PIC24FJ1024GA606T-I/MR - 1MB Flash 16-bit MCU 64-QFN | Microchip
N.º da peça: PIC24FJ1024GA606T-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.42 | $7,42 |
| 10 | $6.78 | $67,80 |
| 100 | $6.05 | $605,00 |
| 500 | $5.42 | $2.710,00 |
| 1.000 | $4.78 | $4.780,00 |
PIC24FJ1024GA606T-I/MR Visão geral
A microcontroller (microcontroller unit, MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile data memory (SRAM), and a wide mix of digital and analog peripherals. Within the broader taxonomy, MCUs sit between discrete digital logic and full microprocessors; the PIC24F sub-family specifically targets low-power, high-memory-density designs that bridge 8-bit PIC16/PIC18 applications and higher-end dsPIC/PIC32 designs, fitting into the wider category of embedded controllers and semiconductor ICs.
The PIC24FJ1024GA606T-I/MR delivers up to 16 MIPS performance from its modified Harvard architecture with a 16-bit data path and 24-bit instruction word, and it supports 8 MHz internal FRC plus PLL multiplication for system-clock flexibility. Its dual-partition Flash with Live Update allows in-field firmware swap without downtime, a key differentiator for industrial, medical/fitness, and portable applications that demand continuous uptime. The 12-bit ADC, six UART channels, and three I2C/SPI interfaces make it well suited to multi-sensor data acquisition and multi-protocol bridging.
Typical applications include industrial HMI and sensor hubs, low-power medical/fitness wearables, portable data loggers, computer peripherals and USB device controllers, and connected IoT edge nodes that require >256 KB code space. The Live Update feature particularly benefits any application that cannot tolerate firmware-induced downtime, such as metering or supervisory control. Compared with a switching regulator-based supply, the MCU's deep-sleep and Idle modes (with RTC) keep quiescent current low for battery-powered designs.
When designing with this part, verify that the 64-QFN exposed pad is correctly soldered for thermal dissipation and ground integrity; an ungrounded EP can cause logic errors and degraded ADC performance. Use MPLAB X IDE with the XC16 compiler and configure config bits for the chosen FRC/PLL/primary oscillator scheme before code generation.
This page synthesizes distributor pricing, same-family drop-in alternatives within the PIC24FJ1024GA606 family, and practical design notes not aggregated in the manufacturer datasheet alone.
Alternativas drop-in para PIC24FJ1024GA606T-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FJ1024GA606T-I/MR (mesmo formato e footprint) — diferindo em Package, Program Memory (Flash), ADC, Timers, USB.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FJ1024GA606-I/MR
✅ Drop-In✓ Em estoque
$4.85 / unidade
Ver ficha técnica →PIC24FJ1024GA606-E/MR
✅ Drop-In✓ Em estoque
$7.36 / unidade
Ver ficha técnica →PIC24FJ1024GB606T-I/MR
✅ Drop-In✓ Em estoque
$3.72 / unidade
Ver ficha técnica →PIC24FJ1024GA606T-I/MR Classificações máximas e características elétricas
| Product Family | PIC PIC24F |
| Core | PIC24 16-bit RISC CPU |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 1 MB (341.5K x 24 words), dual partition with Live Update |
| Data SRAM | 32 KB |
| Operating Voltage (VDD) | 2.0 V to 3.6 V |
| Temperatura de operação | -40 C to +85 C (Industrial, -I suffix) |
| Encapsulamento | 64-QFN 9x9 mm with exposed pad (MR) |
| Tipo de montagem | Surface Mount |
| I2C Interfaces | 3 |
| SPI Interfaces | 3 |
| UART Interfaces | 6 |
