MT53E768M64D4HJ-046 - 48Gbit LPDDR4X SDRAM | Micron
MPN: MT53E768M64D4HJ-046 β Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for MT53E768M64D4HJ-046 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
MT53E768M64D4HJ-046 AUT:C
β Drop-Inπ Reference alternative (not in catalog)
MT53E768M64D4HJ-046 AIT:A
β Drop-Inπ Reference alternative (not in catalog)
MT53E768M64D4HJ-046 AAT:C
β Drop-Inπ Reference alternative (not in catalog)
MT53E768M64D4HJ-046 WT:C
β Drop-Inπ Reference alternative (not in catalog)
MT53E768M64D4HJ-046 AAT:B
β Drop-Inπ Reference alternative (not in catalog)
MT53E768M64D4HJ-046 AIT MS:C
β Drop-Inπ Reference alternative (not in catalog)
MT53E768M64D4HJ-046 Maximum Ratings & Electrical Characteristics
| Memory Type | SDRAM - Mobile LPDDR4X |
| Memory Size | 48 Gbit (6 GB) |
| Memory Organization | 768M x 64 |
| Interface | Parallel |
| Clock Frequency | 2.133 GHz |
| Access Time | 3.5 ns |
| Data Rate | 2133 Mbps/pin |
| I/O Interface Standard | LVSTL |
| Package | 556-WFBGA (12.4 mm x 12.4 mm) |
| Mounting Type | Surface Mount |
| Automotive Qualification | Available (AUT suffix variant) |
MT53E768M64D4HJ-046 [data_needed: single die / qdp per suffix] Pin Configuration Guide
Complete pinout information for MT53E768M64D4HJ-046 ([data_needed: single die / qdp per suffix] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: single die / qdp per suffix] package pinout diagram for MT53E768M64D4HJ-046](/assets/package-diagrams/default.svg?v=1788069619)
No detailed pinout data available for MT53E768M64D4HJ-046.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
MT53E768M64D4HJ-046 is suitable for 6 applications: Automotive Digital Cockpit and Infotainment, Edge-AI Compute Modules, Mobile Handsets and Tablets, Networking and Communication Equipment, Industrial Vision and Machine Inspection, Test, Measurement and Prototyping Platforms.
Automotive Digital Cockpit and Infotainment
The MT53E768M64D4HJ-046 family fits automotive cockpit SoCs that drive multiple high-resolution displays and require several gigabytes of shared memory. The AUT:C automotive suffix variant is listed in Micron's automotive LPDDR4/LPDDR4X catalog, and Micron supports safety workflows with FMEDA data, Safety Manual, and Pin FMEA reporting. The 48Gbit (6 GB) density on a 64-bit bus at 2133 Mbps/pin supplies roughly 17 GB/s class bandwidth for map rendering, cluster graphics, and multimedia. Designers should verify controller speed-bin support and use the AUT grade wherever the platform requires automotive qualification evidence rather than the commercial AAT suffix.
Recommended
Edge-AI Compute Modules
Edge-AI accelerators and SoMs need multi-gigabyte working memory for neural network activation buffers and frame buffers, making the 6 GB MT53E768M64D4HJ-046 a strong fit. Its 768M x 64 organization provides a wide 64-bit parallel interface at 2133 Mbps/pin with LVSTL signaling, delivering the burst bandwidth CNN and transformer inference workloads demand while LPDDR4X low VDDQ operation keeps interface power manageable in fanless enclosures. The 12.4 mm x 12.4 mm 556-ball WFBGA leaves routing room for power inductors and the length-matched bus on a compact module. Confirm that the module's memory controller init code matches the C-status speed bin before production.
Recommended
Mobile Handsets and Tablets
Smartphone and tablet main memory is the classic LPDDR4X use case, and the 48Gbit 768M x 64 MT53E768M64D4HJ-046 provides 6 GB in a single 556-ball WFBGA that fits application-processor PoP-adjacent layouts. The 2133 MHz clock and 3.5 ns access time match mainstream mobile SoC memory-controller speed bins, while LPDDR4X low-VDDQ I/O directly extends battery life during heavy multitasking and gaming. Deep-power-down and self-refresh modes managed by the controller minimize standby drain. Handset designers should validate the exact die revision and status code (WT/AAT suffix) against the SoC vendor's memory compatibility list before tape-out.
Recommended
Networking and Communication Equipment
Enterprise access points, small-cell radios, and network appliances use LPDDR4X as packet-buffer and control-plane memory where DDR4 DIMM solutions are too power hungry. The MT53E768M64D4HJ-046's 6 GB capacity handles large flow tables and jitter buffers, and its 64-bit bus at 2133 Mbps/pin sustains the sustained read/write streaming typical of line-rate forwarding. The industrial AIT:A suffix suits equipment specified for extended ambient temperatures in sealed outdoor enclosures. Because networking boards often run multi-Phy topologies, follow Micron's routing guidelines for length-matched LVSTL bus groups and reference-plane continuity to preserve signal integrity at speed.
Recommended
Industrial Vision and Machine Inspection
Machine-vision controllers buffering multiple high-frame-rate camera streams benefit from the MT53E768M64D4HJ-046's combination of 6 GB capacity and high burst bandwidth. A 64-bit LPDDR4X bus at 2133 Mbps/pin absorbs multi-sensor image pipelines without dropping frames, while LPDDR4X's lower interface voltage reduces heat in sealed industrial enclosures with passive cooling. The AIT industrial suffix addresses factory-floor temperature ranges and the AUT suffix serves vision systems integrated into mobile machinery. Designers should budget memory bandwidth across capture, inference, and display paths, and enable controller refresh tuning per the Micron datasheet temperature-compensated refresh guidance.
