P1020NXE2FFB - QorIQ P1 Dual-Core 800MHz SoC | NXP
N.º da peça: P1020NXE2FFB ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $82.1 | $821,00 |
| 100 | $71.45 | $7.145,00 |
| 500 | $62.8 | $31.400,00 |
| 1.000 | $54.95 | $54.950,00 |
P1020NXE2FFB Visão geral
A microprocessor (MPU) is an integrated circuit that contains one or more central processing units, cache, memory controllers, and peripheral interfaces on a single die. Within the broader taxonomy, an MPU is a sub-class of microcontroller/microprocessor IC, which itself sits under Integrated Circuits > Microprocessors. The QorIQ P1 family, derived from the PowerQUICC lineage, represents NXP's value-tier communications processors used in wired and wireless access, industrial control, and printing/imaging platforms.
Key features include dual e500v2 cores with 36-bit physical addressing, integrated SEC 4.0 security engine for IPSec/SSL acceleration, three Gigabit Ethernet interfaces (two SGMII plus one RGMII), two PCIe Gen 1 controllers, a USB 2.0 controller with ULPI interface, DDR2/DDR3 memory controller with ECC, and four TDM channels. The device operates from -40C to +125C junction temperature, making it suitable for extended-temperature industrial and outdoor networking equipment.
Architecturally, the P1020NXE2FFB employs the e500v2 core with double-precision FPU, 32KB I/D L1 cache per core, and a unified 256KB L2 cache. The platform uses a CoreNet fabric for on-chip interconnect, a separate MAPLE-B2 acceleration engine for print/imaging offload, and the SEC 4.0 hardware crypto block supporting DES, 3DES, AES, ARC4, RSA, ECC, and MD5/SHA-1/SHA-2 hashes.
Typical applications include multi-service routers, DSLAM line cards, industrial gateways, network-attached storage controllers, multi-function printer controllers, and Smart Energy/Grid communication nodes. The combination of dual-core processing and hardware cryptography makes it ideal for VPN/SSL termination at the network edge.
When designing with the P1020NXE2FFB, ensure the DDR3 interface is terminated per JEDEC recommendations and that the core voltage rails (0.9V/1.0V, 1.5V, 3.3V) are sequenced according to the power-up requirements. Heat dissipation at 800 MHz is moderate but the 31x31 mm BGA still requires thermal vias and adequate PCB copper for sustained 125C operation.
Alternativas drop-in para P1020NXE2FFB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com P1020NXE2FFB (mesmo formato e footprint) — diferindo em Operating Temperature, USB, Memory Controller, Mounting Type, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
P1020NXE2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1010NXE2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1011NSN2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2020NXE2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1020NSE2HFB
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
P1014NXE2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1020NXE2FFB Classificações máximas e características elétricas
| Architecture | Power Architecture e500v2 |
| Core Configuration | Dual-core (2 cores), 32-bit |
| Maximum Core Frequency | 800 MHz |
| L1 Cache (per core) | 32 KB instruction + 32 KB data |
| L2 Cache | 256 KB unified |
| Security Engine | SEC 4.0 (DES/3DES/AES/RSA/ECC/SHA) |
| Ethernet Interfaces | 3x Gigabit (2x SGMII + 1x RGMII) |
| Memory Controller | DDR2/DDR3 with ECC |
| PCIe Controllers | 2x PCIe Gen 1 |
| USB | 1x USB 2.0 with ULPI |
| TDM | 4 channels |
| Encapsulamento | 689-TEPBGA II (31x31 mm) |
| Temperatura de operação | -40C to +125C (junction) |
| Status RoHS | RoHS Compliant |
| Lead-Free Status | Lead Free |
| Tipo de montagem | Surface Mount (BGA) |
| Qualification | Not Qualified (industrial grade) |
Guia de Configuração de Pinos do P1020NXE2FFB 689-tepbga ii (31x31 mm)
Configuração de pinos para P1020NXE2FFB (pacote 689-tepbga ii (31x31 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para P1020NXE2FFB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
P1020NXE2FFB é adequado para 6 aplicaçãos: Multi-Service Router / Gateway, Industrial Networking / Smart Grid Gateway, Network-Attached Storage (NAS) Controller, Multi-Function Printer Controller, Wireless LAN Access Point Controller, DSLAM / Access Aggregation Line Card.
Multi-Service Router / Gateway
The P1020NXE2FFB's dual e500v2 cores at 800 MHz deliver the parallel processing headroom required for simultaneous WAN routing, firewall, and VPN termination at gigabit line rates. Hardware SEC 4.0 offloads AES-256 IPSec/SSL/TLS, sustaining 1 Gbps encrypted throughput without CPU loading, while three GbE interfaces (2x SGMII + 1x RGMII) connect directly to WAN PHY and LAN switch fabric without external MAC devices.
Recomendado
Industrial Networking / Smart Grid Gateway
The -40C to +125C extended-temperature grade (FFB suffix) and hardware ECC memory controller make the P1020NXE2FFB well-suited for outdoor Smart Grid gateways, substation routers, and SCADA communication nodes. Dual PCIe Gen 1 lanes connect to Wi-Fi 6 and cellular modems, while the SEC engine secures DNP3/IEC 61850 traffic - critical infrastructure requiring FIPS-validated cryptography at the network edge.
Recomendado
Network-Attached Storage (NAS) Controller
The dual-core architecture and DDR3 with ECC memory controller provide the throughput required for NAS controllers managing multi-drive SATA arrays and gigabit network traffic. SEC 4.0 hardware encryption enables AES-256 volume encryption with negligible throughput penalty, while USB 2.0 with ULPI connects to front-panel LCD/button interfaces and PCIe x4 connects to SATA or SAS RAID controllers.
