PIC32MM0128GPM064T-I/MR - 32-bit 25MHz MCU, 128KB Flash | Microchip
N.º da peça: PIC32MM0128GPM064T-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.84 | $2,84 |
| 10 | $2.51 | $25,10 |
| 100 | $2.2 | $220,00 |
| 500 | $1.96 | $980,00 |
| 1.000 | $1.74 | $1.740,00 |
PIC32MM0128GPM064T-I/MR Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, and programmable peripherals around a shared bus. Within the broader hierarchy, the PIC32MM GPM family sits under 32-bit microcontrollers -> microcontrollers -> embedded processors -> semiconductors. The microAptiv core is a streamlined MIPS32 implementation optimized for low dynamic power, while ECC (Error-Correcting Code) on Flash adds single-bit error correction that is rare in cost-sensitive MCUs.
Key features include 128 KB ECC Flash, 16 KB SRAM, six 16-bit timers, three USART, two SPI, two I2C, a 12-channel 10/12-bit ADC, four comparators, and a USB 2.0 full-speed device/host/OTG controller. The IC operates from 2.0 V to 3.6 V with active current typically below 10 mA at 25 MHz and sleep current in the microamp range thanks to nanoWatt XLP technology.
The architecture pairs a 2-cycle MIPS32 pipeline with a tightly-coupled peripheral set and a 4-channel DMA that offloads data movement from the CPU. ECC on Flash detects and corrects single-bit errors, improving reliability in industrial and IoT deployments where soft errors are a concern. The 9x9 mm QFN with EP exposes the thermal pad, reducing theta_JA compared to non-EP packages.
Typical applications include USB-connected sensor hubs, low-power IoT edge nodes, USB HID peripherals (keyboards, mice, game controllers), industrial telemetry, battery-powered instruments, and consumer human-interface devices where low standby current is essential.
When designing with this part, allocate the exposed pad (EP) to a continuous ground plane with at least 16 thermal vias to keep junction temperature within the -40C to +85C industrial range. The 25 MHz core requires a stable 3.3 V rail; decouple VDD with 100 nF and 4.7 uF ceramics placed within 5 mm of the package.
This page synthesizes distributor pricing, drop-in PIC32MM same-family alternatives, and practical layout guidance not collated in the manufacturer datasheet.
Alternativas drop-in para PIC32MM0128GPM064T-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MM0128GPM064T-I/MR (mesmo formato e footprint) — diferindo em ADC, Package, Communication Interfaces, Core Architecture, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MM0256GPM064-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.45 / unidade
Ver ficha técnica →PIC32MM0064GPM064-I/MR
✅ Drop-In✓ Em estoque
$2.04 / unidade
Ver ficha técnica →PIC32MM0128GPM064T-I/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv |
| Core Size | 32-bit |
| Maximum CPU Frequency | 25 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) with ECC |
| SRAM | 16 KB |
| EEPROM | 4 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| I/O Pins | 53 (max) |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| ADC | 12-channel, 10/12-bit, 200 ksps |
| Comparators | 4 |
| Timers | 6 x 16-bit |
| DMA Channels | 4 |
| Communication Interfaces | 3 x USART, 2 x SPI, 2 x I2C |
| Encapsulamento | 64-pin QFN (9x9 mm) with EP |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (Industrial, "I") |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do PIC32MM0128GPM064T-I/MR 64-pin qfn (9x9 mm) with ep
Configuração de pinos para PIC32MM0128GPM064T-I/MR (pacote 64-pin qfn (9x9 mm) with ep). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MM0128GPM064T-I/MR.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MM0128GPM064T-I/MR é adequado para 6 aplicaçãos: USB HID Peripherals (Keyboard / Mouse / Game Controller), Low-Power IoT Sensor Hubs, Industrial Telemetry / Data Loggers, USB Charging and Power Banks, Consumer Human-Interface Devices, Medical Point-of-Care USB Devices.
USB HID Peripherals (Keyboard / Mouse / Game Controller)
The PIC32MM0128GPM064T-I/MR's integrated USB 2.0 full-speed Device/Host/OTG controller eliminates an external PHY, reducing BOM and PCB area for HID peripherals. Its 25 MHz microAptiv core handles HID class drivers and debounce logic without taxing the bus, while 128 KB Flash stores USB descriptors and customization tables. Sleep current in the microamp range extends battery life in wireless dongles, and 53 GPIO pins directly drive LED matrices and scan matrices without extra logic. Designers should pair the USB D+/D- lines with 22 ohm series resistors and a 1.0 uF VBUS decoupling cap per datasheet recommendations.
Recomendado
Low-Power IoT Sensor Hubs
In IoT sensor hubs the PIC32MM0128GPM064T-I/MR delivers active current below 10 mA at 25 MHz and sub-microamp sleep current via nanoWatt XLP, enabling multi-year battery life on a CR2032 cell. The 12-channel 10/12-bit ADC reads temperature, humidity, and analog sensors directly, while the 4-channel DMA moves data to SRAM without waking the CPU. The 64-pin QFN EP allows compact board layout, and three USART channels connect to BLE, LoRa, or sub-GHz radio modules. ECC Flash protects sensor calibration tables against soft errors in field deployments.
