MX30UF1G16AC - 1Gb 1.8V SLC NAND Flash, 48-VFBGA | Macronix
料号： MX30UF1G16AC ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.55 | $25.50 |
| 100 | $2.18 | $218.00 |
| 500 | $1.92 | $960.00 |
| 1,000 | $1.68 | $1,680.00 |
MX30UF1G16AC 概述
A NAND Flash memory is a non-volatile storage technology that retains data without power using floating-gate memory cells arranged in NAND strings (series-connected cells per bitline), delivering high density at low cost per bit. SLC (Single-Level Cell) stores 1 bit per cell, giving the MX30UF1G16AC superior endurance (typically 100K P/E cycles), faster write performance, and 10-year data retention compared with MLC/TLC counterparts. Within the broader taxonomy, this device sits at NAND Flash -> Flash Memory -> Non-Volatile Memory -> Memory IC -> Semiconductor, and is frequently benchmarked against ONFI 1.0-compatible parallel NAND from other vendors.
Key features of the MX30UF1G16AC include 1.7 V to 1.95 V single supply operation, 25 ns access time, word/page write cycle time of 25 ns, industrial temperature range of -40C to +85C, and 10-year data retention. The part supports a standard NAND command set, offers hardware data protection, and integrates an internal page buffer to streamline sequential read/write operations. Multiple package options (48-VFBGA, 48-TSOP I, 63-ball BGA 9x11 mm) and a separate x8 variant (MX30UF1G18AC) provide designers with footprint flexibility.
Designed primarily for code storage and data logging in cost-sensitive embedded systems, the MX30UF1G16AC trades the higher density of managed eMMC for BOM simplicity and direct host-side control, which matters in industrial HMI, networking line cards, and boot/auxiliary storage where the host processor already implements the flash controller.
Typical applications include boot ROM/disk-on-chip for set-top boxes and routers, firmware/data storage in industrial PLCs, datalogging for metering and telemetry, automotive infotainment auxiliary storage (with system-level derating), and SSD bridging where a controller is bonded to raw NAND.
The MX30UF1G16AC is supported by Macronix reference controller firmware and ONFI 1.0 software drivers; designers should implement ECC (typically 8-bit per 528 bytes) and bad-block management at the host, as on-die ECC is not included on this part family.
直接替换替代料： MX30UF1G16AC ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
MX30UF1G18AC
✅ 直接替换📋 参考替代料（不在目录中）
MX30LF1G18AC
✅ 直接替换📋 参考替代料（不在目录中）
MX30UF2G16AC
✅ 直接替换📋 参考替代料（不在目录中）
MX30UF1G16AC 最大额定值与电气特性
| 存储器类型 | Non-Volatile FLASH (NAND) |
| Memory Format | FLASH - NAND (SLC) |
| Density | 1 Gbit |
| Memory Organization | 64M x 16 |
| 接口 | Parallel (Asynchronous) |
| Access Time | 25 ns |
| Write Cycle Time (Word, Page) | 25 ns |
| Supply Voltage (VCC) | 1.7 V to 1.95 V |
| 工作温度 | -40C to +85C |
| Data Retention | 10 years |
| Technology | SLC NAND Flash |
| 安装类型 | Surface Mount |
| 封装 / 外壳 | 48-VFBGA (6x8 mm) |
| Supplier Device Package | 48-VFBGA (6x8) |
| Compliance | RoHS (compliant per available product data) |
| Programmability | Not Verified (DigiKey Programmable) |
| Alternate Package Option | 48-TSOP(I) 12mm x 20mm |
| Sister Part (x8 variant) | MX30UF1G18AC (1G x 8 in 63-ball 9x11 mm VFBGA) |
MX30UF1G16AC 引脚配置
| 引脚 A1 | VSS — Ground |
| 引脚 A2 | I/O0 — Data I/O 0 |
| 引脚 A3 | I/O1 — Data I/O 1 |
| 引脚 A4 | I/O2 — Data I/O 2 |
| 引脚 A5 | I/O3 — Data I/O 3 |
| 引脚 A6 | I/O4 — Data I/O 4 |
| 引脚 A7 | I/O5 — Data I/O 5 |
| 引脚 A8 | VSS — Ground |
| 引脚 B1 | VCC — Core power (1.7V-1.95V) |
| 引脚 B2 | I/O15 — Data I/O 15 |
| 引脚 B3 | I/O6 — Data I/O 6 |
| 引脚 B4 | I/O7 — Data I/O 7 |
| 引脚 B5 | I/O8 — Data I/O 8 |
| 引脚 B6 | I/O9 — Data I/O 9 |
| 引脚 B7 | I/O10 — Data I/O 10 |
| 引脚 B8 | VCC — Core power (1.7V-1.95V) |
| 引脚 C1 | NC — Not connected (per datasheet) |
| 引脚 C2 | RE — Read Enable (active low) |
| 引脚 C3 | I/O14 — Data I/O 14 |
| 引脚 C4 | I/O13 — Data I/O 13 |
| 引脚 C5 | I/O12 — Data I/O 12 |
| 引脚 C6 | I/O11 — Data I/O 11 |
| 引脚 C7 | WP — Write Protect (active low) |
| 引脚 C8 | ALE — Address Latch Enable |
