PIC24FJ256GB610-E/BG - 16-Bit 32MHz 256KB Flash MCU | Microchip
Référence : PIC24FJ256GB610-E/BG ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.05 | $130,50 |
| 100 | $11.6 | $1 160,00 |
| 500 | $10.15 | $5 075,00 |
| 1 000 | $9.05 | $9 050,00 |
PIC24FJ256GB610-E/BG Présentation
What is a PIC24F microcontroller? The PIC24F is Microchip's 16-bit MCU family built on a modified Harvard architecture with a 16-bit datapath and 24-bit instruction word, sitting between 8-bit PIC16/PIC18 MCUs and 32-bit PIC32 devices. It targets low-power (eXtreme Low Power, XLP) and USB-enabled embedded applications, balancing deterministic interrupt latency with rich connectivity (USB OTG, UART, SPI, I2C) - a category typically used in consumer, industrial, and automotive body-electronics designs.
Key features include six UART modules, three I2C and three SPI interfaces, six PWM channels with capture/compare, a 10-bit 1.1 Msps ADC, a Real-Time Clock/Calendar, and a full-speed USB 2.0 On-The-Go controller with PHY. The dual-bank Flash with ECC and Live Update allows field firmware upgrades without downtime, a critical feature for remote sensors and automotive modules requiring in-service reprogramming.
Architecturally, the device combines a single-cycle 16-bit ALU with a hardware multiply/divide engine and a DMA-free peripheral set. The XLP deep-sleep current (typical values vary by mode) supports years of battery life when paired with an external RTC and sleep-wake peripheral triggers, while the 85 GPIO pins and extensive interrupt-on-change logic enable complex human-machine interface and sensor-fusion front-ends.
Typical applications include USB-OTG peripherals, automotive body controllers, industrial HMI panels, smart energy metering, and portable medical instrumentation. The wide extended temperature range and AEC-Q100 qualification suitability make the PIC24FJ256GB610 family attractive for under-hood automotive nodes and outdoor industrial installations.
When designing with this MCU, allocate the 0.80 mm BGA ball pitch carefully - it requires HDI PCB fabrication (laser-drilled microvias) and precise reflow profiling. The Live Update feature must be enabled in the configuration words and requires the dual-partition linker script; firmware teams should plan application layout for safe A/B image swap before deployment.
Alternatives de remplacement direct pour PIC24FJ256GB610-E/BG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ256GB610-E/BG (même facteur de forme et même empreinte) — différant par Package, ADC, Program Memory (Flash), Core Architecture, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ256GB610-I/BG
✅ Remplacement direct✓ En stock
$3.95 / unité
Voir la fiche technique →PIC24FJ256GB610T-E/BG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ1024GB610-I/BG
✅ Remplacement direct✓ En stock
$7.44 / unité
Voir la fiche technique →PIC24FJ256GA610-I/BG
✅ Remplacement direct✓ En stock
$3.41 / unité
Voir la fiche technique →PIC24FJ256GA610T-I/BG
✅ Remplacement direct✓ En stock
$5.36 / unité
Voir la fiche technique →PIC24FJ128GA610-I/BG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ256GB610-E/BG Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC24F (16-bit modified Harvard) |
| CPU Core | PIC24 16-bit RISC |
| Fréquence d'horloge maximale | 32 MHz (32 MIPS) |
| Program Memory (Flash) | 256 KB (85.5K x 24) dual-bank with ECC |
| RAM Size | 32 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| Number of I/O Pins | 85 |
