1 Gbit density is ideal for dual-image firmware (2 x 256 MB) plus a 256 MB log partition plus a 256 MB config partition, fitting comfortably within 128 MB. Its parallel interface pairs with networking SoCs that include a NAND controller, and the open-drain R/B# pin simplifies interrupt-driven operation. The 100 us R/B# power-on delay per datasheet v1.3 lets the host issue the reset command 1.5 us after VCC stable, ensuring a clean startup sequence even during fast PoE voltage ramps.
Recomendado
Linux Boot + Rootfs for Industrial HMI Panels
Industrial HMI panels running embedded Linux (Buildroot/Yocto) commonly boot from and store their rootfs on a 1 Gbit SLC NAND. The MX30LF1GE8AB-TI-TR fits this role: its 128 MB usable data area (after bad-block and ECC overhead) is enough for a stripped-down Linux rootfs plus application data, and its TSOP-48 package simplifies PCB layout under the LCD carrier board. Pairing with a JFFS2 or UBIFS filesystem handles wear-leveling across the 100 K cycle-per-block endurance, giving years of reliable operation. Designers should budget 5-10% spare blocks for bad-block replacement during the panel's 10+ year service life.
Recomendado
IoT Edge Devices and Sensor Hubs
Battery- or line-powered IoT edge devices and sensor hubs benefit from the MX30LF1GE8AB-TI-TR's mature 1 Gbit density and 3.3 V operation. The SLC endurance of 100 K cycles per block supports frequent sensor data buffering in event-driven edge nodes, and the 10-year retention covers long-life sensor deployments in smart-building, smart-agriculture, or smart-metering applications. Designers can implement OTA firmware updates by writing the new image to a secondary partition and switching boot pointers. The TSOP-48 footprint is shared with Macronix 1.8 V (UF) parts, allowing a single layout to support both 3 V and 1.8 V SoCs by changing only the BOM line.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MX30LF1GE8AB-TI-TR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MX30LF1GE8AB-TI | MX30LF1G08AA-TI | MX30LF2GE8AB-TI | TC58BVG0S3HTAI0 | MT29F1G08ABAEAWP |
|---|---|---|---|---|---|---|
| Brand | Macronix | Macronix | Macronix | Macronix | Toshiba | Micron Technology |
| Package | TSOP-48 | TSOP-48 - same | TSOP-48 - same | TSOP-48 - same | TSOP-48 - same | TSOP-48 - same |
| Density | 1 Gbit | 1 Gbit | 1 Gbit | 2 Gbit | 1 Gbit | 1 Gbit |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Interface | Parallel x8 | Parallel x8 | Parallel x8 | Parallel x8 | Parallel x8 | Parallel x8 |
| ONFI Compliance | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 |
| ECC Architecture | ECC-Free (external) | ECC-Free (external) | ECC-Free (external) | ECC-Free (external) | ECC-Free (external) | ECC-Free (external) |
| Endurance | 100 K cycles / block | 100 K cycles / block | 100 K cycles / block | 100 K cycles / block | 100 K cycles / block | 100 K cycles / block |
Principais diferenciais
- Mature 1 Gbit supply chain with shorter lead times (vs MX30LF2GE8AB-TI)
- SLC endurance and data retention (vs MT29F1G08ABAEAWP)
- Revision v1.3 datasheet with corrected bad-block marker (vs MX30LF1G08AA-TI)
- Tape-and-reel packaging for SMT production (vs MX30LF1GE8AB-TI)
Notas de projeto
Decouple VCC with a 1 uF X7R ceramic plus a 100 nF X7R placed within 3 mm of the VCC (pin 28) and VSS (pins 20, 33, 38, 48) pins. Hold VCC stable during program and erase operations - a brown-out below 2.7 V mid-program can corrupt the target block. Allow 1.5 us after VCC reaches 2.7 V before issuing the reset (0xFF) command, then wait at least 100 us for R/B# to de-assert per datasheet revision v1.3.
Route the 8-bit I/O bus (I/O0-I/O7, pins 29-32 and 34-37) with matched trace lengths to within 2-3 mm to preserve setup/hold timing at 20 ns access time. Keep CE#, RE#, WE#, CLE, ALE traces short and away from switching power nodes. The R/B# pin is open-drain and requires a 4.7 K to 10 K pull-up to VCC. Place the TSOP-48 footprint on the top side or bottom side with no vias under the package to simplify inspection and rework.
Per Macronix datasheet revision v1.3, the bad-block marker is now 00h on the 1st and 2nd page (not non-FFh on 1st or 2nd page as in earlier revisions). Host firmware performing factory bad-block scan must check the 2048th byte of the 1st and 2nd pages for 00h. Skipping the 2nd page check can lead to using a partially bad block, causing data corruption in production. Also note that cache read is not supported on the MX30LF1GE8AB (unlike its predecessor MX30LF1G08AA).
The CLE and ALE signals must be held stable while CE# is asserted to correctly latch the command vs address cycle. Driving CLE/ALE too close to the CE# edge can cause the wrong cycle to be latched. Place a series 33 ohm resistor on each NAND control line (CE#, RE#, WE#, CLE, ALE, WP#) if the host SoC is more than 50 mm away, to dampen reflections on the parallel bus at 20 ns access time.
Informações de conformidade
RoHS compliant per Macronix product page. Industrial temperature grade -40 C to +85 C. Not AEC-Q100 qualified - choose the dedicated automotive-grade Macronix SLC NAND variant for safety-critical automotive modules.
