OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems
MPN: OSD3358-512M-BAS-XB ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85.99 | $85.99 |
| 10 | $82.5 | $825.00 |
| 100 | $76.8 | $7,680.00 |
| 500 | $71.4 | $35,700.00 |
| 1,000 | $67.2 | $67,200.00 |
OSD3358-512M-BAS-XB Overview
An SiP (System-In-Package) is a single BGA module that integrates the processor, memory, and power management into one substrate. Compared to a discrete SoC + external DDR3 + discrete PMIC layout, an SiP eliminates high-speed DDR3 routing between chips, reduces PCB layer count, simplifies DDR3 tuning, and shortens EMC qualification. In the OSD335x taxonomy, the device belongs to the AM3358-based Octavo Systems SiP family that brings a Sitara Application Processor into a single BGA footprint suitable for industrial SBCs, gateways, and HMI designs.
Key features include an ARM Cortex-A8 core with NEON SIMD, a SGX530 graphics accelerator for display/HMI workloads, dual 32-bit LPDDR1/DDR2/DDR3 memory controller (DDR3 is internally populated to 512 MB), two industrial-grade PRU-ICSS subsystems for deterministic real-time I/O, three I2C, two SPI, two CAN, gigabit Ethernet, and integrated USB 2.0 high-speed PHYs. The TPS65217C handles all six supply rails (VDD_MPU, VDD_CORE, VDSPLL, VDDA1V8, VDDS, DDR3 VTT) and supports dynamic voltage scaling for energy-aware operation.
The architecture reduces board area by approximately 60% relative to a discrete AM3358 design, accelerates time-to-market by removing DDR3 length-matching iterations, and simplifies EMI/ESD certification because high-speed nets are encapsulated inside the SiP substrate. Industrial users leverage the -40 C to +85 C rating for outdoor enclosures and factory automation, while still drawing on the full Sitara Linux and TI Processor SDK software ecosystem.
Typical applications include industrial IoT gateways, programmable logic controllers, HMI panels, robotics controllers, edge vision nodes, and home/small-business networking appliances. The BeagleBone Blue robotics platform uses the BAS variant, demonstrating production-grade Linux system stability on this OSD3359/OCTAVO SiP family. For harsher-thermal environments, the -XB industrial-temperature variant is the preferred drop-in choice.
When designing with the OSD3358-512M-BAS-XB, allow a minimum keep-out of 0.5 mm around the BGA and a 4-layer PCB with continuous GND beneath the package for thermal dissipation and DDR3 signal integrity. Use TI Processor SDK Linux or Debian images and consult the OSD335x reference schematic for proper PMIC sequencing and decoupling.
Drop-in alternatives for OSD3358-512M-BAS-XB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with OSD3358-512M-BAS-XB (same form factor and footprint) — differing in Mounting Type, Ethernet, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
OSD3358-512M-BAS
✅ Drop-In✓ In Stock
$59.95 / Unit
View Datasheet →OSD3358-512M-IND
✅ Drop-In📋 Reference alternative (not in catalog)
OSD3358-1G-IND
✅ Drop-In📋 Reference alternative (not in catalog)
OSD3358-512M-BAS-XB-TR
✅ Drop-In📋 Reference alternative (not in catalog)
OSD3358-256M-IND
✅ Drop-In📋 Reference alternative (not in catalog)
OSD3358-1G-ISM
✅ Drop-In📋 Reference alternative (not in catalog)
OSD3358-512M-BAS-XB Maximum Ratings & Electrical Characteristics
| Device Type | System-In-Package (SiP) |
| Integrated Processor | TI Sitara AM3358 ARM Cortex-A8 |
| Maximum CPU Clock | 1 GHz |
| Graphics Accelerator | SGX530 |
| Onboard DDR3 SDRAM | 512 MB |
| Power Management IC | TPS65217C (integrated) |
| Operating Temperature Range | -40 C to +85 C (industrial) |
| Package | 400-ball BGA |
| Mounting Type | Surface Mount |
| PRU-ICSS Subsystems | 2 (industrial-grade) |
| Ethernet | 10/100/1000 Mbps (Gigabit) |
| USB | USB 2.0 High-Speed PHY |
| CAN | 2x CAN 2.0B |
| SPI | 2x SPI |
| I2C | 3x I2C |
| RoHS Status | Compliant |
OSD3358-512M-BAS-XB 400-ball bga Pin Configuration Guide
Pin configuration for OSD3358-512M-BAS-XB (400-ball bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for OSD3358-512M-BAS-XB.
Refer to the datasheet for full pin configuration.
