OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems
MPN： OSD3358-512M-ISM ✓ 啟用中OSD3358-512M-ISM 概覽
A System-on-Module (SOM) or System-in-Package (SiP) is a pre-integrated computing block that combines a microprocessor, memory, power management, and supporting passives into a single package or small board. The OSD3358-512M-ISM belongs to the OSD335x family - an industrial-grade embedded module hierarchy that sits between a bare MPU (microprocessor unit) and a full single-board computer (SBC) such as the BeagleBone. Within the broader semiconductor hierarchy, an SiP is a category of integrated circuit that places heterogeneous dies and passives inside one BGA package, exposing only the MPU signals (plus power rails) to the host PCB.
Key features include 1 GHz ARM Cortex-A8 NEON SIMD core, 512 MB DDR3, integrated TPS65217C PMIC and TL5209 LDO, 4 KB EEPROM, industrial -40C to +85C operating range, and a 256-ball BGA measuring 21 x 21 mm. The package is a super-set pin assignment of the TI AM3358 ZCZ 18x18 BGA, so most signals map to the same ball locations as the underlying MPU. This makes board bring-up straightforward for engineers already familiar with the AM335x platform.
Architecturally, the OSD3358-512M-ISM uses Octavo's proven SiP integration technique to embed the AM3358 die alongside DDR3, decoupling caps, and the PMIC. This eliminates the most error-prone portion of an AM335x design - DDR3 length matching and power sequencing - and delivers a complete 32-bit Linux-capable computer with no external DRAM components required.
Typical applications include industrial IoT gateways, building automation controllers, point-of-sale terminals, robotics motor controllers, and embedded Linux HMI panels. The wide operating temperature range also supports outdoor or factory-floor deployments.
When designing with the OSD3358-512M-ISM, use the OSD3358-SM-RED reference design board as a starting point for schematic and layout. Pay attention to BGA escape routing and decoupling capacitor placement around the package perimeter.
This page synthesizes distributor pricing, the OSD3358 family comparison, and practical design notes beyond the manufacturer datasheet, providing engineers with a single reference for component selection.
直接替換替代品，適用於 OSD3358-512M-ISM — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： OSD3358-512M-ISM （相同外形與佔位） — 差異在於 Mounting Type, Package, Ethernet, Graphics Accelerator, Maximum CPU Clock.
OSD3358-512M-BSM
✅ 直接替換聯絡詢價
查看資料表 →OSD3358-512M-BAS-XB
✅ 直接替換聯絡詢價
查看資料表 →OSD3358-512M-ICB
✅ 直接替換📋 參考替代品（不在目錄中）
OSD3358-1G-ISM
✅ 直接替換📋 參考替代品（不在目錄中）
OSD3358-512M-ISM 規格（製造商公布）
| Product Type | System-in-Package (SiP) / System-on-Module (SOM) |
| Series | OSD3358 |
| Core Processor | Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD |
| CPU Speed | 1 GHz |
| RAM Size | 512 MB DDR3 |
| PMIC | TPS65217C |
| Auxiliary LDO | TL5209 |
| EEPROM | 4 KB |
| 封裝 | 256-ball BGA, 21 mm x 21 mm |
| Form Factor | SiP (System-in-Package) |
| 工作溫度 | -40C to +85C (industrial) |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
OSD3358-512M-ISM 介面與連接器
目前沒有 OSD3358-512M-ISM 的製造商公開介面清單。連接器與排針詳細資訊請參閱製造商文件。
請參閱 製造商文件 以取得完整的擴充排針腳位定義與連接器腳位編號。
功率與熱特性
| 操作溫度 | -40C to +85C (industrial) |
OSD3358-512M-ISM 由製造商公布的功率輸入與熱參數。
典型應用
OSD3358-512M-ISM 適用於 6 應用s: Industrial IoT Gateway, Building Automation Controller, Point-of-Sale (POS) Terminal, Robotics Motor Controller, Embedded Linux HMI Panel, Portable Data Acquisition System.
Industrial IoT Gateway
The OSD3358-512M-ISM's 1 GHz ARM Cortex-A8 core and 512 MB DDR3 make it ideal for industrial IoT gateways running Linux with MQTT, Modbus, or OPC-UA protocol stacks. The integrated TPS65217C PMIC eliminates external power tree design, while the industrial -40C to +85C temperature range supports factory-floor deployment without additional thermal management. Engineers can pair it with a TI CC2652 wireless MCU or an external Wi-Fi/BLE module for cloud connectivity.
推薦
Building Automation Controller
The OSD3358-512M-ISM's compact 21 x 21 mm BGA footprint and Linux-capable Cortex-A8 core suit building automation controllers managing HVAC, lighting, and access control subsystems. The 512 MB DDR3 comfortably runs BACnet or KNX stack implementations, while the industrial temperature rating allows deployment in unconditioned mechanical rooms. The integrated PMIC simplifies UL-listed power designs by reducing external component count.
