PIC18F25K80-I/MM - 8-bit 64MHz MCU, 32KB Flash, ECAN | Microchip
N.º da peça: PIC18F25K80-I/MM ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.5 | $4,50 |
| 10 | $4.05 | $40,50 |
| 100 | $3.62 | $362,00 |
| 500 | $3.24 | $1.620,00 |
| 1.000 | $2.89 | $2.890,00 |
PIC18F25K80-I/MM Visão geral
A microcontroller (MCU) is a single-chip computer containing a CPU, non-volatile program memory (Flash), volatile data memory (SRAM), and peripherals such as timers, ADCs, and communication interfaces; in the wider taxonomy, the PIC18F25K80 belongs to PIC18 -> 8-bit MCU -> microcontroller -> embedded processor -> semiconductor. ECAN is Microchip's enhanced implementation of the Controller Area Network (CAN) protocol originally standardized as ISO 11898 and widely used in automotive and industrial networks, and nanoWatt XLP is Microchip's low-power technology that drops sleep current to nanoamp levels for battery-backed designs.
Key features include operation from 1.8 V to 5.5 V, sleep current below 60 nA typical, integrated ECAN for CAN 2.0B networks, a 12-bit A/D converter with up to 11 analog input channels plus CTMU for capacitive touch, and four 16-bit timers including CCP/ECCP. The 64 MHz clock supports 16 MIPS throughput, executing 1 instruction per clock thanks to the PIC18 RISC-style pipeline, while on-board debugging is provided through in-circuit debug and two programming pins for In-Circuit Serial Programming (ICSP).
Typical applications include building automation nodes, elevator control panels, industrial CAN nodes, automotive body and sensor networks, and battery-powered remote sensor modules. The wide 1.8V-5.5V supply range lets the part operate directly from a single Li-ion or 2xAA cell stack, while ECAN enables robust peer-to-peer communication in noisy industrial or vehicle environments.
Use a 100 nF decoupling capacitor close to VDD plus a 10 uF bulk capacitor when load steps are large; bypass AVSS/AVDD separately on ADC references and respect the analog and digital ground split. Configure the device for ECAN via the CONFIG register bits and verify the bit timing against the oscillator choice.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet — providing engineering decision context beyond the spec sheet.
Alternativas drop-in para PIC18F25K80-I/MM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18F25K80-I/MM (mesmo formato e footprint) — diferindo em Package, Timers, ADC, CAN Interface, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18F25K80T-I/MM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18F25K80-I/MMVAO
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18F25K80T-E/MM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18F26K80-H/MM
✅ Drop-In✓ Em estoque
$4.1 / unidade
Ver ficha técnica →PIC18F25K80-I/MM Classificações máximas e características elétricas
| Core Architecture | PIC18 8-bit RISC |
| Program Flash Memory | 32 KB (16K x 16) |
| SRAM | 3.6 KB |
| EEPROM | 1 KB |
| Frequência máxima de clock | 64 MHz |
| Instruction Throughput | 16 MIPS |
| Operating Voltage Range | 1.8 V to 5.5 V |
| Sleep Current (XLP typical) | <60 nA |
| ADC | 12-bit, up to 11 channels |
| CAN Interface | ECAN (CAN 2.0B) |
| UART | 2x EUSART |
| Synchronous Serial | SPI / I2C |
| Timers | 4x 16-bit with CCP/ECCP |
| Touch Sensing | CTMU (Capacitive Touch) |
| Encapsulamento | 28-QFN-S (6x6 mm) /MM |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (industrial, /I) |
| Programming/Debug | ICSP, in-circuit debug |
| Status RoHS | Compliant |
Configuração de pinos do PIC18F25K80-I/MM
| Pino 1 | RA2 — PORTA I/O / analog AN2 |
| Pino 2 | RA3 — PORTA I/O / analog AN3 |
| Pino 3 | RA4 — PORTA I/O / analog AN4 / SOSC output |
| Pino 4 | RA5 — PORTA I/O / analog AN5 |
| Pino 5 | RA6 — PORTA I/O / analog AN6 / OSC2 |
| Pino 6 | RA7 — PORTA I/O / analog AN7 / OSC1 |
| Pino 7 | VDD — Positive supply 1.8-5.5 V |
| Pino 8 | VSS — Ground reference |
| Pino 9 | OSC1/RA7 — Crystal oscillator input / RA7 shared |
| Pino 10 | OSC2/RA6 — Crystal oscillator output / RA6 shared |
| Pino 11 | CANTX/RC6 — ECAN transmit / PORTC I/O |
| Pino 12 | CANRX/RC7 — ECAN receive / PORTC I/O |
| Pino 13 | RC0 — PORTC I/O / SOSCO crystal output |
| Pino 14 | RC1 — PORTC I/O / SOSCI crystal input |
| Pino 15 | RC2 — PORTC I/O |
| Pino 16 | RC3 — PORTC I/O / SCL I2C clock |
| Pino 17 | RC4 — PORTC I/O / SDA I2C data |
| Pino 18 | RC5 — PORTC I/O |
| Pino 19 | VSS — Ground reference |
| Pino 20 | VDD — Positive supply 1.8-5.5 V |
| Pino 21 | RB0 — PORTB I/O / AN8 / interrupt-on-change |
| Pino 22 | RB1 — PORTB I/O / AN9 |
| Pino 23 | RB2 — PORTB I/O / AN10 |
| Pino 24 | RB3 — PORTB I/O / AN11 |
| Pino 25 | RB4 — PORTB I/O |
| Pino 26 | RB5 — PORTB I/O |
| Pino 27 | ICSPCLK/RB6 — ICSP clock / PORTB I/O / programming |
| Pino 28 | ICSPDAT/RB7 — ICSP data / PORTB I/O / programming |
Aplicações típicas
PIC18F25K80-I/MM é adequado para 6 aplicaçãos: Building Automation Node, Elevator Control Panel, Industrial CAN Node, Automotive Body and Sensor Network, Battery-Powered Remote Sensor Module, Capacitive Touch User Interface.