Typical Applications
OSD3358-512M-BAS-XB is suitable for 7 applications: Industrial IoT Gateways, Human-Machine Interface (HMI) Panels, Robotics Controllers, Edge Vision and Image Processing Nodes, Programmable Logic Controllers (PLC), Small-Business Networking Appliances, Data Acquisition and Industrial Test Equipment.
Industrial IoT Gateways
The OSD3358-512M-BAS-XB's integrated 512 MB DDR3, gigabit Ethernet, dual CAN 2.0B, and -40 C to +85 C industrial temperature range make it ideal for industrial IoT gateways that aggregate field-bus data from PLCs, sensors, and motor drives. The AM3358 Cortex-A8 at 1 GHz runs full Linux with TLS, OPC-UA, or MQTT stacks without external memory expansion, while the TPS65217C PMIC simplifies 24V-to-rail power design inside factory cabinets. Two PRU-ICSS subsystems provide deterministic GPIO timing for EtherCAT, Profinet, or proprietary real-time fieldbus without burdening the Cortex-A8. Compared to a discrete Sitara + DDR3 design, the OSD3358-512M-BAS-XB reduces BOM risk and shrinks PCB area by approximately 60% in compact DIN-rail gateway enclosures.
Recommended
Human-Machine Interface (HMI) Panels
The OSD3358-512M-BAS-XB pairs an ARM Cortex-A8 with NEON and a SGX530 GPU to drive TFT LCD panels up to 24-bit via the integrated LCD controller, while the 512 MB DDR3 holds Qt/GTK framebuffers and application graphics without external RAM. The 400-ball BGA keeps the SoC footprint small enough for 3.5-inch to 7-inch panel PCBs, and the -XB industrial temperature rating supports outdoor and factory-floor enclosures. The two PRU-ICSS cores handle touch-panel scanning and backlight PWM with microsecond determinism while the Cortex-A8 runs the GUI. Linux distributions such as Yocto and Buildroot boot natively, letting developers reuse existing Qt applications from the TI Processor SDK.
Recommended
Robotics Controllers
The OSD3358-512M-BAS-XB is the same SiP used on the BeagleBone Blue robotics reference platform, validated for 4 DC motor controllers, 8 servo outputs, 4 quadrature encoders, IMU, and barometer. Dual PRU-ICSS run 100 kHz encoder sampling and pulse-width modulation deterministically, while the Cortex-A8 executes ROS 2 / Python high-level planners. The 512 MB DDR3 supports ROS 2 nodes and SLAM mapping without external memory. Industrial -40 C to +85 C operation lets the same SiP serve autonomous mobile robots in warehouses, agricultural robots, and outdoor UAV ground stations where ambient temperatures vary widely.
Recommended
Edge Vision and Image Processing Nodes
For low-power edge vision, the OSD3358-512M-BAS-XB combines an ARM Cortex-A8 with NEON SIMD and 512 MB DDR3 to run OpenCV-based motion detection, license-plate OCR, or simple CNN inference at the network edge. The integrated USB 2.0 high-speed PHY accepts UVC webcams and MIPI-CSI adapter boards, while gigabit Ethernet uplinks the results to a SCADA or cloud server. Industrial -40 C to +85 C operation supports roadside and outdoor cabinet deployments. The compact 400-ball BGA footprint keeps the vision node PCB under 50 mm x 50 mm, ideal for retrofit installations.
Recommended
Programmable Logic Controllers (PLC)
The OSD3358-512M-BAS-XB serves as the application processor inside compact PLCs, combining Cortex-A8 logic execution with two PRU-ICSS cores for high-speed digital I/O scanning at microsecond rates. The 512 MB DDR3 supports IEC 61131-3 runtimes, ladder-logic interpreters, and Modbus/TCP stacks, while the -40 C to +85 C range satisfies industrial cabinet thermal requirements. Dual CAN 2.0B ports interop with CANopen and DeviceNet field devices commonly found on factory floors. The integrated TPS65217C PMIC powers the SiP directly from a 24V industrial bus via a wide-input buck converter, simplifying the power tree.
Recommended
Small-Business Networking Appliances
The OSD3358-512M-BAS-XB's gigabit Ethernet MAC and USB 2.0 ports make it a strong fit for small-business firewalls, VPN endpoints, and Wi-Fi controller appliances. The Cortex-A8 at 1 GHz with NEON accelerates IPsec AES encryption, while 512 MB DDR3 supports OpenWrt, pfSense-like stacks, and DPI tables. The integrated TPS65217C PMIC keeps total power consumption below 5 W, suitable for fanless enclosures. Industrial -40 C to +85 C operation supports telecom closet and outdoor cabinet installations with extended ambient temperatures.
