MX30UF1G18AC-XKI-TR - 1Gbit 1.8V SLC NAND Flash | Macronix
N.º da peça: MX30UF1G18AC-XKI-TR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.55 | $25,50 |
| 100 | $2.28 | $228,00 |
| 500 | $2.05 | $1.025,00 |
| 1.000 | $1.85 | $1.850,00 |
| 3.000 | $1.62 | $4.860,00 |
MX30UF1G18AC-XKI-TR Visão geral
NAND Flash memory is a type of non-volatile storage that retains data when power is removed. Within the storage hierarchy it sits below DRAM in cost-per-bit but offers far higher density and endurance than NOR Flash. SLC stores one bit per cell, trading density for the highest endurance and reliability of any NAND technology. The MX30UF1G18AC-XKI-TR belongs to the MX30UF family of 1.8 V SLC NAND parts that complement Macronix's parallel and serial NOR Flash portfolio, targeting code and data storage in embedded systems.
Key features include a parallel (asynchronous) x8 I/O interface with multiplexed address and data, hardware-ready 4-bit ECC for single-bit correction within each 528-byte page, and an ONFI 1.0-compliant command set that simplifies firmware development across density migrations. The 1.8 V core supply enables direct connection to low-voltage SoCs without level shifters, and the small 9 mm x 11 mm VFBGA footprint suits space-constrained designs such as wearables, IoT edge nodes, and SSD cache modules.
The architecture is based on a NAND array organized as 128 M x 8 with page sizes of 2,112 bytes (2,048 main + 64 spare) and 64 pages per block. The internal 4-bit ECC engine corrects single-bit errors in real time, dramatically reducing host MCU bandwidth and firmware complexity for bad-block management. The interface uses an 8-bit bidirectional data bus with standard NAND control signals (CE, RE, WE, ALE, CLE) and a busy/ready status pin.
Typical applications include Linux boot and rootfs storage on ARM-based SoCs in industrial gateways, IoT edge devices, networking equipment, automotive infotainment, and POS terminals where ONFI-standard drivers and SLC reliability are required. The wide temperature operation also supports outdoor and industrial installations.
When designing with this part, ensure the host controller supports the ONFI 1.0 command set or implements a software NAND driver. A minimum of one external 1.8 V decoupling cap per power pin plus proper signal integrity on the parallel bus are essential for reliable operation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para MX30UF1G18AC-XKI-TR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MX30UF1G18AC-XKI-TR (mesmo formato e footprint) — diferindo em Memory Type, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MX30UF1G18AC-XKI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30UF1G18AC-XKI-T
✅ Drop-In✓ Em estoque
$1.95 / unidade
Ver ficha técnica →MX30UF2G18AC-XKI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30UF4G18AC-XKI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30LF1G18AC-XKI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30UF1G18AC-XKI-TR Classificações máximas e características elétricas
| Tipo de memória | Non-Volatile NAND Flash (SLC) |
| Density | 1 Gbit (128 M x 8) |
| Organização da memória | 128 M x 8 bit |
| Operating Voltage (Vcc) | 1.8 V (1.7 V to 1.95 V) |
| Initial Access Time | 25 ns |
| Interface | Parallel (asynchronous) x8 |
| ONFI Compliance | ONFI 1.0 |
| Internal ECC | 4-bit ECC (per 528-byte page) |
| Page Size | 2,112 bytes (2,048 main + 64 spare) |
