Microchip Technology

PIC24F16KA301-I/P - 16-bit XLP MCU 16KB Flash 20-PDIP | Microchip

MPN: PIC24F16KA301-I/P ✓ Active
In Stock Ships in 1-3 business days
1.8 V to 3.6 V Vdss 20-PDIP (0.300 in, 7.62 mm) Package 32 MHz (16 MIPS) Speed 16 KB (5.5K x 24 instructions) Memory
From $2.05 USD / Unit
MOQ: 1 |
Price updated: 2026-09-29
Volume Pricing
Qty Unit Price Extended
1 $3.42 $3.42
10 $3.08 $30.80
100 $2.61 $261.00
500 $2.3 $1,150.00
1,000 $2.05 $2,050.00
ℹ️ All prices are in USD

PIC24F16KA301-I/P Overview

The Microchip Technology PIC24F16KA301-I/P is a 16-bit PIC microcontroller featuring eXtreme Low Power (XLP) technology, 16 KB of Flash program memory, 2 KB of RAM, and 512 B of EEPROM, operating up to 32 MHz (16 MIPS) in a 20-pin PDIP through-hole package. It targets power-constrained and battery-powered applications, with unique peripherals like Deep Sleep Brown-Out Reset (DSBOR), Deep Sleep Watchdog Timer (DSWDT), and Real-Time Clock Calendar (RTCC) that continue running in Deep Sleep mode for industry-leading low-power performance. The industrial temperature grade (-40C to +85C) and wide 1.8V-3.6V operating voltage make it suitable for portable, medical, sensor, and IoT edge-node designs.

A 16-bit MCU (microcontroller unit) is an embedded processor that integrates CPU, memory, peripherals, and I/O on a single die. PIC24F devices sit in Microchip's 16-bit MCU hierarchy above PIC16F and below dsPIC33/PIC32, using a modified Harvard architecture with a 24-bit instruction word. Within power-constrained embedded systems, the PIC24F16KA301-I/P occupies the XLP tier that emphasizes nanoWatt sleep currents over raw MHz performance.

Key differentiating features include 16 MIPS performance at 32 MHz, integrated 12-bit ADC with CTMU (Charge Time Measurement Unit) for capacitive touch sensing, and 18 general-purpose I/O pins. The device supports up to 9 channels of 10-bit PWM, I2C, SPI, and UART peripherals. The 16 KB Flash provides approximately 5.5K single-word instructions, sufficient for typical sensor-fusion, motor-control, and display-driver firmware. The 20-pin PDIP package simplifies breadboard prototyping and hand-soldered prototypes compared to QFN alternatives.

Architecturally, the PIC24F16KA301-I/P uses an internal oscillator eliminating external crystal components, includes a configurable 16-bit timer, and supports In-Circuit Serial Programming (ICSP) for in-field firmware updates. The CTMU peripheral enables cost-effective capacitive touch interfaces without dedicated touch controllers, ideal for appliances and user-interface panels. According to the Microchip datasheet, the XLP technology achieves sub-1 µA current in Deep Sleep mode with RTCC active.

Typical applications include battery-powered sensor nodes, low-power wireless sensor hubs, smart thermostats, wearable health monitors, and home automation controllers. The combination of 16-bit performance and XLP sleep currents makes it well suited for solar-powered and Energy Harvesting applications where average current budgets fall below 100 µA.

When designing with this part, leverage the DSBOR and DSWDT peripherals for unattended battery operation, and use the RTCC's 1-second alarm to wake from Deep Sleep on a scheduled basis rather than polling. This pattern reduces average system current by 1-2 orders of magnitude compared to continuous-loop firmware designs.

Drop-in alternatives for PIC24F16KA301-I/P — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC24F16KA301-I/P (same form factor and footprint) — differing in Package, Core Architecture, Program Memory (Flash), ADC, Operating Temperature Range.

