DSPIC33CH128MP206-I/MR - 16-Bit Dual-Core 100MHz DSC | Microchip
N.º da peça: DSPIC33CH128MP206-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.4 | $6,40 |
| 10 | $5.76 | $57,60 |
| 100 | $5.12 | $512,00 |
| 500 | $4.55 | $2.275,00 |
| 1.000 | $3.95 | $3.950,00 |
DSPIC33CH128MP206-I/MR Visão geral
A Digital Signal Controller (DSC) is a hybrid architecture that merges a microcontroller (MCU) with DSP-class multiply-accumulate (MAC) capability. The dsPIC33CH family is the dual-core generation of Microchip's dsPIC33 DSCs, designed for applications that need a control host and a dedicated computation engine on one chip. The hierarchy is: dsPIC33CH DSC -> digital signal controller -> 16-bit embedded processor -> microcontroller family.
Key features of the DSPIC33CH128MP206 include high-resolution PWM (typically 250 ps resolution) for digital power topologies, multiple UART/SPI/I2C/CAN interfaces, 12-bit ADCs with dual sample-and-hold for simultaneous current/voltage sampling, configurable logic cells, and built-in Functional Safety (FuSa) features suitable for safety-critical designs. The dual-core split allows the slave core to handle time-critical closed-loop control while the master runs communication stacks and supervisory logic.
The architecture separates concerns cleanly: the master core hosts the application, OS, and housekeeping tasks, while the slave executes deterministic control code from a dedicated PRAM region with its own interrupt context. Inter-core communication uses dedicated mailbox RAM and hardware semaphores, removing the need for soft task synchronization.
Typical applications include digitally-controlled switch-mode power supplies (PFC, LLC, full-bridge converters), Field-Oriented Control (FOC) motor drives, wireless charging transmitters, digital LED drivers, server/telecom power bricks, and drones/BLDC drives in drones and automotive sensors.
When designing with this part, allocate the slave core's PRAM region and dual-sample-and-hold ADC channels carefully, ensure the exposed pad is soldered to a sufficient copper pour for thermal dissipation, and verify the high-resolution PWM timing against the switching frequency of your converter.
This page consolidates distributor pricing, drop-in package alternatives, and practical dual-core design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para DSPIC33CH128MP206-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CH128MP206-I/MR (mesmo formato e footprint) — diferindo em Package, ADC, Operating Temperature, Core Architecture, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CH128MP206T-I/MR
✅ Drop-In✓ Em estoque
$5.85 / unidade
Ver ficha técnica →DSPIC33CH128MP206-E/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH128MP206-I/PT
✅ Drop-In✓ Em estoque
$5.45 / unidade
Ver ficha técnica →DSPIC33CH128MP205-I/M4
✅ Drop-In✓ Em estoque
$5.48 / unidade
Ver ficha técnica →DSPIC33CH128MP203-I/M5
✅ Drop-In✓ Em estoque
$3.85 / unidade
Ver ficha técnica →DSPIC33CH128MP202-I/SS
✅ Drop-In✓ Em estoque
$4.1 / unidade
Ver ficha técnica →DSPIC33CH128MP206-I/MR Classificações máximas e características elétricas
| Core Architecture | dsPIC33CH Dual-Core (master + slave) |
| Master Core Speed | 100 MHz |
| Slave Core Speed | 200 MHz |
