MX30UF1G16AC - 1Gb 1.8V SLC NAND Flash, 48-VFBGA | Macronix
N.º da peça: MX30UF1G16AC ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.55 | $25,50 |
| 100 | $2.18 | $218,00 |
| 500 | $1.92 | $960,00 |
| 1.000 | $1.68 | $1.680,00 |
MX30UF1G16AC Visão geral
A NAND Flash memory is a non-volatile storage technology that retains data without power using floating-gate memory cells arranged in NAND strings (series-connected cells per bitline), delivering high density at low cost per bit. SLC (Single-Level Cell) stores 1 bit per cell, giving the MX30UF1G16AC superior endurance (typically 100K P/E cycles), faster write performance, and 10-year data retention compared with MLC/TLC counterparts. Within the broader taxonomy, this device sits at NAND Flash -> Flash Memory -> Non-Volatile Memory -> Memory IC -> Semiconductor, and is frequently benchmarked against ONFI 1.0-compatible parallel NAND from other vendors.
Key features of the MX30UF1G16AC include 1.7 V to 1.95 V single supply operation, 25 ns access time, word/page write cycle time of 25 ns, industrial temperature range of -40C to +85C, and 10-year data retention. The part supports a standard NAND command set, offers hardware data protection, and integrates an internal page buffer to streamline sequential read/write operations. Multiple package options (48-VFBGA, 48-TSOP I, 63-ball BGA 9x11 mm) and a separate x8 variant (MX30UF1G18AC) provide designers with footprint flexibility.
Designed primarily for code storage and data logging in cost-sensitive embedded systems, the MX30UF1G16AC trades the higher density of managed eMMC for BOM simplicity and direct host-side control, which matters in industrial HMI, networking line cards, and boot/auxiliary storage where the host processor already implements the flash controller.
Typical applications include boot ROM/disk-on-chip for set-top boxes and routers, firmware/data storage in industrial PLCs, datalogging for metering and telemetry, automotive infotainment auxiliary storage (with system-level derating), and SSD bridging where a controller is bonded to raw NAND.
The MX30UF1G16AC is supported by Macronix reference controller firmware and ONFI 1.0 software drivers; designers should implement ECC (typically 8-bit per 528 bytes) and bad-block management at the host, as on-die ECC is not included on this part family.
Alternativas drop-in para MX30UF1G16AC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MX30UF1G18AC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30LF1G18AC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30UF2G16AC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30UF1G16AC Classificações máximas e características elétricas
| Tipo de memória | Non-Volatile FLASH (NAND) |
| Memory Format | FLASH - NAND (SLC) |
| Density | 1 Gbit |
| Memory Organization | 64M x 16 |
| Interface | Parallel (Asynchronous) |
| Access Time | 25 ns |
| Write Cycle Time (Word, Page) | 25 ns |
| Supply Voltage (VCC) | 1.7 V to 1.95 V |
| Temperatura de operação | -40C to +85C |
| Data Retention | 10 years |
| Technology | SLC NAND Flash |
| Tipo de montagem | Surface Mount |
| Encapsulamento / Caixa | 48-VFBGA (6x8 mm) |
| Supplier Device Package | 48-VFBGA (6x8) |
| Compliance | RoHS (compliant per available product data) |
| Programmability | Not Verified (DigiKey Programmable) |
| Alternate Package Option | 48-TSOP(I) 12mm x 20mm |
| Sister Part (x8 variant) | MX30UF1G18AC (1G x 8 in 63-ball 9x11 mm VFBGA) |
Configuração de pinos do MX30UF1G16AC
| Pino A1 | VSS — Ground |
| Pino A2 | I/O0 — Data I/O 0 |
| Pino A3 | I/O1 — Data I/O 1 |
| Pino A4 | I/O2 — Data I/O 2 |
| Pino A5 | I/O3 — Data I/O 3 |
| Pino A6 | I/O4 — Data I/O 4 |
| Pino A7 | I/O5 — Data I/O 5 |
| Pino A8 | VSS — Ground |
| Pino B1 | VCC — Core power (1.7V-1.95V) |
| Pino B2 | I/O15 — Data I/O 15 |
| Pino B3 | I/O6 — Data I/O 6 |
| Pino B4 | I/O7 — Data I/O 7 |
| Pino B5 | I/O8 — Data I/O 8 |
| Pino B6 | I/O9 — Data I/O 9 |
| Pino B7 | I/O10 — Data I/O 10 |
| Pino B8 | VCC — Core power (1.7V-1.95V) |
| Pino C1 | NC — Not connected (per datasheet) |
| Pino C2 | RE — Read Enable (active low) |
| Pino C3 | I/O14 — Data I/O 14 |
| Pino C4 | I/O13 — Data I/O 13 |