Recommended
Data Acquisition and Industrial Test Equipment
The OSD3358-512M-BAS-XB combines Cortex-A8 processing with two PRU-ICSS subsystems capable of sub-microsecond GPIO timing, ideal for data-acquisition front-ends and bench-top industrial test equipment. The 512 MB DDR3 buffers high-speed sample streams from external ADCs, while the gigabit Ethernet or USB 2.0 HS ports stream results to a host PC. The -40 C to +85 C industrial rating allows the same module to be deployed in environmental chambers, factory calibration cells, and field service test kits without redesign. Yocto Linux enables deterministic real-time extensions for precise sample timing.
Recommended
Recommended Products Summary
Engineering reference data for OSD3358-512M-BAS-XB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | OSD3358-512M-BAS | OSD3358-512M-IND | OSD3358-1G-IND | OSD3358-512M-BAS-XB-TR | OSD3358-256M-IND | OSD3358-1G-ISM |
|---|---|---|---|---|---|---|---|
| Brand | Octavo Systems | Octavo Systems - same | Octavo Systems - same | Octavo Systems - same | Octavo Systems - same | Octavo Systems - same | Octavo Systems - same |
| Package | 400-ball BGA | 400-ball BGA - same | 400-ball BGA - same | 400-ball BGA - same | 400-ball BGA - same | 400-ball BGA - same | 400-ball BGA - same |
| Integrated Processor | TI Sitara AM3358 Cortex-A8 1 GHz | AM3358 Cortex-A8 1 GHz | AM3358 Cortex-A8 1 GHz | AM3358 Cortex-A8 1 GHz | AM3358 Cortex-A8 1 GHz | AM3358 Cortex-A8 1 GHz | AM3358 Cortex-A8 1 GHz |
| DDR3 Memory | 512 MB | 512 MB | 512 MB | 1 GB | 512 MB | 256 MB | 1 GB |
| Operating Temperature Range | -40 C to +85 C | 0 C to +85 C (commercial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial, ISM) |
| Integrated PMIC | TPS65217C | TPS65217C | TPS65217C | TPS65217C | TPS65217C | TPS65217C | TPS65217C |
| PRU-ICSS Subsystems | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Approximate Unit Price (USD) | 85.99 | 75.00 - 80.00 (lower, commercial) | 85.00 - 95.00 | 110.00 - 120.00 | 85.99 (T&R variant) | 70.00 - 80.00 (lower memory) | 115.00 - 125.00 (ISM/extended) |
Key Differentiators
- Industrial -40 C to +85 C temperature range within the same SiP package as commercial-grade parts (vs OSD3358-512M-BAS (commercial 0 C to +85 C))
- Dual industrial-grade PRU-ICSS subsystems for deterministic real-time I/O (vs OSD3358-256M-IND (lower memory, otherwise same))
- Integrated TPS65217C PMIC with all six AM3358 rails inside the SiP (vs Discrete AM3358 + external TPS65217C design)
Design Notes
The OSD3358-512M-BAS-XB integrates the AM3358, DDR3, and TPS65217C PMIC inside a single 400-ball BGA substrate. Estimated: at full 1 GHz Cortex-A8 load with both PRU-ICSS active, internal power dissipation can reach 2-3 W; design a continuous GND plane and at least 4 thermal vias under the BGA thermal balls to keep junction temperature below 110 C across the -40 C to +85 C ambient range.
Because the DDR3 traces are encapsulated inside the SiP substrate, the OSD3358-512M-BAS-XB eliminates external DDR3 length-matching and write-leveling tuning. Designers should still allocate a 4-layer PCB with continuous GND beneath the package, 50 ohm single-ended controlled impedance for USB and Ethernet differential pairs, and a 0.5 mm keep-out around the BGA outline for manufacturing tolerances.
Follow the OSD335x reference schematic for PMIC sequencing, especially the connection of LDO1/LDO2/LDO3/LDO4 to VDD_MPU, VDD_CORE, VDDS, and VDDA1V8 rails. Estimated: place the 22 uF / 0.1 uF bulk capacitors within 5 mm of their respective BGA balls to suppress the AM3358 load-transient spikes that occur at PRU real-time edge events.
Do not connect external DDR3 memory to the OSD3358-512M-BAS-XB - the package already integrates 512 MB of DDR3, and the AM3358 memory controller signals are not externally accessible. Also, the PRU-ICSS pins are multiplexed with the LCD controller and cannot be used simultaneously for both; plan pin allocation early in the schematic design.
Compliance Information
RoHS and REACH compliance per Octavo Systems product page. The OSD3358-512M-BAS-XB is not AEC-Q100 qualified - choose AEC-Q100-qualified automotive parts if required. Industrial -40 C to +85 C operating range only.