推薦
Point-of-Sale (POS) Terminal
The OSD3358-512M-ISM runs a full Linux distribution with Qt or Chromium-based POS user interfaces, handling barcode scanning, payment processing, and receipt printing from a single integrated module. The 1 GHz Cortex-A8 with NEON SIMD accelerates barcode decoding and cryptographic payment operations, while the 512 MB DDR3 is sufficient for browser-based POS applications. The small BGA footprint enables slim, fanless terminal designs.
推薦
Robotics Motor Controller
The OSD3358-512M-ISM's NEON SIMD capability accelerates real-time inverse kinematics and trajectory planning computations for robotics motor control applications. Its 1 GHz Cortex-A8 with hardware floating-point delivers deterministic motion control loops when paired with a Linux PREEMPT_RT kernel. The integrated PMIC and small footprint let designers place the SiP directly on a robot arm controller board, eliminating wiring harnesses.
推薦
Embedded Linux HMI Panel
The OSD3358-512M-ISM drives small-to-medium LVDS or RGB TFT displays for embedded HMI panels in medical, industrial, and appliance products. The 512 MB DDR3 supports a framebuffer plus Qt or LVGL graphical stacks, while the 1 GHz Cortex-A8 renders complex animations smoothly. Industrial temperature rating and integrated power management simplify panel designs that must operate continuously in production environments.
推薦
Portable Data Acquisition System
The OSD3358-512M-ISM's low-power Cortex-A8 architecture and integrated power management make it suitable for portable, battery-powered data acquisition systems used in field instrumentation. The 1 GHz core processes high-speed ADC samples and stores them locally or streams over USB/Ethernet. Industrial temperature rating supports outdoor and ruggedized deployments, while the small BGA enables handheld form factors.
推薦
推薦產品摘要
工程參考資料，適用於 OSD3358-512M-ISM — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | OSD3358-512M-BSM | OSD3358-512M-BAS-XB | OSD3358-512M-ICB | OSD3358-1G-ISM |
|---|---|---|---|---|---|
| Brand | Octavo Systems | Octavo Systems | Octavo Systems | Octavo Systems | Octavo Systems |
| Package | 256-ball BGA, 21x21 mm | 256-ball BGA, 21x21 mm - same | 256-ball BGA, 21x21 mm - same | 256-ball BGA on carrier PCB - same die | 256-ball BGA, 21x21 mm - same |
| Processor | AM3358 ARM Cortex-A8 1 GHz | AM3358 ARM Cortex-A8 1 GHz | AM3358 ARM Cortex-A8 1 GHz | AM3358 ARM Cortex-A8 1 GHz | AM3358 ARM Cortex-A8 1 GHz |
| DDR3 Memory | 512 MB | 512 MB | 512 MB | 512 MB | 1 GB |
| PMIC | TPS65217C integrated | TPS65217C integrated | TPS65217C integrated | TPS65217C integrated | TPS65217C integrated |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
主要差異化特點
- Integrated DDR3 + PMIC in single BGA (對比OSD3358-512M-BSM)
- Highest memory capacity in same footprint (對比OSD3358-1G-ISM)
- Bare SiP gives full baseboard design flexibility (對比OSD3358-512M-ICB)
設計說明
Estimated: The 256-ball BGA at 21x21 mm requires 6-layer PCB stack-up with 0.8 mm ball pitch escape routing. Use microvias (laser-drilled) on the top layer for fanout and standard through-vias on inner layers. Place at least 8 ground balls on the package perimeter to provide a continuous return path for high-speed DDR3 signals. Reference the Octavo OSD3358-SM-RED design files for proven layout.
The OSD3358-512M-ISM dissipates approximately 2-3 W under full 1 GHz Linux load. Place thermal vias in a 4x4 grid under the central ground balls of the BGA to conduct heat to an internal copper plane or bottom-side heatsink. Industrial -40C to +85C operation is achievable with proper PCB thermal design; the AM3358 internal die has a junction-to-ambient thermal resistance that requires at least 4 cm^2 of copper pour at 1 oz thickness for safe operation at +85C ambient.
Do not assume the OSD3358-512M-ISM boots Linux out of the box - you must supply a boot image via SD card, eMMC, or SPI flash connected to the AM3358 MMC/SPI pins. The integrated TPS65217C PMIC requires proper power-up sequencing controlled by the AM3358 PMIC handshake pins; bypassing this by tying PGOOD high can prevent the SiP from powering up. Always consult the Octavo OSD3358 hardware user manual before layout.
合規資訊
RoHS compliance per Octavo product page. Industrial temperature grade (-40C to +85C) but not AEC-Q100 qualified. Reach and halogen-free status not explicitly stated in provided data.