| Block Size | 64 pages (135,168 bytes) |
| Program/Erase Endurance | 100,000 cycles per block |
| Data Retention | 10 years |
| Encapsulamento | VFBGA-63 (63-ball 9 mm x 11 mm, 0.8 mm pitch) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (Industrial) |
| Status RoHS | Compliant (Halogen Free) |
Configuração de pinos do MX30UF1G18AC-XKI-TR
| Pino A1 | NC — Not connected (per datasheet) |
| Pino A2 | NC — Not connected (per datasheet) |
| Pino A3 | NC — Not connected (per datasheet) |
| Pino A4 | VSS — Ground |
| Pino A5 | VSS — Ground |
| Pino A6 | NC — Not connected (per datasheet) |
| Pino A7 | NC — Not connected (per datasheet) |
| Pino A8 | NC — Not connected (per datasheet) |
| Pino B1 | NC — Not connected (per datasheet) |
| Pino B2 | DQ0 — Data I/O 0 |
| Pino B3 | DQ1 — Data I/O 1 |
| Pino B4 | VCC — 1.8 V power supply |
| Pino B5 | VCC — 1.8 V power supply |
| Pino B6 | DQ2 — Data I/O 2 |
| Pino B7 | DQ3 — Data I/O 3 |
| Pino B8 | NC — Not connected (per datasheet) |
| Pino C1 | NC — Not connected (per datasheet) |
| Pino C2 | DQ4 — Data I/O 4 |
| Pino C3 | DQ5 — Data I/O 5 |
| Pino C4 | VSS — Ground |
| Pino C5 | VSS — Ground |
| Pino C6 | DQ6 — Data I/O 6 |
| Pino C7 | DQ7 — Data I/O 7 |
| Pino C8 | NC — Not connected (per datasheet) |
| Pino D1 | NC — Not connected (per datasheet) |
| Pino D2 | NC — Not connected (per datasheet) |
| Pino D3 | ALE — Address Latch Enable |
| Pino D4 | RE# — Read Enable (active low) |
| Pino D5 | WE# — Write Enable (active low) |
| Pino D6 | CLE — Command Latch Enable |
| Pino D7 | NC — Not connected (per datasheet) |
| Pino D8 | NC — Not connected (per datasheet) |
| Pino E1 | NC — Not connected (per datasheet) |
| Pino E2 | NC — Not connected (per datasheet) |
| Pino E3 | WP# — Write Protect (active low) |
| Pino E4 | CE# — Chip Enable (active low) |
| Pino E5 | R/B# — Ready/Busy (active low) |
| Pino E6 | NC — Not connected (per datasheet) |
| Pino E7 | NC — Not connected (per datasheet) |
| Pino E8 | NC — Not connected (per datasheet) |
| Pino F1 | NC — Not connected (per datasheet) |
| Pino F2 | NC — Not connected (per datasheet) |
| Pino F3 | NC — Not connected (per datasheet) |
| Pino F4 | VCC — 1.8 V power supply |
| Pino F5 | VCC — 1.8 V power supply |
| Pino F6 | NC — Not connected (per datasheet) |
| Pino F7 | NC — Not connected (per datasheet) |
| Pino F8 | NC — Not connected (per datasheet) |
| Pino G1 | NC — Not connected (per datasheet) |
| Pino G2 | NC — Not connected (per datasheet) |
| Pino G3 | NC — Not connected (per datasheet) |
| Pino G4 | VSS — Ground |
| Pino G5 | VSS — Ground |
| Pino G6 | NC — Not connected (per datasheet) |
| Pino G7 | NC — Not connected (per datasheet) |
| Pino G8 | NC — Not connected (per datasheet) |
| Pino H1 | NC — Not connected (per datasheet) |
| Pino H2 | NC — Not connected (per datasheet) |
| Pino H3 | NC — Not connected (per datasheet) |
| Pino H4 | NC — Not connected (per datasheet) |
| Pino H5 | NC — Not connected (per datasheet) |
| Pino H6 | NC — Not connected (per datasheet) |
| Pino H7 | NC — Not connected (per datasheet) |
| Pino H8 | NC — Not connected (per datasheet) |
Aplicações típicas
MX30UF1G18AC-XKI-TR é adequado para 6 aplicaçãos: Linux Boot and Rootfs Storage on ARM SoCs, Industrial IoT Edge Data Logger, Automotive Infotainment and Telematics Storage, Networking Equipment and Router Firmware Storage, POS Terminal and Payment Kiosk Storage, Medical Device Code and Patient Data Storage.