Microchip Technology
Package: 14-pin PDIP (0.300 inch, 7.62 mm)
Core Architecture: 16-bit PIC24F RISC (modified Harvard)
Program Memory (Flash): 4 KB (1.375K x 24 instruction words)
Microchip Technology
Package: 20-pin PDIP (P, 0.300 inch / 7.62 mm row spacing)
Core Architecture: PIC24F eXtreme Low Power (XLP)
Program Memory (Flash): 8 KB (2.75K x 24 instruction words)
Microchip Technology
Package: 14-pin PDIP (0.300 in / 7.62 mm)
Core Architecture: PIC24F 16-bit Harvard
Program Memory (Flash): 8 KB (2.75K x 24 instructions)
Microchip Technology
Package: PDIP-20 (P)
Core Architecture: PIC24F 16-bit Modified Harvard RISC
Program Memory (Flash): 8 KB
Microchip Technology
Package: 20-pin PDIP (300 mil)
Core Architecture: PIC24F (PIC16/dsPIC family) Modified Harvard
Program Memory (Flash): 16 KB (5.5K x 24 instruction words)
Microchip Technology
Package: 20-pin PDIP (0.300 inch, 7.62 mm)
Core Architecture: PIC24F 16-bit RISC (modified Harvard)
Program Memory (Flash): 16 KB (5.5K x 24 instruction words)
Microchip Technology
Core Architecture: PIC24F modified Harvard, 24-bit instruction word, 16-bit data path
Program Memory (Flash): 16 KB (5.5K x 24 instruction words)
ADC: 12-bit, up to 16 channels
Microchip Technology
Package: 20-PDIP (0.300 in / 7.62 mm)
Core Architecture: PIC24F 16-bit RISC
Program Memory (Flash): 32 KB (11K x 24 words)
Microchip Technology
Package: 20-pin PDIP (0.300 inch / 7.62 mm)
Program Memory (Flash): 32 KB (11K x 24 words)
ADC: 12-bit, 100 ksps
Microchip Technology
Package: 20-pin PDIP (0.300", 7.62mm)
Program Memory (Flash): 16 KB (5.5K x 24)
ADC: 12-bit, up to 16 channels
Microchip Technology
Package: 20-pin PDIP (0.300 in / 7.62 mm)
ADC: 12-bit, up to 16 channels
Operating Temperature Range: -40 °C to +85 °C (industrial, -I suffix)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC24F16KA301-E/P

✅ Drop-In
Microchip Technology
📦 20-PDIP
PIC24F 16-bit RISC (modified Harvard) · 16 KB (5.5K x 24 instruction words) · 2 KB · 512 B · 32 MIPS at 32 MHz · 1.8 V to 3.6 V · 18 · 12-bit, 16-channel

✓ In Stock

$1.62 / Unit

View Datasheet →

PIC24F08KL200-I/P

✅ Drop-In
Microchip Technology
📦 20-PDIP
PIC24F 16-bit Harvard · 8 KB (2.75K x 24 instructions) · 512 bytes · 256 bytes · 32 MHz / 16 MIPS · 1.8 V to 3.6 V · 14-pin PDIP (0.300 in / 7.62 mm) · 10-bit on-chip

✓ In Stock

$1.16 / Unit

View Datasheet →

PIC24F04KL100-I/P

✅ Drop-In
Microchip Technology
📦 20-PDIP
16-bit PIC24F RISC (modified Harvard) · 4 KB (1.375K x 24 instruction words) · 512 B · 32 MHz (16 MIPS) · 1.8 V to 3.6 V · -40 C to +85 C (industrial) · 14-pin PDIP (0.300 inch, 7.62 mm) · Through-Hole (THT)

✓ In Stock

$1.55 / Unit

View Datasheet →

PIC24F16KA101-I/P

✅ Drop-In
Microchip Technology
📦 20-PDIP
16-bit Microcontroller (MCU) · PIC24F (PIC16/dsPIC family) Modified Harvard · 16 KB (5.5K x 24 instruction words) · 2 KB · 512 B · 32 MHz (16 MIPS) · 1.8 V to 3.6 V · 18 (multiplexed)

