MT40A512M16HA-083E:A - 8Gb DDR4 512Mx16 SDRAM | Micron
N.º da peça: MT40A512M16HA-083E:A ✓ Ativo| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MT40A512M16HA-083E:A Visão geral
DDR4 SDRAM is a volatile memory technology that stores data in an array of cells and refreshes its contents periodically to maintain data retention. Within the memory hierarchy, DDR4 SDRAM is a high-capacity working-memory component used by computer processors, embedded systems, networking equipment, and industrial controllers. The MT40A512M16HA-083E:A combines a 512M x 16 organization with DDR4 timing and interface features intended for reliable high-bandwidth embedded applications.
The verified distributor and manufacturer listings identify this part as an 8Gbit, 512Mx16 DDR4 SDRAM with a 1.2 GHz data rate, 1.14 V to 1.26 V operating voltage, and a 96-FBGA (9x14) package. The x16 organization provides a wider data path than x8 devices when used in systems whose memory controller supports the corresponding organization. The exact speed-bin, timing, voltage, and temperature details should be confirmed against the current Micron datasheet before layout or firmware qualification.
This memory is suited to embedded processors, industrial controllers, communications equipment, data-acquisition systems, and other applications that use DDR4 SDRAM directly or through a compatible memory controller. The 96-ball FBGA package requires careful PCB escape routing, power-delivery design, and thermal analysis. Because DRAM packages are sensitive to voltage noise and signal integrity, follow the manufacturer’s reference layout and power recommendations rather than relying on generic BGA rules.
The main design consideration is ensuring that the memory controller, board layout, voltage rails, and firmware memory timing all support the selected DDR4 device and operating conditions. The part number suffix identifies the vendor ordering configuration, so designers should verify package orientation, ball assignments, and temperature requirements during procurement and validation. This page combines verified distributor specifications, manufacturer references, cross-reference results, and practical integration guidance to support component selection.
Unlike a standalone register or interface IC, this device is a high-density, volatile memory component whose behavior depends strongly on system-level memory design. Use the exact Micron part documentation as the authoritative source for electrical, timing, mechanical, and reliability limits before production release.
Alternativas drop-in para MT40A512M16HA-083E:A — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
HGD48G16M26
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT40A512M16HA-083E:A Classificações máximas e características elétricas
| Tipo de memória | DDR4 SDRAM |
| Memory Density | 8 Gbit |
| Memory Organization | 512M x 16 |
| Taxa de dados | 1.2 GHz |
| Supply Voltage Range | 1.14 V to 1.26 V |
| Encapsulamento | 96-FBGA (9 x 14) |
| Interface | Parallel DDR4 SDRAM |
| Temperatura de operação | 0C to +95C |
| Tipo de montagem | Surface Mount |
| Volatile Memory | Yes |
| Technology | SDRAM - DDR4 |
| Memory Format | DRAM |
| Status RoHS | Compliant |
| Ball Count | 96 balls |
| Memory Category | Volatile DRAM |
| Manufacturer | Micron Technology Inc. |
| Product Status | Active |
Guia de Configuração de Pinos do MT40A512M16HA-083E:A 96-fbga (9 x 14)
Configuração de pinos para MT40A512M16HA-083E:A (pacote 96-fbga (9 x 14)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MT40A512M16HA-083E:A.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MT40A512M16HA-083E:A é adequado para 6 aplicaçãos: Embedded Processor Systems, Industrial Control Equipment, Networking and Communications, Data Acquisition and Test Systems, Communications Gateways, Robotics and Automation.
Embedded Processor Systems
MT40A512M16HA-083E:A fits embedded processor platforms whose memory controller supports DDR4 with a 512M x 16 organization. Its verified 8Gb density provides 1 GB of addressable memory using two chips in a typical x32 arrangement. The 1.2 GHz data rate and 1.14 V to 1.26 V supply range fit standard DDR4 power planning, while the 96-FBGA package requires a carefully controlled multilayer PCB. Designers should confirm controller compatibility, address mapping, and training support before layout release.
Recomendado
Industrial Control Equipment
Industrial controllers often need predictable external memory for deterministic control data, diagnostics, and logging. The MT40A512M16HA-083E:A provides 8Gb of DDR4 storage in a 512M x 16 organization, and its listed 0C to +95C range provides a useful baseline for equipment operating within that range. The device should be paired with an industrial-rated memory controller, proper supply sequencing, and validated thermal design. Confirm long-term availability and any extended-temperature requirements before using this exact suffix.