Recomendado
Multi-Function Printer Controller
The integrated MAPLE-B2 print/image acceleration block offloads rendering and image processing, offloading these workloads from the CPU cores to deliver fast first-page-out times. Dual cores handle network protocol stacks (TCP/IP, SMB, IPP, LPD) while MAPLE handles 600+ DPI rasterization, and TDM channels interface with analog fax/modem modules - making this a true single-chip MFP SoC.
Recomendado
Wireless LAN Access Point Controller
Three GbE interfaces support mesh backhaul and PoE uplink, while two PCIe x1 lanes connect to dual-band 802.11ac/ax Wi-Fi radios. The SEC 4.0 engine accelerates WPA2-Enterprise / WPA3 encryption for enterprise AP deployments, and the e500v2 cores run the hostapd/control-plane stack with hardware crypto at line rate - delivering carrier-grade access point throughput.
Recomendado
DSLAM / Access Aggregation Line Card
TDM channels aggregate legacy T1/E1/J1 voice circuits while PCIe interfaces connect to DSL PHY devices and backhaul Ethernet. The dual cores handle layer-2/3 forwarding across thousands of subscribers with hardware QoS, and the ECC memory controller protects routing tables from soft errors - critical for carrier-grade uptime in central-office deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P1020NXE2FFB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P1020NXE2HFB | P1010NXE2HFB | P1011NSN2HFB | P2020NXE2HFB | P1020NSE2HFB | P1014NXE2HFB |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Architecture | Power Architecture e500v2 dual-core | Power Architecture e500v2 dual-core (same) | Power Architecture e500v2 single-core | Power Architecture e500v2 single-core | Power Architecture e500v2 dual-core | Power Architecture e500v2 dual-core (same) | Power Architecture e500v2 single-core |
| Maximum Core Frequency | 800 MHz | 800 MHz (same) | 800 MHz | 800 MHz | 1.2 GHz (+50%) | 800 MHz (same) | 800 MHz |
| Core Count | 2 | 2 (same) | 1 (-50%) | 1 (-50%) | 2 (same) | 2 (same) | 1 (-50%) |
| Operating Temperature | -40C to +125C (junction) | -40C to +85C (commercial) | -40C to +85C (commercial) | -40C to +85C (commercial) | -40C to +85C (commercial) | -40C to +85C (commercial) | -40C to +105C (industrial) |
| Security Engine | SEC 4.0 | SEC 4.0 (same) | SEC 3.4 | SEC 3.4 | SEC 4.0 (same) | SEC 4.0 (same) | SEC 4.0 |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Obsolete | Obsolete | NRND | Obsolete | Obsolete |
Principais diferenciais
- Extended temperature grade up to 125C junction (vs P1020NXE2HFB)
- Dual-core vs single-core scaling (vs P1011NSN2HFB)
- SEC 4.0 vs SEC 3.4 hardware crypto (vs P1010NXE2HFB)
Notas de projeto
The 689-TEPBGA II package at 31x31 mm requires thermal via arrays (0.3 mm drill, 1.0 mm pitch) under the thermal pad connected to internal ground planes. Estimated: at 800 MHz dual-core operation with 0.9V core voltage and 1.5W typical dissipation, junction-to-ambient thermal resistance of approximately 15 C/W on a 4-layer JEDEC JESD51 board keeps Tj under 100C at 70C ambient, but thermal design margin should be verified per NXP AN3939 for extended-temperature FFB-grade operation.
DDR3 interface requires matched-length routing (within 25 mil) for byte lanes and 50-ohm single-ended controlled impedance per JEDEC. Estimated: trace impedance target is 50 ohms +/-10% with reference to GND plane within 8 mil. Use fly-by topology for command/address signals with termination VTT at the far end; VTT decoupling requires 100 uF bulk plus 0.1 uF per-pin bypass capacitors.
Power-up sequencing must follow NXP datasheet requirements: VDD (0.9V/1.0V core) ramps first, followed by VDDQ (1.5V DDR), then VDDIO (3.3V). Each rail requires monotonic ramp with <20 ms rise time and proper POR sequencing controller (e.g., NUP4202 or similar) to prevent ESD latch-up. Estimated: total inrush during power-up ramp is approximately 800 mA peak across all rails for the dual-core variant.
SGMII serial interfaces require AC-coupled routing with 0.1 uF capacitors in series and 100-ohm differential impedance per IEEE 802.3. PCIe Gen 1 lanes require similar 85-100 ohm differential routing with maximum 4-inch trace length and 2 skew-matching vias; reference clock must be routed as 100-ohm differential with no stub branches. Place AC caps within 200 mils of the device ball.
Common design pitfalls include: (1) omitting JTAG pull-ups on TCK/TMS/TRST, causing boundary-scan failures; (2) leaving TEST_SEL pins floating, which can put the device in factory test mode; (3) using single-core boot code on dual-core silicon, which only enables core 0; (4) violating the maximum reflow temperature of 260C peak for the TEPBGA package; (5) not enabling the SEC engine in U-Boot for production secure-boot deployments.
Informações de conformidade
RoHS compliant and lead-free per NXP product page and DigiKey listing. Not AEC-Q100 qualified (industrial grade); halogen-free status not explicitly stated in verified data. SEC 4.0 engine can be FIPS 140-2 validated at the system level for federal applications.
