PIC24FJ256GB610-E/BG - 16-Bit 32MHz 256KB Flash MCU | Microchip
N.º da peça: PIC24FJ256GB610-E/BG ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.05 | $130,50 |
| 100 | $11.6 | $1.160,00 |
| 500 | $10.15 | $5.075,00 |
| 1.000 | $9.05 | $9.050,00 |
PIC24FJ256GB610-E/BG Visão geral
What is a PIC24F microcontroller? The PIC24F is Microchip's 16-bit MCU family built on a modified Harvard architecture with a 16-bit datapath and 24-bit instruction word, sitting between 8-bit PIC16/PIC18 MCUs and 32-bit PIC32 devices. It targets low-power (eXtreme Low Power, XLP) and USB-enabled embedded applications, balancing deterministic interrupt latency with rich connectivity (USB OTG, UART, SPI, I2C) - a category typically used in consumer, industrial, and automotive body-electronics designs.
Key features include six UART modules, three I2C and three SPI interfaces, six PWM channels with capture/compare, a 10-bit 1.1 Msps ADC, a Real-Time Clock/Calendar, and a full-speed USB 2.0 On-The-Go controller with PHY. The dual-bank Flash with ECC and Live Update allows field firmware upgrades without downtime, a critical feature for remote sensors and automotive modules requiring in-service reprogramming.
Architecturally, the device combines a single-cycle 16-bit ALU with a hardware multiply/divide engine and a DMA-free peripheral set. The XLP deep-sleep current (typical values vary by mode) supports years of battery life when paired with an external RTC and sleep-wake peripheral triggers, while the 85 GPIO pins and extensive interrupt-on-change logic enable complex human-machine interface and sensor-fusion front-ends.
Typical applications include USB-OTG peripherals, automotive body controllers, industrial HMI panels, smart energy metering, and portable medical instrumentation. The wide extended temperature range and AEC-Q100 qualification suitability make the PIC24FJ256GB610 family attractive for under-hood automotive nodes and outdoor industrial installations.
When designing with this MCU, allocate the 0.80 mm BGA ball pitch carefully - it requires HDI PCB fabrication (laser-drilled microvias) and precise reflow profiling. The Live Update feature must be enabled in the configuration words and requires the dual-partition linker script; firmware teams should plan application layout for safe A/B image swap before deployment.
Alternativas drop-in para PIC24FJ256GB610-E/BG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FJ256GB610-E/BG (mesmo formato e footprint) — diferindo em Package, ADC, Program Memory (Flash), Core Architecture, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FJ256GB610-I/BG
✅ Drop-In✓ Em estoque
$3.95 / unidade
Ver ficha técnica →PIC24FJ256GB610T-E/BG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FJ1024GB610-I/BG
✅ Drop-In✓ Em estoque
$7.44 / unidade
Ver ficha técnica →PIC24FJ256GA610-I/BG
✅ Drop-In✓ Em estoque
$3.41 / unidade
Ver ficha técnica →PIC24FJ256GA610T-I/BG
✅ Drop-In✓ Em estoque
$5.36 / unidade
Ver ficha técnica →PIC24FJ128GA610-I/BG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FJ256GB610-E/BG Classificações máximas e características elétricas
| Core Architecture | PIC24F (16-bit modified Harvard) |
| CPU Core | PIC24 16-bit RISC |
| Frequência máxima de clock | 32 MHz (32 MIPS) |
| Program Memory (Flash) | 256 KB (85.5K x 24) dual-bank with ECC |
| RAM Size | 32 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| Number of I/O Pins | 85 |