Linux Boot and Rootfs Storage on ARM SoCs
The MX30UF1G18AC-XKI-TR provides reliable 1 Gbit SLC NAND storage for Linux bootloaders, kernel images, and read-only root filesystems on ARM Cortex-A SoCs that include an ONFI-compliant NAND controller. The ONFI 1.0 command set enables direct use of standard Linux MTD subsystem drivers without custom glue code, and the internal 4-bit ECC engine handles single-bit error correction in hardware, freeing the host CPU from bit-error polling. With 100,000 P/E cycles per block and 10-year data retention, this part is ideal for industrial gateways, IoT edge devices, and HMI panels where the operating system must survive years of continuous read/write cycles. Designers place the part on the SoC's NAND bus with minimal 0.1 uF decoupling per power pin.
Recomendado
Industrial IoT Edge Data Logger
In industrial IoT edge nodes, the MX30UF1G18AC-XKI-TR serves as the local non-volatile store for time-series sensor data, configuration logs, and OTA update staging areas. The 1.8 V Vcc allows direct connection to low-power SoCs like the NXP i.MX RT series or STM32H7+external NAND controller, eliminating level shifters on the data bus and reducing BOM cost. The -40C to +85C industrial temperature range supports outdoor installations and factory automation cabinets. The SLC endurance of 100,000 P/E cycles per block handles the high write-amplification typical of small-block log writes, while the 4-bit ECC prevents data corruption from environmental bit errors. Typical designs use a 1.8 V buck regulator and a small serial NOR for the bootloader, with this NAND for the application partition.
Recomendado
Automotive Infotainment and Telematics Storage
The MX30UF1G18AC-XKI-TR's 1.8 V operation, 1 Gbit SLC density, and -40C to +85C temperature range make it suitable for automotive infotainment systems, telematics control units (TCUs), and digital instrument clusters that require reliable code and map storage. Automotive designs typically select the MX30UF1G18AC-XKI-TR for non-safety storage partitions (navigation maps, voice prompts, entertainment media), while the SLC technology ensures the long-term reliability needed under hood-temperature conditions. The parallel x8 interface supports the high read bandwidth required for map tile loading and audio buffer playback. Note that safety-critical functions should use automotive-qualified parts with AEC-Q100 certification; this standard-grade part suits non-safety automotive storage.
Recomendado
Networking Equipment and Router Firmware Storage
In routers, switches, and small-cell base stations, the MX30UF1G18AC-XKI-TR provides 1 Gbit of SLC NAND for the OpenWrt/Linux firmware image, configuration files, and system logs. The 25 ns initial access time is fast enough for fast-boot router designs, and the ONFI 1.0 command set simplifies firmware bring-up on common networking SoCs. The 1 Gbit capacity is sufficient for compressed firmware images plus user configuration space. Industrial temperature operation supports outdoor cabinet deployments and uncontrolled-environment installations. Engineers typically pair this part with a small SPI NOR for the first-stage bootloader and configure U-Boot to chain-load from NAND for the main firmware.
Recomendado
POS Terminal and Payment Kiosk Storage
Point-of-sale (POS) terminals and payment kiosks use the MX30UF1G18AC-XKI-TR as the application and transaction-log storage medium, where SLC reliability and long data retention are critical for compliance reasons. The internal 4-bit ECC ensures transaction log integrity, while 100,000 P/E cycles support years of daily transaction writes without block wear-out. The 1.8 V interface simplifies the power tree when pairing with modern low-power application processors. The compact 9 mm x 11 mm VFBGA-63 footprint enables slim kiosk form factors. Design teams typically integrate hardware write-protect jumpers and external tamper-detection signals to meet payment-card-industry security requirements.