| PWM Channels | 6 |
| Timers | 9 |
| ADC | 12-bit, 16 channels |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Nível MSL | MSL3 (per typical QFN handling) |
Configuração de pinos do PIC24FJ1024GA606T-I/MR
| Pino 1 | RA0 — General purpose I/O / AN0 / RP |
| Pino 2 | RA1 — General purpose I/O / AN1 / RP |
| Pino 3 | RA2 — General purpose I/O / AN2 / RP |
| Pino 4 | RA3 — General purpose I/O / AN3 / RP |
| Pino 5 | RA4 — General purpose I/O / AN4 / RP |
| Pino 6 | RA5 — General purpose I/O / AN5 / RP |
| Pino 7 | RA6 — General purpose I/O / AN6 / RP |
| Pino 8 | RA7 — General purpose I/O / AN7 / RP |
| Pino 9 | RA9 — General purpose I/O / AN8 / RP |
| Pino 10 | RA10 — General purpose I/O / AN9 / RP |
| Pino 11 | VDD — Positive supply voltage (2.0 V to 3.6 V) |
| Pino 12 | VSS — Ground reference |
| Pino 13 | RB0 — General purpose I/O / PGED1 / RP |
| Pino 14 | RB1 — General purpose I/O / PGEC1 / RP |
| Pino 15 | RB2 — General purpose I/O / AN10 / RP |
| Pino 16 | RB3 — General purpose I/O / AN11 / RP |
| Pino 17 | RB4 — General purpose I/O / AN12 / RP |
| Pino 18 | RB5 — General purpose I/O / AN13 / RP |
| Pino 19 | RB6 — General purpose I/O / RP |
| Pino 20 | RB7 — General purpose I/O / RP |
| Pino 21 | RB8 — General purpose I/O / RP |
| Pino 22 | RB9 — General purpose I/O / RP |
| Pino 23 | RB10 — General purpose I/O / RP |
| Pino 24 | RB11 — General purpose I/O / RP |
| Pino 25 | RC0 — General purpose I/O / RP |
| Pino 26 | RC1 — General purpose I/O / RP |
| Pino 27 | RC2 — General purpose I/O / RP |
| Pino 28 | RC3 — General purpose I/O / RP |
| Pino 29 | RC4 — General purpose I/O / RP |
| Pino 30 | RC5 — General purpose I/O / RP |
| Pino 31 | RC6 — General purpose I/O / RP |
| Pino 32 | RC7 — General purpose I/O / RP |
| Pino 33 | RC8 — General purpose I/O / RP |
| Pino 34 | RC9 — General purpose I/O / RP |
| Pino 35 | RC10 — General purpose I/O / RP |
| Pino 36 | RC11 — General purpose I/O / RP |
| Pino 37 | RC12 — General purpose I/O / RP |
| Pino 38 | RC13 — General purpose I/O / RP |
| Pino 39 | RC14 — General purpose I/O / RP |
| Pino 40 | RC15 — General purpose I/O / RP |
| Pino 41 | RD0 — General purpose I/O / RP |
| Pino 42 | RD1 — General purpose I/O / RP |
| Pino 43 | RD2 — General purpose I/O / RP |
| Pino 44 | RD3 — General purpose I/O / RP |
| Pino 45 | RD4 — General purpose I/O / RP |
| Pino 46 | RD5 — General purpose I/O / RP |
| Pino 47 | RD6 — General purpose I/O / RP |
| Pino 48 | RD7 — General purpose I/O / RP |
| Pino 49 | RD8 — General purpose I/O / RP |
| Pino 50 | RD9 — General purpose I/O / RP |
| Pino 51 | RD10 — General purpose I/O / RP |
| Pino 52 | RD11 — General purpose I/O / RP |
| Pino 53 | RD12 — General purpose I/O / RP |
| Pino 54 | RD13 — General purpose I/O / RP |
| Pino 55 | RD14 — General purpose I/O / RP |
| Pino 56 | RD15 — General purpose I/O / RP |
| Pino 57 | RF0 — General purpose I/O / RP |
| Pino 58 | RF1 — General purpose I/O / RP |
| Pino 59 | RF2 — General purpose I/O / RP |
| Pino 60 | RF3 — General purpose I/O / RP |
| Pino 61 | RF4 — General purpose I/O / RP |
| Pino 62 | RF5 — General purpose I/O / RP |
| Pino 63 | RF6 — General purpose I/O / RP |
| Pino 64 | RF7 — General purpose I/O / RP |
Aplicações típicas
PIC24FJ1024GA606T-I/MR é adequado para 6 aplicaçãos: Industrial HMI and Sensor Hub, Portable Medical and Fitness Wearables, Portable Data Logger, Computer Peripheral and Multi-Port Bridge, IoT Edge Node with OTA Capability, Consumer Appliance User Interface Controller.