Recommended
Test, Measurement and Prototyping Platforms
FPGA- and SoC-based instrumentation and prototyping boards use LPDDR4X to buffer high-speed waveform and logic data, and the 48Gbit MT53E768M64D4HJ-046 gives instrument designers 6 GB of capture memory on a single package. The 2133 MHz, 3.5 ns timing profile is supported by mainstream memory-controller IP, and the WT wide-temperature suffix provides margin for bench-to-field deployment across variable environments. Since 556-ball WFBGA rework is impractical, prototype builds should populate the exact target suffix and status code intended for production, and validate initialization timing with the controller vendor's compliance suites before committing layout.
Recommended
Recommended Products Summary
Engineering reference data for MT53E768M64D4HJ-046 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT53E768M64D4HJ-046 AUT:C | MT53E768M64D4HJ-046 AIT:A | MT53E768M64D4HJ-046 AAT:C | MT53E768M64D4HJ-046 WT:C | MT53E768M64D4HJ-046 AAT:B | MT53E768M64D4HJ-046 AIT MS:C |
|---|---|---|---|---|---|---|---|
| Package | 556-WFBGA (12.4x12.4) | 556-WFBGA (12.4x12.4) - same | 556-WFBGA (12.4x12.4) - same | 556-WFBGA (12.4x12.4) - same | 556-WFBGA (12.4x12.4) - same | 556-WFBGA (12.4x12.4) - same | 556-WFBGA (12.4x12.4) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Memory Size | 48 Gbit | 48 Gbit | 48 Gbit | 48 Gbit | 48 Gbit | 48 Gbit | 48 Gbit |
| Memory Organization | 768M x 64 | 768M x 64 | 768M x 64 | 768M x 64 | 768M x 64 | 768M x 64 | 768M x 64 |
| Clock Frequency | 2.133 GHz | 2.133 GHz | 2.133 GHz | 2.133 GHz | 2.133 GHz | 2.133 GHz | 2.133 GHz |
| Access Time | 3.5 ns | 3.5 ns | 3.5 ns | 3.5 ns | 3.5 ns | 3.5 ns | 3.5 ns |
| Temperature Grade | Per suffix (verify with Micron) | Automotive (A) | Industrial (AI) | Commercial (AA) | Wide temperature (WT) | Commercial (AA) | Industrial (AI) |
| LPDDR4X Coding | Yes (distributor-listed LPDDR4X on AUT/AIT MS suffixes) | Yes (LPDDR4X) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | Yes (LPDDR4X per Microchip USA) | Yes (LPDDR4X) |
| Unit Price | [DATA_NEEDED: quote-based] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Automotive qualification option on identical die (vs MT53E768M64D4HJ-046 AAT:C)
- Industrial temperature availability (vs MT53E768M64D4HJ-046 AAT:C)
- 48Gbit single-package density on a 64-bit bus (vs MT53E512M64D2HJ-046)
- Trade-off: no verified cross-brand pin-compatible second source (vs Samsung / SK Hynix LPDDR4X equivalents)
Design Notes
LPDDR4X buses at 2133 Mbps/pin require per-byte length matching (typically within +/-25 mil intra-byte at standard PCB stackups), controlled impedance (approximately 40-60 ohm single-ended per controller vendor guidelines), and solid reference planes under every LVSTL signal group. Avoid splitting DQ byte lanes across plane gaps, and keep the CA bus routed as a matched group with its own timing budget. Run IBIS-AMI simulation with the Micron LPDDR4X IBIS model and the SoC controller model before tape-out; at this data rate, via stubs and AC-coupling capacitor placement materially affect eye margins.
LPDDR4X uses separate supply rails (VDD1 core and low VDD2/VDD2Q I/O domain) with fast transient requirements during burst accesses. Select a PMIC LPDDR4X rail with load-step response sized for full-bus write bursts, and follow the PMIC vendor's output capacitor recommendations rather than generic DDR values. Verify the exact rail voltages and power-up sequencing order from the Micron datasheet for the -046 speed bin; powering the I/O domain before or out of sequence with core can latch damage. Estimated: a 6 GB part active at full bus utilization draws on the order of hundreds of milliwatts for I/O alone, so thermal budgeting should include power-plane copper.
The most frequent MT53E-series design errors are suffix confusion and speed-bin mismatch. The suffix letters (AAT, AUT, AIT, WT and status code A/B/C) encode temperature grade and die status - substituting a commercial AAT for an automotive AUT in a vehicle platform voids qualification intent, and the B-versus-C status coding can reflect die-stack (QDP) differences per Mouser listings. Always confirm the full ordering PN against the approved vendor list and verify the memory controller's supported timing table covers the -046 bin's JEDEC AC parameters before layout release.
The 556-ball 12.4 mm x 12.4 mm WFBGA uses a fine ball pitch requiring via-in-pad with filled and capped vias or dog-bone fanout on high-layer-count boards. Follow Micron application note guidance for BGA fanout: dedicate interior layers to DQ routing, use back-drilling or blind vias to control stub lengths, and provide ample thermal relief via arrays under the package for solder reliability per IPC conventions. Since BGA solder joints cannot be visually inspected, add X-ray or boundary-scan-based inspection steps to the assembly test plan.
Compliance Information
Compliance status not stated in the verified web data. The AUT suffix is listed in Micron's automotive LPDDR4X catalog, but explicit AEC-Q100 qualification status for this exact suffix was not captured. Confirm via Micron product pages and certificates of conformance.