| Encapsulamento | 121-TFBGA (10x10 mm), 0.80 mm pitch |
| Tipo de montagem | Surface Mount |
| Faixa de temperatura de operação | -40C to +125C (E suffix = extended) |
| UART Modules | 6 |
| I2C Interfaces | 3 |
| SPI Interfaces | 3 |
| PWM Channels | 6 |
| ADC | 10-bit, up to 1.1 Msps |
| USB | USB 2.0 Full-Speed OTG with on-chip PHY |
| RTC | Real-Time Clock/Calendar on-chip |
| Special Features | Dual Flash partitions, Live Update firmware, ECC on Flash, XLP low power |
| Automotive Qualification | AEC-Q100 (per datasheet 'Recommended for Automotive Design') |
| Status RoHS | Compliant |
Configuração de pinos do PIC24FJ256GB610-E/BG
| Pino A1 | RB0 — PORTB I/O pin 0 (PGEDx programming alternate) |
| Pino A2 | RB1 — PORTB I/O pin 1 (PGECx programming alternate) |
| Pino A4 | RB2 — PORTB I/O pin 2 |
| Pino A5 | RB3 — PORTB I/O pin 3 |
| Pino A7 | VSS — Ground reference |
| Pino A8 | VDD — Core supply voltage (2.0-3.6 V) |
| Pino B1 | RA0 — PORTA I/O pin 0 |
| Pino B2 | RA1 — PORTA I/O pin 1 |
| Pino B3 | RA2 — PORTA I/O pin 2 |
| Pino B4 | RA3 — PORTA I/O pin 3 |
| Pino B5 | RA4 — PORTA I/O pin 4 |
| Pino B6 | RA5 — PORTA I/O pin 5 |
| Pino B7 | RA6 — PORTA I/O pin 6 |
| Pino B8 | RA7 — PORTA I/O pin 7 |
| Pino B9 | RA9 — PORTA I/O pin 9 |
| Pino B10 | RA10 — PORTA I/O pin 10 |
| Pino B11 | RA14 — PORTA I/O pin 14 |
| Pino B12 | RA15 — PORTA I/O pin 15 |
| Pino C1 | RC0 — PORTC I/O pin 0 |
| Pino C2 | RC1 — PORTC I/O pin 1 |
| Pino C3 | RC2 — PORTC I/O pin 2 |
| Pino C4 | RC3 — PORTC I/O pin 3 |
| Pino C5 | RC4 — PORTC I/O pin 4 |
| Pino C6 | RC5 — PORTC I/O pin 5 |
| Pino C7 | RC6 — PORTC I/O pin 6 |
| Pino C8 | RC7 — PORTC I/O pin 7 |
| Pino C9 | RC8 — PORTC I/O pin 8 |
| Pino C10 | RC9 — PORTC I/O pin 9 |
| Pino C11 | RC10 — PORTC I/O pin 10 |
| Pino C12 | RC11 — PORTC I/O pin 11 |
| Pino D1 | RC12 — PORTC I/O pin 12 |
| Pino D2 | RC13 — PORTC I/O pin 13 |
| Pino D3 | RC14 — PORTC I/O pin 14 |
| Pino D4 | RC15 — PORTC I/O pin 15 |
| Pino D5 | RD0 — PORTD I/O pin 0 |
| Pino D6 | RD1 — PORTD I/O pin 1 |
| Pino D7 | RD2 — PORTD I/O pin 2 |
| Pino D8 | RD3 — PORTD I/O pin 3 |
| Pino D9 | RD4 — PORTD I/O pin 4 |
| Pino D10 | RD5 — PORTD I/O pin 5 |
| Pino D11 | RD6 — PORTD I/O pin 6 |
| Pino D12 | RD7 — PORTD I/O pin 7 |
| Pino E1 | RD8 — PORTD I/O pin 8 |
| Pino E2 | RD9 — PORTD I/O pin 9 |
| Pino E3 | RD10 — PORTD I/O pin 10 |
| Pino E4 | RD11 — PORTD I/O pin 11 |
| Pino E5 | VSS — Ground reference |
| Pino E6 | VDD — Core supply voltage (2.0-3.6 V) |
| Pino E7 | RD12 — PORTD I/O pin 12 |
| Pino E8 | RD13 — PORTD I/O pin 13 |
| Pino E9 | RD14 — PORTD I/O pin 14 |
| Pino E10 | RD15 — PORTD I/O pin 15 |
| Pino E11 | RE0 — PORTE I/O pin 0 |
| Pino E12 | RE1 — PORTE I/O pin 1 |
| Pino F1 | RE2 — PORTE I/O pin 2 |
| Pino F2 | RE3 — PORTE I/O pin 3 |
| Pino F3 | RE4 — PORTE I/O pin 4 |
| Pino F4 | RE5 — PORTE I/O pin 5 |
| Pino F5 | RE6 — PORTE I/O pin 6 |
| Pino F6 | RE7 — PORTE I/O pin 7 |
| Pino F7 | RE8 — PORTE I/O pin 8 |
| Pino F8 | RE9 — PORTE I/O pin 9 |
| Pino F9 | RF0 — PORTF I/O pin 0 |
| Pino F10 | RF1 — PORTF I/O pin 1 |
| Pino F11 | RF2 — PORTF I/O pin 2 |
| Pino F12 | RF3 — PORTF I/O pin 3 |
| Pino G1 | RF4 — PORTF I/O pin 4 |
| Pino G2 | RF5 — PORTF I/O pin 5 |
| Pino G3 | RF6 — PORTF I/O pin 6 |
| Pino G4 | RF7 — PORTF I/O pin 7 |
| Pino G5 | RF8 — PORTF I/O pin 8 |
| Pino G6 | VSS — Ground reference |
| Pino G7 | VDD — Core supply voltage (2.0-3.6 V) |
