MT29F8G16ADBDAH4-IT:D - 8Gb x16 SLC NAND Flash, 1.8V | Micron
N.º da peça: MT29F8G16ADBDAH4-IT:D ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.05 | $60,50 |
| 100 | $5.2 | $520,00 |
| 500 | $4.45 | $2.225,00 |
| 1.000 | $3.95 | $3.950,00 |
MT29F8G16ADBDAH4-IT:D Visão geral
An SLC (Single-Level Cell) NAND flash is a non-volatile memory that stores one bit per memory cell, providing higher write endurance, faster write speeds, and longer data retention than MLC/TLC counterparts. NAND Flash sits below NOR Flash in the storage hierarchy, optimized for high-density sequential and page-based access in embedded systems, automotive infotainment, industrial gateways, and boot/media storage subsystems where reliability and bit-level integrity outweigh raw cost-per-bit.
Key features include 8Gbit density (1 Gbyte), x16 data bus for high-throughput parallel access, ONFI-compatible asynchronous interface, internal data ECC support per page, and a 63-VFBGA surface-mount package suitable for compact, reflow-solderable embedded designs. The device supports standard NAND command set (read, program, erase, status read, ID read) and operates from a single 1.8V Vcc rail.
The MT29F8G16ADBDAH4-IT:D uses Micron's 4Gb/8Gb/16Gb NAND flash die platform, leveraging proven floating-gate SLC cell technology and a mature CMOS process. Page size is typically 2048 bytes + 64 bytes spare (for x16), supporting partial-page programming and block erase. The parallel interface allows direct connection to microcontrollers, application processors, and FPGAs without external glue logic.
Typical applications include automotive infotainment and telematics storage, industrial control/IIoT gateways, networking equipment (switches/routers for OS images and logs), point-of-sale terminals, medical data recorders, and Linux/Android embedded boot or mass-storage subsystems requiring reliable, industrial-temperature non-volatile memory.
When designing with this part, ensure proper signal integrity on the parallel data bus, respect Vcc ramp sequencing, and implement software or hardware ECC for data integrity. The compact 9x11 mm VFBGA footprint simplifies PCB layout but requires careful fan-out and via-in-pad or microvia design for reliable manufacturability.
This page synthesizes distributor pricing, drop-in compatible alternatives across Micron and competing vendors, application guidance, and practical PCB/thermal design notes beyond the manufacturer datasheet to accelerate your embedded storage design.
Alternativas drop-in para MT29F8G16ADBDAH4-IT:D — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MT29F8G16ADBDAH4-AIT:D
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT29F8G16ADBDAH4-IT:D TR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT29F4G08ABADAH4-ITX:D
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT29F16G08ADACAH4:C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT29F8G16ADACAH4-IT:D
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
K9F8G08U0M-PCB0
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT29F8G16ADBDAH4-IT:D Classificações máximas e características elétricas
| Tipo de memória | Non-volatile FLASH - NAND (SLC) |
| Tamanho da memória | 8 Gbit (1 Gbyte) |
| Memory Organization | 512M x 16 |
| Interface | Parallel (asynchronous, x16) |
| Access Time | 25 ns |
| Supply Voltage (Vcc) | 1.7 V to 1.95 V (1.8 V typ) |
| Supply Voltage Max | 1.95 V |
| Supply Voltage Min | 1.7 V |
| Temperatura de operação | -40C to +85C (Industrial) |
| Encapsulamento / Caixa | 63-VFBGA (9 mm x 11 mm) |
| Tipo de montagem | Surface Mount |
| Technology | SLC NAND Flash |
| Page Size | 2048 bytes + 64 bytes spare (x16) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do MT29F8G16ADBDAH4-IT:D 63-vfbga (9 mm x 11 mm)
Configuração de pinos para MT29F8G16ADBDAH4-IT:D (pacote 63-vfbga (9 mm x 11 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MT29F8G16ADBDAH4-IT:D.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MT29F8G16ADBDAH4-IT:D é adequado para 6 aplicaçãos: Automotive Infotainment & Telematics, Industrial IoT Gateways & Edge Storage, Networking Equipment (Switches / Routers), Point-of-Sale (POS) Terminals, Medical Data Recorders / Patient Monitoring, Embedded Boot / Mass-Storage Subsystems.
