MT53E768M64D4HJ-046 - 48Gbit LPDDR4X SDRAM | Micron
N.º da peça: MT53E768M64D4HJ-046 ✓ Ativo| Qtd. | Preço unitário | Total |
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MT53E768M64D4HJ-046 Visão geral
LPDDR4X (Low Power Double Data Rate 4X) is a JEDEC-defined high-bandwidth, low-voltage mobile DRAM standard used as the main-system memory in smartphones, tablets, automotive infotainment, and edge-AI compute platforms. LPDDR4X sits within the mobile DRAM hierarchy alongside LPDDR4 and below LPDDR5, and is distinguished from LPDDR4 by a lower VDDQ I/O supply that significantly reduces interface power at the same data rate.
Key features of this device include its 48Gbit (6 GB) density in a single package, a wide 64-bit data bus, 2133 MHz clock rate with 3.5 ns access latency, and the ultra-compact 556-ball fine-pitch BGA (FBGA/WFBGA) footprint suited to space-constrained PCBs. Micron offers this die in multiple temperature and status suffixes (AAT, AUT, AIT, WT) covering commercial and automotive-grade operating conditions.
The MT53E LPDDR4X family uses a CMOS dynamic memory core with bank-group architecture supporting burst accesses over a parallel interface, and quad-die package (QDP) variants are referenced by distributors (FBGA QDP coding on the B-suffix speed bins). Signals use LVSTL (Low Voltage Swing Terminated Logic) terminated I/O for signal integrity at 2133 Mbps/pin.
Typical applications include automotive digital cockpits and ADAS platforms, high-resolution mobile displays and handsets, networking and edge-AI compute modules, and embedded systems requiring multi-gigabyte memory bandwidth in a small footprint.
Design consideration: LPDDR4X routing demands strict length matching of the 64-bit data bus, on-die-termination configuration during controller initialization, and a regulated VDD2/VDDCA power rail with fast transient response; consult the Micron datasheet and controller compatibility list before layout.
This page synthesizes distributor listings, temperature-suffix variants, and drop-in same-die alternatives not consolidated in the manufacturer part catalog.
Alternativas drop-in para MT53E768M64D4HJ-046 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MT53E768M64D4HJ-046 AUT:C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT53E768M64D4HJ-046 AIT:A
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT53E768M64D4HJ-046 AAT:C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT53E768M64D4HJ-046 WT:C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT53E768M64D4HJ-046 AAT:B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT53E768M64D4HJ-046 AIT MS:C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT53E768M64D4HJ-046 Classificações máximas e características elétricas
| Tipo de memória | SDRAM - Mobile LPDDR4X |
| Tamanho da memória | 48 Gbit (6 GB) |
| Memory Organization | 768M x 64 |
| Interface | Parallel |
| Clock Frequency | 2.133 GHz |
| Access Time | 3.5 ns |
| Taxa de dados | 2133 Mbps/pin |
| I/O Interface Standard | LVSTL |
| Encapsulamento | 556-WFBGA (12.4 mm x 12.4 mm) |
| Tipo de montagem | Surface Mount |
| Automotive Qualification | Available (AUT suffix variant) |
Guia de Configuração de Pinos do MT53E768M64D4HJ-046 556-wfbga (12.4 mm x 12.4 mm)
Configuração de pinos para MT53E768M64D4HJ-046 (pacote 556-wfbga (12.4 mm x 12.4 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MT53E768M64D4HJ-046.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MT53E768M64D4HJ-046 é adequado para 6 aplicaçãos: Automotive Digital Cockpit and Infotainment, Edge-AI Compute Modules, Mobile Handsets and Tablets, Networking and Communication Equipment, Industrial Vision and Machine Inspection, Test, Measurement and Prototyping Platforms.
Automotive Digital Cockpit and Infotainment
The MT53E768M64D4HJ-046 family fits automotive cockpit SoCs that drive multiple high-resolution displays and require several gigabytes of shared memory. The AUT:C automotive suffix variant is listed in Micron's automotive LPDDR4/LPDDR4X catalog, and Micron supports safety workflows with FMEDA data, Safety Manual, and Pin FMEA reporting. The 48Gbit (6 GB) density on a 64-bit bus at 2133 Mbps/pin supplies roughly 17 GB/s class bandwidth for map rendering, cluster graphics, and multimedia. Designers should verify controller speed-bin support and use the AUT grade wherever the platform requires automotive qualification evidence rather than the commercial AAT suffix.
