PIC18F26K80T-I/MM - 8-Bit 64MHz 64KB Flash MCU w/ ECAN | Microchip
N.º da peça: PIC18F26K80T-I/MM ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.32 | $4,32 |
| 10 | $3.88 | $38,80 |
| 100 | $3.42 | $342,00 |
| 500 | $2.96 | $1.480,00 |
| 1.000 | $2.38 | $2.380,00 |
PIC18F26K80T-I/MM Visão geral
What is an 8-bit microcontroller with integrated CAN? An MCU (microcontroller) is a single-chip computer containing a CPU core, memory, and programmable peripherals. ECAN (Enhanced Controller Area Network) is Microchip's hardware implementation of the Bosch CAN 2.0B protocol used for robust in-vehicle and industrial networking. The PIC18F26K80 family sits in the hierarchy: PIC microcontroller -> 8-bit PIC18 core -> nanoWatt XLP low-power subfamily -> K80 series with ECAN. AEC-Q100 qualification means the part has completed automotive stress-test certification.
Key features include 64KB Flash organized as 32K x 16 words, 24 digital I/O lines, hardware ECAN supporting CAN 2.0B active/passive/Listen modes, a 12-bit ADC with up to 11 input channels, four 16-bit timers, two comparators, a charge-time measurement unit (CTMU), and nanoWatt XLP technology that drops typical sleep current into the nanoampere range. The internal oscillator is selectable from 31kHz to 16MHz, reducing external component count.
The PIC18F26K80T-I/MM uses an enhanced Harvard RISC architecture with a 16-bit instruction word and 8-bit data path, hardware multiplier, and a 31-deep stack. ECAN handles bit rates up to 1Mbps with filtering and acceptance masks, eliminating firmware bit-banging for automotive buses. The 12-bit ADC achieves up to 100 ksps with acquisition control, and the CTMU enables capacitive touch and time-of-flight measurement when paired with on-chip comparators.
Typical applications include automotive body and chassis ECAN nodes, building climate and access control panels, industrial sensor interface boards with CAN backbone connectivity, and low-power remote sensor platforms. The wide 1.8V to 5.5V supply range supports battery-powered and 5V industrial buses directly.
When designing with this MCU, reserve the exposed pad (EP) for thermal dissipation and a low-impedance ground bond; an ungrounded EP degrades ADC accuracy and ESD robustness. Use the ICSP programming interface even in production layouts to allow late-stage firmware updates, and budget for the ECAN transceiver (e.g. MCP2551 or MCP2562) as a required companion.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC18F26K80T-I/MM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18F26K80T-I/MM (mesmo formato e footprint) — diferindo em Package, Timers, ADC, CTMU, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18F26K80-I/MM
✅ Drop-In✓ Em estoque
$2.86 / unidade
Ver ficha técnica →PIC18F26K80-E/MM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18F26K80-H/MM
✅ Drop-In✓ Em estoque
$4.1 / unidade
Ver ficha técnica →PIC18F25K80-I/MM
✅ Drop-In✓ Em estoque
$2.89 / unidade
Ver ficha técnica →PIC18F26K80T-I/SS
✅ Drop-In✓ Em estoque
$4.12 / unidade
Ver ficha técnica →PIC18F26K80T-I/MM Classificações máximas e características elétricas
| Core | PIC18 8-bit RISC |
| Family | PIC XLP 18K with ECAN |
| Program Memory (Flash) | 64 KB (32K x 16) |
| RAM | 3.6 KB (3.6K x 8) |
| EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Operating Voltage | 1.8 V to 5.5 V |
| I/O Pins | 24 |
| ADC | 12-bit, up to 11 channels |
| Comparators | 2 |
| Timers | 4 x 16-bit |
| ECAN | Yes (CAN 2.0B) |
| CTMU | Yes |
| Internal Oscillator | 31 kHz to 16 MHz selectable |
| Encapsulamento | 28-QFN-S (6x6 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (I grade) |
| AEC-Q100 | Automotive grade (per distributor parametric data) |
| RoHS | Compliant |
Configuração de pinos do PIC18F26K80T-I/MM
| Pino 1 | RA2 — Digital I/O / analog input AN2 |
| Pino 2 | RA3 — Digital I/O / analog input AN3 / VREF+ |
| Pino 3 | RA4 — Digital I/O / analog input AN4 |
| Pino 4 | RA5 — Digital I/O / analog input AN5 |
