PIC16LF18854-I/ML - 8-Bit 32MHz XLP MCU 7KB Flash 28-QFN | Microchip
N.º da peça: PIC16LF18854-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.56 | $25,60 |
| 100 | $2.27 | $227,00 |
| 500 | $2.02 | $1.010,00 |
| 1.000 | $1.78 | $1.780,00 |
PIC16LF18854-I/ML Visão geral
What is a Microcontroller (MCU)? A microcontroller is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile data memory (SRAM), optional EEPROM, and I/O peripherals into one IC. Within the broader taxonomy, an MCU belongs to embedded computing, sits under microcontrollers, and is classified by its core architecture — here, an 8-bit RISC core with 14-bit wide instructions (the PIC16 mid-range enhanced core). The "LF" suffix denotes the 1.8V–3.6V wide-voltage variant optimized for low-power operation.
Key differentiating features include integrated 10-bit ADC with computation (ADC2), a 5-bit/8-bit DAC, two Capture/Compare/PWM (CCP) modules, two 10-bit PWMs, Configurable Logic Cells (CLC), Complementary Waveform Generator (CWG), Numerically Controlled Oscillator (NCO), Zero-Cross Detect (ZCD), and on-chip temperature indicator. Communication is provided by EUSART, two SPI/I2C (MSSP), and a 32 kHz internal oscillator for sleep-time accuracy.
At the architecture level, the device pairs a 49-instruction enhanced mid-range core with a 16-level hardware stack, hardware multiply assist, and CLC-based interconnect that lets designers wire peripherals without code overhead. The integrated Core Independent Peripherals (CIPs) — HLT, WWDT, CRC/SCAN — support functional-safety-style features for deterministic response.
Typical applications include low-power IoT sensor nodes, battery-powered wearables, consumer white goods, e-metering, HVAC controls, and USB/HID adapters when paired with a companion transceiver. Designers select this part when sleep current, deterministic CIP behaviour, and 5V-tolerant-tolerant I/O on a 28-QFN footprint are all required in the same BOM line.
When laying out the PCB, expose the QFN thermal/epposed pad (EP) to a top-layer copper flood with at least 8 thermal vias to the inner/inner planes. Decouple VDD with a 100 nF X7R placed within 2 mm of the pin, and add a bulk 1 µF–10 µF if the load step exceeds 50 mA.
This page synthesizes distributor pricing, drop-in same-footprint alternatives, and application guidance not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC16LF18854-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16LF18854-I/ML (mesmo formato e footprint) — diferindo em Package, ADC, Core Architecture, Program Memory (Flash), Communication.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16LF18855-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F18854-I/ML
✅ Drop-In✓ Em estoque
$1.02 / unidade
Ver ficha técnica →PIC16LF18856-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.55 / unidade
Ver ficha técnica →PIC16LF18857-I/ML
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC16LF18875-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.55 / unidade
Ver ficha técnica →PIC16LF18854-I/ML Classificações máximas e características elétricas
| Core | PIC16 8-bit RISC, 14-bit instruction set (enhanced mid-range) |
| CPU Speed (max) | 32 MHz |
| Program Flash | 7 KB (4K x 14 words) |
| Data SRAM | 512 bytes |
| Data EEPROM | 256 bytes |
| Operating Voltage | 1.8 V to 3.6 V (LF suffix) |
| Encapsulamento | 28-QFN (6x6 mm) with exposed pad |
| ADC | 10-bit ADC with Computation (ADC2) |
| DAC | 5-bit and 8-bit DAC |
| Timers/PWM | 2x CCP, 2x 10-bit PWM, CWG, NCO |
| Communication | 1x EUSART, 2x MSSP (SPI/I2C) |
| Core Independent Peripherals | CLC, ZCD, HLT, WWDT, CRC/SCAN, temp indicator |
| Low-Power Mode | XLP — eXtreme Low Power (sleep / doze / idle) |
| Temperatura de operação | -40C to +85C (industrial, "I") |
| Tipo de montagem | Surface Mount (QFN with EP) |
| Status RoHS | Compliant |
Configuração de pinos do PIC16LF18854-I/ML
| Pino 1 | RA5 — Bidirectional I/O pin / analog input / CLC output |
| Pino 2 | RA4 — Bidirectional I/O pin / analog input / CLC output |
| Pino 3 | RA3 — Bidirectional I/O pin / analog input / reference voltage |
| Pino 4 | RC5 — Bidirectional I/O pin / CCP / PWM |
| Pino 5 | RC4 — Bidirectional I/O pin / PWM output |
| Pino 6 | RC3 — Bidirectional I/O pin / SCL (MSSP) |