Building Automation Node
The PIC18F25K80-I/MM is ideal for building automation sensor and actuator nodes because its 1.8 V to 5.5 V operating range lets it run directly from 2xAA cells while the integrated ECAN interface connects to building-wide CAN bus backbones at 50 kbps to 1 Mbps. Sub-60 nA XLP sleep current enables battery-powered wireless or wired sensor modules that report temperature, humidity, or occupancy on schedule and last years on a single cell pack, while the 12-bit ADC with 11 channels directly digitizes analog sensor outputs (thermistor bridges, photo-diodes, CO2 sensor outputs) without an external ADC. The CTMU peripheral further adds capacitive-touch button support for wall switches and dimmers, replacing mechanical buttons with a single IC.
Recomendado
Elevator Control Panel
The PIC18F25K80-I/MM fits elevator control subsystems that demand deterministic CAN 2.0B communication between car-panel boards, floor-IO nodes, and the central controller. The 16 MIPS throughput is enough to handle multi-floor button scanning with hardware CCP/ECCP generating PWM-controlled LED indicators and buzzer cadences, while the 28-QFN 6x6 mm footprint keeps each node compact inside tight panel enclosures. For elevator wiring-loop integrity the ECAN peripheral provides robust differential signaling with hardware acceptance filters, eliminating the need for an external CAN controller and reducing BOM cost.
Recomendado
Industrial CAN Node
In industrial CAN nodes the PIC18F25K80-I/MM provides an integrated ECAN engine that supports standard 11-bit and extended 29-bit identifiers, meeting ISO 11898-1 and CANopen / DeviceNet protocol requirements without an external controller. The wide 1.8 V to 5.5 V supply window tolerates 24 V industrial bus rails when paired with a switching regulator, while the 12-bit ADC lets the MCU read 4-20 mA current loops through a precision shunt directly. Four 16-bit timers with CCP/ECCP deliver up to four PWM channels for motor-control and proportional-valve actuation, all in an industrial -40C to +85C rated QFN that mounts on vibration-resistant leadless pads.
Recomendado
Automotive Body and Sensor Network
For automotive body controllers the PIC18F25K80-I/MM drives ECAN nodes that share chassis status between door modules, mirror controllers, seat-position sensors, and HVAC actuators over a 500 kbps CAN body bus. The 12-bit ADC with CTMU enables capacitive moisture and rain-sensor interfaces, while the small 28-QFN footprint suits mirror and door-module housings. For under-hood or AEC-Q100 qualified designs, the engineer should select the PIC18F25K80-E/MM extended-temperature variant (or the VAO lot variant for automotive traceability); the -I/MM itself is industrial-grade but shares the same die.
Recomendado
Battery-Powered Remote Sensor Module
The PIC18F25K80-I/MM's nanoWatt XLP technology with sub-60 nA sleep current makes it a strong choice for remote sensor modules running from a single CR2032 or 2xAA cell pack. Wake-up sources include the real-time clock calendar, watch-dog timer, and external interrupts on RB0/RB1 ports, while the integrated 12-bit ADC reads sensor outputs on each wake event before returning to sleep. The ECAN peripheral is parked in sleep with wake-on-CAN support, allowing battery nodes to interrupt the bus only when a reading crosses a configured threshold, extending battery life up to multiple years in intermittent-duty applications.
