PIC24F16KA304-E/MV - 16KB Flash XLP 16-bit MCU 48-UQFN | Microchip
N.º da peça: PIC24F16KA304-E/MV ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.1 | $3,10 |
| 10 | $2.79 | $27,90 |
| 100 | $2.49 | $249,00 |
| 500 | $2.21 | $1.105,00 |
| 1.000 | $1.97 | $1.970,00 |
PIC24F16KA304-E/MV Visão geral
A 16-bit PIC microcontroller is a member of the advanced Harvard-architecture RISC controller family that executes most instructions in a single cycle, providing higher code density and deterministic throughput than legacy 8-bit parts while retaining the familiar PIC ecosystem of MPLAB X IDE, XC16 compilers and a vast library of application notes. Within the broader hierarchy, PIC24F devices sit between PIC16 (8-bit) and dsPIC33 (16-bit DSP) families, targeting general-purpose embedded applications where low power and rich peripherals matter more than absolute compute.
Differentiating specifications include 16 KB self-programmable Flash, 2 KB SRAM, 512 bytes EEPROM, a 12-bit ADC with up to 16 input channels, 5 Capture/Compare/PWM modules, Real-Time Clock and Calendar (RTCC) with calendar mode, 2 I²C, 2 SPI and 2 UART interfaces, a Charge Time Measurement Unit (CTMU) for capacitive touch, and a 16-bit timer/counter bank. The 48-UQFN (6x6 mm) package exposes up to 39 general-purpose I/O pins, suiting compact designs that require many parallel sensor or signal interfaces.
Internally, the PIC24F16KA304 uses a 16-bit modified-Harvard core with a 16x16 hardware multiply, single-cycle bit manipulation and a peripheral engine supporting DMA-free interrupt-driven operation. The Deep Sleep state drops current to nanoamp levels while retaining RTCC, DSBOR and DSWDT, enabling years of operation from a single coin cell. CTMU allows touch buttons and proximity sensing without external analogue ICs.
Typical applications include IoT sensor nodes, wearable health monitors, battery-powered instrumentation, capacitive touch interfaces, smart utility meters, energy-harvesting nodes and remote controls. The wide 1.8V–5.5V operating range permits direct connection to lithium, alkaline or even energy-harvested supplies. Designers should budget for the 48-UQFN's 0.4 mm pitch reflow profile and ensure the exposed thermal pad is properly soldered to the ground plane to minimise thermal resistance and maximise electrical performance.
Alternativas drop-in para PIC24F16KA304-E/MV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24F16KA304-E/MV (mesmo formato e footprint) — diferindo em ADC, I/O Pins, Package, CTMU, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FV16KA304-E/MV
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PIC24F16KA304-E/MV Classificações máximas e características elétricas
| Core Architecture | 16-bit PIC (modified Harvard RISC) |
| Family | PIC24F XLP 16-bit MCU |
| Program Memory (Flash) | 16 KB (5.5K x 24 instructions) |
| RAM | 2 KB |
| EEPROM | 512 bytes |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage Range | 1.8 V to 3.6 V |
| Faixa de temperatura de operação | -40 °C to +125 °C (E suffix) |
| ADC | 12-bit, up to 16 channels |
| I/O Pins (Maximum) | 39 (varies by package) |
| Timers | 16-bit Timer/Counter modules |
| CCP Modules | 5 Capture/Compare/PWM |
| Communication Interfaces | 2x I2C, 2x SPI, 2x UART |
| RTCC | Yes (Real-Time Clock with calendar) |
| CTMU (Capacitive Touch) | Yes |
| Low-Power Features | XLP, Deep Sleep with RTCC, DSBOR, DSWDT |
| Encapsulamento / Caixa | 48-UQFN (6x6 mm) |
| Tipo de montagem | Surface Mount |
| Oscillator | Internal (with PLL option) |
| RoHS | Compliant |
Configuração de pinos do PIC24F16KA304-E/MV
| Pino 1 | RA0 — I/O / AN0 / CVREF- |
| Pino 2 | RA1 — I/O / AN1 |