| Pino 7 | RC6 — Bidirectional I/O pin / TX (EUSART) |
| Pino 8 | RC7 — Bidirectional I/O pin / RX (EUSART) |
| Pino 9 | RB7 — Bidirectional I/O pin / system clock output |
| Pino 10 | RB6 — Bidirectional I/O pin / ICD clock |
| Pino 11 | RB5 — Bidirectional I/O pin / analog input |
| Pino 12 | RB4 — Bidirectional I/O pin / analog input |
| Pino 13 | RC2 — Bidirectional I/O pin / analog input / DAC |
| Pino 14 | RC1 — Bidirectional I/O pin / CCP / analog input |
| Pino 15 | RC0 — Bidirectional I/O pin / analog input |
| Pino 16 | RA2 — Bidirectional I/O pin / analog input / DAC reference |
| Pino 17 | RA1 — Bidirectional I/O pin / analog input / DAC output |
| Pino 18 | RA0 — Bidirectional I/O pin / analog input |
| Pino 19 | VSS — Ground reference |
| Pino 20 | VDD — Positive supply (1.8V–3.6V) |
| Pino 21 | RB0 — Bidirectional I/O pin / ZCD / CLC output |
| Pino 22 | RB1 — Bidirectional I/O pin / analog input |
| Pino 23 | RB2 — Bidirectional I/O pin / analog input |
| Pino 24 | RB3 — Bidirectional I/O pin / analog input |
| Pino 25 | RA6 — Bidirectional I/O pin / oscillator / CLC output |
| Pino 26 | RA7 — Bidirectional I/O pin / oscillator / CLC output |
| Pino 27 | MCLR — Master Clear (reset) input, active-low |
| Pino 28 | VSS — Ground reference |
Aplicações típicas
PIC16LF18854-I/ML é adequado para 7 aplicaçãos: Battery-Powered IoT Sensor Nodes, Consumer White Goods (Washing Machines / Dishwashers), Smart Wearable / Fitness Bands, HVAC Climate Controls, Electronic Metering / Smart Utility, USB HID Peripherals / Adapters, LED Lighting / Dimmable Lamps.
Battery-Powered IoT Sensor Nodes
The PIC16LF18854-I/ML fits battery-powered IoT sensor nodes thanks to its 1.8V–3.6V wide-voltage range and eXtreme Low-Power (XLP) technology. Its 32 kHz internal oscillator keeps time during sleep, while the 10-bit ADC with Computation (ADC2) off-loads averaging and threshold checks from the CPU. Configurable Logic Cells (CLC) and the Windowed Watchdog Timer (WWDT) let the part wake only on meaningful events. Compared to a discrete timer+MCU approach, this single chip reduces BOM count and sleep current, extending coin-cell or 2x AA battery life.
Recomendado
Consumer White Goods (Washing Machines / Dishwashers)
The PIC16LF18854-I/ML serves consumer white goods where 7 KB Flash holds user-interface state machines plus motor-control sequencing. The Complementary Waveform Generator (CWG) and dual 10-bit PWMs drive TRIAC/IGBT half-bridges for universal-motor or BLDC control, while the Zero-Cross Detect (ZCD) synchronizes phase-angle firing with the AC line. With hardware CRC/SCAN and a Windowed Watchdog Timer, the design meets IEC 60730 Class B household-appliance safety expectations. Its 28-QFN (6x6) footprint fits compact display modules.
Recomendado
Smart Wearable / Fitness Bands
In smart wearables, the PIC16LF18854-I/ML drives LEDs, reads PPG/heart-rate sensor data, and manages Bluetooth sleep handshakes — all on a 1.8V Li-ion cell rail. The integrated 5/8-bit DAC calibrates the optical sensor's bias, while the EUSART interfaces with a low-energy BLE module. With nA-level sleep currents, the part can last weeks between charges in an always-on wearable. Its 28-QFN (6x6) keeps the BOM small enough for wristband-class PCBs.
Recomendado
HVAC Climate Controls
The PIC16LF18854-I/ML handles thermostat and damper-actuator control in HVAC systems, where the ADC2 channels read NTC thermistors, the 10-bit PWM drives TRIAC-fired heating stages, and the EUSART bridges to a Wi-Fi module for cloud control. The hardware CRC/SCAN block supports functional-safety integrity checks, while the temperature indicator provides on-chip die-temperature monitoring for fan-control loops. The 28-QFN footprint simplifies reflow in compact wall-mount thermostats.
Recomendado
Electronic Metering / Smart Utility
The PIC16LF18854-I/ML's 256-byte EEPROM is ideal for e-metering — it stores tariff tables, calibration constants, and tamper logs without external NVM. The 10-bit ADC with Computation reads current-sense shunt or CT inputs, while the Hardware Limit Timer (HLT) reacts within microseconds to overloads. Combined with XLP sleep modes, the design can run years on the meter's primary-cell battery. The 28-QFN (6x6) is small enough for DIN-rail form factors.