Recomendado
Capacitive Touch User Interface
Because the PIC18F25K80-I/MM integrates the Charge Time Measurement Unit (CTMU) peripheral alongside the 12-bit ADC, engineers can build capacitive-touch button arrays, sliders, and proximity sensors with no external touch controller. Each of up to 11 analog channels can be configured as a CTMU-driven capacitive input, with the on-chip ADC measuring charge-time delta to detect finger touch through overlays up to several millimeters thick. Combined with the XLP sleep current below 60 nA, the MCU keeps touch scanning power under microamp averages, suitable for battery-powered HMI panels and IoT wall controls.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18F25K80-I/MM — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18F25K80T-I/MM | PIC18F25K80-I/MMVAO | PIC18F25K80T-E/MM | PIC18F26K80-H/MM |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN-S (6x6 mm) /MM | 28-QFN-S (6x6 mm) /MM - same | 28-QFN-S (6x6 mm) /MMVAO - same | 28-QFN-S (6x6 mm) /MM - same | 28-QFN-S (6x6 mm) /MM - same |
| Flash Memory | 32 KB | 32 KB - same | 32 KB - same | 32 KB - same | 64 KB (+100%) |
| SRAM | 3.6 KB | 3.6 KB - same | 3.6 KB - same | 3.6 KB - same | 4 KB (+11%) |
| Maximum Clock | 64 MHz (16 MIPS) | 64 MHz - same | 64 MHz - same | 64 MHz - same | 64 MHz - same |
| Operating Voltage | 1.8 V to 5.5 V | 1.8-5.5 V - same | 1.8-5.5 V - same | 1.8-5.5 V - same | 1.8-5.5 V - same |
| ECAN / CAN 2.0B | Yes | Yes - same | Yes - same | Yes - same | Yes - same |
| Temperature Grade | -40C to +85C (Industrial) | -40 to +85C - same | -40 to +85C industrial lot | -40C to +125C (Extended) | -40 to +150C (High temp) |
| Packaging Carrier | Tube / Tray | Tape & Reel | Tube | Tape & Reel | Tube |
Principais diferenciais
- Integrated ECAN with automotive-grade extension (vs PIC18F25K80-E/MM (extended temp variant))
- Doubled memory headroom (vs PIC18F25K80-I/MM base part)
- Automotive lot traceability via VAO suffix (vs Standard PIC18F25K80-I/MM)
Notas de projeto
Place a 100 nF decoupling capacitor within 2-3 mm of each VDD pin (pins 7 and 20) and add a single 10 uF bulk capacitor on the supply rail near the MCU. Both pins 7 and 20 must be connected, even if only one is decoupled, as the datasheet requires both for proper bias distribution. The internal 2.5 V bandgap reference for the ADC is supplied from VDD and is sensitive to high-frequency switching noise; route noisy digital traces away from AVSS/AVDD and use a small ferrite bead to isolate the analog rail when low ADC noise is required.
Although the PIC18F25K80-I/MM is rated up to 64 MHz (16 MIPS), the 28-QFN 6x6 mm package has a typical theta_JA of ~45 C/W on a 1-oz 2-layer JEDEC test board, so continuous 64 MHz operation at high ambient (60-85C) still keeps the junction well within the 150C limit. No additional heatsinking is required, but the exposed thermal pad (pin 29/PAD) must be soldered to a copper pour of at least 0.25 in^2 to meet the rated specs; a floating pad raises theta_JA to ~85 C/W and can cause thermal shutdown during sustained ECAN traffic at +85C ambient.
Route ICSPCLK (RB6) and ICSPDAT (RB7) traces so the 4.7 kohm ICSP pull-ups on each line do not share wiring with high-current load drivers; if port remapping moves these functions to PORTC, document the change to avoid bricking during field firmware updates. Keep the ECAN CANTX/CANRX differential pair (RC6/RC7) at 100 ohm differential impedance and length-matched within 5 mm to comply with CAN bus standards; place the MCP2562 transceiver within 10 mm of these pins to minimize stub length and keep reflections under 5%.
When migrating from the legacy PIC18F2580 to the PIC18F25K80-I/MM, do not assume identical RAM layout — the K80 family expanded SRAM to 3.6 KB by reorganizing the GPR bank, so any assembly code that hard-codes bank addresses in the 0x100-0x1FF region must be reviewed. Similarly, the ECAN module replaces the legacy CAN module with different buffer organization (ECAN1 vs CAN); firmware built against PIC18F2580 needs a register-level port per Microchip migration guide AN1245. Always verify CONFIG register defaults in MPLAB X before re-flashing a customer-side binary.
The 12-bit ADC achieves its rated ±2 LSB INL/DNL only when the input source impedance is below 2.5 kohm and the conversion clock is set between 1.6 and 6.25 MHz (FOSC/4 to FOSC/64). For higher-impedance sensors, add an external unity-gain buffer (such as an MCP6001 op-amp) between the sensor and the ANx pin to avoid conversion errors caused by the ADC's sample-and-hold leakage. When using CTMU for capacitive touch, calibrate each channel's reference current via the CTMUICON register against temperature to maintain touch accuracy over -40C to +85C.
Informações de conformidade
RoHS compliant and lead-free per Microchip material declaration. The -I/MM industrial grade is NOT AEC-Q100 qualified — for AEC-Q100 automotive designs choose the -E (extended) or -H (high) temperature variant. Halogen-free packaging per the Microchip packaging material datasheet (PMD).
