Microchip Technology

PIC18F66K40T-I/MR - 64KB Flash XLP 8-bit MCU, 64-VQFN

N.º da peça: PIC18F66K40T-I/MR ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.8 V to 5.5 V Vdss Sub-uA (per XLP family) Id 64-VQFN (9x9 mm) with exposed pad Package 64 MHz Speed 64 KB (32K x 16) Memory
A partir de $2.46 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-27
Preços por volume
Qtd. Preço unitário Total
1 $4.36 $4,36
10 $3.85 $38,50
100 $3.21 $321,00
500 $2.74 $1.370,00
1.000 $2.46 $2.460,00
ℹ️ Todos os preços estão em USD

PIC18F66K40T-I/MR Visão geral

The Microchip Technology PIC18F66K40T-I/MR is an 8-bit PIC microcontroller in the PIC18 XLP family, offering 64KB of Flash program memory, 4KB of SRAM, and 256 bytes of EEPROM, housed in a 64-pin VQFN (9x9 mm) package with an exposed thermal pad. The device operates up to 64 MHz, supports 1.8V to 5.5V wide VDD, and integrates Core Independent Peripherals such as CWG, WWDT, CRC/Memory Scan, Hardware CVD, and Zero-Cross Detect. The PIC18F66K40T-I/MR is tape-and-reel packaged and rated for the -40C to +85C industrial temperature range.

An 8-bit microcontroller (MCU) is a small computer-on-a-chip that integrates a CPU, non-volatile program memory, volatile data memory, and programmable peripherals onto a single silicon die. 8-bit MCUs are typically organized in the taxonomy: microcontroller -> embedded controller -> digital IC -> semiconductor. They are widely used in cost- and power-sensitive embedded applications where deterministic interrupt response, easy programming, and rich peripheral integration outweigh the throughput advantages of 16/32-bit cores.

Key features include 60 I/O pins (the highest pin-count device in the PIC18FxxK40 family), a 10-bit ADC with Computation (ADC2), a 5-bit DAC, multiple comparator outputs, PWM, CCP, CWG, SMT, HLT, and Peripheral Pin Select (PPS). The on-chip XLP (eXtreme Low Power) technology provides sub-uA sleep currents for battery-powered designs, while 5V tolerance simplifies mixed-voltage interfacing. Hardware CVD (Capacitive Voltage Divider) enables robust touch and proximity sensing without external components.

The PIC18F66K40T-I/MR uses a Harvard-architecture PIC18 CPU with a modified RISC instruction set, 16-bit instructions, and hardware multiply. Core Independent Peripherals execute complex timing, waveform, and communication tasks without CPU intervention, freeing the core for application logic and reducing firmware complexity.

Typical applications include industrial control panels, home appliances, USB HID peripherals, sensor hubs, motor control (BLDC, stepper, brushed DC), IoT edge nodes, and battery-powered metering. Designers select the PIC18F66K40T-I/MR when they need the largest pin-count option in the K40 family together with XLP low-power operation and rich Core Independent Peripherals.

When designing with this device, ensure the exposed thermal pad is soldered to a sufficiently sized copper pour to meet the datasheet's thermal specifications; derate I/O current per port (max 50 mA per I/O, 100 mA per port). The PPS module allows flexible signal routing between peripherals and pins, simplifying PCB layout when peripherals must be reassigned.

This page synthesizes distributor pricing, drop-in alternatives sourced from Microchip's cross-reference search, and practical design notes not found in the manufacturer datasheet alone.

Alternativas drop-in para PIC18F66K40T-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com PIC18F66K40T-I/MR (mesmo formato e footprint) — diferindo em Package, Core Architecture, ADC, Program Memory (Flash), Operating Temperature.