| Pino 5 | RA6 — Digital I/O / oscillator output |
| Pino 6 | RA7 — Digital I/O / oscillator input |
| Pino 7 | VSS — Ground reference |
| Pino 8 | VDD — Positive supply (1.8V-5.5V) |
| Pino 9 | RB0 — Digital I/O / interrupt-on-change / AN12 |
| Pino 10 | RB1 — Digital I/O / AN10 |
| Pino 11 | RB2 — Digital I/O / CANTX (ECAN transmit) |
| Pino 12 | RB3 — Digital I/O / CANRX (ECAN receive) |
| Pino 13 | RB4 — Digital I/O |
| Pino 14 | RB5 — Digital I/O / programming |
| Pino 15 | RB6 — Digital I/O / ICSP clock |
| Pino 16 | RB7 — Digital I/O / ICSP data |
| Pino 17 | RC0 — Digital I/O / AN16 |
| Pino 18 | RC1 — Digital I/O / AN17 |
| Pino 19 | RC2 — Digital I/O / AN18 |
| Pino 20 | RC3 — Digital I/O / AN19 / SCL |
| Pino 21 | RC4 — Digital I/O / AN20 / SDA |
| Pino 22 | RC5 — Digital I/O / AN21 |
| Pino 23 | RC6 — Digital I/O / TX (UART) |
| Pino 24 | RC7 — Digital I/O / RX (UART) |
| Pino 25 | RE3 — Digital I/O / MCLR (reset, active-low) |
| Pino 26 | AVDD — Analog positive supply |
| Pino 27 | AVSS — Analog ground |
| Pino 28 | EP — Exposed pad - thermal/ground bond, must be soldered to PCB ground |
Aplicações típicas
PIC18F26K80T-I/MM é adequado para 6 aplicaçãos: Automotive Body ECAN Node, Industrial Building Climate & Access Control, Battery-Powered CAN Sensor Node, Capacitive Touch HMI with CAN, Automotive Sensor Cluster with ECAN, Low-Power Industrial Data Logger.
Automotive Body ECAN Node
The PIC18F26K80T-I/MM is purpose-built for in-vehicle CAN nodes controlling body electronics such as door modules, mirror controllers, and seat position sensors. Its 64MHz CPU executes 16 MIPS, plenty for SAE J1939 stack handling plus local sensor sampling, while the 64KB Flash accommodates application plus transport-layer diagnostics. Hardware ECAN with CAN 2.0B active mode and 1Mbps capability offloads message filtering from the CPU, leaving headroom for periodic ADC scans of mirror position and temperature. AEC-Q100 automotive qualification per distributor data and the 1.8-5.5V supply range allow direct connection to 12V body buses through a regulator. Pair the MCU with an MCP2562 CAN transceiver and CTMU-driven touch switches for a complete body-control ECU.
Recomendado
Industrial Building Climate & Access Control
The PIC18F26K80T-I/MM serves as the CAN backbone controller in HVAC, access panel, and security sensor networks. Its 12-bit ADC with 11 channels digitizes thermistor, humidity, and CO2 sensors directly, while four 16-bit timers drive PWM outputs for damper and valve actuators. ECAN enables daisy-chained panels to communicate status without a central PLC, and nanoWatt XLP keeps standby current below 1 uA for always-on energy-harvesting panels. The 28-QFN-S 6x6 mm package supports compact panel PCBs, and the 1.8-5.5V supply lets the same board run from 3.3V logic or 5V industrial rails.
Recomendado
Battery-Powered CAN Sensor Node
In remote industrial sites and agricultural monitoring, the PIC18F26K80T-I/MM hosts battery-powered sensor nodes that wake on timer interrupt, take ADC readings, transmit over ECAN, and return to nanoWatt XLP sleep. Typical sleep currents below 1 uA and the 1.8V minimum supply allow multi-year operation from a single Li-SOCl2 cell. The 64KB Flash supports full CANopen or DeviceNet profiles, while 3.6KB RAM handles message buffers plus local sensor averaging. Internal oscillator eliminates external crystals, reducing BOM for vibration-prone environments.
Recomendado
Capacitive Touch HMI with CAN
The PIC18F26K80T-I/MM integrates the CTMU peripheral for capacitive touch sensing, enabling 4-8 button sliders without external touch ICs. Combined with ECAN, this yields networked HMI panels for industrial machinery and appliances. The CTMU measures charge time with 12-bit resolution through the ADC, supporting reliable touch through 3 mm glass or plastic overlays. Hardware ECAN streams touch events upstream at low bus load, while the CPU remains free for LED PWM drive and debounce logic.