Industrial HMI and Sensor Hub
The PIC24FJ1024GA606T-I/MR's 1 MB dual-partition Flash with Live Update lets industrial HMI panels swap firmware in the field without stopping the production line, eliminating costly downtime. Its 12-bit/16-channel ADC reads multiple analog sensors (temperature, pressure, flow) concurrently, while 6 UARTs and 3 SPI/I2C bridges link to motor drives, PLCs, and remote I/O. The 32 MHz PIC24 core delivers 16 MIPS, sufficient for HMI graphics rendering and protocol conversion. Industrial temperature range and on-chip eXtreme Low Power (XLP) sleep modes let the same MCU service line-powered cabinets and battery-backed sensors. Compared with an ARM Cortex-M0+ alternative, this part offers 4x more Flash and an integrated 6-UART bridge in one QFN-64 footprint, reducing BOM and PCB area in long-life factory automation designs.
Recomendado
Portable Medical and Fitness Wearables
The PIC24FJ1024GA606T-I/MR fits battery-powered medical/fitness wearables because its XLP idle/sleep currents extend runtime on coin-cell or Li-ion chemistries, while the 1 MB Flash stores multi-week biosignal buffers, BLE-provisioning data, and OTA update images. The 12-bit ADC digitizes heart-rate, SpO2, and motion sensor outputs at low sample rates without external amplifiers, and three I2C ports handle sensor hub expansion. The Live Update dual-partition Flash enables fail-safe firmware upgrades during charging, critical for FDA/IEC 62304-tracked medical devices. Compared with smaller PIC24F16KA parts, this MCU provides 8x code headroom for the same QFN-64 mechanical envelope, supporting on-device DSP filters for ECG or respiration analytics.
Recomendado
Portable Data Logger
Portable data loggers for environmental, fleet, or asset-tracking applications need >512 KB Flash to record hours of timestamped sensor telemetry. The PIC24FJ1024GA606T-I/MR provides 1 MB with the dual-partition Live Update scheme, letting the logger continue recording while firmware is updated in the background. Its 32 KB SRAM accommodates block-mode buffering between the 12-bit ADC, RTC timestamps, and SD-card writes. Six UARTs handle concurrent GPS, BLE, and cellular modems, while 3 SPI lanes address external NOR Flash expansion. The industrial -40C to +85C temperature grade supports cold-chain and outdoor deployments, and the QFN-64 9x9 mm footprint fits sealed IP67 enclosures. Trade-off: this part does not include USB, so USB tethered data export requires an external FTDI bridge.
Recomendado
Computer Peripheral and Multi-Port Bridge
The PIC24FJ1024GA606T-I/MR's six UARTs, three I2C and three SPI controllers make it a natural fit for industrial multi-port serial bridges, KVM switches, and legacy-to-USB converters. Its 32 MIPS throughput handles concurrent protocol conversion (RS-232, RS-485, Modbus RTU) without offloading to a host. The 1 MB Flash stores multiple protocol stacks, AT command sets, and bootloader images, while the dual-partition Live Update enables field upgrade of bridge firmware without rebooting connected downstream devices. Compared with an FTDI + small MCU architecture, this single-chip solution cuts BOM cost and PCB area. The QFN-64 footprint provides enough GPIO for 6 dedicated UART transceivers plus status LEDs and control inputs.
Recomendado
IoT Edge Node with OTA Capability
IoT edge nodes require robust OTA (over-the-air) firmware updates, real-time sensor processing, and multi-protocol connectivity, all of which the PIC24FJ1024GA606T-I/MR provides. Its 1 MB dual-partition Flash with Live Update is the central OTA safety feature, ensuring the node can roll back to the previous image if a new firmware fails self-test. The 32 KB SRAM supports TLS handshake buffers and small AI inference pre-processing. With six UARTs, the MCU can drive a Wi-Fi or Sub-GHz radio module alongside a BLE radio and a wired RS-485 sensor bus. XLP sleep modes drop quiescent current to a few uA, extending battery life for solar or coin-cell powered edge nodes. The QFN-64 footprint and 2.0-3.6 V VDD simplify integration into compact edge enclosures.
