PIC24F32KA304-I/ML - 32KB Flash XLP 16-bit MCU | Microchip
N.º da peça: PIC24F32KA304-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $4.88 | $48,80 |
| 100 | $4.12 | $412,00 |
| 500 | $3.65 | $1.825,00 |
| 1.000 | $3.21 | $3.210,00 |
PIC24F32KA304-I/ML Visão geral
A 16-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and peripherals on a single silicon die. The PIC24F family sits in the hierarchy: MCU -> 16-bit MCU -> PIC24F family -> microcontroller -> embedded processor -> semiconductor. The 16-bit architecture provides enhanced computational performance and C-compiler efficiency over 8-bit PIC MCUs, while the XLP (eXtreme Low Power) technology extends battery life in power-constrained applications through nanoWatt features.
Key features include a 32 MHz internal oscillator, 17 general-purpose I/O pins, multiple communication peripherals (UART, SPI, I2C), a 12-bit ADC with 200 ksps conversion rate, and multiple 16-bit timers. The device operates from 1.8V to 3.6V supply voltage, with a maximum operating temperature range of -40C to +85C in the industrial grade (-I suffix). The 44-QFN package provides a compact footprint with exposed thermal pad.
Technically, the PIC24F32KA304 uses a modified Harvard architecture with separate program and data buses, enabling simultaneous instruction fetch and data access. The integrated nanoWatt XLP technology achieves deep-sleep currents below 20 nA with RTCC running, while the peripheral pin select (PPS) feature allows flexible remapping of digital peripherals to I/O pins.
Typical applications include battery-powered IoT sensor nodes, wearable health monitors, remote controls, low-power wireless sensor networks, energy harvesting devices, and consumer electronics requiring extended battery life. The combination of high computational performance, multiple communication interfaces, and ultra-low-power modes makes this MCU particularly suitable for edge computing and connected IoT endpoints.
When designing with this device, ensure decoupling capacitors (100 nF + 10 uF) are placed close to the VDD pins, and that unused I/O pins are configured as outputs to minimize current consumption. The PPS feature requires careful configuration in MPLAB X IDE to avoid peripheral conflicts.
This page synthesizes distributor pricing from DigiKey, drop-in alternatives from Microchip's PIC24F family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC24F32KA304-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24F32KA304-I/ML (mesmo formato e footprint) — diferindo em Core Architecture, Family, Operating Temperature, Package, Timers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24F32KA304-E/ML
✅ Drop-In✓ Em estoque
$2.95 / unidade
Ver ficha técnica →PIC24FV32KA304-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24F32KA302-I/ML
✅ Drop-In✓ Em estoque
$3.2 / unidade
Ver ficha técnica →PIC24F16KA304-I/ML
✅ Drop-In✓ Em estoque
$1.85 / unidade
Ver ficha técnica →PIC24F32KA301-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24F08KM204-I/ML
✅ Drop-In✓ Em estoque
$2.31 / unidade
Ver ficha técnica →PIC24F32KA304-I/ML Classificações máximas e características elétricas
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Family | PIC24F XLP 24F |
| Program Memory (Flash) | 32 KB (11K x 24 words) |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 17 |
| Encapsulamento | 44-QFN (8x8 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (industrial grade) |
| Communication Peripherals | UART, SPI, I2C |
| Timers | Multiple 16-bit timers |
| XLP Technology | Yes (eXtreme Low Power) |
| Status RoHS | Compliant |
| Nível MSL | 1 |
Configuração de pinos do PIC24F32KA304-I/ML