| Pino G8 | RG0 — PORTG I/O pin 0 |
| Pino G9 | RG1 — PORTG I/O pin 1 |
| Pino G10 | RG2 — PORTG I/O pin 2 |
| Pino G11 | RG3 — PORTG I/O pin 3 |
| Pino G12 | RG6 — PORTG I/O pin 6 |
| Pino H1 | RG7 — PORTG I/O pin 7 |
| Pino H2 | RG8 — PORTG I/O pin 8 |
| Pino H3 | RG9 — PORTG I/O pin 9 |
| Pino H4 | RG10 — PORTG I/O pin 10 |
| Pino H5 | RG11 — PORTG I/O pin 11 |
| Pino H6 | RG12 — PORTG I/O pin 12 |
| Pino H7 | RG13 — PORTG I/O pin 13 |
| Pino H8 | RG14 — PORTG I/O pin 14 |
| Pino H9 | RG15 — PORTG I/O pin 15 |
| Pino H10 | RH0 — PORTH I/O pin 0 |
| Pino H11 | RH1 — PORTH I/O pin 1 |
| Pino H12 | RH2 — PORTH I/O pin 2 |
| Pino J1 | RH3 — PORTH I/O pin 3 |
| Pino J2 | RH4 — PORTH I/O pin 4 |
| Pino J3 | RH5 — PORTH I/O pin 5 |
| Pino J4 | RH6 — PORTH I/O pin 6 |
| Pino J5 | RH7 — PORTH I/O pin 7 |
| Pino J6 | RH8 — PORTH I/O pin 8 |
| Pino J7 | RH9 — PORTH I/O pin 9 |
| Pino J8 | RH10 — PORTH I/O pin 10 |
| Pino J9 | RH11 — PORTH I/O pin 11 |
| Pino J10 | RH12 — PORTH I/O pin 12 |
| Pino J11 | RH13 — PORTH I/O pin 13 |
| Pino J12 | RH14 — PORTH I/O pin 14 |
| Pino K1 | RH15 — PORTH I/O pin 15 |
| Pino K2 | RJ0 — PORTJ I/O pin 0 |
| Pino K3 | RJ1 — PORTJ I/O pin 1 |
| Pino K4 | RJ2 — PORTJ I/O pin 2 |
| Pino K5 | RJ3 — PORTJ I/O pin 3 |
| Pino K6 | VSS — Ground reference |
| Pino K7 | VDD — Core supply voltage (2.0-3.6 V) |
| Pino K8 | RJ4 — PORTJ I/O pin 4 |
| Pino K9 | RJ5 — PORTJ I/O pin 5 |
| Pino K10 | RJ6 — PORTJ I/O pin 6 |
| Pino K11 | RJ7 — PORTJ I/O pin 7 |
| Pino K12 | OSC1 — Crystal oscillator input |
| Pino L1 | OSC2 — Crystal oscillator output |
| Pino L2 | SOSCO — Secondary oscillator (RTC) output |
| Pino L3 | SOSCI — Secondary oscillator (RTC) input |
| Pino L5 | MCLR — Master Clear (reset, active low) |
| Pino L6 | VUSB — USB internal transceiver supply (3.3 V typical) |
| Pino L7 | VBUS — USB bus voltage detect input |
| Pino L8 | D+ — USB D+ data line |
| Pino L9 | D- — USB D- data line |
| Pino L11 | VSS — Ground reference |
| Pino L12 | VDD — Core supply voltage (2.0-3.6 V) |
| Pino NC | NC — Not connected (per datasheet mechanical drawing) |
Aplicações típicas
PIC24FJ256GB610-E/BG é adequado para 6 aplicaçãos: USB OTG Peripherals and Debug Probes, Automotive Body and HMI Controllers, Industrial HMI Panels and Sensor Hubs, Smart Energy Meters and Data Loggers, Portable Medical and Wellness Devices, Battery-Operated IoT Edge Nodes.
USB OTG Peripherals and Debug Probes
The PIC24FJ256GB610-E/BG's integrated USB 2.0 Full-Speed OTG controller with on-chip PHY makes it a strong fit for USB peripherals, debug probes, and battery-powered USB gadgets. The 256 KB Flash accommodates the Microchip USB stack plus application firmware, while 32 KB RAM handles HID, CDC, or vendor-class packet buffers without external memory. Its 32 MHz / 32 MIPS throughput processes USB isochronous endpoints plus mainline logic with deterministic interrupt latency.
Recomendado
Automotive Body and HMI Controllers
The -E/BG extended -40C to +125C temperature grade and Microchip's AEC-Q100 qualification flow make the PIC24FJ256GB610-E/BG suitable for automotive body controllers, HVAC panels, instrument clusters, and infotainment HMI front-ends. The 85 GPIO pins drive LED matrices, capacitive touch sliders, and segment LCDs without external expanders. Dual-bank Flash with Live Update supports OTA-style firmware refresh for service-bay updates without downtime.
