PIC24FJ256GB610-E/BG - 16-Bit 32MHz 256KB Flash MCU | Microchip
Артикул: PIC24FJ256GB610-E/BG ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.05 | $130,50 |
| 100 | $11.6 | $1.160,00 |
| 500 | $10.15 | $5.075,00 |
| 1.000 | $9.05 | $9.050,00 |
PIC24FJ256GB610-E/BG Обзор
What is a PIC24F microcontroller? The PIC24F is Microchip's 16-bit MCU family built on a modified Harvard architecture with a 16-bit datapath and 24-bit instruction word, sitting between 8-bit PIC16/PIC18 MCUs and 32-bit PIC32 devices. It targets low-power (eXtreme Low Power, XLP) and USB-enabled embedded applications, balancing deterministic interrupt latency with rich connectivity (USB OTG, UART, SPI, I2C) - a category typically used in consumer, industrial, and automotive body-electronics designs.
Key features include six UART modules, three I2C and three SPI interfaces, six PWM channels with capture/compare, a 10-bit 1.1 Msps ADC, a Real-Time Clock/Calendar, and a full-speed USB 2.0 On-The-Go controller with PHY. The dual-bank Flash with ECC and Live Update allows field firmware upgrades without downtime, a critical feature for remote sensors and automotive modules requiring in-service reprogramming.
Architecturally, the device combines a single-cycle 16-bit ALU with a hardware multiply/divide engine and a DMA-free peripheral set. The XLP deep-sleep current (typical values vary by mode) supports years of battery life when paired with an external RTC and sleep-wake peripheral triggers, while the 85 GPIO pins and extensive interrupt-on-change logic enable complex human-machine interface and sensor-fusion front-ends.
Typical applications include USB-OTG peripherals, automotive body controllers, industrial HMI panels, smart energy metering, and portable medical instrumentation. The wide extended temperature range and AEC-Q100 qualification suitability make the PIC24FJ256GB610 family attractive for under-hood automotive nodes and outdoor industrial installations.
When designing with this MCU, allocate the 0.80 mm BGA ball pitch carefully - it requires HDI PCB fabrication (laser-drilled microvias) and precise reflow profiling. The Live Update feature must be enabled in the configuration words and requires the dual-partition linker script; firmware teams should plan application layout for safe A/B image swap before deployment.
Аналоги без доработки для PIC24FJ256GB610-E/BG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC24FJ256GB610-E/BG (тот же форм-фактор и посадочное место) — отличается по Package, ADC, Program Memory (Flash), Core Architecture, Operating Temperature.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC24FJ256GB610-I/BG
✅ Прямая замена✓ В наличии
$3.95 / шт.
Открыть даташит →PIC24FJ256GB610T-E/BG
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24FJ1024GB610-I/BG
✅ Прямая замена✓ В наличии
$7.44 / шт.
Открыть даташит →PIC24FJ256GA610-I/BG
✅ Прямая замена✓ В наличии
$3.41 / шт.
Открыть даташит →PIC24FJ256GA610T-I/BG
✅ Прямая замена✓ В наличии
$5.36 / шт.