| Pino 1 | RP5/RB5 — I/O port pin / remappable peripheral |
| Pino 2 | VSS — Ground reference |
| Pino 3 | RP6/RB6/PGEC2 — I/O port pin / ICD clock |
| Pino 4 | RP7/RB7/PGED2 — I/O port pin / ICD data |
| Pino 5 | RP8/RB8 — I/O port pin |
| Pino 6 | RP9/RB9 — I/O port pin |
| Pino 7 | VDD — Positive supply voltage (1.8V to 3.6V) |
| Pino 8 | VSS — Ground reference |
| Pino 9 | OSC1/CLKI/RA1 — Oscillator input / general I/O |
| Pino 10 | OSC2/CLKO/RA2 — Oscillator output / general I/O |
| Pino 11 | VREF+/CVREF+/AN0/RA0 — ADC reference positive / analog input |
| Pino 12 | VREF-/CVREF-/AN1/RA1 — ADC reference negative / analog input |
| Pino 13 | AN2/RA2 — Analog input 2 / general I/O |
| Pino 14 | AN3/RA3 — Analog input 3 / general I/O |
| Pino 15 | RA4 — General purpose I/O |
| Pino 16 | RA5 — General purpose I/O |
| Pino 17 | RA6 — General purpose I/O |
| Pino 18 | RA7 — General purpose I/O |
| Pino 19 | VSS — Ground reference |
| Pino 20 | VDD — Positive supply voltage (1.8V to 3.6V) |
| Pino 21 | RC0 — I/O port pin |
| Pino 22 | RC1 — I/O port pin |
| Pino 23 | RC2 — I/O port pin |
| Pino 24 | RC3 — I/O port pin |
| Pino 25 | RC4 — I/O port pin |
| Pino 26 | RC5 — I/O port pin |
| Pino 27 | RC6 — I/O port pin |
| Pino 28 | RC7 — I/O port pin |
| Pino 29 | RD0 — I/O port pin |
| Pino 30 | RD1 — I/O port pin |
| Pino 31 | RD2 — I/O port pin |
| Pino 32 | RD3 — I/O port pin |
| Pino 33 | RD4 — I/O port pin |
| Pino 34 | RD5 — I/O port pin |
| Pino 35 | VSS — Ground reference |
| Pino 36 | VDD — Positive supply voltage (1.8V to 3.6V) |
| Pino 37 | RB0/PGEC1 — I/O port pin / programming clock |
| Pino 38 | RB1/PGED1 — I/O port pin / programming data |
| Pino 39 | RB2 — I/O port pin |
| Pino 40 | RB3 — I/O port pin |
| Pino 41 | RP4/RB4 — I/O port pin / remappable peripheral |
| Pino 42 | RP3/RB3 — I/O port pin / remappable peripheral |
| Pino 43 | RP2/RB2 — I/O port pin / remappable peripheral |
| Pino 44 | RP1/RB1 — I/O port pin / remappable peripheral |
Aplicações típicas
PIC24F32KA304-I/ML é adequado para 7 aplicaçãos: Battery-Powered IoT Sensor Nodes, Wearable Health Monitors, Remote Controls and Consumer Electronics, Low-Power Wireless Sensor Networks, Energy Harvesting Devices, Industrial Sensor Modules, Smart Home Edge Devices.
Battery-Powered IoT Sensor Nodes
The PIC24F32KA304-I/ML's XLP technology and 32 KB Flash make it well-suited for battery-powered IoT sensor nodes operating from coin cells or 2xAA batteries. The 32 MHz CPU speed supports on-device sensor data processing and edge analytics, while deep-sleep currents below 1 uA extend battery life to years. Place decoupling capacitors (100 nF + 10 uF) close to the VDD pins, and configure unused I/O as outputs to minimize quiescent draw.
Recomendado
Wearable Health Monitors
The PIC24F32KA304-I/ML's compact 44-QFN (8x8 mm) package and XLP features are ideal for wearable health monitors such as fitness bands, smartwatches, and continuous glucose monitors. The 32 KB Flash accommodates BLE stack firmware and sensor processing algorithms, while 17 I/O pins support multiple sensor interfaces (accelerometer, heart rate, SpO2). The 1.8V to 3.6V VDD range is compatible with single-cell lithium-ion battery systems.
Recomendado
Remote Controls and Consumer Electronics
The PIC24F32KA304-I/ML supports remote control applications including TV remotes, smart home controllers, and wireless keyboard receivers. Its 32 MHz speed handles IR protocol encoding/decoding and RF communication stacks, while XLP deep-sleep modes preserve battery life over years of standby. The integrated peripherals (UART, SPI, I2C) interface directly with RF transceivers and IR LED drivers without external glue logic.