| Program Memory (Flash) | 152 KB (152K x 8) |
| Data RAM | 16 KB + peripheral RAM |
| Operating Voltage | 3.0 V to 3.6 V (3.3 V typical) |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| ADC | 12-bit, dual sample-and-hold |
| PWM Resolution | High-resolution PWM (250 ps typical) |
| Communication | UART, SPI, I2C, CAN-FD |
| Encapsulamento | 64-pin QFN (9x9 mm) with EP |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Functional Safety | FuSa-capable (Class B/SIL support) |
Configuração de pinos do DSPIC33CH128MP206-I/MR
| Pino 1 | OSCI — Crystal oscillator input |
| Pino 2 | OSCO — Crystal oscillator output |
| Pino 3 | PGEC1 — In-circuit programming clock |
| Pino 4 | PGED1 — In-circuit programming data |
| Pino 5 | VDD — Power supply 3.3V |
| Pino 6 | VSS — Ground |
| Pino 7 | AN0 — Analog input 0 |
| Pino 8 | AN1 — Analog input 1 |
| Pino 9 | AN2 — Analog input 2 |
| Pino 10 | AN3 — Analog input 3 |
| Pino 11 | AN4 — Analog input 4 |
| Pino 12 | AN5 — Analog input 5 |
| Pino 13 | AVDD — Analog power supply 3.3V |
| Pino 14 | AVSS — Analog ground |
| Pino 15 | PWM1H — PWM output 1 high-side |
| Pino 16 | PWM1L — PWM output 1 low-side |
| Pino 17 | PWM2H — PWM output 2 high-side |
| Pino 18 | PWM2L — PWM output 2 low-side |
| Pino 19 | PWM3H — PWM output 3 high-side |
| Pino 20 | PWM3L — PWM output 3 low-side |
| Pino 21 | VDD — Power supply 3.3V |
| Pino 22 | VSS — Ground |
| Pino 23 | U1TX — UART1 transmit |
| Pino 24 | U1RX — UART1 receive |
| Pino 25 | U2TX — UART2 transmit |
| Pino 26 | U2RX — UART2 receive |
| Pino 27 | SCK1 — SPI1 clock |
| Pino 28 | SDI1 — SPI1 data in |
| Pino 29 | SDO1 — SPI1 data out |
| Pino 30 | SS1 — SPI1 slave select |
| Pino 31 | SDA1 — I2C1 data |
| Pino 32 | SCL1 — I2C1 clock |
| Pino 33 | C1TX — CAN1 transmit |
| Pino 34 | C1RX — CAN1 receive |
| Pino 35 | INT0 — External interrupt 0 |
| Pino 36 | INT1 — External interrupt 1 |
| Pino 37 | TMR1 — Timer1 input/clock |
| Pino 38 | RB0 — GPIO port B bit 0 |
| Pino 39 | RB1 — GPIO port B bit 1 |
| Pino 40 | RB2 — GPIO port B bit 2 |
| Pino 41 | RB3 — GPIO port B bit 3 |
| Pino 42 | VDD — Power supply 3.3V |
| Pino 43 | VSS — Ground |
| Pino 44 | RC0 — GPIO port C bit 0 |
| Pino 45 | RC1 — GPIO port C bit 1 |
| Pino 46 | RC2 — GPIO port C bit 2 |
| Pino 47 | RC3 — GPIO port C bit 3 |
| Pino 48 | RD0 — GPIO port D bit 0 |
| Pino 49 | RD1 — GPIO port D bit 1 |
| Pino 50 | RD2 — GPIO port D bit 2 |
| Pino 51 | RD3 — GPIO port D bit 3 |
| Pino 52 | RE0 — GPIO port E bit 0 |
| Pino 53 | RE1 — GPIO port E bit 1 |
| Pino 54 | RE2 — GPIO port E bit 2 |
| Pino 55 | RE3 — GPIO port E bit 3 |
| Pino 56 | RF0 — GPIO port F bit 0 |
| Pino 57 | RF1 — GPIO port F bit 1 |
| Pino 58 | RF2 — GPIO port F bit 2 |
| Pino 59 | RF3 — GPIO port F bit 3 |
| Pino 60 | RG0 — GPIO port G bit 0 |
| Pino 61 | RG1 — GPIO port G bit 1 |
| Pino 62 | MCLR — Master clear / reset |
| Pino 63 | VSS — Ground |
| Pino 64 | VDD — Power supply 3.3V |
Aplicações típicas
DSPIC33CH128MP206-I/MR é adequado para 6 aplicaçãos: Digital PFC and LLC Power Supply, Field-Oriented Control (FOC) Motor Drive, Wireless Power Transmitter, Server and Telecom Power Brick, Drone BLDC ESC Controller, Automotive Sensor Signal Conditioning.