| Boîtier | 121-TFBGA (10x10 mm), 0.80 mm pitch |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40C to +125C (E suffix = extended) |
| UART Modules | 6 |
| I2C Interfaces | 3 |
| SPI Interfaces | 3 |
| PWM Channels | 6 |
| ADC | 10-bit, up to 1.1 Msps |
| USB | USB 2.0 Full-Speed OTG with on-chip PHY |
| RTC | Real-Time Clock/Calendar on-chip |
| Special Features | Dual Flash partitions, Live Update firmware, ECC on Flash, XLP low power |
| Automotive Qualification | AEC-Q100 (per datasheet 'Recommended for Automotive Design') |
| Statut RoHS | Compliant |
Configuration des broches de PIC24FJ256GB610-E/BG
| Broche A1 | RB0 — PORTB I/O pin 0 (PGEDx programming alternate) |
| Broche A2 | RB1 — PORTB I/O pin 1 (PGECx programming alternate) |
| Broche A4 | RB2 — PORTB I/O pin 2 |
| Broche A5 | RB3 — PORTB I/O pin 3 |
| Broche A7 | VSS — Ground reference |
| Broche A8 | VDD — Core supply voltage (2.0-3.6 V) |
| Broche B1 | RA0 — PORTA I/O pin 0 |
| Broche B2 | RA1 — PORTA I/O pin 1 |
| Broche B3 | RA2 — PORTA I/O pin 2 |
| Broche B4 | RA3 — PORTA I/O pin 3 |
| Broche B5 | RA4 — PORTA I/O pin 4 |
| Broche B6 | RA5 — PORTA I/O pin 5 |
| Broche B7 | RA6 — PORTA I/O pin 6 |
| Broche B8 | RA7 — PORTA I/O pin 7 |
| Broche B9 | RA9 — PORTA I/O pin 9 |
| Broche B10 | RA10 — PORTA I/O pin 10 |
| Broche B11 | RA14 — PORTA I/O pin 14 |
| Broche B12 | RA15 — PORTA I/O pin 15 |
| Broche C1 | RC0 — PORTC I/O pin 0 |
| Broche C2 | RC1 — PORTC I/O pin 1 |
| Broche C3 | RC2 — PORTC I/O pin 2 |
| Broche C4 | RC3 — PORTC I/O pin 3 |
| Broche C5 | RC4 — PORTC I/O pin 4 |
| Broche C6 | RC5 — PORTC I/O pin 5 |
| Broche C7 | RC6 — PORTC I/O pin 6 |
| Broche C8 | RC7 — PORTC I/O pin 7 |
| Broche C9 | RC8 — PORTC I/O pin 8 |
| Broche C10 | RC9 — PORTC I/O pin 9 |
| Broche C11 | RC10 — PORTC I/O pin 10 |
| Broche C12 | RC11 — PORTC I/O pin 11 |
| Broche D1 | RC12 — PORTC I/O pin 12 |
| Broche D2 | RC13 — PORTC I/O pin 13 |
| Broche D3 | RC14 — PORTC I/O pin 14 |
| Broche D4 | RC15 — PORTC I/O pin 15 |
| Broche D5 | RD0 — PORTD I/O pin 0 |
| Broche D6 | RD1 — PORTD I/O pin 1 |
| Broche D7 | RD2 — PORTD I/O pin 2 |
| Broche D8 | RD3 — PORTD I/O pin 3 |
| Broche D9 | RD4 — PORTD I/O pin 4 |
| Broche D10 | RD5 — PORTD I/O pin 5 |
| Broche D11 | RD6 — PORTD I/O pin 6 |
| Broche D12 | RD7 — PORTD I/O pin 7 |
| Broche E1 | RD8 — PORTD I/O pin 8 |
| Broche E2 | RD9 — PORTD I/O pin 9 |
| Broche E3 | RD10 — PORTD I/O pin 10 |
| Broche E4 | RD11 — PORTD I/O pin 11 |
| Broche E5 | VSS — Ground reference |
| Broche E6 | VDD — Core supply voltage (2.0-3.6 V) |
| Broche E7 | RD12 — PORTD I/O pin 12 |
| Broche E8 | RD13 — PORTD I/O pin 13 |
| Broche E9 | RD14 — PORTD I/O pin 14 |
| Broche E10 | RD15 — PORTD I/O pin 15 |
| Broche E11 | RE0 — PORTE I/O pin 0 |
| Broche E12 | RE1 — PORTE I/O pin 1 |
| Broche F1 | RE2 — PORTE I/O pin 2 |
| Broche F2 | RE3 — PORTE I/O pin 3 |
| Broche F3 | RE4 — PORTE I/O pin 4 |
| Broche F4 | RE5 — PORTE I/O pin 5 |
| Broche F5 | RE6 — PORTE I/O pin 6 |
| Broche F6 | RE7 — PORTE I/O pin 7 |
| Broche F7 | RE8 — PORTE I/O pin 8 |
| Broche F8 | RE9 — PORTE I/O pin 9 |
| Broche F9 | RF0 — PORTF I/O pin 0 |
| Broche F10 | RF1 — PORTF I/O pin 1 |
| Broche F11 | RF2 — PORTF I/O pin 2 |
| Broche F12 | RF3 — PORTF I/O pin 3 |
| Broche G1 | RF4 — PORTF I/O pin 4 |
| Broche G2 | RF5 — PORTF I/O pin 5 |
| Broche G3 | RF6 — PORTF I/O pin 6 |
| Broche G4 | RF7 — PORTF I/O pin 7 |
| Broche G5 | RF8 — PORTF I/O pin 8 |
| Broche G6 | VSS — Ground reference |
| Broche G7 | VDD — Core supply voltage (2.0-3.6 V) |