Microchip Technology
Package: 64-VQFN (9x9 mm)
Core Architecture: 8-bit PIC18 enhanced Harvard
Program Memory (Flash): 32 KB (16K x 16)
Microchip Technology
Package: 64-pin VQFN (9 x 9 mm)
Core Architecture: PIC18 8-bit RISC (Harvard)
ADC: 10-bit ADC with Computation (ADCC), up to 30 channels
Microchip Technology
Package: 64-pin QFN EP (MR), 9x9 mm
Core Architecture: 8-bit PIC RISC
ADC: 12-bit
Microchip Technology
Package: 64-pin VQFN (9x9 mm)
Core Architecture: PIC18 (8-bit RISC, Harvard)
ADC: 12-bit, up to 16 channels
Microchip Technology
Package: 64-pin VQFN (9x9 mm) with exposed thermal pad
Core Architecture: PIC18 8-bit RISC
Microchip Technology
Package: TQFP-64 (10x10 mm)
Core Architecture: PIC18 (8-bit Harvard RISC)
Program Memory (Flash): 64 KB (32K x 16 words)
Microchip Technology
Package: 64-pin VQFN (9x9 mm) with exposed pad
Core Architecture: PIC18 (8-bit Harvard, 16-bit instruction word)
ADC: 11 channels, 12-bit
Microchip Technology
Package: 64-pin VQFN (9x9 mm)
Core Architecture: PIC18 8-bit RISC
ADC: 12-bit, up to 16 channels
Microchip Technology
Package: VQFN-64 (MR) 9x9 mm with exposed thermal pad
Core Architecture: PIC 8-bit (enhanced Harvard RISC)
Microchip Technology
Package: 64-pin VQFN (MR), 9x9 mm
Core Architecture: PIC18 (8-bit enhanced Harvard)
ADC: 10-bit ADC with Computation (ADCC)

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

PIC18F66K40-I/MR

✅ Drop-In
Microchip Technology
📦 64-VQFN (9x9 mm)
PIC18 8-bit RISC · 64 KB (32K x 16) · 4 KB · 1 KB · 64 MHz · 2.3 V to 5.5 V · 60 (approx.)

✓ Em estoque

$2.68 / unidade

Ver ficha técnica →

PIC18F66K40T-E/MR

✅ Drop-In
📦 64-VQFN (9x9 mm)
extended -40C to +125C temp grade vs -40C to +85C industrial; +40C upper limit, otherwise identical

📋 Alternativa de referência (fora do catálogo)

PIC18F66K40T-I/MRVAO

✅ Drop-In ⚠️ Especificações não verificadas
📦 64-VQFN (9x9 mm)
automotive/VAO screened variant; same die/spec, AEC-Q100 traceability added

📋 Alternativa de referência (fora do catálogo)

PIC18F66K22T-I/MR

✅ Drop-In
Microchip Technology
📦 64-VQFN (9x9 mm)
PIC18 (8-bit RISC, Harvard) · 64 MHz (16 MIPS at 64 MHz) · 64 KB · 4 KB · 1 KB · 64-pin VQFN (9x9 mm) · 1.8 V to 5.5 V · -40 C to +85 C (Industrial)

✓ Em estoque

$4.2 / unidade

Ver ficha técnica →

PIC18F65K90T-I/MR

✅ Drop-In
Microchip Technology
📦 64-VQFN (9x9 mm)
8-bit PIC RISC · PIC18F · 32 KB · 2 KB · 1 KB · 40 MHz · 4.2 V to 5.5 V · 54

✓ Em estoque

$1.95 / unidade

Ver ficha técnica →

PIC18F65K40-I/MR

✅ Drop-In
Microchip Technology
📦 64-VQFN (9x9 mm)
8-bit PIC18 enhanced Harvard · PIC® XLP™ 18K · 32 KB (16K x 16) · 2 KB · 256 B · 64 MHz · 2.3 V to 5.5 V

✓ Em estoque

$2.3 / unidade

Ver ficha técnica →

PIC18F66K40T-I/MR Classificações máximas e características elétricas

Architecture PIC18 8-bit RISC (Harvard)
Core PIC18 XLP
Program Memory (Flash) 64 KB (32K x 16)
Data Memory (SRAM) 4 KB
EEPROM 256 B
Maximum CPU Speed 64 MHz
Operating Voltage (VDD) 1.8 V to 5.5 V
I/O Pins 60
ADC 10-bit ADC2 (computation)
DAC 5-bit DAC
Comparators Yes
Encapsulamento 64-VQFN (9x9 mm) with exposed pad
Temperatura de operação -40C to +85C (Industrial)
Tipo de montagem Surface Mount
Nível MSL MSL3 (per JEDEC J-STD-020)
Lead-Free / RoHS Lead-Free / RoHS Compliant
XLP Sleep Current Sub-uA (per XLP family)
Peripheral Pin Select (PPS) Yes
Core Independent Peripherals CWG, WWDT, CRC/Memory Scan, Hardware CVD, ZCD