Recomendado
Networking and Communications
For packet buffering, protocol tables, and communications logs, MT40A512M16HA-083E:A supplies high-density DDR4 in a x16 organization that can be paired with compatible memory controllers. The verified 1.2 GHz interface and 1.14 V to 1.26 V voltage range are appropriate starting criteria for DDR4 designs. The 96-FBGA package demands controlled escape routing, reference planes, and decoupling to preserve timing margin. System designers should simulate the complete memory channel and test with production board variants.
Recomendado
Data Acquisition and Test Systems
Data-acquisition and test systems can use MT40A512M16HA-083E:A when temporary buffers, firmware overlays, or sample storage require more capacity than internal memory provides. The 8Gb density and 512M x 16 organization support systems designed for parallel DDR4 access, while the 1.2 GHz rate provides a defined performance class for data movement. Designers must account for ECC requirements, controller support, thermal conditions, and software initialization. Use manufacturer timing specifications rather than assuming a generic DDR4 profile.
Recomendado
Communications Gateways
Gateway equipment can use MT40A512M16HA-083E:A for local buffering, protocol translation tables, and firmware data when the controller supports a 512M x 16 DDR4 interface. The verified 8Gb capacity is useful for dual-channel or multi-chip arrangements, but the exact topology depends on the SoC memory interface and board constraints. The 96-FBGA (9x14) package requires high-quality BGA assembly and thermal-via planning. Validate DDR4 training, refresh behavior, and firmware memory initialization across all intended operating states.
Recomendado
Robotics and Automation
Robotics controllers and automation equipment can benefit from the MT40A512M16HA-083E:A when motion-control software, sensor buffers, and diagnostic logs require external DDR4 memory. The component’s x16 organization must match the controller and interconnect arrangement, and the 1.2 GHz speed class must be supported by the complete memory channel. Because DDR4 is volatile, firmware must include correct initialization, refresh, and power-management procedures. Confirm mechanical, temperature, and long-term supply requirements before design freeze.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MT40A512M16HA-083E:A — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | HGD48G16M26 |
|---|---|---|
| Package | 96-FBGA (9 x 14) | 96-FBGA (9 x 14) candidate; confirm supplier data |
| Brand | Micron Technology | HGCHIPS |
| Memory Type | DDR4 SDRAM | DDR4 candidate; confirm supplier data |
| Density | 8 Gbit | 8 Gbit candidate |
| Organization | 512M x 16 | 512M x 16 candidate |
| Data Rate | 1.2 GHz | 1.2 GHz candidate |
| Replacement Confidence | Reference part | Candidate only; pinout and die revision require confirmation |
Principais diferenciais
- Exact 512M x 16 organization (vs MT40A1G8PM-083E:A)
- Verified DDR4 1.2 GHz performance class (vs HGD48G16M26)
- Documented Micron 96-FBGA package configuration (vs HGD48G16M26)
Notas de projeto
The verified supply range is 1.14 V to 1.26 V, but the memory rail must also meet Micron’s detailed DC, AC ripple, transient, and sequencing requirements. Place bulk and local decoupling close to the 96-ball FBGA power balls, provide a continuous ground reference, and verify the rail with realistic controller and refresh activity. Do not design from the nominal 1.2 V value alone.
Use the Micron package drawing and reference layout for the 96-FBGA (9x14) escape routing. Preserve short, symmetric DDR4 routes, avoid plane splits on byte lanes, maintain continuous return paths, and account for via stubs and crosstalk. The x16 organization makes lane-by-lane routing and controller pin assignment critical, so complete signal-integrity simulations should include the selected memory controller and PCB stack-up.
Do not substitute an x8 DDR4 device solely because it has the same 8Gb density. MT40A512M16HA-083E:A is 512M x 16, while MT40A1G8PM-083E:A is listed as 1G x 8; the organizations affect chip-select wiring, address mapping, firmware configuration, and potentially the PCB. Validate controller support and all timing parameters before treating any alternate part as compatible.
DDR4 SDRAM performance and reliability depend on a stable power rail and controlled junction temperature. Model the memory, controller, and surrounding components together, including board copper, vias, enclosure airflow, and worst-case ambient temperature. The listed 0C to +95C range is a device operating specification, not a guarantee that every board layout maintains acceptable margin throughout that range.
Validate DDR4 eye masks, skew, jitter, impedance, and crosstalk with the actual controller, package model, PCB stack-up, and intended memory topology. Account for BGA pad parasitics and via transitions rather than relying only on schematic connectivity. Test early silicon with the production memory configuration and include temperature, voltage, and refresh conditions in the validation plan.
Informações de conformidade
RoHS status is confirmed by the verified distributor data. Other compliance attributes are not explicitly established in the supplied sources and remain unknown.