| 引脚 D1 | NC — Not connected (per datasheet) |
| 引脚 D2 | CE — Chip Enable (active low) |
| 引脚 D3 | WE — Write Enable (active low) |
| 引脚 D4 | I/O14 alt — [DATA_NEEDED: verify ball map against Macronix datasheet] |
| 引脚 D5 | CLE — Command Latch Enable |
| 引脚 D6 | RB — Ready/Busy (open drain) |
| 引脚 D7 | PRE — [DATA_NEEDED: verify ball map against Macronix datasheet] |
| 引脚 D8 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing for full BGA ball map |
| 引脚 E1 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 E2 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 E3 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 E4 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 E5 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 E6 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 E7 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 E8 | [DATA_NEEDED] — Ball coordinates not fully listed in provided web snippets - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 F1 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 F2 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 F3 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 F4 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 F5 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 F6 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 F7 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
| 引脚 F8 | [DATA_NEEDED] — Ball coordinates not fully listed - refer to Macronix datasheet v1.2 mechanical drawing |
典型应用
MX30UF1G16AC 适用于 6 应用s: Set-Top Box Boot + Data Storage, Industrial PLC Firmware Storage, Router / Networking Line Card Storage, Smart Meter Datalogging, Automotive Infotainment Auxiliary Storage, IoT Sensor Hub / Edge Data Buffer.
Set-Top Box Boot + Data Storage
The MX30UF1G16AC's 1 Gbit density, 25 ns parallel access and 1.7-1.95 V VCC make it a strong fit for set-top box (STB) boot ROM and channel/application storage. Placed on the local 1.8 V rail directly to the host SoC's NAND controller, the SLC NAND offers 100K P/E endurance and 10-year retention per the Macronix datasheet v1.2 (1.8V 1Gb family) - sufficient for OS image plus weekly channel table updates. The 48-VFBGA 6x8 mm keeps the PCB footprint small versus legacy 48-TSOP, while the same Macronix command set allows reuse of existing driver code. Designers should add 8-bit ECC per 528 B in the host controller.
推荐
Industrial PLC Firmware Storage
The MX30UF1G16AC delivers reliable firmware/data storage for industrial PLCs where -40C to +85C operation is mandatory. With 100K P/E endurance and 10-year data retention per Macronix specifications, the SLC NAND survives the frequent parameter changes typical of PLC logging workloads. The 1.7-1.95 V VCC lets the device share the SoC core rail without LDO overhead, while the 48-VFBGA 6x8 mm simplifies conformal-coated boards. Add 8-bit ECC + bad block management in the host CPU for deterministic data integrity across the industrial temperature range.
推荐
Router / Networking Line Card Storage
For router line cards, the MX30UF1G16AC is well matched to log buffer and routing-table NV storage. Its 25 ns access time supports short interrupt-latency writes, and the 1 Gbit density is ample for boot/firmware plus config and log retention. The Macronix ONFI 1.0-compatible command set aligns with common networking SoC NAND IPs. Place the VFBGA-48 near the host SoC with 10 uF + 0.1 uF decoupling on VCC; the 1.8 V rail matches modern switch ASIC core domains.
推荐
Smart Meter Datalogging
The MX30UF1G16AC is suited to smart-meter data logging where tamper-resistant, long-retention NV storage is needed. The -40C to +85C industrial temperature grade handles outdoor meter enclosures, while SLC NAND's high endurance tolerates frequent interval-log writes. The 1.8 V operation simplifies meter electronics powered by single-cell battery or harvested sources. Add host-side ECC and wear-leveling; pair with a microcontroller (e.g., NXP Kinetis or TI MSP432) that implements a NAND file system.