Открыть даташит →PIC24FJ128GA610-I/BG
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24FJ256GB610-E/BG Максимальные параметры и электрические характеристики
| Core Architecture | PIC24F (16-bit modified Harvard) |
| CPU Core | PIC24 16-bit RISC |
| Максимальная тактовая частота | 32 MHz (32 MIPS) |
| Program Memory (Flash) | 256 KB (85.5K x 24) dual-bank with ECC |
| RAM Size | 32 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| Number of I/O Pins | 85 |
| Корпус | 121-TFBGA (10x10 mm), 0.80 mm pitch |
| Тип монтажа | Surface Mount |
| Диапазон рабочих температур | -40C to +125C (E suffix = extended) |
| UART Modules | 6 |
| I2C Interfaces | 3 |
| SPI Interfaces | 3 |
| PWM Channels | 6 |
| ADC | 10-bit, up to 1.1 Msps |
| USB | USB 2.0 Full-Speed OTG with on-chip PHY |
| RTC | Real-Time Clock/Calendar on-chip |
| Special Features | Dual Flash partitions, Live Update firmware, ECC on Flash, XLP low power |
| Automotive Qualification | AEC-Q100 (per datasheet 'Recommended for Automotive Design') |
| Статус RoHS | Compliant |
Конфигурация выводов PIC24FJ256GB610-E/BG
| Контакт A1 | RB0 — PORTB I/O pin 0 (PGEDx programming alternate) |
| Контакт A2 | RB1 — PORTB I/O pin 1 (PGECx programming alternate) |
| Контакт A4 | RB2 — PORTB I/O pin 2 |
| Контакт A5 | RB3 — PORTB I/O pin 3 |
| Контакт A7 | VSS — Ground reference |
| Контакт A8 | VDD — Core supply voltage (2.0-3.6 V) |
| Контакт B1 | RA0 — PORTA I/O pin 0 |
| Контакт B2 | RA1 — PORTA I/O pin 1 |
| Контакт B3 | RA2 — PORTA I/O pin 2 |
| Контакт B4 | RA3 — PORTA I/O pin 3 |
| Контакт B5 | RA4 — PORTA I/O pin 4 |
| Контакт B6 | RA5 — PORTA I/O pin 5 |
| Контакт B7 | RA6 — PORTA I/O pin 6 |
| Контакт B8 | RA7 — PORTA I/O pin 7 |
| Контакт B9 | RA9 — PORTA I/O pin 9 |
| Контакт B10 | RA10 — PORTA I/O pin 10 |
| Контакт B11 | RA14 — PORTA I/O pin 14 |
| Контакт B12 | RA15 — PORTA I/O pin 15 |
| Контакт C1 | RC0 — PORTC I/O pin 0 |
| Контакт C2 | RC1 — PORTC I/O pin 1 |
| Контакт C3 | RC2 — PORTC I/O pin 2 |
| Контакт C4 | RC3 — PORTC I/O pin 3 |
| Контакт C5 | RC4 — PORTC I/O pin 4 |
| Контакт C6 | RC5 — PORTC I/O pin 5 |
| Контакт C7 | RC6 — PORTC I/O pin 6 |
| Контакт C8 | RC7 — PORTC I/O pin 7 |
| Контакт C9 | RC8 — PORTC I/O pin 8 |
| Контакт C10 | RC9 — PORTC I/O pin 9 |
| Контакт C11 | RC10 — PORTC I/O pin 10 |
| Контакт C12 | RC11 — PORTC I/O pin 11 |
| Контакт D1 | RC12 — PORTC I/O pin 12 |
| Контакт D2 | RC13 — PORTC I/O pin 13 |
| Контакт D3 | RC14 — PORTC I/O pin 14 |
| Контакт D4 | RC15 — PORTC I/O pin 15 |
| Контакт D5 | RD0 — PORTD I/O pin 0 |
| Контакт D6 | RD1 — PORTD I/O pin 1 |
| Контакт D7 | RD2 — PORTD I/O pin 2 |
| Контакт D8 | RD3 — PORTD I/O pin 3 |
| Контакт D9 | RD4 — PORTD I/O pin 4 |
| Контакт D10 | RD5 — PORTD I/O pin 5 |
| Контакт D11 | RD6 — PORTD I/O pin 6 |
| Контакт D12 | RD7 — PORTD I/O pin 7 |
| Контакт E1 | RD8 — PORTD I/O pin 8 |
| Контакт E2 | RD9 — PORTD I/O pin 9 |