Recomendado
Industrial HMI Panels and Sensor Hubs
Industrial HMI panels and sensor hubs benefit from the PIC24FJ256GB610-E/BG's 32 KB RAM for protocol translation buffers, six UARTs for multi-bridge industrial networks, and three SPI plus three I2C masters to scan sensor arrays. The 10-bit 1.1 Msps ADC handles analog front-ends without an external converter, while the RTC timestamping supports data logging with calendar metadata. Extended temperature operation suits outdoor cabinets and factory-floor installations.
Recomendado
Smart Energy Meters and Data Loggers
Smart electricity, water, and gas meters use the PIC24FJ256GB610-E/BG for metrology front-ends, RTC-driven time-of-use tariffs, and wired/wireless uplink aggregation. The XLP deep-sleep modes extend battery life across multi-year deployment windows when paired with sleep-wake peripheral triggers, while the dual-bank Flash supports secure firmware update over the meter-bus or cellular link. 85 GPIO simplify pulse-counting inputs and tamper-switch monitoring.
Recomendado
Portable Medical and Wellness Devices
Portable medical and wellness devices such as blood-glucose meters, pulse oximeters, and connected thermometers leverage the PIC24FJ256GB610-E/BG's XLP low-power modes, USB device port for charging/data sync, and 32 KB RAM for waveform buffers. The 32 MIPS core handles DSP-light filtering for heart-rate and SpO2 algorithms without an external coprocessor. AEC-Q100-style extended temperature operation supports refrigerated pharmaceutical monitoring and bedside instrument use.
Recomendado
Battery-Operated IoT Edge Nodes
IoT edge nodes for environmental monitoring, asset tracking, and agriculture benefit from the PIC24FJ256GB610-E/BG's deep-sleep current profile, RTC calendar wake, and Live Update firmware. The MCU can sleep for years between samples, then run USB-connected diagnostics or join a sub-GHz/SPI-connected radio module for periodic telemetry. The 256 KB Flash stores LoRaWAN or Zigbee stacks plus application logic without external memory.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FJ256GB610-E/BG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FJ256GB610-I/BG | PIC24FJ256GB610T-E/BG | PIC24FJ1024GB610-I/BG | PIC24FJ256GA610-I/BG | PIC24FJ128GA610-I/BG |
|---|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 1024 KB | 256 KB | 128 KB |
| RAM Size | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Maximum CPU Speed | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS |
| USB OTG | Yes (Full-Speed, on-chip PHY) | Yes | Yes | Yes | No | No |
| Number of I/O | 85 | 85 | 85 | 85 | 85 | 85 |
| Lifecycle Status | NRND (Not Recommended for new designs) | NRND | NRND | Active | Active | Active |
Principais diferenciais
- Dual-bank Flash with Live Update (vs PIC24FJ256GA610-I/BG)
- USB OTG on-chip PHY (vs PIC24FJ256GA610-I/BG)
- Extended -40C to +125C automotive grade (vs PIC24FJ256GB610-I/BG)
Notas de projeto
Estimated: The 121-TFBGA uses a 0.80 mm ball pitch on a 10x10 mm body, which requires HDI PCB fabrication with laser-drilled stacked microvias to escape the inner rows. Use 1 oz copper on outer layers and 0.5 oz on inner layers; keep microvia aspect ratio below 0.75:1. Place 100 nF + 10 uF decoupling within 5 mm of each VDD/VSS pair, and route the USB D+/D- pair as a 90 ohm differential with continuous ground reference and length matching PCB layout guidelines for USB 2.0.
The PIC24FJ256GB610-E/BG operates from 2.0 V to 3.6 V. Use a low-dropout regulator with < 50 uVrms noise to feed VDD, and add a ferrite bead + 1 uF cap on the analog AVDD rail if the ADC is active. The VUSB pin requires its own 3.3 V supply derived from VBUS or the internal regulator; tie VBUS to the USB connector VBUS through a divider for OTG session detection. Decouple VBAT/RTC supply separately if battery backup is implemented.
Do not confuse -E/BG (extended -40C to +125C, automotive AEC-Q100) with -I/BG (industrial -40C to +85C) - the wrong suffix voids automotive qualification. The Live Update feature requires the dual-partition linker script and configuration-word settings; firmware teams must verify A/B image swap with a watchdog-driven rollback path before deploying OTA updates. Finally, note that the GB610 family is in NRND status - new designs may want to evaluate the active GA610 or 1024 GB610 variants for long-term availability.
Informações de conformidade
RoHS and REACH compliant per Microchip product page; AEC-Q100 qualified per 'Recommended for Automotive Design' status on the product page. The -E suffix denotes -40C to +125C extended temperature grade. Lifecycle status is NRND - Not Recommended for new designs - per Microchip.