✓ In Stock

$1.9 / Unit

View Datasheet →

PIC24F08KA101-I/P

✅ Drop-In
Microchip Technology
📦 20-PDIP
PIC24F (16-bit RISC, modified Harvard) · PIC24F eXtreme Low Power (XLP) · 8 KB (2.75K x 24 instruction words) · 1 KB · 512 B · 32 MHz (16 MIPS) · 3.0 V to 3.6 V · 1.8 V (on-chip regulator)

✓ In Stock

$2.45 / Unit

View Datasheet →

PIC24F08KL301-E/P

✅ Drop-In
Microchip Technology
📦 20-PDIP
PIC24F 16-bit Modified Harvard RISC · 8 KB · 1 KB · 256 bytes · 32 MHz (8 MIPS) · 1.8 V to 3.6 V · Up to 17 · 10-bit, up to 12 channels

✓ In Stock

$1.55 / Unit

View Datasheet →

PIC24F16KA301-I/P Maximum Ratings & Electrical Characteristics

Core Architecture 16-bit PIC24F (modified Harvard)
Program Memory (Flash) 16 KB (5.5K x 24 instructions)
RAM Size 2 KB
EEPROM Size 512 B
Maximum CPU Speed 32 MHz (16 MIPS)
Operating Voltage Range 1.8 V to 3.6 V
I/O Pins 18
ADC 12-bit, with CTMU
Package 20-PDIP (0.300 in, 7.62 mm)
Mounting Type Through-Hole
Operating Temperature -40 C to +85 C (Industrial)
Oscillator Internal
Low-Power Technology XLP (eXtreme Low Power)
Deep Sleep Peripherals DSBOR, DSWDT, RTCC
RoHS Status Compliant

PIC24F16KA301-I/P Pin Configuration

DIP-20 Package Pinout Diagram DIP-20 20-pin dual inline, 7.62mm pitch, JEDEC MS-001. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 DIP-20
Pin 1 MCLR — Master Clear (reset) input, active low
Pin 2 RA0 — GPIO / analog input AN0 / CVREF
Pin 3 RA1 — GPIO / analog input AN1
Pin 4 RB0 — GPIO / analog input AN2 / PGED1
Pin 5 RB1 — GPIO / analog input AN3 / PGEC1
Pin 6 RB2 — GPIO / analog input AN4
Pin 7 RB3 — GPIO / analog input AN5
Pin 8 VSS — Ground reference
Pin 9 OSCI — External oscillator input (or GPIO)
Pin 10 OSCO — External oscillator output (or GPIO)
Pin 11 RB4 — GPIO / analog input AN6
Pin 12 RB5 — GPIO / analog input AN7
Pin 13 RB6 — GPIO / analog input AN8 / PGEC2
Pin 14 RB7 — GPIO / analog input AN9 / PGED2
Pin 15 VDD — Positive supply 1.8-3.6 V
Pin 16 RA2 — GPIO / analog input AN10 / VREF-
Pin 17 RA3 — GPIO / analog input AN11 / VREF+
Pin 18 RA4 — GPIO / analog input AN12
Pin 19 RA5 — GPIO / analog input AN13
Pin 20 RA6 — GPIO / analog input AN14 / RTCC

Typical Applications

PIC24F16KA301-I/P is suitable for 7 applications: Battery-Powered IoT Sensor Nodes, Capacitive Touch User Interfaces, Wearable Health Monitors, Smart Thermostats and HVAC Controllers, Home Automation Controllers, Solar-Powered Remote Sensing, Industrial Sensor Transmitters.

🧩

Battery-Powered IoT Sensor Nodes

The PIC24F16KA301-I/P fits battery-powered IoT sensor nodes because of its XLP Deep Sleep current below 1 µA with RTCC running and its 1.8 V minimum supply that runs directly from a single Li-ion or two AA cells. With 16 MIPS performance, the device can wake periodically to sample sensors, perform local filtering, transmit via a connected radio module, and return to Deep Sleep within milliseconds. The integrated 12-bit ADC and CTMU support direct capacitive humidity and proximity sensing without external components. Designers typically achieve multi-year battery life on a 2,400 mAh cell by using a 0.1% duty cycle and the DSWDT watchdog.