| Broche G8 | RG0 — PORTG I/O pin 0 |
| Broche G9 | RG1 — PORTG I/O pin 1 |
| Broche G10 | RG2 — PORTG I/O pin 2 |
| Broche G11 | RG3 — PORTG I/O pin 3 |
| Broche G12 | RG6 — PORTG I/O pin 6 |
| Broche H1 | RG7 — PORTG I/O pin 7 |
| Broche H2 | RG8 — PORTG I/O pin 8 |
| Broche H3 | RG9 — PORTG I/O pin 9 |
| Broche H4 | RG10 — PORTG I/O pin 10 |
| Broche H5 | RG11 — PORTG I/O pin 11 |
| Broche H6 | RG12 — PORTG I/O pin 12 |
| Broche H7 | RG13 — PORTG I/O pin 13 |
| Broche H8 | RG14 — PORTG I/O pin 14 |
| Broche H9 | RG15 — PORTG I/O pin 15 |
| Broche H10 | RH0 — PORTH I/O pin 0 |
| Broche H11 | RH1 — PORTH I/O pin 1 |
| Broche H12 | RH2 — PORTH I/O pin 2 |
| Broche J1 | RH3 — PORTH I/O pin 3 |
| Broche J2 | RH4 — PORTH I/O pin 4 |
| Broche J3 | RH5 — PORTH I/O pin 5 |
| Broche J4 | RH6 — PORTH I/O pin 6 |
| Broche J5 | RH7 — PORTH I/O pin 7 |
| Broche J6 | RH8 — PORTH I/O pin 8 |
| Broche J7 | RH9 — PORTH I/O pin 9 |
| Broche J8 | RH10 — PORTH I/O pin 10 |
| Broche J9 | RH11 — PORTH I/O pin 11 |
| Broche J10 | RH12 — PORTH I/O pin 12 |
| Broche J11 | RH13 — PORTH I/O pin 13 |
| Broche J12 | RH14 — PORTH I/O pin 14 |
| Broche K1 | RH15 — PORTH I/O pin 15 |
| Broche K2 | RJ0 — PORTJ I/O pin 0 |
| Broche K3 | RJ1 — PORTJ I/O pin 1 |
| Broche K4 | RJ2 — PORTJ I/O pin 2 |
| Broche K5 | RJ3 — PORTJ I/O pin 3 |
| Broche K6 | VSS — Ground reference |
| Broche K7 | VDD — Core supply voltage (2.0-3.6 V) |
| Broche K8 | RJ4 — PORTJ I/O pin 4 |
| Broche K9 | RJ5 — PORTJ I/O pin 5 |
| Broche K10 | RJ6 — PORTJ I/O pin 6 |
| Broche K11 | RJ7 — PORTJ I/O pin 7 |
| Broche K12 | OSC1 — Crystal oscillator input |
| Broche L1 | OSC2 — Crystal oscillator output |
| Broche L2 | SOSCO — Secondary oscillator (RTC) output |
| Broche L3 | SOSCI — Secondary oscillator (RTC) input |
| Broche L5 | MCLR — Master Clear (reset, active low) |
| Broche L6 | VUSB — USB internal transceiver supply (3.3 V typical) |
| Broche L7 | VBUS — USB bus voltage detect input |
| Broche L8 | D+ — USB D+ data line |
| Broche L9 | D- — USB D- data line |
| Broche L11 | VSS — Ground reference |
| Broche L12 | VDD — Core supply voltage (2.0-3.6 V) |
| Broche NC | NC — Not connected (per datasheet mechanical drawing) |
Applications typiques
PIC24FJ256GB610-E/BG convient pour 6 applications: USB OTG Peripherals and Debug Probes, Automotive Body and HMI Controllers, Industrial HMI Panels and Sensor Hubs, Smart Energy Meters and Data Loggers, Portable Medical and Wellness Devices, Battery-Operated IoT Edge Nodes.
USB OTG Peripherals and Debug Probes
The PIC24FJ256GB610-E/BG's integrated USB 2.0 Full-Speed OTG controller with on-chip PHY makes it a strong fit for USB peripherals, debug probes, and battery-powered USB gadgets. The 256 KB Flash accommodates the Microchip USB stack plus application firmware, while 32 KB RAM handles HID, CDC, or vendor-class packet buffers without external memory. Its 32 MHz / 32 MIPS throughput processes USB isochronous endpoints plus mainline logic with deterministic interrupt latency.
Recommandé
Automotive Body and HMI Controllers
The -E/BG extended -40C to +125C temperature grade and Microchip's AEC-Q100 qualification flow make the PIC24FJ256GB610-E/BG suitable for automotive body controllers, HVAC panels, instrument clusters, and infotainment HMI front-ends. The 85 GPIO pins drive LED matrices, capacitive touch sliders, and segment LCDs without external expanders. Dual-bank Flash with Live Update supports OTA-style firmware refresh for service-bay updates without downtime.