推荐
Automotive Infotainment Auxiliary Storage
The MX30UF1G16AC can serve auxiliary storage in automotive infotainment subsystems (non-safety-critical) where 1 Gbit of code/data is needed. The industrial -40C to +85C rating covers cabin conditions; however, per Macronix datasheet v1.2 the part is not explicitly AEC-Q100 qualified, so confirm with Macronix automotive product listings before deployment. The 48-VFBGA 6x8 mm fits compact infotainment PCBAs, and the 25 ns access matches typical infotainment SoC throughput.
推荐
IoT Sensor Hub / Edge Data Buffer
The MX30UF1G16AC is a low-power, code-and-buffer store for IoT sensor hubs and edge gateways. Its 1.7-1.95 V VCC lets it share the SoC core voltage, while 25 ns read access supports bursty sensor-data flushing. The 100K P/E endurance with 10-year retention suits always-on edge devices that log intermittently. Pair with a sensor hub microcontroller (e.g., STM32, NXP Kinetis) and use the Macronix ONFI 1.0 driver family, adding host ECC and wear-leveling for robust operation.
推荐
推荐产品汇总
工程参考数据： MX30UF1G16AC ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MX30UF1G18AC | MX30LF1G18AC | MX30UF2G16AC |
|---|---|---|---|---|
| Brand | Macronix | Macronix | Macronix | Macronix |
| Package | 48-VFBGA (6x8 mm) | 63-ball VFBGA (9x11 mm) - BGA family but different ball count | 48-TSOP(I) 12x20 mm or BGA per option | 48-VFBGA (6x8 mm) - same |
| Density | 1 Gbit | 1 Gbit | 1 Gbit | 2 Gbit |
| Organization | 64M x 16 | 128M x 8 | 128M x 8 | 128M x 16 |
| Supply Voltage (VCC) | 1.7 V to 1.95 V | 1.7 V to 1.95 V | 2.7 V to 3.6 V (3.3 V family) | 1.7 V to 1.95 V |
| Access Time | 25 ns | 25 ns | 25 ns | 25 ns |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Memory Type / Cell | NAND Flash (SLC) | NAND Flash (SLC) | NAND Flash (SLC) | NAND Flash (SLC) |
| On-die ECC | Not included (host ECC required) | Not included (host ECC required) | Not included (host ECC required) | Not included (host ECC required) |
关键差异点
- 1.8 V native VCC with 1.7-1.95 V range （对比 MX30LF1G18AC)
- x16 48-VFBGA footprint at 1 Gbit （对比 MX30UF1G18AC (x8 63-ball BGA))
- Same package, double density upgrade path （对比 MX30UF2G16AC)
- Industrial -40C to +85C temperature range （对比 Consumer-grade NAND alternatives)
设计说明
Estimated: At VCC = 1.8 V nominal, MX30UF1G16AC active read current is roughly tens of mA and standby current is sub-100 uA per Macronix datasheet family characteristics - exact ICC active/standby values must be cross-checked against the datasheet's DC characteristics table. Place a 10 uF ceramic + 0.1 uF high-frequency bypass on VCC adjacent to the VFBGA balls to suppress transient inrush during page read/program.
Route the parallel data bus (I/O0-I/O15) with matched lengths within a tight skew budget because NAND access (25 ns) is sensitive to skew on RE/WE relative to CLE/ALE. Keep CE per device to a short stub. For 48-VFBGA, escape-route all VSS/VCC balls to an unbroken plane; place 0.1 uF decoupling directly under the BGA in inner layers if the PCB stackup allows.
The 25 ns access timing imposes a setup/hold window that may be marginal at VCC = 1.7 V corner; validate timing at the host SoC's slowest process/temperature corner. Add a small RC damping on RB (Ready/Busy) if multiple NANDs share the bus to limit ringing.
Do not assume replacement with a Micron MT29F1G or Winbond W29N01 is pin-compatible without verifying the BGA ball map - Micron and Winbond typically use different ball assignments even at the same density. Always check the Macronix datasheet v1.2 mechanical drawing vs the candidate vendor's package, and implement host-side 8-bit ECC + bad-block management since this Macronix family does not include on-die ECC.
合规信息
RoHS compliant per Macronix product page; industrial temperature grade -40C to +85C; not explicitly AEC-Q100 qualified - confirm before automotive deployment.