Recomendado
Automotive Sensor Cluster with ECAN
A body-domain sensor cluster - combining temperature, pressure, and proximity data - uses the PIC18F26K80T-I/MM as the ECAN master. The 12-bit ADC runs at 100 ksps to capture multiple analog sensors, the CTMU drives proximity sensing, and ECAN broadcasts consolidated messages at 500 kbps. Internal 16MHz oscillator and 1.8-5.5V range simplify the analog front-end design, while the 28-QFN-S 6x6 mm footprint allows the cluster to fit behind instrument panels without active cooling.
Recomendado
Low-Power Industrial Data Logger
The PIC18F26K80T-I/MM anchors a low-power industrial data logger that samples analog or digital sensors, stores bursts in 3.6KB RAM, and dumps over ECAN on demand. NanoWatt XLP drops sleep current below 1 uA, and the 1.8-5.5V supply permits direct operation from supercap or solar cells. The 12-bit ADC digitizes 4-20mA loop signals after a resistor, while four 16-bit timers pace sampling. ECAN Listen mode allows passive sniffing for diagnostics without disturbing bus traffic.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18F26K80T-I/MM — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18F26K80-I/MM | PIC18F26K80-E/MM | PIC18F26K80-H/MM | PIC18F25K80-I/MM | PIC18F26K80T-I/SS |
|---|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | SSOP-28 (through-hole, different body) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50%) | 64 KB |
| RAM | 3.6 KB | 3.6 KB | 3.6 KB | 3.6 KB | 3.6 KB | 3.6 KB |
| Maximum CPU Speed | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| ECAN | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Extended -40C to +125C | High-temp -40C to +150C (H grade) | Industrial -40C to +85C | Industrial -40C to +85C |
| Packaging Form | Tape & Reel | Tube | Tube / T&R options | Tube / T&R options | Tube | Tape & Reel |
| Unit Price (qty 1000) | $2.38 | $2.45 (est., tube form) | $2.65 (est., automotive grade premium) | $2.85 (est., high-temp premium) | $2.15 (est., half flash) | $2.42 (est., SSOP body) |
Principais diferenciais
- Full 64KB Flash at 28-QFN-S (vs PIC18F25K80-I/MM)
- Wide 1.8V-5.5V supply range (vs PIC18F46K80 (40-pin only))
- CTMU capacitive touch on-chip (vs External touch IC designs)
Notas de projeto
The 28-QFN-S package dissipates heat primarily through the central exposed pad (EP). At 64MHz with all peripherals active, internal dissipation is approximately 30-50 mA core current. Solder the EP to a PCB ground pour of at least 50 mm^2 with multiple thermal vias to inner ground planes; an ungrounded or floating EP degrades ADC accuracy, ESD performance, and long-term reliability. Estimated: at full 64MHz core + ECAN + ADC operation, junction-to-ambient thermal resistance of the QFN-S with proper EP soldering is approximately 35-45 C/W.
Keep the 12-bit ADC traces short and routed away from digital switching nodes such as ECAN, oscillator outputs, and PWM signals. Place a ferrite bead or small inductor between VDD and AVDD, with a 100nF decoupling capacitor within 5mm of the AVDD pin and a 10uF bulk capacitor on VDD. Per Microchip datasheet section 25, AVDD must be within +/-0.3V of VDD at power-up to avoid ADC latchup; add a 1kohm resistor if sequencing is not guaranteed.
Estimated: configure unused I/O pins as outputs with logic-low to minimize sleep current and avoid floating-input shoot-through. The CTMU must be calibrated using the internal bandgap reference at production, and ECAN bit timing parameters must be derived from FCAN clock after PLL lock - reconfiguring after oscillator changes can desynchronize the bus. Always assert the MCLR pin through a 10kohm pull-up and 100nF capacitor; leaving MCLR floating causes spurious resets in noisy automotive environments.
The ECAN CANTX and CANRX pins on RB2/RB3 are high-speed digital edges; route them as a matched 100-ohm differential pair to the MCP2551/MCP2562 transceiver with 100nF decoupling on the transceiver VCC. Keep the differential pair length-matched within 5mm, and place a 120-ohm termination resistor across CANH/CANL at each end of the bus. Splice grounds only at the transceiver; do not create ground loops between the MCU and the transceiver with multiple ground stitches.
Informações de conformidade
AEC-Q100 automotive qualification per distributor parametric data (DigiKey/Mouser/LCSC). RoHS and REACH compliant per Microchip product page. Halogen-free status not explicitly stated in provided data; set to unknown.