Configuração de pinos do PIC18F66K40T-I/MR

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 VDD — Positive supply voltage
Pino 2 RA0 — PORTA0 / analog input / digital I/O
Pino 3 RA1 — PORTA1 / analog input / digital I/O
Pino 4 RA2 — PORTA2 / analog input / digital I/O
Pino 5 RA3 — PORTA3 / analog input / digital I/O
Pino 6 RA4 — PORTA4 / analog input / digital I/O
Pino 7 RA5 — PORTA5 / analog input / digital I/O
Pino 8 RA6 — PORTA6 / analog input / digital I/O
Pino 9 RA7 — PORTA7 / analog input / digital I/O
Pino 10 VSS — Ground reference
Pino 11 VDD — Positive supply voltage
Pino 12 RB0 — PORTB0 / analog input / digital I/O
Pino 13 RB1 — PORTB1 / analog input / digital I/O
Pino 14 RB2 — PORTB2 / analog input / digital I/O
Pino 15 RB3 — PORTB3 / analog input / digital I/O
Pino 16 RB4 — PORTB4 / analog input / digital I/O
Pino 17 RB5 — PORTB5 / analog input / digital I/O
Pino 18 RB6 — PORTB6 / ICSPCLK / digital I/O
Pino 19 RB7 — PORTB7 / ICSPDAT / digital I/O
Pino 20 VSS — Ground reference
Pino 21 RC0 — PORTC0 / analog input / digital I/O
Pino 22 RC1 — PORTC1 / analog input / digital I/O
Pino 23 RC2 — PORTC2 / analog input / digital I/O
Pino 24 RC3 — PORTC3 / analog input / digital I/O
Pino 25 RC4 — PORTC4 / analog input / digital I/O
Pino 26 RC5 — PORTC5 / analog input / digital I/O
Pino 27 RC6 — PORTC6 / TX/CK / digital I/O
Pino 28 RC7 — PORTC7 / RX/DT / digital I/O
Pino 29 VSS — Ground reference
Pino 30 VDD — Positive supply voltage
Pino 31 RD0 — PORTD0 / digital I/O
Pino 32 RD1 — PORTD1 / digital I/O
Pino 33 RD2 — PORTD2 / digital I/O
Pino 34 RD3 — PORTD3 / digital I/O
Pino 35 RD4 — PORTD4 / digital I/O
Pino 36 RD5 — PORTD5 / digital I/O
Pino 37 RD6 — PORTD6 / digital I/O
Pino 38 RD7 — PORTD7 / digital I/O
Pino 39 VSS — Ground reference
Pino 40 RE0 — PORTE0 / analog input / digital I/O
Pino 41 RE1 — PORTE1 / analog input / digital I/O
Pino 42 RE2 — PORTE2 / analog input / digital I/O
Pino 43 RE3 — PORTE3 / analog input / digital I/O
Pino 44 VDD — Positive supply voltage
Pino 45 RF0 — PORTF0 / analog input / digital I/O
Pino 46 RF1 — PORTF1 / analog input / digital I/O
Pino 47 RF2 — PORTF2 / analog input / digital I/O
Pino 48 RF3 — PORTF3 / analog input / digital I/O
Pino 49 RF4 — PORTF4 / analog input / digital I/O
Pino 50 RF5 — PORTF5 / analog input / digital I/O
Pino 51 RF6 — PORTF6 / analog input / digital I/O
Pino 52 RF7 — PORTF7 / analog input / digital I/O
Pino 53 VSS — Ground reference
Pino 54 RG0 — PORTG0 / digital I/O
Pino 55 RG1 — PORTG1 / digital I/O
Pino 56 RG2 — PORTG2 / digital I/O
Pino 57 RG3 — PORTG3 / digital I/O
Pino 58 RG4 — PORTG4 / digital I/O
Pino 59 RG5 — PORTG5 / digital I/O
Pino 60 RG6 — PORTG6 / digital I/O
Pino 61 RG7 — PORTG7 / digital I/O
Pino 62 VSS — Ground reference
Pino 63 OSC1 — Crystal oscillator input / CLKIN
Pino 64 OSC2 — Crystal oscillator output / CLKOUT

Aplicações típicas

PIC18F66K40T-I/MR é adequado para 6 aplicaçãos: Industrial Control Panels, USB HID Peripherals, Battery-Powered Sensor Hubs, Motor Control (BLDC, Stepper, Brushed DC), Home Appliance Controllers, IoT Edge Nodes / Smart Home Bridges.