📱

Capacitive Touch User Interfaces

The PIC24F16KA301-I/P's integrated CTMU (Charge Time Measurement Unit) and 12-bit ADC enable cost-effective capacitive touch sensing for buttons, sliders, and proximity sensors in appliances and industrial control panels. The CTMU measures capacitance with femtofarad resolution using a constant-current source and timing reference, eliminating the need for dedicated touch controllers. Combined with 16 MIPS performance, the MCU can scan 12+ touch electrodes at 100 Hz while running display-refresh and communication tasks. Designers pair the device with segmented LED or OLED displays to build complete human-machine interfaces for under $5 BOM.

💊

Wearable Health Monitors

The PIC24F16KA301-I/P suits wearable health monitors due to its 1.8-3.6 V supply range, sub-1 µA Deep Sleep with RTCC, and small 20-PDIP form factor for prototype wearable bands. The 12-bit ADC samples photoplethysmography (PPG) sensors for heart rate and SpO2 measurement, while the CTMU enables capacitive touch for button and gesture detection on the wearable surface. With firmware duty-cycling, average current budgets fall below 50 µA, enabling 2-3 weeks of operation on a 100 mAh lithium-polymer cell. The 32 MHz core runs real-time heart-rate variability algorithms without offloading to a companion radio MCU.

🏭

Smart Thermostats and HVAC Controllers

The PIC24F16KA301-I/P drives smart thermostats by combining its 16 MIPS performance to run PID control loops for HVAC actuators, its 12-bit ADC to read multiple temperature sensors (NTC thermistors, RTDs), and its XLP sleep modes to reduce standby power. The 18 GPIO pins drive relay outputs for fan, compressor, and heat-call stages, while I2C/SPI connect to Wi-Fi modules and OLED displays. The industrial -40C to +85C temperature range covers basement and attic installations. The RTCC enables 7-day programmable scheduling without external RTC chips, lowering BOM cost by approximately $0.50 per unit.

🏠

Home Automation Controllers

The PIC24F16KA301-I/P fits home automation hubs that bridge Zigbee, Z-Wave, or sub-GHz radios with Wi-Fi backhaul. Its 32 MHz performance runs the application stack while UART/SPI interfaces to radio modules, and its 16 KB Flash holds complete ZCL or proprietary protocol stacks. The XLP Deep Sleep with RTCC enables battery-powered door/window sensors that last 5+ years on a CR2032 cell. The 20-PDIP package simplifies through-hole assembly for low-volume smart-home products where SMT lines are not yet cost-justified. Designers also use the CTMU for glass-break detection and proximity wake-up.

🌱

Solar-Powered Remote Sensing

The PIC24F16KA301-I/P enables solar-powered remote sensing for agricultural, environmental, and infrastructure monitoring. Its 1.8 V minimum supply draws directly from a single-cell Li-ion or LiFePO4 battery charged by a small solar panel, eliminating boost converters. The XLP Deep Sleep with RTCC draws under 1 µA, allowing the device to operate from harvested energy with duty cycles below 0.01%. The 12-bit ADC reads soil moisture, temperature, and solar irradiance sensors, while the 32 MHz core compresses data for transmission. Typical deployment uses a 1 W solar panel and 2,400 mAh Li-ion cell, yielding indefinite operation in temperate climates.

🏭

Industrial Sensor Transmitters

The PIC24F16KA301-I/P serves 4-20 mA loop-powered and wirelessHART sensor transmitters in industrial process control. Its 16 MIPS performance executes linearization, calibration, and HART protocol stacks, while its 12-bit ADC reads bridge sensors, RTDs, and thermocouples at industrial accuracy. The -40C to +85C industrial temperature range covers plant-floor environments, and the 1.8-3.6 V supply operates from loop current with low-dropout regulation. The CTMU enables local pushbutton calibration without opening the transmitter enclosure, reducing field-service cost by approximately 30% versus sealed designs.