Recomendado
Low-Power Wireless Sensor Networks
The PIC24F32KA304-I/ML is well-suited for wireless sensor network end nodes using protocols like Zigbee, LoRa, or proprietary Sub-GHz. The 32 KB Flash fits networking protocol stacks, while 32 MHz CPU processes sensor data before transmission. Combined with nanoWatt XLP sleep modes, end nodes can operate for 5-10 years on a single battery, per Microchip's typical XLP application examples.
Recomendado
Energy Harvesting Devices
The PIC24F32KA304-I/ML's ultra-low deep-sleep current and 1.8V minimum VDD are ideal for energy harvesting applications including self-powered wireless switches, solar-powered environmental sensors, and vibration-energy nodes. The device operates from harvested sources down to 1.8V, while deep-sleep with RTCC running keeps total system current under 1 uA, ensuring reliable operation even with intermittent energy availability.
Recomendado
Industrial Sensor Modules
The PIC24F32KA304-I/ML's industrial temperature grade (-40C to +85C) and robust 16-bit architecture suit industrial sensor modules for process control, HVAC monitoring, and factory automation. The 12-bit ADC with 200 ksps handles analog sensor inputs (4-20 mA loops, thermistors, pressure transducers), while XLP modes reduce thermal dissipation in sealed enclosures. The 44-QFN package fits within compact DIN-rail or panel-mount form factors.
Recomendado
Smart Home Edge Devices
The PIC24F32KA304-I/ML fits smart home edge devices including smart door locks, occupancy sensors, and HVAC controllers. Its 32 KB Flash stores Zigbee or Thread protocol stacks plus application firmware, while the 32 MHz CPU handles on-device processing to reduce cloud round-trips. The peripheral pin select (PPS) feature allows flexible routing of UART/SPI/I2C to physical pins, simplifying PCB layout for compact smart home form factors.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24F32KA304-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24F32KA304-E/ML | PIC24FV32KA304-I/ML | PIC24F32KA302-I/ML | PIC24F16KA304-I/ML | PIC24F32KA301-I/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Flash Memory | 32 KB | 32 KB | 32 KB | 32 KB | 16 KB | 32 KB |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.0 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| 5V Tolerant I/O | No | No | Yes | No | No | No |
| CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Temperature | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| I/O Pins | 17 | 17 | 17 | 14 | 17 | 13 |
| XLP Technology | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Wide operating voltage range with 5V-tolerant option (vs PIC24F32KA304-E/ML)
- Higher memory density in same QFN package (vs PIC24F16KA304-I/ML)
- Maximum I/O count in 44-QFN family (vs PIC24F32KA301-I/ML)
Notas de projeto
Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD pin (multiple VDD pins on the 44-QFN package). Add a single 10 uF bulk capacitor near the device for transient load handling. For battery-powered designs, configure unused I/O pins as outputs low to minimize quiescent current, and use Sleep mode aggressively between sensor readings to leverage XLP technology's sub-1 uA deep-sleep currents.
The 44-QFN (8x8 mm) package has an exposed thermal pad (EP) on the underside that must be soldered to a PCB pad of at least equal size for mechanical reliability and thermal dissipation. Connect this EP to the ground plane through multiple thermal vias to improve heat spreading. Keep analog and digital traces separated, and route the OSC1/OSC2 traces short and symmetric to minimize EMI.
PIC24F device pins have a maximum voltage of 3.6V and are NOT 5V tolerant per the datasheet. Do not connect 5V signals directly to any I/O pin. For 5V systems, use the PIC24FV32KA304 variant (5V tolerant) or external level shifters. Also, ensure the MCLR pin (if present) is pulled high through a 10 kOhm resistor for normal operation; leaving it floating prevents code execution.
Estimated: At 32 MHz CPU clock and full peripheral operation, the device consumes approximately 15 mA. With the 44-QFN package thermal resistance of theta_JA around 28 C/W, the junction temperature rise is roughly 12C above ambient at full active load. No heatsink is needed for typical embedded applications, but ensure adequate PCB copper area under the EP for thermal relief in sealed enclosures.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified; for automotive applications consider PIC24F automotive-grade variants.