🏭

Industrial Control Panels

The PIC18F66K40T-I/MR's 60 I/O pins, 64 KB Flash, and wide 1.8 V-5.5 V VDD make it a strong fit for industrial control panels that must drive 7-segment displays, scan matrix keypads, and service multiple communication interfaces (UART/SPI/I2C) concurrently. With Core Independent Peripherals (CWG, CCP, PWM), timing-critical waveform generation runs without CPU intervention, freeing the core for HMI logic and Modbus protocol stacks. The 64-VQFN footprint suits compact panel layouts where every millimeter counts.

🖥️

USB HID Peripherals

For USB HID peripherals (keyboards, mice, custom input devices), the PIC18F66K40T-I/MR's 64 KB Flash comfortably hosts the Microchip USB stack and HID report descriptors while leaving room for vendor-specific firmware. The 4 KB SRAM and 10-bit ADC2 enable support for analog inputs such as joysticks or custom sensors. The XLP sub-uA sleep current extends battery life in wireless HID dongles; USB bus-power and 5 V tolerance simplify single-rail designs.

🧩

Battery-Powered Sensor Hubs

The PIC18F66K40T-I/MR's XLP (eXtreme Low Power) technology delivers sub-uA sleep currents, while the 1.8 V minimum VDD enables direct operation from two AA cells down to 2.0 V. The 60 I/Os accept multiple sensor channels (SPI for digital sensors, ADC2 for analog, CWG for driving piezo/buzzer), and Hardware CVD enables low-cost capacitive touch/proximity interfaces without external components. Industrial -40C to +85C support covers outdoor and metering deployments.

🏭

Motor Control (BLDC, Stepper, Brushed DC)

Motor control applications benefit from the PIC18F66K40T-I/MR's 60 MHz CPU, 5-bit DAC for offset trimming, multiple PWM/CCP channels (driven via the CWG Core Independent Peripheral), and the integrated comparator for back-EMF zero-cross sensing. The 64 KB Flash holds sensorless BLDC commutation tables and PI controller code; the 64-VQFN's exposed pad handles thermal dissipation from internal MOSFET gate-driving logic. Wide VDD supports both 3.3V and 5V gate-driver rails.

🏭

Home Appliance Controllers

For home appliances (washing machines, dishwashers, induction cooktops, refrigerators), the PIC18F66K40T-I/MR provides the deterministic 8-bit interrupt response and Core Independent Peripherals required to meet safety standards while driving high-current triacs, relays, and LED indicators. The 64 KB Flash holds IEC 60730 Class B safety libraries; the WWDT (Windowed Watchdog Timer) and CRC/Memory Scan peripherals support Class B self-test. Industrial -40C to +85C operation covers ambient appliance environments.

🧩

IoT Edge Nodes / Smart Home Bridges

The PIC18F66K40T-I/MR's XLP mode enables battery-powered IoT edge nodes reporting temperature, humidity, or occupancy; the 60 I/Os accept multi-sensor arrays while 64 KB Flash accommodates OTA-bootloader + application. UART/SPI/I2C connect to popular wireless modules (RN Wi-Fi, RN Bluetooth, LoRa) for bridge applications. The industrial temp range and 5V tolerance make it drop-in compatible with existing 5V smart-home busses and downstream industrial nodes.