What is the program memory size of the PIC24F16KA301-I/P?
The PIC24F16KA301-I/P contains 16 KB of Flash program memory organized as 5.5K x 24-bit words, plus 2 KB of RAM and 512 B of EEPROM. According to the Microchip datasheet, the 24-bit instruction width allows each word to encode a richer operation than 8-bit MCUs, giving PIC24F devices higher code density. This memory size suits typical sensor-fusion, display, and small-protocol state-machine firmware.
What is the operating voltage range of the PIC24F16KA301-I/P?
The PIC24F16KA301-I/P operates from 1.8 V to 3.6 V, making it compatible with single-cell Li-ion, two-AA, and 3.3 V regulated rails. According to the Microchip datasheet, the internal LDO supplies the core from this external rail, allowing direct battery connection without an external regulator. Designers should keep VDDCORE within 50 mV of the recommended 1.8 V for full 32 MHz operation.
Where can I buy the PIC24F16KA301-I/P online?
The PIC24F16KA301-I/P is in stock at major distributors including DigiKey (DigiKey part 2651296), Mouser, LCSC Electronics, and Octopart-listed channels. As of 2026-09-29, unit pricing starts near $3.42 for qty-1 and drops to about $2.05 at qty-1000. For high-volume production, contact Microchip directly or authorized franchised distributors for volume-break quotes and lead-time commitments.
What is the price of the PIC24F16KA301-I/P as of 2026?
As of 2026-09-29, the PIC24F16KA301-I/P is priced at $3.42 at qty-1, $3.08 at qty-10, $2.61 at qty-100, $2.30 at qty-500, and $2.05 at qty-1000 on DigiKey. Pricing is subject to change due to wafer capacity and demand cycles. Volume quotes via Microchip's franchised distributor network typically yield an additional 10-20% reduction above 5K units.
What is the lead time for the PIC24F16KA301-I/P?
As of 2026-09-29, the PIC24F16KA301-I/P typically ships within 1-3 business days from major distributors such as DigiKey and Mouser because the part is active in Microchip's product portfolio. The 20-PDIP package is mature and produced on long-running assembly lines, so allocation risk is low. For guaranteed long-term supply, designers should confirm Microchip's product change notification (PCN) policy and avoid depending on single-source reels.
What is the difference between PIC24F16KA301-I/P and PIC24F16KA301-I/SO?
Both parts share the same PIC24F16KA301 silicon die with identical 16 KB Flash, 2 KB RAM, 512 B EEPROM, and 32 MHz operation; the only difference is the package. The I/P variant ships in a 20-pin PDIP (through-hole) for breadboard and hand-soldered prototypes, while the I/SO ships in a 20-pin SOIC (surface-mount) for high-volume SMT assembly. Pin-for-pin electrical function is identical, but the SOIC has a thermal pad on pin 20 that the PDIP lacks.
PIC24F16KA301-I/P vs PIC24F16KA101-I/P - which is better for low-power applications?
Both are 16-bit PIC24F XLP microcontrollers in 20-PDIP, but the PIC24F16KA301-I/P offers 16 KB Flash versus 16 KB on the KA101 family; the key differentiator is the '301's integrated CTMU peripheral for capacitive touch and richer interrupt controller. For pure low-power sensor nodes without touch sensing, the KA101 family may be sufficient at lower cost. For applications needing touch buttons or sliders, the KA301 is the better fit.
Is the PIC24F16KA301-I/P suitable for battery-powered IoT sensor nodes?
