OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems
N.º da peça: OSD3358-512M-ISM ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $62.46 | $62,46 |
| 10 | $58.2 | $582,00 |
| 50 | $54.1 | $2.705,00 |
| 100 | $50.75 | $5.075,00 |
| 500 | $46.8 | $23.400,00 |
OSD3358-512M-ISM Visão geral
A System-on-Module (SOM) or System-in-Package (SiP) is a pre-integrated computing block that combines a microprocessor, memory, power management, and supporting passives into a single package or small board. The OSD3358-512M-ISM belongs to the OSD335x family - an industrial-grade embedded module hierarchy that sits between a bare MPU (microprocessor unit) and a full single-board computer (SBC) such as the BeagleBone. Within the broader semiconductor hierarchy, an SiP is a category of integrated circuit that places heterogeneous dies and passives inside one BGA package, exposing only the MPU signals (plus power rails) to the host PCB.
Key features include 1 GHz ARM Cortex-A8 NEON SIMD core, 512 MB DDR3, integrated TPS65217C PMIC and TL5209 LDO, 4 KB EEPROM, industrial -40C to +85C operating range, and a 256-ball BGA measuring 21 x 21 mm. The package is a super-set pin assignment of the TI AM3358 ZCZ 18x18 BGA, so most signals map to the same ball locations as the underlying MPU. This makes board bring-up straightforward for engineers already familiar with the AM335x platform.
Architecturally, the OSD3358-512M-ISM uses Octavo's proven SiP integration technique to embed the AM3358 die alongside DDR3, decoupling caps, and the PMIC. This eliminates the most error-prone portion of an AM335x design - DDR3 length matching and power sequencing - and delivers a complete 32-bit Linux-capable computer with no external DRAM components required.
Typical applications include industrial IoT gateways, building automation controllers, point-of-sale terminals, robotics motor controllers, and embedded Linux HMI panels. The wide operating temperature range also supports outdoor or factory-floor deployments.
When designing with the OSD3358-512M-ISM, use the OSD3358-SM-RED reference design board as a starting point for schematic and layout. Pay attention to BGA escape routing and decoupling capacitor placement around the package perimeter.
This page synthesizes distributor pricing, the OSD3358 family comparison, and practical design notes beyond the manufacturer datasheet, providing engineers with a single reference for component selection.
Alternativas drop-in para OSD3358-512M-ISM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com OSD3358-512M-ISM (mesmo formato e footprint) — diferindo em Mounting Type, Package, Ethernet, Graphics Accelerator, Maximum CPU Clock.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
OSD3358-512M-BSM
✅ Drop-In✓ Em estoque
$30.95 / unidade
Ver ficha técnica →OSD3358-512M-BAS-XB
✅ Drop-In✓ Em estoque
$67.2 / unidade
Ver ficha técnica →OSD3358-512M-ICB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
OSD3358-1G-ISM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
OSD3358-512M-ISM Especificações (publicadas pelo fabricante)
| Product Type | System-in-Package (SiP) / System-on-Module (SOM) |
| Series | OSD3358 |
| Core Processor | Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD |
| CPU Speed | 1 GHz |
| RAM Size | 512 MB DDR3 |
| PMIC | TPS65217C |
| Auxiliary LDO | TL5209 |
| EEPROM | 4 KB |
| Encapsulamento | 256-ball BGA, 21 mm x 21 mm |
| Form Factor | SiP (System-in-Package) |
| Temperatura de operação | -40C to +85C (industrial) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Interfaces e Conectores do OSD3358-512M-ISM
Não há lista de interfaces publicada pelo fabricante disponível para OSD3358-512M-ISM. Consulte a documentação do fabricante para detalhes de conectores e headers.
Consulte a documentação do fabricante para a pinagem completa do conector de expansão e a numeração dos pinos do conector.
Características de potência e térmicas
| Temperatura de Funcionamento | -40C to +85C (industrial) |
Parâmetros de entrada de potência e térmicos para OSD3358-512M-ISM, conforme publicados pelo fabricante.
Aplicações típicas
OSD3358-512M-ISM é adequado para 6 aplicaçãos: Industrial IoT Gateway, Building Automation Controller, Point-of-Sale (POS) Terminal, Robotics Motor Controller, Embedded Linux HMI Panel, Portable Data Acquisition System.
Industrial IoT Gateway
The OSD3358-512M-ISM's 1 GHz ARM Cortex-A8 core and 512 MB DDR3 make it ideal for industrial IoT gateways running Linux with MQTT, Modbus, or OPC-UA protocol stacks. The integrated TPS65217C PMIC eliminates external power tree design, while the industrial -40C to +85C temperature range supports factory-floor deployment without additional thermal management. Engineers can pair it with a TI CC2652 wireless MCU or an external Wi-Fi/BLE module for cloud connectivity.