Recomendado
Edge-AI Compute Modules
Edge-AI accelerators and SoMs need multi-gigabyte working memory for neural network activation buffers and frame buffers, making the 6 GB MT53E768M64D4HJ-046 a strong fit. Its 768M x 64 organization provides a wide 64-bit parallel interface at 2133 Mbps/pin with LVSTL signaling, delivering the burst bandwidth CNN and transformer inference workloads demand while LPDDR4X low VDDQ operation keeps interface power manageable in fanless enclosures. The 12.4 mm x 12.4 mm 556-ball WFBGA leaves routing room for power inductors and the length-matched bus on a compact module. Confirm that the module's memory controller init code matches the C-status speed bin before production.
Recomendado
Mobile Handsets and Tablets
Smartphone and tablet main memory is the classic LPDDR4X use case, and the 48Gbit 768M x 64 MT53E768M64D4HJ-046 provides 6 GB in a single 556-ball WFBGA that fits application-processor PoP-adjacent layouts. The 2133 MHz clock and 3.5 ns access time match mainstream mobile SoC memory-controller speed bins, while LPDDR4X low-VDDQ I/O directly extends battery life during heavy multitasking and gaming. Deep-power-down and self-refresh modes managed by the controller minimize standby drain. Handset designers should validate the exact die revision and status code (WT/AAT suffix) against the SoC vendor's memory compatibility list before tape-out.
Recomendado
Networking and Communication Equipment
Enterprise access points, small-cell radios, and network appliances use LPDDR4X as packet-buffer and control-plane memory where DDR4 DIMM solutions are too power hungry. The MT53E768M64D4HJ-046's 6 GB capacity handles large flow tables and jitter buffers, and its 64-bit bus at 2133 Mbps/pin sustains the sustained read/write streaming typical of line-rate forwarding. The industrial AIT:A suffix suits equipment specified for extended ambient temperatures in sealed outdoor enclosures. Because networking boards often run multi-Phy topologies, follow Micron's routing guidelines for length-matched LVSTL bus groups and reference-plane continuity to preserve signal integrity at speed.
Recomendado
Industrial Vision and Machine Inspection
Machine-vision controllers buffering multiple high-frame-rate camera streams benefit from the MT53E768M64D4HJ-046's combination of 6 GB capacity and high burst bandwidth. A 64-bit LPDDR4X bus at 2133 Mbps/pin absorbs multi-sensor image pipelines without dropping frames, while LPDDR4X's lower interface voltage reduces heat in sealed industrial enclosures with passive cooling. The AIT industrial suffix addresses factory-floor temperature ranges and the AUT suffix serves vision systems integrated into mobile machinery. Designers should budget memory bandwidth across capture, inference, and display paths, and enable controller refresh tuning per the Micron datasheet temperature-compensated refresh guidance.