Recomendado
Industrial Telemetry / Data Loggers
Industrial telemetry designs use the PIC32MM0128GPM064T-I/MR's USB OTG to dump logged data to a USB stick without an external bridge chip. The 128 KB ECC Flash and 4 KB EEPROM store weeks of samples, while the comparators and ADC handle analog signal conditioning. The -40C to +85C industrial temperature rating suits factory-floor deployments, and the QFN-64 EP plus 16 thermal vias keep junction temperature safe inside sealed enclosures. Hardware ECC on Flash corrects single-bit errors caused by long-term radiation exposure in industrial environments.
Recomendado
USB Charging and Power Banks
Power-bank controllers benefit from the PIC32MM0128GPM064T-I/MR's USB OTG, four comparators for current/voltage sensing, and DMA-driven ADC scanning for accurate coulomb counting. The microAptiv core executes USB BC1.2 and proprietary charging protocols while the deep-sleep modes keep quiescent draw under 10 uA, preserving stored battery capacity. The 64-pin QFN gives plenty of GPIO for status LEDs, button input, and load switch control. ECC Flash keeps charging algorithm parameters reliable over years of thermal cycling.
Recomendado
Consumer Human-Interface Devices
The PIC32MM0128GPM064T-I/MR suits consumer HIDs like touch panels, remote controls, and VR peripherals where low active power and USB connectivity matter. The microAptiv core at 25 MHz plus DMA handles capacitive touch scanning and report generation in real time, while the comparators enable touch wake-up from deep sleep. The 53 GPIO pins directly drive RGB LED chains and segment displays. nanoWatt XLP modes extend battery life in coin-cell powered remotes that spend most of their time asleep.
Recomendado
Medical Point-of-Care USB Devices
Point-of-care medical devices such as USB-connected glucose meters, pulse oximeters, and handheld diagnostic probes leverage the PIC32MM0128GPM064T-I/MR's USB device controller for tether-free PC connectivity. The 12-bit ADC provides sufficient resolution for analog front-ends, while the ECC Flash preserves calibration coefficients essential for clinical accuracy. The 64-pin QFN EP and compact 9x9 mm footprint suit space-constrained handhelds. nanoWatt XLP sleep modes extend battery life between patient sessions, and the industrial -40C to +85C rating tolerates field-clinic conditions.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MM0128GPM064T-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MM0256GPM064-I/MR | PIC32MM0064GPM064-I/MR |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9 mm) with EP | 64-pin QFN (9x9 mm) with EP - same | 64-pin QFN (9x9 mm) with EP - same |
| Core | MIPS32 microAptiv, 32-bit | MIPS32 microAptiv, 32-bit | MIPS32 microAptiv, 32-bit |
| Max CPU Frequency | 25 MHz | 25 MHz | 25 MHz |
| Flash | 128 KB with ECC | 256 KB with ECC | 64 KB with ECC |
| SRAM | 16 KB | 32 KB | 8 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| ADC | 12-channel, 10/12-bit | 12-channel, 10/12-bit | 12-channel, 10/12-bit |
Principais diferenciais
- 256 KB Flash upgrade path in same package (vs PIC32MM0256GPM064-I/MR)
- Lower Flash density in same package (vs PIC32MM0064GPM064-I/MR)
- ECC Flash protection (vs PIC32MM0032GPL036-E/MV)
Notas de projeto
Solder the exposed thermal pad (EP) of the 64-pin QFN to a continuous ground copper pour with at least 16 thermal vias for production reliability. The EP is the primary heat path; missing or insufficient vias cause the junction to exceed the -40C to +85C industrial range under USB plus ADC load. Keep the EP polygon clear of signal traces that cross between the package and the polygon to avoid shorts.
Decouple each VDD/VSS pair with a 100 nF X7R ceramic placed within 5 mm of the pin, plus a shared 4.7 uF bulk capacitor near the package. USB operation requires VDD >= 3.0 V with the bulk cap holding the rail within 5% during USB packet transmission. Place a ferrite bead between the 3.3 V regulator and the MCU's analog VDD pin if analog accuracy matters.
Route USB D+ and D- as a 90-ohm differential pair with length matching within 2 mm and no stubs. Series 22-ohm resistors near the MCU and a 1.0 uF VBUS decoupling capacitor on the connector side are required. Keep the pair away from switching regulators and oscillator traces; minimize the via count on the D+/D- nets.
Do not enable USB when VDD falls below 3.0 V; the USB PHY may source the bus incorrectly. Always configure the nanoWatt XLP sleep mode by setting the appropriate bits in the PMD and PWRCON registers before issuing a WAIT instruction; otherwise current draw will be much higher than datasheet figures. The ECC feature requires the configuration words to be set correctly to avoid spurious single-bit corrections on boot.
Informações de conformidade
RoHS and REACH compliant per Microchip product page; industrial grade "I" temperature range, not AEC-Q100 qualified (choose PIC32MK AEC-Q100 parts for automotive).