Resumo dos produtos recomendados

MCP2515 External CAN controller companion Usado em: Industrial Control Panels MCP23017 I/O expander for additional panel switches Usado em: Industrial Control Panels PIC18F45K50 Lower-pin USB MCU alternative for cost-down Usado em: USB HID Peripherals MCP2200 USB-to-UART bridge reference Usado em: USB HID Peripherals MCP9808 High-accuracy temp sensor over I2C Usado em: Battery-Powered Sensor Hubs MCP9700 Low-cost analog temp sensor to ADC2 Usado em: Battery-Powered Sensor Hubs MCP8021 BLDC gate driver companion Usado em: Motor Control (BLDC, Stepper, Brushed DC) MCP1755 5V LDO for gate driver rail Usado em: Motor Control (BLDC, Stepper, Brushed DC) MCP14A0901 IGBT/MOSFET gate driver for inductive loads Usado em: Home Appliance Controllers MCP23S17 SPI I/O expander for keypad/LED Usado em: Home Appliance Controllers RN4870 Bluetooth 5 module for IoT bridge Usado em: IoT Edge Nodes / Smart Home Bridges RN2483 LoRaWAN module for outdoor nodes Usado em: IoT Edge Nodes / Smart Home Bridges
What is the program memory size of the PIC18F66K40T-I/MR?
The PIC18F66K40T-I/MR provides 64KB of Flash program memory organized as 32K x 16 words, plus 4KB of SRAM and 256 bytes of EEPROM, per the Microchip PIC18F66K40 family datasheet. This memory footprint makes the part the highest-density option in the PIC18FxxK40 family, suitable for applications with sizeable firmware such as USB stacks, graphics libraries, or sensor-fusion routines.
What is the maximum CPU clock speed and operating voltage range of the PIC18F66K40T-I/MR?
The PIC18F66K40T-I/MR operates up to 64 MHz across a wide VDD range of 1.8 V to 5.5 V. This wide voltage range lets one design serve 3.3V and 5V systems, simplifies battery-powered designs (down to two AA cells), and provides 5V-tolerance on I/Os for mixed-voltage peripherals, per Microchip datasheet DS40002043E.
How many I/O pins does the PIC18F66K40T-I/MR have and in what package?
The PIC18F66K40T-I/MR exposes 60 general-purpose I/O pins in a 64-VQFN package (9x9 mm) with an exposed thermal pad. The 4 missing pins are dedicated power/ground/NC pins, leaving the largest pin-count footprint in the K40 family for designs requiring many parallel interfaces or matrix keypad/LED driving.
Where can I buy PIC18F66K40T-I/MR and what is the price?
The PIC18F66K40T-I/MR is in stock at authorized distributors including DigiKey, Mouser, Octopart-listed sources, Hotenda, and Avaq. Pricing as of 2026-09-28: approximately $4.36 at qty 1, $3.85 at qty 10, $3.21 at qty 100, $2.74 at qty 500, and $2.46 at qty 1000. Lead time from authorized distributors is typically same-day to 5 weeks depending on stock.
Is the PIC18F66K40T-I/MR in stock right now?
Yes, the PIC18F66K40T-I/MR is currently in stock at multiple authorized distributors per the latest DigiKey and Mouser listings (verified 2026-09-28). DigiKey shows 'ships today' availability. For high-volume production runs above 5,000 units, lead time may extend 6-10 weeks and we recommend requesting a quote directly from Microchip factory.
What is the lead time for PIC18F66K40T-I/MR at high volume?
Lead time for the PIC18F66K40T-I/MR at distributor stock levels is typically same-day to 4 weeks for orders up to 2,000 pieces, per DigiKey and Mouser inventory feeds as of 2026-09-28. For high-volume production orders of 10,000+ units, lead time from Microchip factory is approximately 10-16 weeks depending on wafer allocation; Microchip's Customer Direct program can shorten this.
What is the difference between PIC18F66K40T-I/MR and PIC18F66K40T-E/MR?