Recomendado
USB HID Peripherals / Adapters
The PIC16LF18854-I/ML pairs with a Microchip USB3300 or MIC2026 USB 2.0 controller to build USB HID adapters (keyboards, mice, custom-input devices). The MSSP peripherals drive the SPI/I2C link to a sensor hub, while the CLC block implements debounce logic on capacitive-touch pads. The 256-byte EEPROM retains user-pairing or calibration across power cycles. With 7 KB Flash and the 28-QFN footprint, the design fits inside a USB dongle housing.
Recomendado
LED Lighting / Dimmable Lamps
The PIC16LF18854-I/ML's 10-bit PWMs and CWG combine to deliver flicker-free dimming for LED lighting. The ZCD synchronizes PWM edges to the AC line for 0–10V or TRIAC dimmer compatibility, while the 8-bit DAC drives constant-current regulator references. With XLP sleep modes, the design still meets Energy Star standby requirements (<100 mW). The 28-QFN (6x6) layout fits inside PAR30 / A19 lamp bases.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16LF18854-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16LF18855-I/ML | PIC16F18854-I/ML | PIC16LF18856-I/ML | PIC16LF18857-I/ML | PIC16LF18875-I/ML |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6) ML | 28-QFN (6x6) ML - same | 28-QFN (6x6) ML - same | 28-QFN (6x6) ML - same | 28-QFN (6x6) ML - same | 28-QFN (6x6) ML - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | PIC16 8-bit, 14-bit instructions | PIC16 8-bit, 14-bit instructions | PIC16 8-bit, 14-bit instructions | PIC16 8-bit, 14-bit instructions | PIC16 8-bit, 14-bit instructions | PIC16 8-bit, 14-bit instructions |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Max CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Program Flash | 7 KB (4K x 14) | 14 KB (8K x 14) - +100% | 7 KB (4K x 14) | 14 KB+ (larger) | 14 KB+ (larger) | 14 KB+ (larger) |
| Data SRAM | 512 bytes | 1 KB | 512 bytes | 1 KB+ | 1 KB+ | 1 KB+ |
| Data EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
| XLP / Low Power | Yes (XLP) | Yes (XLP) | Yes (XLP) | Yes (XLP) | Yes (XLP) | Yes (XLP) |
Principais diferenciais
- Expanded memory in same 28-QFN footprint (vs PIC16LF18855-I/ML)
- 5V-capable supply range (vs PIC16F18854-I/ML)
- Compact 6x6 mm footprint for miniaturized designs (vs PIC16LF18855-I/SP (28-SPDIP))
Notas de projeto
The 28-QFN (6x6) package requires an exposed thermal pad (EP) tied to VSS for both electrical ground and thermal dissipation. Per Microchip layout guidelines, the EP must be soldered to a top-layer copper flood of at least the same footprint area, with 8–10 thermal vias (0.3 mm drill, 0.6 mm pad) stitching the top flood to the inner ground plane. Failure to solder the EP can cause erratic logic or thermal shutdown at moderate loads.
Decouple VDD with a 100 nF X7R placed within 2 mm of the VDD pin, and add a bulk 1 µF–10 µF tantalum or ceramic capacitor at the package's power pin for transient suppression. The PIC16LF18854 draws microamp-level sleep current but sub-mA peaks when the ADC2 is active — undersized bulk capacitance will cause voltage dips and brown-out resets. For battery applications, choose a low-Iq LDO such as MCP1700 downstream of the cell.
Do not exceed 3.6 V on VDD — the LF suffix in PIC16LF18854 denotes the low-voltage variant (1.8 V–3.6 V). Use PIC16F18854 instead if 5 V rails are required. The MCLR pin requires a 10 kΩ pull-up to VDD; floating MCLR causes intermittent resets. Unused I/O pins must be configured as outputs low or inputs with the WPUEN bit cleared to avoid shoot-through or phantom interrupts.
Keep the 32.768 kHz crystal traces short (<5 mm) and symmetric, with a guard ground around the oscillator pins. Route the analog ADC2 inputs away from PWM and digital switching lines to minimize coupled noise; if unavoidable, route perpendicular and add a small RC filter (10 Ω + 100 pF). MCLR trace should be kept short to prevent false resets from EMI; add a 100 nF cap on MCLR for production environments.
Informações de conformidade
RoHS compliant per Microchip product page and distributor listings; lead-free and halogen-free per Microchip environmental data. AEC-Q100 qualification is not applicable — automotive-grade variants (PIC16LF18854-E/ML or -I/VAO) are available separately.