Recomendado
Building Automation Controller
The OSD3358-512M-ISM's compact 21 x 21 mm BGA footprint and Linux-capable Cortex-A8 core suit building automation controllers managing HVAC, lighting, and access control subsystems. The 512 MB DDR3 comfortably runs BACnet or KNX stack implementations, while the industrial temperature rating allows deployment in unconditioned mechanical rooms. The integrated PMIC simplifies UL-listed power designs by reducing external component count.
Recomendado
Point-of-Sale (POS) Terminal
The OSD3358-512M-ISM runs a full Linux distribution with Qt or Chromium-based POS user interfaces, handling barcode scanning, payment processing, and receipt printing from a single integrated module. The 1 GHz Cortex-A8 with NEON SIMD accelerates barcode decoding and cryptographic payment operations, while the 512 MB DDR3 is sufficient for browser-based POS applications. The small BGA footprint enables slim, fanless terminal designs.
Recomendado
Robotics Motor Controller
The OSD3358-512M-ISM's NEON SIMD capability accelerates real-time inverse kinematics and trajectory planning computations for robotics motor control applications. Its 1 GHz Cortex-A8 with hardware floating-point delivers deterministic motion control loops when paired with a Linux PREEMPT_RT kernel. The integrated PMIC and small footprint let designers place the SiP directly on a robot arm controller board, eliminating wiring harnesses.
Recomendado
Embedded Linux HMI Panel
The OSD3358-512M-ISM drives small-to-medium LVDS or RGB TFT displays for embedded HMI panels in medical, industrial, and appliance products. The 512 MB DDR3 supports a framebuffer plus Qt or LVGL graphical stacks, while the 1 GHz Cortex-A8 renders complex animations smoothly. Industrial temperature rating and integrated power management simplify panel designs that must operate continuously in production environments.
Recomendado
Portable Data Acquisition System
The OSD3358-512M-ISM's low-power Cortex-A8 architecture and integrated power management make it suitable for portable, battery-powered data acquisition systems used in field instrumentation. The 1 GHz core processes high-speed ADC samples and stores them locally or streams over USB/Ethernet. Industrial temperature rating supports outdoor and ruggedized deployments, while the small BGA enables handheld form factors.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para OSD3358-512M-ISM — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | OSD3358-512M-BSM | OSD3358-512M-BAS-XB | OSD3358-512M-ICB | OSD3358-1G-ISM |
|---|---|---|---|---|---|
| Brand | Octavo Systems | Octavo Systems | Octavo Systems | Octavo Systems | Octavo Systems |
| Package | 256-ball BGA, 21x21 mm | 256-ball BGA, 21x21 mm - same | 256-ball BGA, 21x21 mm - same | 256-ball BGA on carrier PCB - same die | 256-ball BGA, 21x21 mm - same |
| Processor | AM3358 ARM Cortex-A8 1 GHz | AM3358 ARM Cortex-A8 1 GHz | AM3358 ARM Cortex-A8 1 GHz | AM3358 ARM Cortex-A8 1 GHz | AM3358 ARM Cortex-A8 1 GHz |
| DDR3 Memory | 512 MB | 512 MB | 512 MB | 512 MB | 1 GB |
| PMIC | TPS65217C integrated | TPS65217C integrated | TPS65217C integrated | TPS65217C integrated | TPS65217C integrated |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- Integrated DDR3 + PMIC in single BGA (vs OSD3358-512M-BSM)
- Highest memory capacity in same footprint (vs OSD3358-1G-ISM)
- Bare SiP gives full baseboard design flexibility (vs OSD3358-512M-ICB)
Notas de projeto
Estimated: The 256-ball BGA at 21x21 mm requires 6-layer PCB stack-up with 0.8 mm ball pitch escape routing. Use microvias (laser-drilled) on the top layer for fanout and standard through-vias on inner layers. Place at least 8 ground balls on the package perimeter to provide a continuous return path for high-speed DDR3 signals. Reference the Octavo OSD3358-SM-RED design files for proven layout.
The OSD3358-512M-ISM dissipates approximately 2-3 W under full 1 GHz Linux load. Place thermal vias in a 4x4 grid under the central ground balls of the BGA to conduct heat to an internal copper plane or bottom-side heatsink. Industrial -40C to +85C operation is achievable with proper PCB thermal design; the AM3358 internal die has a junction-to-ambient thermal resistance that requires at least 4 cm^2 of copper pour at 1 oz thickness for safe operation at +85C ambient.
Do not assume the OSD3358-512M-ISM boots Linux out of the box - you must supply a boot image via SD card, eMMC, or SPI flash connected to the AM3358 MMC/SPI pins. The integrated TPS65217C PMIC requires proper power-up sequencing controlled by the AM3358 PMIC handshake pins; bypassing this by tying PGOOD high can prevent the SiP from powering up. Always consult the Octavo OSD3358 hardware user manual before layout.
Informações de conformidade
RoHS compliance per Octavo product page. Industrial temperature grade (-40C to +85C) but not AEC-Q100 qualified. Reach and halogen-free status not explicitly stated in provided data.