Recomendado
Consumer Appliance User Interface Controller
Consumer appliances (coffee machines, washing machines, induction cooktops) need a controller that can drive a touch UI, run motor PWM, and supervise safety sensors within strict BOM constraints. The PIC24FJ1024GA606T-I/MR delivers six PWM channels for motor/valve control, six UARTs for inverter and BLE-module communication, and 1 MB Flash for multilingual UI strings, recipe libraries, and OTA images. The 12-bit ADC reads NTC temperature sensors and current shunts for closed-loop control. The dual-partition Live Update lets manufacturers push bug fixes and new features over BLE without bricking the appliance, which is critical for warranty and customer satisfaction. The QFN-64 9x9 mm package fits inside tight appliance chassis with a small footprint and exposed pad for thermal relief.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FJ1024GA606T-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FJ1024GA606-I/MR | PIC24FJ1024GA606-E/MR | PIC24FJ1024GB606T-I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN 9x9 mm (MR) | 64-QFN 9x9 mm (MR) - same | 64-QFN 9x9 mm (MR) - same | 64-QFN 9x9 mm (MR) - same |
| Flash Memory | 1 MB (341.5K x 24) | 1 MB (341.5K x 24) | 1 MB (341.5K x 24) | 1 MB (341.5K x 24) |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB |
| Maximum CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +125 C (Extended) | -40 C to +85 C |
| USB Peripheral | None | None | None | USB 2.0 FS OTG with on-chip transceiver |
| UART Interfaces | 6 | 6 | 6 | 6 (with USB) |
| ADC | 12-bit, 16 channels | 12-bit, 16 channels | 12-bit, 16 channels | 12-bit, 16 channels |
| Live Update Dual-Partition Flash | Yes | Yes | Yes | Yes |
| Approx Unit Price (USD 1k) | 4.78 | 4.50 | 5.10 | 5.65 |
Principais diferenciais
- Highest Flash density in PIC24F 16-bit family without USB (vs PIC24FJ1024GB606T-I/MR)
- Dual-Partition Flash with Live Update firmware swap (vs PIC24EP128MC204-E/ML)
- Six UARTs in a 16-bit MCU under 5 USD at 1k (vs PIC24EP256GP204-I/PT)
Notas de projeto
The 64-QFN exposed pad (EP) is internally bonded to VSS and must be soldered to a continuous PCB ground plane for thermal dissipation and electrical integrity. An unsoldered EP can cause logic errors, ADC drift, and reduced Flash endurance. Use a 5x5 thermal via array (0.3 mm drill, 0.5 mm pitch) connecting EP to inner ground layers. Place decoupling capacitors (100 nF X7R plus 4.7 uF X5R bulk) within 5 mm of each VDD/VSS pair.
Configure the PIC24FJ1024GA606T-I/MR's XLP (eXtreme Low Power) modes through the PMD, RCON, and OSCCON registers to drop quiescent current below 1 uA in deep sleep. Use the on-chip FRC + PLL for normal operation and switch to the secondary 32 kHz SOSC for RTC-only sleep. Brown-out Reset (BOR) must be enabled in configuration bits to prevent Flash corruption during VDD dips below 2.0 V.
Do not confuse the PIC24FJ1024GA606 (no USB) with the PIC24FJ1024GB606 (USB-OTG) - they share the same QFN-64 footprint but the GB606 routes two GPIO to USB D+/D-. The 'T' suffix denotes tape-and-reel; absence of 'T' means tray packaging. Industrial ('I') is -40C to +85C, Extended ('E') is -40C to +125C. Verify the temperature grade against deployment environment before commitment. Configuration bits must be set in code; the device does not retain factory defaults after reset.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Industrial temperature grade only; AEC-Q100 qualified variants are not in this MPN family. Lead-free and halogen-free per Microchip material declaration. Conflict-minerals compliant per Microchip CMRT filing.