Recomendado
Medical Device Code and Patient Data Storage
Medical devices such as patient monitors, infusion pumps, and portable diagnostic tools use the MX30UF1G18AC-XKI-TR to store firmware images, calibration tables, and patient session logs. The SLC NAND endurance of 100,000 P/E cycles and 10-year retention ensure long-term data integrity for medical records, while the industrial -40C to +85C temperature range supports clinical and field-use environments. The ONFI 1.0 command set and 4-bit ECC engine reduce the host MCU's computational burden, allowing lower-power processors to handle patient-data I/O without latency spikes. Designers should ensure IEC 60601-1 compliance for the full system; this Macronix part provides the storage layer with appropriate medical-grade firmware integration.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MX30UF1G18AC-XKI-TR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MX30UF1G18AC-XKI | MX30UF1G18AC-XKI-T | MX30UF2G18AC-XKI | MX30UF4G18AC-XKI | MX30LF1G18AC-XKI |
|---|---|---|---|---|---|---|
| Brand | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix |
| Package | VFBGA-63 (9x11 mm) | VFBGA-63 (9x11 mm) - same | VFBGA-63 (9x11 mm) - same | VFBGA-63 (9x11 mm) - same | VFBGA-63 (9x11 mm) - same | VFBGA-63 (9x11 mm) - same |
| Density | 1 Gbit (128 M x 8) | 1 Gbit (128 M x 8) | 1 Gbit (128 M x 8) | 2 Gbit (256 M x 8) | 4 Gbit (512 M x 8) | 1 Gbit (128 M x 8) |
| Operating Voltage (Vcc) | 1.8 V (1.7 V to 1.95 V) | 1.8 V (1.7 V to 1.95 V) | 1.8 V (1.7 V to 1.95 V) | 1.8 V (1.7 V to 1.95 V) | 1.8 V (1.7 V to 1.95 V) | 3.0 V (2.7 V to 3.6 V) |
| Initial Access Time | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| Internal ECC | 4-bit ECC | 4-bit ECC | 4-bit ECC | 4-bit ECC | 4-bit ECC | 4-bit ECC |
| ONFI Compliance | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 |
| Packaging | Tape & Reel | Tray | Tape & Reel (alt orientation) | Tray | Tray | Tray |
| Program/Erase Endurance | 100,000 cycles/block | 100,000 cycles/block | 100,000 cycles/block | 100,000 cycles/block | 100,000 cycles/block | 100,000 cycles/block |
Principais diferenciais
- Highest-capacity 1.8 V SLC NAND option in same VFBGA-63 footprint family (vs MX30UF4G18AC-XKI)
- Lower voltage operation than the 3 V MX30LF family (vs MX30LF1G18AC-XKI)
- Integrated hardware 4-bit ECC engine (vs MX30UF1G18AC-XKI)
Notas de projeto
Power-rail design is critical for parallel NAND reliability. Place a 0.1 uF X7R ceramic decoupling capacitor within 2 mm of each VCC ball, plus a single 4.7 uF bulk capacitor on the 1.8 V rail near the device. Use a regulator with <50 mV peak-to-peak noise; switching ripple above 100 mV p-p on VCC can cause programming errors. For VCCQ (I/O voltage), tie to the same 1.8 V rail; do not connect to a separate 3.3 V rail.
VFBGA-63 with 0.8 mm pitch requires NSMD pads with 0.4 mm diameter and a microvia-in-pad stackup for reliable solder joints. Route the 8-bit DQ bus, control signals (CE#, RE#, WE#, ALE, CLE), and R/B# on the same layer with matched lengths within +/- 250 ps to avoid setup/hold violations. Add a ground guard trace around the parallel bus to minimize crosstalk from adjacent high-speed signals such as USB or Ethernet pairs.
Series-dampening resistors (22-33 ohm) on RE# and WE# are strongly recommended to ring down the parallel bus reflections, especially when the trace length exceeds 25 mm. The R/B# (Ready/Busy) signal is open-drain and requires a 4.7 kohm pull-up to VCCQ; ensure the host controller samples R/B# before issuing status commands to avoid polling timing errors.
Do not omit the WP# (Write Protect) pull-down: leaving WP# floating can put the device into an undefined write-protected state on power-up. Also, ensure the host SoC's NAND controller is configured for 4-bit ECC mode; enabling 8-bit ECC mode (a valid setting for newer MX30UF parts) on this 1 Gbit die will fail programming operations and may cause silent data corruption. Always perform bad-block management at the file-system (UBI/UBIFS) layer to avoid using factory-marked bad blocks.
Informações de conformidade
Halogen free and RoHS compliant per Macronix product page. Standard grade; not AEC-Q100 qualified - select automotive-qualified Macronix parts for safety-critical automotive applications.