| Контакт E3 | RD10 — PORTD I/O pin 10 |
| Контакт E4 | RD11 — PORTD I/O pin 11 |
| Контакт E5 | VSS — Ground reference |
| Контакт E6 | VDD — Core supply voltage (2.0-3.6 V) |
| Контакт E7 | RD12 — PORTD I/O pin 12 |
| Контакт E8 | RD13 — PORTD I/O pin 13 |
| Контакт E9 | RD14 — PORTD I/O pin 14 |
| Контакт E10 | RD15 — PORTD I/O pin 15 |
| Контакт E11 | RE0 — PORTE I/O pin 0 |
| Контакт E12 | RE1 — PORTE I/O pin 1 |
| Контакт F1 | RE2 — PORTE I/O pin 2 |
| Контакт F2 | RE3 — PORTE I/O pin 3 |
| Контакт F3 | RE4 — PORTE I/O pin 4 |
| Контакт F4 | RE5 — PORTE I/O pin 5 |
| Контакт F5 | RE6 — PORTE I/O pin 6 |
| Контакт F6 | RE7 — PORTE I/O pin 7 |
| Контакт F7 | RE8 — PORTE I/O pin 8 |
| Контакт F8 | RE9 — PORTE I/O pin 9 |
| Контакт F9 | RF0 — PORTF I/O pin 0 |
| Контакт F10 | RF1 — PORTF I/O pin 1 |
| Контакт F11 | RF2 — PORTF I/O pin 2 |
| Контакт F12 | RF3 — PORTF I/O pin 3 |
| Контакт G1 | RF4 — PORTF I/O pin 4 |
| Контакт G2 | RF5 — PORTF I/O pin 5 |
| Контакт G3 | RF6 — PORTF I/O pin 6 |
| Контакт G4 | RF7 — PORTF I/O pin 7 |
| Контакт G5 | RF8 — PORTF I/O pin 8 |
| Контакт G6 | VSS — Ground reference |
| Контакт G7 | VDD — Core supply voltage (2.0-3.6 V) |
| Контакт G8 | RG0 — PORTG I/O pin 0 |
| Контакт G9 | RG1 — PORTG I/O pin 1 |
| Контакт G10 | RG2 — PORTG I/O pin 2 |
| Контакт G11 | RG3 — PORTG I/O pin 3 |
| Контакт G12 | RG6 — PORTG I/O pin 6 |
| Контакт H1 | RG7 — PORTG I/O pin 7 |
| Контакт H2 | RG8 — PORTG I/O pin 8 |
| Контакт H3 | RG9 — PORTG I/O pin 9 |
| Контакт H4 | RG10 — PORTG I/O pin 10 |
| Контакт H5 | RG11 — PORTG I/O pin 11 |
| Контакт H6 | RG12 — PORTG I/O pin 12 |
| Контакт H7 | RG13 — PORTG I/O pin 13 |
| Контакт H8 | RG14 — PORTG I/O pin 14 |
| Контакт H9 | RG15 — PORTG I/O pin 15 |
| Контакт H10 | RH0 — PORTH I/O pin 0 |
| Контакт H11 | RH1 — PORTH I/O pin 1 |
| Контакт H12 | RH2 — PORTH I/O pin 2 |
| Контакт J1 | RH3 — PORTH I/O pin 3 |
| Контакт J2 | RH4 — PORTH I/O pin 4 |
| Контакт J3 | RH5 — PORTH I/O pin 5 |
| Контакт J4 | RH6 — PORTH I/O pin 6 |
| Контакт J5 | RH7 — PORTH I/O pin 7 |
| Контакт J6 | RH8 — PORTH I/O pin 8 |
| Контакт J7 | RH9 — PORTH I/O pin 9 |
| Контакт J8 | RH10 — PORTH I/O pin 10 |
| Контакт J9 | RH11 — PORTH I/O pin 11 |
| Контакт J10 | RH12 — PORTH I/O pin 12 |
| Контакт J11 | RH13 — PORTH I/O pin 13 |
| Контакт J12 | RH14 — PORTH I/O pin 14 |
| Контакт K1 | RH15 — PORTH I/O pin 15 |
| Контакт K2 | RJ0 — PORTJ I/O pin 0 |
| Контакт K3 | RJ1 — PORTJ I/O pin 1 |
| Контакт K4 | RJ2 — PORTJ I/O pin 2 |
| Контакт K5 | RJ3 — PORTJ I/O pin 3 |
| Контакт K6 | VSS — Ground reference |
| Контакт K7 | VDD — Core supply voltage (2.0-3.6 V) |
| Контакт K8 | RJ4 — PORTJ I/O pin 4 |
| Контакт K9 | RJ5 — PORTJ I/O pin 5 |
| Контакт K10 | RJ6 — PORTJ I/O pin 6 |
| Контакт K11 | RJ7 — PORTJ I/O pin 7 |
| Контакт K12 | OSC1 — Crystal oscillator input |
| Контакт L1 | OSC2 — Crystal oscillator output |