| Pino 3 | RA2 — I/O / AN2 / VREF- |
| Pino 4 | RA3 — I/O / AN3 / VREF+ |
| Pino 5 | RA4 — I/O / AN4 |
| Pino 6 | AVDD — Analog power supply |
| Pino 7 | AVSS — Analog ground |
| Pino 8 | RA5 — I/O / AN5 / VBG |
| Pino 9 | RA6 — I/O / OSC2 / CLKO |
| Pino 10 | RA7 — I/O / OSC1 / CLKI |
| Pino 11 | VDD — Digital power supply (1.8 V – 3.6 V) |
| Pino 12 | VSS — Digital ground |
| Pino 13 | RB0 — I/O / AN6 / PGED1 |
| Pino 14 | RB1 — I/O / AN7 / PGEC1 |
| Pino 15 | RB2 — I/O / AN8 / SDA2 |
| Pino 16 | RB3 — I/O / AN9 / SCL2 |
| Pino 17 | RB4 — I/O / AN10 |
| Pino 18 | RB5 — I/O / AN11 |
| Pino 19 | RB6 — I/O / AN12 |
| Pino 20 | RB7 — I/O / AN13 |
| Pino 21 | RC0 — I/O / AN14 |
| Pino 22 | RC1 — I/O / AN15 |
| Pino 23 | RC2 — I/O / U1RTS / SCL1 |
| Pino 24 | RC3 — I/O / U1CTS / SDA1 |
| Pino 25 | RC4 — I/O / U1TX / SDA1 alt |
| Pino 26 | RC5 — I/O / U1RX |
| Pino 27 | RC6 — I/O / U2TX / SCL2 |
| Pino 28 | RC7 — I/O / U2RX / SDA2 |
| Pino 29 | RD0 — I/O / INT0 |
| Pino 30 | RD1 — I/O / IC1 |
| Pino 31 | RD2 — I/O / IC2 |
| Pino 32 | RD3 — I/O / OC1 |
| Pino 33 | RD4 — I/O / OC2 |
| Pino 34 | RD5 — I/O / OC3 |
| Pino 35 | RD6 — I/O / OC4 / SS1 |
| Pino 36 | RD7 — I/O / OC5 |
| Pino 37 | RE0 — I/O / IC3 |
| Pino 38 | RE1 — I/O / IC4 |
| Pino 39 | RE2 — I/O / IC5 |
| Pino 40 | RE3 — I/O / SCL1 alt |
| Pino 41 | RE4 — I/O / SDA1 alt |
| Pino 42 | RE5 — I/O |
| Pino 43 | RE6 — I/O |
| Pino 44 | RE7 — I/O |
| Pino 45 | RF0 — I/O |
| Pino 46 | MCLR — Master Clear / Reset input (active low) |
| Pino 47 | OSC1 — Crystal oscillator input / CLKI |
| Pino 48 | OSC2 — Crystal oscillator output / CLKO |
Aplicações típicas
PIC24F16KA304-E/MV é adequado para 6 aplicaçãos: Battery-Powered IoT Sensor Node, Wearable Health Monitor, Capacitive Touch User Interface, Smart Utility Meter Endpoint, Industrial Sensor Hub, Remote Control and Wireless Key Fob.
Battery-Powered IoT Sensor Node
The PIC24F16KA304-E/MV fits IoT sensor nodes through its XLP nanoWatt Deep Sleep current of less than 20 nA with RTCC, DSBOR and DSWDT still active, allowing years of operation from a single coin cell. Its 12-bit ADC and CTMU support direct sensor and capacitive-touch interfacing without external analogue ICs. The 32 MHz core and 16 MIPS throughput handle lightweight LoRa, Zigbee or BLE stack preparation before transmit duty cycling.
Recomendado
Wearable Health Monitor
Wearable health monitors benefit from the PIC24F16KA304-E/MV's 1.8 V–3.6 V direct Li-ion compatibility and extended -40 °C to +125 °C range for skin-contact operation. The 16 ADC channels digitise heart-rate, SpO2 and temperature sensors, while CTMU drives capacitive touch buttons. With 16 KB Flash and 2 KB RAM, firmware comfortably fits RTOS-free main-loop scheduling plus BLE command parsing.
Recomendado
Capacitive Touch User Interface
The CTMU peripheral on the PIC24F16KA304-E/MV enables robust capacitive touch sliders and buttons without dedicated touch ICs, reducing BOM cost in appliances and consumer products. Combined with the 12-bit ADC, mixed touch-and-analogue sensing is straightforward. Deep Sleep with wake-on-touch conserves power between user interactions, while the 48-UQFN (6x6 mm) footprint keeps the touch PCB compact behind glass overlays.
Recomendado
Smart Utility Meter Endpoint
Utility metering endpoints require RTC accuracy and reliable sleep wakeups, both delivered by the PIC24F16KA304-E/MV's RTCC, DSBOR and DSWDT peripherals that operate during Deep Sleep. The 12-bit ADC with 16 channels samples current shunts, voltage dividers and temperature sensors for power-quality logging. The 48-UQFN package fits inside sealed meter enclosures with extended -40 °C to +125 °C operation.