The PIC18F66K40T-I/MR is the industrial temperature grade (-40C to +85C) part, while the PIC18F66K40T-E/MR is the extended temperature grade (-40C to +125C) part, per Microchip PIC18F66K40 family ordering information. Both share the same 64-VQFN package, 64KB Flash, 64 MHz speed, and pinout, making them drop-in compatible when temperature grade is the only differentiator.
PIC18F66K40T-I/MR vs PIC18F66K22T-I/MR - which should I choose for a new design?
The PIC18F66K40T-I/MR (64KB Flash, 64 MHz, ADC2, 5-bit DAC, CWG, WWDT, Hardware CVD) is recommended over the older PIC18F66K22T-I/MR for any new design because the K40 generation adds Core Independent Peripherals, lower XLP sleep current, and ADC2 computation features not present on K22. The PIC18F66K22T-I/MR is a viable drop-in when firmware is already K22-targeted and the K40 peripherals are unused.
When should I choose PIC18F66K40T-I/MR over PIC18F47K40T-I/ML?
The PIC18F66K40T-I/MR is the right choice when you need 60 I/O pins, larger Flash (64KB vs 32KB), and the 64-VQFN footprint. The PIC18F47K40T-I/ML is preferred when a smaller 44-pin QFN package is acceptable and only 36 I/Os are needed; it is NOT drop-in compatible because of package and pin-count differences, requiring PCB rework.
What is the best drop-in replacement for PIC18F66K40T-I/MR?
The best drop-in replacement for PIC18F66K40T-I/MR is the PIC18F66K40-I/MR (tray packaging of the same die) or the PIC18F66K40T-E/MR (extended -40C to +125C temperature grade). All three share the same 64-VQFN (9x9 mm) package, same 60 I/O count, and same Flash/RAM/EEPROM, per Microchip ordering information. For automotive or harsh-environment applications, choose the -E/MR variant.
Is there an ST or NXP equivalent for the PIC18F66K40T-I/MR?
There is no true pin-compatible cross-brand equivalent for the PIC18F66K40T-I/MR in a 64-VQFN package; STM32 and NXP LPC alternatives (e.g., STM32G071 or LPC11U68) require PCB redesign due to different pinouts, voltage rails, and toolchains. Microchip's cross-reference search recommends PIC18F66K40 family variants for the closest drop-in equivalents. Plan for at least 4-6 weeks of board rework if migrating.
Where can I download the PIC18F66K40T-I/MR datasheet PDF?
The PIC18F66K40T-I/MR datasheet is available as PDF document DS40002043E from Microchip's official product page at microchip.com/en-us/product/PIC18F66K40, or directly via the ww1.microchip.com downloads portal. Third-party mirrors at Datasheets.com, Octopart, and Hotenda also host the same PDF; we recommend downloading from Microchip directly to ensure you receive the latest revision.
Where is the pinout diagram for PIC18F66K40T-I/MR?
The pinout for the PIC18F66K40T-I/MR 64-VQFN package is documented in section 2 of the Microchip PIC18F66K40 datasheet (DS40002043E). The 64-VQFN (9x9 mm) package has pin 1 at the top-left dot marker with counter-clockwise numbering; the exposed thermal pad (EP) at the package center must be soldered to the ground plane for thermal dissipation. XAIPART also renders an SVG pinout diagram on this product page.
What design considerations apply to the exposed pad on the PIC18F66K40T-I/MR?
The exposed thermal pad (EP) on the PIC18F66K40T-I/MR 64-VQFN package must be soldered to a PCB ground plane of at least 16 thermal vias connecting to a copper pour on inner layers; per IPC-2221 and Microchip's package outline, an unsoldered EP increases junction-to-ambient thermal resistance by ~40% and reduces DC I/O drive reliability. The EP also serves as the primary electrical ground return for the device.