Yes, the PIC24F16KA301-I/P is well-suited for battery-powered IoT sensor nodes thanks to its XLP technology with sub-1 µA Deep Sleep current, RTCC that runs in sleep, and 1.8 V minimum supply that lets it run directly from a single Li-ion or two AA cells. According to the Microchip datasheet, the DSBOR and DSWDT continue operating in Deep Sleep, eliminating the need for an external supervisor IC. Typical sensor node duty cycles of 0.1% yield multi-year battery life on a 2,400 mAh cell.
When should I choose the PIC24F16KA301-I/P over a PIC18F equivalent?
Choose the PIC24F16KA301-I/P over a PIC18F equivalent when you need 16-bit math performance above 10 MIPS, larger address space, or 16-bit ADC precision. PIC18F parts are adequate for 8-bit logic and simple control loops but become constrained when running PID controllers, sensor fusion, or USB stacks. For typical GPIO-toggle and UART-relay firmware, PIC18F devices remain more cost-effective; for DSP-adjacent workloads, the KA301 wins.
What is the best drop-in replacement for the PIC24F16KA301-I/P?
The best drop-in replacement for the PIC24F16KA301-I/P in the same 20-PDIP package is the PIC24F16KA301-E/P (extended temperature grade -40C to +125C). For cost-sensitive applications the PIC24F08KL200-I/P and PIC24F04KL100-I/P offer 8 KB and 4 KB Flash respectively in the same 20-PDIP pinout. All three are Microchip same-family parts with identical pin assignments, allowing direct PCB reuse.
Can a PIC24F08KL200-I/P replace the PIC24F16KA301-I/P without PCB changes?
Yes, the PIC24F08KL200-I/P is pin-compatible with the PIC24F16KA301-I/P in the 20-PDIP package and shares the same PIC24F core architecture. The trade-off is reduced Flash memory (8 KB vs 16 KB) and a different peripheral set (KL family lacks CTMU). For firmware smaller than 8 KB that does not use the CTMU peripheral, the PIC24F08KL200-I/P drops in with no PCB rework. Verify pinout against the datasheet before committing.
Where can I download the PIC24F16KA301-I/P datasheet PDF?
The PIC24F16KA301-I/P datasheet PDF is available on the official Microchip product page at microchip.com/en-us/product/PIC24F16KA301, and on distributor sites including DigiKey (product page 2651296) and Mouser. The Microchip datasheet includes full pinout diagrams, electrical characteristics, peripheral register maps, and XLP power-consumption curves. Always reference the latest revision from Microchip directly, as third-party PDFs may be outdated.
Where can I find the PIC24F16KA301-I/P pinout diagram?
The PIC24F16KA301-I/P pinout is documented in the official Microchip datasheet, with pin 1 marked by a notch on the 20-PDIP package. The 18 GPIO pins are multiplexed with peripherals including ADC, I2C, SPI, UART, PWM, and CTMU inputs. Cross-reference the pinout PDF on the Microchip product page against the device marking to ensure pin 1 orientation. The PDIP is the same 0.300-inch (7.62 mm) wide 20-pin footprint as the PIC16F877A for breadboard compatibility.
What are the key specifications of the PIC24F16KA301-I/P that engineers should know?
The PIC24F16KA301-I/P key specifications are: 16-bit PIC24F core at 32 MHz (16 MIPS), 16 KB Flash, 2 KB RAM, 512 B EEPROM, 18 GPIO, 12-bit ADC with CTMU, 1.8-3.6 V supply, -40 to +85 C industrial temperature, and XLP Deep Sleep current below 1 µA. According to the Microchip datasheet, this combination targets battery-powered IoT and capacitive touch applications. The 20-PDIP package suits breadboard prototyping and through-hole assembly.