| Pino C5 | I/O12 — Data I/O 12 |
| Pino C6 | I/O11 — Data I/O 11 |
| Pino C7 | WP — Write Protect (active low) |
| Pino C8 | ALE — Address Latch Enable |
| Pino D1 | NC — Not connected (per datasheet) |
| Pino D2 | CE — Chip Enable (active low) |
| Pino D3 | WE — Write Enable (active low) |
| Pino D4 | I/O14 alt — [DATA_NEEDED: verify ball map against Macronix datasheet] |
| Pino D5 | CLE — Command Latch Enable |
| Pino D6 | RB — Ready/Busy (open drain) |
| Pino D7 | PRE — [DATA_NEEDED: verify ball map against Macronix datasheet] |
| Pino D8 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing for full BGA ball map |
| Pino E1 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino E2 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino E3 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino E4 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino E5 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino E6 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino E7 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino E8 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino F1 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino F2 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino F3 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino F4 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino F5 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino F6 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino F7 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| Pino F8 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
Aplicações típicas
MX30UF1G16AC é adequado para 6 aplicaçãos: Set-Top Box Boot + Data Storage, Industrial PLC Firmware Storage, Router / Networking Line Card Storage, Smart Meter Datalogging, Automotive Infotainment Auxiliary Storage, IoT Sensor Hub / Edge Data Buffer.
Set-Top Box Boot + Data Storage
The MX30UF1G16AC's 1 Gbit density, 25 ns parallel access and 1.7-1.95 V VCC make it a strong fit for set-top box (STB) boot ROM and channel/application storage. Placed on the local 1.8 V rail directly to the host SoC's NAND controller, the SLC NAND offers 100K P/E endurance and 10-year retention per the Macronix datasheet v1.2 (1.8V 1Gb family) - sufficient for OS image plus weekly channel table updates. The 48-VFBGA 6x8 mm keeps the PCB footprint small versus legacy 48-TSOP, while the same Macronix command set allows reuse of existing driver code. Designers should add 8-bit ECC per 528 B in the host controller.
Recomendado
Industrial PLC Firmware Storage
The MX30UF1G16AC delivers reliable firmware/data storage for industrial PLCs where -40C to +85C operation is mandatory. With 100K P/E endurance and 10-year data retention per Macronix specifications, the SLC NAND survives the frequent parameter changes typical of PLC logging workloads. The 1.7-1.95 V VCC lets the device share the SoC core rail without LDO overhead, while the 48-VFBGA 6x8 mm simplifies conformal-coated boards. Add 8-bit ECC + bad block management in the host CPU for deterministic data integrity across the industrial temperature range.
Recomendado
Router / Networking Line Card Storage
For router line cards, the MX30UF1G16AC is well matched to log buffer and routing-table NV storage. Its 25 ns access time supports short interrupt-latency writes, and the 1 Gbit density is ample for boot/firmware plus config and log retention. The Macronix ONFI 1.0-compatible command set aligns with common networking SoC NAND IPs. Place the VFBGA-48 near the host SoC with 10 uF + 0.1 uF decoupling on VCC; the 1.8 V rail matches modern switch ASIC core domains.
Recomendado
Smart Meter Datalogging
The MX30UF1G16AC is suited to smart-meter data logging where tamper-resistant, long-retention NV storage is needed. The -40C to +85C industrial temperature grade handles outdoor meter enclosures, while SLC NAND's high endurance tolerates frequent interval-log writes. The 1.8 V operation simplifies meter electronics powered by single-cell battery or harvested sources. Add host-side ECC and wear-leveling; pair with a microcontroller (e.g., NXP Kinetis or TI MSP432) that implements a NAND file system.