Automotive Infotainment & Telematics
The MT29F8G16ADBDAH4-IT:D's 8 Gbit SLC density, x16 parallel interface, and 1.8V Vcc make it ideal for automotive infotainment head units and telematics control units (TCUs) that store navigation maps, audio buffers, OTA staging images, and event logs. Its -40C to +85C industrial temperature range covers cabin and under-hood environments. Compared to MLC/TLC, SLC delivers higher write endurance (typically 100k P/E cycles) which is critical for the constantly-updating telematics/OTA use case. The 25 ns access time provides low-latency reads for fast boot and responsive UI rendering. Place the 63-VFBGA on inner PCB layers with via-in-pad for clean fan-out, and route the 16-bit data bus with matched-length signals to the host SoC to meet parallel NAND timing.
Recomendado
Industrial IoT Gateways & Edge Storage
Industrial IoT gateways require reliable, long-retention storage for sensor logs, firmware images, and protocol buffers. The MT29F8G16ADBDAH4-IT:D delivers 1 Gbyte of SLC capacity at 1.8V, perfectly sized for storing Linux rootfs, application binaries, and rolling telemetry buffers in IIoT edge nodes. Its x16 bus supports high-throughput streaming from sensors (cameras, vibration, audio) without bottlenecking the host MCU. SLC's 10x write endurance advantage over MLC extends service life in 24/7 logging applications. Use the device alongside a hardware ECC engine (BCH or Hamming) on the host side; the standard NAND command set (00h/30h read, 80h/10h program, 60h/D0h erase) is compatible with common controller IPs.
Recomendado
Networking Equipment (Switches / Routers)
Small-to-medium networking switches and routers use parallel NAND for storing bootloader, OS image (Linux/uClinux), configuration files, and system logs. The MT29F8G16ADBDAH4-IT:D's 8 Gbit capacity is sufficient for a compressed router firmware and persistent log buffer. Its 25 ns access time keeps read latency low for fast boot and quick firmware-update application. The 63-VFBGA's compact 9x11 mm footprint fits beneath SoC heat-spreaders on space-constrained switch PCBAs. Operate the part from a clean 1.8V LDO; add 0.1 uF + 10 uF decoupling close to the balls to suppress Vcc transients during simultaneous page-program operations across multiple CE# blocks.
Recomendado
Point-of-Sale (POS) Terminals
POS terminals need reliable, tamper-resistant storage for transaction logs, firmware, payment certificates, and audit trails across multi-year deployment cycles. The MT29F8G16ADBDAH4-IT:D's SLC endurance and long data retention (10+ years per Micron) make it well-suited for retail terminals that write thousands of small audit records. Its 1 Gbyte density comfortably holds a Linux distro, terminal application, and rolling logs. The parallel x16 interface pairs naturally with ARM application cores from NXP i.MX or Microchip SAMA5 that integrate ONFI-compatible NAND controllers. Design tip: implement wear-leveling and bad-block management in software, even on SLC - Micron specifies <2% initial bad blocks at shipping.
Recomendado
Medical Data Recorders / Patient Monitoring
Patient monitors, infusion pumps, and diagnostic analyzers require non-volatile storage for patient data, calibration logs, and event history with high reliability and data integrity. The MT29F8G16ADBDAH4-IT:D's SLC technology delivers the bit-level integrity medical applications demand, with predictable read/write latency that supports real-time logging loops. Its industrial temperature range accommodates clinical environments. The x16 bus enables fast dumping of high-resolution waveform or imaging buffers. When designing in this application, use BCH ECC with 8-bit correction per 512 bytes - this matches Micron's recommended ECC strength for 8Gbit SLC and ensures bit-error-rate stays below 10^-15 over the product's lifetime.