Recommandé
Industrial HMI Panels and Sensor Hubs
Industrial HMI panels and sensor hubs benefit from the PIC24FJ256GB610-E/BG's 32 KB RAM for protocol translation buffers, six UARTs for multi-bridge industrial networks, and three SPI plus three I2C masters to scan sensor arrays. The 10-bit 1.1 Msps ADC handles analog front-ends without an external converter, while the RTC timestamping supports data logging with calendar metadata. Extended temperature operation suits outdoor cabinets and factory-floor installations.
Recommandé
Smart Energy Meters and Data Loggers
Smart electricity, water, and gas meters use the PIC24FJ256GB610-E/BG for metrology front-ends, RTC-driven time-of-use tariffs, and wired/wireless uplink aggregation. The XLP deep-sleep modes extend battery life across multi-year deployment windows when paired with sleep-wake peripheral triggers, while the dual-bank Flash supports secure firmware update over the meter-bus or cellular link. 85 GPIO simplify pulse-counting inputs and tamper-switch monitoring.
Recommandé
Portable Medical and Wellness Devices
Portable medical and wellness devices such as blood-glucose meters, pulse oximeters, and connected thermometers leverage the PIC24FJ256GB610-E/BG's XLP low-power modes, USB device port for charging/data sync, and 32 KB RAM for waveform buffers. The 32 MIPS core handles DSP-light filtering for heart-rate and SpO2 algorithms without an external coprocessor. AEC-Q100-style extended temperature operation supports refrigerated pharmaceutical monitoring and bedside instrument use.
Recommandé
Battery-Operated IoT Edge Nodes
IoT edge nodes for environmental monitoring, asset tracking, and agriculture benefit from the PIC24FJ256GB610-E/BG's deep-sleep current profile, RTC calendar wake, and Live Update firmware. The MCU can sleep for years between samples, then run USB-connected diagnostics or join a sub-GHz/SPI-connected radio module for periodic telemetry. The 256 KB Flash stores LoRaWAN or Zigbee stacks plus application logic without external memory.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ256GB610-E/BG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ256GB610-I/BG | PIC24FJ256GB610T-E/BG | PIC24FJ1024GB610-I/BG | PIC24FJ256GA610-I/BG | PIC24FJ128GA610-I/BG |
|---|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 1024 KB | 256 KB | 128 KB |
| RAM Size | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Maximum CPU Speed | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS |
| USB OTG | Yes (Full-Speed, on-chip PHY) | Yes | Yes | Yes | No | No |
| Number of I/O | 85 | 85 | 85 | 85 | 85 | 85 |
| Lifecycle Status | NRND (Not Recommended for new designs) | NRND | NRND | Active | Active | Active |
Principaux différenciateurs
- Dual-bank Flash with Live Update (vs PIC24FJ256GA610-I/BG)
- USB OTG on-chip PHY (vs PIC24FJ256GA610-I/BG)
- Extended -40C to +125C automotive grade (vs PIC24FJ256GB610-I/BG)
Notes de conception
Estimated: The 121-TFBGA uses a 0.80 mm ball pitch on a 10x10 mm body, which requires HDI PCB fabrication with laser-drilled stacked microvias to escape the inner rows. Use 1 oz copper on outer layers and 0.5 oz on inner layers; keep microvia aspect ratio below 0.75:1. Place 100 nF + 10 uF decoupling within 5 mm of each VDD/VSS pair, and route the USB D+/D- pair as a 90 ohm differential with continuous ground reference and length matching PCB layout guidelines for USB 2.0.
The PIC24FJ256GB610-E/BG operates from 2.0 V to 3.6 V. Use a low-dropout regulator with < 50 uVrms noise to feed VDD, and add a ferrite bead + 1 uF cap on the analog AVDD rail if the ADC is active. The VUSB pin requires its own 3.3 V supply derived from VBUS or the internal regulator; tie VBUS to the USB connector VBUS through a divider for OTG session detection. Decouple VBAT/RTC supply separately if battery backup is implemented.
Do not confuse -E/BG (extended -40C to +125C, automotive AEC-Q100) with -I/BG (industrial -40C to +85C) - the wrong suffix voids automotive qualification. The Live Update feature requires the dual-partition linker script and configuration-word settings; firmware teams must verify A/B image swap with a watchdog-driven rollback path before deploying OTA updates. Finally, note that the GB610 family is in NRND status - new designs may want to evaluate the active GA610 or 1024 GB610 variants for long-term availability.
Informations de conformité
RoHS and REACH compliant per Microchip product page; AEC-Q100 qualified per 'Recommended for Automotive Design' status on the product page. The -E suffix denotes -40C to +125C extended temperature grade. Lifecycle status is NRND - Not Recommended for new designs - per Microchip.