Recomendado
Industrial Sensor Hub
Industrial sensor hubs leverage the PIC24F16KA304-E/MV's 16 ADC channels, 5 CCP modules and dual I2C/SPI/UART interfaces to aggregate multiple 4–20 mA loops, RTDs and digital sensors. The extended -40 °C to +125 °C rating and 1.8 V–3.6 V supply tolerance suit factory floor installations. CTMU and RTCC add bonus functionality for local display and time-stamping without extra ICs.
Recomendado
Remote Control and Wireless Key Fob
The PIC24F16KA304-E/MV is well suited to wireless key fobs and remote controls thanks to its nanoamp Deep Sleep current and instant wake-on-pin-change capability. The 32 MHz core drives short RF sub-GHz or BLE command bursts within tight FCC duty-cycle budgets. CTMU supports capacitive touch surfaces, while the wide 1.8–3.6 V supply accepts single CR2032 coin cells directly.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24F16KA304-E/MV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FV16KA304-E/MV | PIC24F32KA304-E/MV | PIC24F16KA302T-I/ML | PIC24F16KA302-E/SP | PIC24F16KA301-I/P |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-UQFN (6x6) | 48-UQFN (6x6) - same | 48-UQFN (6x6) - same | 28-QFN (ML) - different | 28-SPDIP (SP) - different | 20-PDIP (P) - different |
| Flash Memory | 16 KB | 16 KB | 32 KB | 16 KB | 16 KB | 16 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Maximum CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Operating Voltage | 1.8 V to 3.6 V | 2.0 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Operating Temperature | -40 °C to +125 °C (E) | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +85 °C (I) | -40 °C to +125 °C | -40 °C to +85 °C (I) |
| ADC Resolution / Channels | 12-bit / 16 ch | 12-bit / 16 ch | 12-bit / 16 ch | 12-bit / 9 ch | 12-bit / 9 ch | 12-bit / 9 ch |
| AEC-Q100 | No | No | No | No | No | No |
| Approximate Unit Price (qty 1) | USD 3.10 | USD 3.20 | USD 3.40 | USD 2.85 | USD 2.95 | USD 2.70 |
Principais diferenciais
- Dual-mode XLP Deep Sleep with RTCC (vs PIC24F16KA301-I/P)
- 16-channel 12-bit ADC vs 9-channel on KA302/KA301 (vs PIC24F16KA302T-I/ML)
- Extended -40 °C to +125 °C (E suffix) vs industrial -40 to +85 °C (I suffix) (vs PIC24F16KA302T-I/ML)
Notas de projeto
Decouple each VDD/VSS pair with a 100 nF X7R ceramic capacitor placed within 5 mm of the pins, and add a bulk 4.7 µF capacitor near the package exposed pad. For Deep Sleep current budget, ground unused pins via the CNPU/CNPD registers and disable unused peripherals using the PMDx bits to avoid parasitic leakage. Source: Microchip datasheet 39927c, Section 2 - Electrical Characteristics.
The 48-UQFN (6x6 mm) package requires a 0.4 mm pitch land pattern with NSMD pads; the central exposed pad must be soldered to a continuous ground pour with at least 9 thermal vias (0.3 mm drill, 0.6 mm pitch) to the inner ground plane for thermal and electrical performance. Stencil aperture should be 1:1 to pad with no soldermask-defined pads, and reflow profile must not exceed 260 °C peak (JEDEC J-STD-020).
Do not leave the MCLR pin floating - either tie it to VDD through a 10 kΩ resistor or drive it with the ICSP programmer. The VCAP pin requires a low-ESR 4.7 µF capacitor; missing this capacitor prevents the internal voltage regulator from starting and the device will not respond to programming. Always configure the JTAGEN fuse bit OFF unless using 4-wire JTAG debug. Source: datasheet 39927c Section 26.
Route the analog traces AVDD/AVSS/VREF+/VREF- as short and symmetric as possible, keeping them clear of digital switching currents. Place analog input RC filters within 5 mm of the ANx pins and bypass the ADC VREF with a 10 nF NPO capacitor plus 1 µF bulk. Reference design patterns for PIC24F are documented in Microchip application note AN1316.
Informações de conformidade
RoHS and REACH compliance stated on Microchip product page. Industrial-grade (E suffix) only; no AEC-Q100 automotive qualified variant in this MPN. For AEC-Q100 applications consider PIC24F16KA304-E/MV automotive-grade derivative - confirm with Microchip.