Recomendado
Automotive Infotainment Auxiliary Storage
The MX30UF1G16AC can serve auxiliary storage in automotive infotainment subsystems (non-safety-critical) where 1 Gbit of code/data is needed. The industrial -40C to +85C rating covers cabin conditions; however, per Macronix datasheet v1.2 the part is not explicitly AEC-Q100 qualified, so confirm with Macronix automotive product listings before deployment. The 48-VFBGA 6x8 mm fits compact infotainment PCBAs, and the 25 ns access matches typical infotainment SoC throughput.
Recomendado
IoT Sensor Hub / Edge Data Buffer
The MX30UF1G16AC is a low-power, code-and-buffer store for IoT sensor hubs and edge gateways. Its 1.7-1.95 V VCC lets it share the SoC core voltage, while 25 ns read access supports bursty sensor-data flushing. The 100K P/E endurance with 10-year retention suits always-on edge devices that log intermittently. Pair with a sensor hub microcontroller (e.g., STM32, NXP Kinetis) and use the Macronix ONFI 1.0 driver family, adding host ECC and wear-leveling for robust operation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MX30UF1G16AC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MX30UF1G18AC | MX30LF1G18AC | MX30UF2G16AC |
|---|---|---|---|---|
| Brand | Macronix | Macronix | Macronix | Macronix |
| Package | 48-VFBGA (6x8 mm) | 63-ball VFBGA (9x11 mm) - BGA family but different ball count | 48-TSOP(I) 12x20 mm or BGA per option | 48-VFBGA (6x8 mm) - same |
| Density | 1 Gbit | 1 Gbit | 1 Gbit | 2 Gbit |
| Organization | 64M x 16 | 128M x 8 | 128M x 8 | 128M x 16 |
| Supply Voltage (VCC) | 1.7 V to 1.95 V | 1.7 V to 1.95 V | 2.7 V to 3.6 V (3.3 V family) | 1.7 V to 1.95 V |
| Access Time | 25 ns | 25 ns | 25 ns | 25 ns |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Memory Type / Cell | NAND Flash (SLC) | NAND Flash (SLC) | NAND Flash (SLC) | NAND Flash (SLC) |
| On-die ECC | Not included (host ECC required) | Not included (host ECC required) | Not included (host ECC required) | Not included (host ECC required) |
Principais diferenciais
- 1.8 V native VCC with 1.7-1.95 V range (vs MX30LF1G18AC)
- x16 48-VFBGA footprint at 1 Gbit (vs MX30UF1G18AC (x8 63-ball BGA))
- Same package, double density upgrade path (vs MX30UF2G16AC)
- Industrial -40C to +85C temperature range (vs Consumer-grade NAND alternatives)
Notas de projeto
Estimated: At VCC = 1.8 V nominal, MX30UF1G16AC active read current is roughly tens of mA and standby current is sub-100 uA per Macronix datasheet family characteristics - exact ICC active/standby values must be cross-checked against the datasheet's DC characteristics table. Place a 10 uF ceramic + 0.1 uF high-frequency bypass on VCC adjacent to the VFBGA balls to suppress transient inrush during page read/program.
Route the parallel data bus (I/O0-I/O15) with matched lengths within a tight skew budget because NAND access (25 ns) is sensitive to skew on RE/WE relative to CLE/ALE. Keep CE per device to a short stub. For 48-VFBGA, escape-route all VSS/VCC balls to an unbroken plane; place 0.1 uF decoupling directly under the BGA in inner layers if the PCB stackup allows.
The 25 ns access timing imposes a setup/hold window that may be marginal at VCC = 1.7 V corner; validate timing at the host SoC's slowest process/temperature corner. Add a small RC damping on RB (Ready/Busy) if multiple NANDs share the bus to limit ringing.
Do not assume replacement with a Micron MT29F1G or Winbond W29N01 is pin-compatible without verifying the BGA ball map - Micron and Winbond typically use different ball assignments even at the same density. Always check the Macronix datasheet v1.2 mechanical drawing vs the candidate vendor's package, and implement host-side 8-bit ECC + bad-block management since this Macronix family does not include on-die ECC.
Informações de conformidade
RoHS compliant per Macronix product page; industrial temperature grade -40C to +85C; not explicitly AEC-Q100 qualified - confirm before automotive deployment.