| Контакт L2 | SOSCO — Secondary oscillator (RTC) output |
| Контакт L3 | SOSCI — Secondary oscillator (RTC) input |
| Контакт L5 | MCLR — Master Clear (reset, active low) |
| Контакт L6 | VUSB — USB internal transceiver supply (3.3 V typical) |
| Контакт L7 | VBUS — USB bus voltage detect input |
| Контакт L8 | D+ — USB D+ data line |
| Контакт L9 | D- — USB D- data line |
| Контакт L11 | VSS — Ground reference |
| Контакт L12 | VDD — Core supply voltage (2.0-3.6 V) |
| Контакт NC | NC — Not connected (per datasheet mechanical drawing) |
Типичное применение
PIC24FJ256GB610-E/BG подходит для 6 применениеs: USB OTG Peripherals and Debug Probes, Automotive Body and HMI Controllers, Industrial HMI Panels and Sensor Hubs, Smart Energy Meters and Data Loggers, Portable Medical and Wellness Devices, Battery-Operated IoT Edge Nodes.
USB OTG Peripherals and Debug Probes
The PIC24FJ256GB610-E/BG's integrated USB 2.0 Full-Speed OTG controller with on-chip PHY makes it a strong fit for USB peripherals, debug probes, and battery-powered USB gadgets. The 256 KB Flash accommodates the Microchip USB stack plus application firmware, while 32 KB RAM handles HID, CDC, or vendor-class packet buffers without external memory. Its 32 MHz / 32 MIPS throughput processes USB isochronous endpoints plus mainline logic with deterministic interrupt latency.
Рекомендуется
Automotive Body and HMI Controllers
The -E/BG extended -40C to +125C temperature grade and Microchip's AEC-Q100 qualification flow make the PIC24FJ256GB610-E/BG suitable for automotive body controllers, HVAC panels, instrument clusters, and infotainment HMI front-ends. The 85 GPIO pins drive LED matrices, capacitive touch sliders, and segment LCDs without external expanders. Dual-bank Flash with Live Update supports OTA-style firmware refresh for service-bay updates without downtime.
Рекомендуется
Industrial HMI Panels and Sensor Hubs
Industrial HMI panels and sensor hubs benefit from the PIC24FJ256GB610-E/BG's 32 KB RAM for protocol translation buffers, six UARTs for multi-bridge industrial networks, and three SPI plus three I2C masters to scan sensor arrays. The 10-bit 1.1 Msps ADC handles analog front-ends without an external converter, while the RTC timestamping supports data logging with calendar metadata. Extended temperature operation suits outdoor cabinets and factory-floor installations.
Рекомендуется
Smart Energy Meters and Data Loggers
Smart electricity, water, and gas meters use the PIC24FJ256GB610-E/BG for metrology front-ends, RTC-driven time-of-use tariffs, and wired/wireless uplink aggregation. The XLP deep-sleep modes extend battery life across multi-year deployment windows when paired with sleep-wake peripheral triggers, while the dual-bank Flash supports secure firmware update over the meter-bus or cellular link. 85 GPIO simplify pulse-counting inputs and tamper-switch monitoring.