Recomendado
Test, Measurement and Prototyping Platforms
FPGA- and SoC-based instrumentation and prototyping boards use LPDDR4X to buffer high-speed waveform and logic data, and the 48Gbit MT53E768M64D4HJ-046 gives instrument designers 6 GB of capture memory on a single package. The 2133 MHz, 3.5 ns timing profile is supported by mainstream memory-controller IP, and the WT wide-temperature suffix provides margin for bench-to-field deployment across variable environments. Since 556-ball WFBGA rework is impractical, prototype builds should populate the exact target suffix and status code intended for production, and validate initialization timing with the controller vendor's compliance suites before committing layout.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MT53E768M64D4HJ-046 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MT53E768M64D4HJ-046 AUT:C | MT53E768M64D4HJ-046 AIT:A | MT53E768M64D4HJ-046 AAT:C | MT53E768M64D4HJ-046 WT:C | MT53E768M64D4HJ-046 AAT:B | MT53E768M64D4HJ-046 AIT MS:C |
|---|---|---|---|---|---|---|---|
| Package | 556-WFBGA (12.4x12.4) | 556-WFBGA (12.4x12.4) - same | 556-WFBGA (12.4x12.4) - same | 556-WFBGA (12.4x12.4) - same | 556-WFBGA (12.4x12.4) - same | 556-WFBGA (12.4x12.4) - same | 556-WFBGA (12.4x12.4) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Memory Size | 48 Gbit | 48 Gbit | 48 Gbit | 48 Gbit | 48 Gbit | 48 Gbit | 48 Gbit |
| Memory Organization | 768M x 64 | 768M x 64 | 768M x 64 | 768M x 64 | 768M x 64 | 768M x 64 | 768M x 64 |
| Clock Frequency | 2.133 GHz | 2.133 GHz | 2.133 GHz | 2.133 GHz | 2.133 GHz | 2.133 GHz | 2.133 GHz |
| Access Time | 3.5 ns | 3.5 ns | 3.5 ns | 3.5 ns | 3.5 ns | 3.5 ns | 3.5 ns |
| Temperature Grade | Per suffix (verify with Micron) | Automotive (A) | Industrial (AI) | Commercial (AA) | Wide temperature (WT) | Commercial (AA) | Industrial (AI) |
Principais diferenciais
- Automotive qualification option on identical die (vs MT53E768M64D4HJ-046 AAT:C)
- Industrial temperature availability (vs MT53E768M64D4HJ-046 AAT:C)
- 48Gbit single-package density on a 64-bit bus (vs MT53E512M64D2HJ-046)
- Trade-off: no verified cross-brand pin-compatible second source (vs Samsung / SK Hynix LPDDR4X equivalents)
Notas de projeto
LPDDR4X buses at 2133 Mbps/pin require per-byte length matching (typically within +/-25 mil intra-byte at standard PCB stackups), controlled impedance (approximately 40-60 ohm single-ended per controller vendor guidelines), and solid reference planes under every LVSTL signal group. Avoid splitting DQ byte lanes across plane gaps, and keep the CA bus routed as a matched group with its own timing budget. Run IBIS-AMI simulation with the Micron LPDDR4X IBIS model and the SoC controller model before tape-out; at this data rate, via stubs and AC-coupling capacitor placement materially affect eye margins.
LPDDR4X uses separate supply rails (VDD1 core and low VDD2/VDD2Q I/O domain) with fast transient requirements during burst accesses. Select a PMIC LPDDR4X rail with load-step response sized for full-bus write bursts, and follow the PMIC vendor's output capacitor recommendations rather than generic DDR values. Verify the exact rail voltages and power-up sequencing order from the Micron datasheet for the -046 speed bin; powering the I/O domain before or out of sequence with core can latch damage. Estimated: a 6 GB part active at full bus utilization draws on the order of hundreds of milliwatts for I/O alone, so thermal budgeting should include power-plane copper.
The most frequent MT53E-series design errors are suffix confusion and speed-bin mismatch. The suffix letters (AAT, AUT, AIT, WT and status code A/B/C) encode temperature grade and die status - substituting a commercial AAT for an automotive AUT in a vehicle platform voids qualification intent, and the B-versus-C status coding can reflect die-stack (QDP) differences per Mouser listings. Always confirm the full ordering PN against the approved vendor list and verify the memory controller's supported timing table covers the -046 bin's JEDEC AC parameters before layout release.
The 556-ball 12.4 mm x 12.4 mm WFBGA uses a fine ball pitch requiring via-in-pad with filled and capped vias or dog-bone fanout on high-layer-count boards. Follow Micron application note guidance for BGA fanout: dedicate interior layers to DQ routing, use back-drilling or blind vias to control stub lengths, and provide ample thermal relief via arrays under the package for solder reliability per IPC conventions. Since BGA solder joints cannot be visually inspected, add X-ray or boundary-scan-based inspection steps to the assembly test plan.
Informações de conformidade
Compliance status not stated in the verified web data. The AUT suffix is listed in Micron's automotive LPDDR4X catalog, but explicit AEC-Q100 qualification status for this exact suffix was not captured. Confirm via Micron product pages and certificates of conformance.