Recomendado
Embedded Boot / Mass-Storage Subsystems
Linux/Android-based designs use NAND flash as the primary boot and mass-storage device. The MT29F8G16ADBDAH4-IT:D with 1 Gbyte density is well-suited to host a U-Boot bootloader, kernel, rootfs, and persistent user data partition in entry-level set-top boxes, HMI panels, or industrial printers. The 63-VFBGA package integrates easily with most SoCs that include NAND controllers. SLC's deterministic write latency simplifies file-system journaling overhead compared to MLC. Use the device in ONFI-compatible asynchronous mode; Micron's MT29F family supports the standard command set, so existing Linux/U-Boot NAND drivers work without modification.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MT29F8G16ADBDAH4-IT:D — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MT29F8G16ADBDAH4-AIT:D | MT29F8G16ADBDAH4-IT:D TR | MT29F4G08ABADAH4-ITX:D | MT29F16G08ADACAH4:C | MT29F8G16ADACAH4-IT:D | K9F8G08U0M-PCB0 |
|---|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung |
| Package | 63-VFBGA (9x11 mm) | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA / TSOP48 (verify) |
| Density | 8 Gbit (1 Gbyte) | 8 Gbit | 8 Gbit | 4 Gbit | 16 Gbit | 8 Gbit | 8 Gbit |
| Bus Width | x16 | x16 | x16 | x8 | x8 | x16 | x8 |
| Supply Voltage | 1.7 V - 1.95 V (1.8 V) | 1.7 V - 1.95 V | 1.7 V - 1.95 V | 1.7 V - 1.95 V | 1.7 V - 1.95 V | 1.7 V - 1.95 V | 1.7 V - 1.95 V |
| Cell Type | SLC | SLC | SLC | SLC | SLC | SLC | SLC |
Principais diferenciais
- x16 bus for higher parallel throughput vs x8 competitors (vs K9F8G08U0M-PCB0)
- Industrial temperature grade (-40C to +85C) standard (vs MT29F16G08ADACAH4:C)
- Single-vendor family scaling across densities (vs MT29F4G08ABADAH4-ITX:D)
Notas de projeto
Decouple the 1.8V Vcc rail with a 0.1 uF X7R ceramic placed within 5 mm of the 63-VFBGA balls, plus a 10 uF bulk ceramic or low-ESR tantalum. NAND flash current spikes sharply during page-program operations (peak tPROG current can exceed 30 mA per chip-enable). Use a low-noise LDO (e.g., LT3042 or LP5900) rated for at least 200 mA with <20 uVrms noise to support clean Vcc during read operations in audio-sensitive applications.
The 63-VFBGA at 9x11 mm has a 0.8 mm ball pitch. Use a 4-layer PCB with via-in-pad or microvia (laser-drilled) stack-up to fan out the inner balls; standard through-vias between balls will not fit at this pitch. Match the data bus (DQ0-DQ15), command latch (ALE), address latch (CLE), and RE/WE lengths within +/- 2 mm to meet the 25 ns tRC timing budget on the parallel interface.
Do not assume x8/x16 bus-width compatibility. MT29F8G16ADBDAH4-IT:D is x16 - if you substitute an x8 part (like MT29F4G08ABADAH4-ITX:D or K9F8G08U0M) into the same PCB, the host firmware must reprogram the NAND controller's bus-width register. Always implement software ECC (BCH 8-bit per 512 bytes minimum) - Micron does not include on-die ECC in this family, and skipping ECC will result in silent data corruption over time.
Although NAND flash is not power-hungry (active read current typically 30 mA, standby 10 uA), continuous heavy page-program workloads can raise the die temperature. In enclosed industrial housings with no airflow, derate the program/erase cycle rate above +70C ambient. The 63-VFBGA's center balls provide some thermal conduction to inner PCB ground planes - stitch thermal vias beneath the BGA to spread heat into a 1 oz ground pour.
Informações de conformidade
RoHS and REACH compliant per Micron product page (2026-10-09). Halogen-free status not stated in the verified data - set to unknown. The -AIT:D variant of this part is AEC-Q100 qualified; the standard IT:D suffix denotes industrial temperature grade only.