Рекомендуется
Portable Medical and Wellness Devices
Portable medical and wellness devices such as blood-glucose meters, pulse oximeters, and connected thermometers leverage the PIC24FJ256GB610-E/BG's XLP low-power modes, USB device port for charging/data sync, and 32 KB RAM for waveform buffers. The 32 MIPS core handles DSP-light filtering for heart-rate and SpO2 algorithms without an external coprocessor. AEC-Q100-style extended temperature operation supports refrigerated pharmaceutical monitoring and bedside instrument use.
Рекомендуется
Battery-Operated IoT Edge Nodes
IoT edge nodes for environmental monitoring, asset tracking, and agriculture benefit from the PIC24FJ256GB610-E/BG's deep-sleep current profile, RTC calendar wake, and Live Update firmware. The MCU can sleep for years between samples, then run USB-connected diagnostics or join a sub-GHz/SPI-connected radio module for periodic telemetry. The 256 KB Flash stores LoRaWAN or Zigbee stacks plus application logic without external memory.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC24FJ256GB610-E/BG — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC24FJ256GB610-I/BG | PIC24FJ256GB610T-E/BG | PIC24FJ1024GB610-I/BG | PIC24FJ256GA610-I/BG | PIC24FJ128GA610-I/BG |
|---|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 1024 KB | 256 KB | 128 KB |
| RAM Size | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Maximum CPU Speed | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS |
| USB OTG | Yes (Full-Speed, on-chip PHY) | Yes | Yes | Yes | No | No |
| Number of I/O | 85 | 85 | 85 | 85 | 85 | 85 |
| Lifecycle Status | NRND (Not Recommended for new designs) | NRND | NRND | Active | Active | Active |
Ключевые отличия
- Dual-bank Flash with Live Update (против PIC24FJ256GA610-I/BG)
- USB OTG on-chip PHY (против PIC24FJ256GA610-I/BG)
- Extended -40C to +125C automotive grade (против PIC24FJ256GB610-I/BG)
Заметки по проектированию
Estimated: The 121-TFBGA uses a 0.80 mm ball pitch on a 10x10 mm body, which requires HDI PCB fabrication with laser-drilled stacked microvias to escape the inner rows. Use 1 oz copper on outer layers and 0.5 oz on inner layers; keep microvia aspect ratio below 0.75:1. Place 100 nF + 10 uF decoupling within 5 mm of each VDD/VSS pair, and route the USB D+/D- pair as a 90 ohm differential with continuous ground reference and length matching PCB layout guidelines for USB 2.0.
The PIC24FJ256GB610-E/BG operates from 2.0 V to 3.6 V. Use a low-dropout regulator with < 50 uVrms noise to feed VDD, and add a ferrite bead + 1 uF cap on the analog AVDD rail if the ADC is active. The VUSB pin requires its own 3.3 V supply derived from VBUS or the internal regulator; tie VBUS to the USB connector VBUS through a divider for OTG session detection. Decouple VBAT/RTC supply separately if battery backup is implemented.
Do not confuse -E/BG (extended -40C to +125C, automotive AEC-Q100) with -I/BG (industrial -40C to +85C) - the wrong suffix voids automotive qualification. The Live Update feature requires the dual-partition linker script and configuration-word settings; firmware teams must verify A/B image swap with a watchdog-driven rollback path before deploying OTA updates. Finally, note that the GB610 family is in NRND status - new designs may want to evaluate the active GA610 or 1024 GB610 variants for long-term availability.
Информация о соответствии
RoHS and REACH compliant per Microchip product page; AEC-Q100 qualified per 'Recommended for Automotive Design' status on the product page. The -E suffix denotes -40C to +125C extended temperature grade. Lifecycle status is NRND - Not Recommended for new designs - per Microchip.