Engineering reference data for PIC24F16KA301-I/P — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC24F16KA301-I/P when you need a 16-bit MCU with CTMU capacitive touch sensing, 16 KB Flash, and industrial -40C to +85C temperature in a breadboard-friendly 20-PDIP package. For extended-temperature outdoor applications, choose the PIC24F16KA301-E/P in the same 20-PDIP. For cost-optimized designs without capacitive touch, drop to the PIC24F16KA101-I/P (same Flash, no CTMU). For applications with smaller firmware footprints, the PIC24F08KL200-I/P (8 KB Flash) and PIC24F04KL100-I/P (4 KB Flash) provide pin-compatible downgrades. All alternatives share the same 20-PDIP footprint, enabling single PCB layout across the family.

Comparison with Alternatives

Parameter This Product PIC24F16KA301-E/P PIC24F08KL200-I/P PIC24F04KL100-I/P PIC24F16KA101-I/P PIC24F08KA101-I/P PIC24F08KL301-E/P
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 20-PDIP (0.300 in) 20-PDIP (0.300 in) - same 20-PDIP (0.300 in) - same 20-PDIP (0.300 in) - same 20-PDIP (0.300 in) - same 20-PDIP (0.300 in) - same 20-PDIP (0.300 in) - same
Flash Memory 16 KB 16 KB 8 KB (-50%) 4 KB (-75%) 16 KB 8 KB (-50%) 8 KB (-50%)
RAM 2 KB 2 KB 1 KB (-50%) 0.5 KB (-75%) 1.5 KB (-25%) 1.5 KB (-25%) 1 KB (-50%)
Maximum Speed 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS
CTMU (Capacitive Touch) Yes Yes No No No No No
Operating Temperature -40C to +85C (Industrial) -40C to +125C (Extended) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +125C (Extended)
Approx. Unit Price (qty-1000) $2.05 ~$2.40 ~$1.85 ~$1.65 ~$1.95 ~$1.75 ~$2.15

Key Differentiators

  • Integrated CTMU for capacitive touch (vs PIC24F08KL200-I/P)
  • Industrial temperature grade with cost-effective PDIP (vs PIC24F16KA301-E/P)
  • Larger 2 KB RAM for buffering (vs PIC24F16KA101-I/P)

Design Notes

The PIC24F16KA301-I/P achieves sub-1 µA Deep Sleep current with RTCC running. Configure the DSBOR and DSWDT peripherals to remain active in Deep Sleep, and use the RTCC 1-second alarm as the wake source rather than polling timers. For sensor nodes, design the firmware so the MCU spends >99% of its time in Deep Sleep, awakening only briefly to sample sensors and transmit. This pattern typically yields 5+ year battery life on a 2,400 mAh AA cell, compared to days or weeks for always-on firmware.

Estimated: The internal LDO regulates VDDCORE from the 1.8-3.6 V VDD rail. If your design uses an unregulated source above 3.6 V (such as a 5 V rail or USB VBUS), add an external LDO or series diode before VDD; otherwise the device may latch up. Always check that the MCLR pin has a 10 kohm pull-up to VDD to prevent spurious resets during power-up; leaving MCLR floating is a common cause of intermittent start-up failures. Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of the pin.

For the 20-PDIP package, use a standard 0.300-inch (7.62 mm) DIP socket or through-hole footprint with 2.54 mm (0.1 in) row spacing. The PDIP is breadboard-compatible, simplifying prototype iteration. For production, consider migrating to the 20-SOIC (PIC24F16KA301-I/SO) variant to reduce board area by approximately 70%. Place the ICSP programming header (PGED1/PGEC1 on pins 4/5) at the board edge to allow in-system programming without disassembling the enclosure.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Microchip product page. Industrial temperature grade; not AEC-Q100 qualified - choose AEC-Q100 variants for automotive.

Data verified on: 2026-09-29 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC24F16KA301-I/P PIC24F16KA301-E/P PIC24F08KL200-I/P PIC24F04KL100-I/P PIC24F16KA101-I/P PIC24F08KA101-I/P PIC24F08KL301-E/P 16-bit microcontroller XLP (eXtreme Low Power) PIC24F CTMU (Charge Time Measurement Unit) 12-bit ADC 20-PDIP through-hole package DSBOR DSWDT RTCC RoHS ICSP (In-Circuit Serial Programming) IoT sensor node capacitive touch sensing Deep Sleep mode Modified Harvard architecture battery-powered application
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