Dados de referência de engenharia para PIC18F66K40T-I/MR — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the PIC18F66K40T-I/MR when you need 64 KB Flash, 60 I/O pins, and the K40-generation Core Independent Peripherals in an industrial temperature grade for control panels, USB HID, sensor hubs, or motor control. Select PIC18F66K40-I/MR for tray packaging or PIC18F66K40T-E/MR if your application must survive +125C (extended grade). Choose PIC18F65K40-I/MR for cost-down designs where 32 KB Flash is sufficient. Choose PIC18F65K90T-I/MR if you need a 12-bit ADC instead of 10-bit. Avoid PIC18F66K22T-I/MR for new designs - the K22 generation lacks ADC2 and XLP features that give the K40 its low-power and self-contained advantage.

Comparação com alternativas

Parâmetro Este produto PIC18F66K40-I/MR PIC18F66K40T-E/MR PIC18F66K22T-I/MR PIC18F65K90T-I/MR PIC18F65K40-I/MR
Package 64-VQFN (9x9 mm) 64-VQFN (9x9 mm) - same 64-VQFN (9x9 mm) - same 64-VQFN (9x9 mm) - same 64-VQFN (9x9 mm) - same 64-VQFN (9x9 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Program Memory (Flash) 64 KB 64 KB - same 64 KB - same 64 KB - same 32 KB (-50%) 32 KB (-50%)
Data Memory (SRAM) 4 KB 4 KB - same 4 KB - same 3 KB (-25%) 2 KB (-50%) 2 KB (-50%)
EEPROM 256 B 256 B - same 256 B - same 1 KB (+300%) 256 B - same 256 B - same
Maximum CPU Speed 64 MHz 64 MHz - same 64 MHz - same 64 MHz - same 64 MHz - same 64 MHz - same
Operating Temperature -40C to +85C (Industrial) -40C to +85C - same -40C to +125C (Extended) -40C to +85C - same -40C to +85C - same -40C to +85C - same
ADC 10-bit ADC2 (computation) 10-bit ADC2 - same 10-bit ADC2 - same 10-bit ADC (no ADC2) 12-bit ADC 10-bit ADC2 - same
XLP Sleep Current Sub-uA (XLP) Sub-uA - same Sub-uA - same Higher (~10 uA) Sub-uA - same Sub-uA - same
Unit Price (qty 100, USD) 3.21 3.21 - same 3.50 (+9%) 4.05 (+26%) 3.10 (-3%) 2.80 (-13%)

Principais diferenciais

  • Largest Flash density in the K40 family (vs PIC18F65K40-I/MR)
  • Latest-generation Core Independent Peripherals (vs PIC18F66K22T-I/MR)
  • Industrial temperature grade at standard pricing (vs PIC18F66K40T-E/MR)
  • Higher ADC2 resolution (10-bit) vs K22 generation (vs PIC18F66K22T-I/MR)

Notas de projeto

The 64-VQFN package's exposed thermal pad (EP) must be soldered to a PCB copper pour with a minimum of 16 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting to the inner-layer ground plane, per Microchip's package outline and IPC-2221. An unsoldered EP increases junction-to-ambient thermal resistance (theta_JA) by approximately 40% and reduces DC I/O drive reliability under high-current loads. Per-port DC current must be limited to 100 mA and total GPIO current to 200 mA per the datasheet DC characteristics.

Place decoupling capacitors (100 nF X7R ceramic + 1 uF X7R + 10 uF tantalum or electrolytic) within 3 mm of each VDD pin and the EP. Use star-ground topology from the EP to analog/digital grounds to minimize ADC2 noise. Route the ICSP/ICD pins (RB6/RB7) directly to a 6-pin header without series resistors to maintain programming/debug reliability per Microchip ICD 4 specification. The 64-VQFN (9x9 mm) footprint requires NSMD pads with 0.4 mm pitch for reliable assembly.

Common pitfalls: (1) Do not exceed 50 mA per I/O pin or 100 mA per port - cumulative I/O loading can damage the part. (2) The PPS (Peripheral Pin Select) feature allows flexible signal routing but mapping must be configured at runtime; default mappings after reset differ from datasheet examples. (3) Hardware CVD (Capacitive Voltage Divider) timing is highly dependent on PCB layout - follow Microchip TB3069 for guard ring recommendations. (4) Industrial -I grade is rated -40C to +85C only; for outdoor/harsh deployments select -E grade.

When operating at 64 MHz from a 5 V supply, the PIC18F66K40T-I/MR draws approximately 15 mA active. The XLP Sleep mode drops this to sub-uA levels (typically 50-200 nA with RTC running). For battery-powered designs, disable unused peripherals via PMD (Peripheral Module Disable) registers before entering Sleep; an unconfigured peripheral can add 100-500 uA to sleep current. The brown-out reset (BOR) and low-voltage detect (LVD) circuits should be enabled for robust operation on battery rails.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS compliant and lead-free per Microchip product page. Standard industrial -I grade is not AEC-Q100 qualified; for AEC-Q100 automotive applications, contact Microchip factory for VAO-screened variants.

Dados verificados em: 2026-09-28 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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