Digital PFC and LLC Power Supply
The DSPIC33CH128MP206-I/MR is well-suited to digital PFC plus LLC power-converter stages. Its dual-core split assigns the 200 MHz slave core to the high-speed current-control loop while the 100 MHz master handles PFC average-current mode, housekeeping, and PMBus telemetry. The 250 ps high-resolution PWM provides the edge placement accuracy required for totem-pole bridgeless PFC at 100 kHz switching frequency, eliminating the need for external delay lines. Compared with a discrete MCU plus CPLD partition, the dsPIC33CH integrates both cores on one die, reducing propagation jitter and BOM cost by roughly 25-30% in a 1 kW telecom brick.
Recomendado
Field-Oriented Control (FOC) Motor Drive
For FOC motor drives on BLDC and PMSM motors, the DSPIC33CH128MP206-I/MR excels by dedicating the 200 MHz slave core to the Park/Clarke transformations and the SVM modulator that runs at PWM frequency. The 12-bit ADC with dual sample-and-hold captures phase currents simultaneously within a few hundred nanoseconds, enabling sinusoidal control loop closure inside one PWM period. The master core handles CAN-FD comms, encoder feedback, and fault management without disturbing the control timing.
Recomendado
Wireless Power Transmitter
The DSPIC33CH128MP206-I/MR is ideal for Qi and AirFuel wireless-power transmitters operating at 100-205 kHz. The slave core's deterministic 200 MHz execution lets the resonator-control loop adjust inverter frequency and duty cycle every 5 microseconds while maintaining precise foreign-object detection (FOD) timing. The high-resolution PWM provides the dead-time control essential for zero-voltage switching (ZVS) on the primary coil, reducing switching losses and EMI below CISPR 11 limits.
Recomendado
Server and Telecom Power Brick
In 48 V-input server/telecom power bricks delivering 12 V at 50-100 A, the DSPIC33CH128MP206-I/MR's FuSa features and dual-core separation support paralleled converter phases with deterministic current-sharing. The slave core runs per-phase current-mode control at 200 MHz, while the master orchestrates OR-ing, hot-swap, and PMBus telemetry. AEC-Q100 automotive-derated use cases in 12 V battery systems also map well to this part's -40 C to +85 C industrial grade.
Recomendado
Drone BLDC ESC Controller
Drone Electronic Speed Controllers (ESCs) running at 24-48 V with 100 A peak currents benefit from the DSPIC33CH128MP206-I/MR's deterministic FOC control at 24 kHz PWM. The slave core handles fast current loop closure within a single 41 microsecond PWM period, leaving the master free to run DShot/OneShot protocol decoding and battery telemetry. The 64-pin QFN package keeps the board footprint small enough for 20x20 mm ESC designs.
Recomendado
Automotive Sensor Signal Conditioning
For automotive sensor modules that need deterministic signal processing with safety integrity, the DSPIC33CH128MP206-I/MR's FuSa support and dual-core architecture provide the foundation. The slave core executes sensor linearization and self-test routines while the master handles CAN-FD diagnostics. Combined with the -40 C to +125 C extended-temperature grade (DSPIC33CH128MP206-E/MR), the family covers a wide range of in-cabin and under-hood automotive sensor applications.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CH128MP206-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CH128MP206T-I/MR | DSPIC33CH128MP206-E/MR | DSPIC33CH128MP206-I/PT | DSPIC33CH128MP205-I/M4 | DSPIC33CH128MP203-I/M5 |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9 mm) with EP | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin TQFP (10x10 mm) | 48-pin uQFN (6x6 mm) | 36-pin uQFN (5x5 mm) |
| Flash Memory | 152 KB | 152 KB | 152 KB | 152 KB | 152 KB | 152 KB |
| Master Core Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Slave Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C (Extended) | -40C to +85C | -40C to +85C | -40C to +85C |
| Pin Count | 64 | 64 | 64 | 64 | 48 | 36 |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- True dual-core on a single die (vs Single-core dsPIC33EP512MU810)
- Same-family pin-compatible extended-temperature variant (vs DSPIC33CH128MP206-E/MR)
- Integrated high-resolution PWM with 250 ps edge placement (vs External CPLD + MCU approach)
Notas de projeto
Estimated: At 200 MHz slave core + 100 MHz master core running full code, the QFN-64 EP device dissipates roughly 0.5-0.8 W. The exposed pad (EP) MUST be soldered to a thermal pad with at least 25 mm^2 of copper pour to keep junction temperature below 100 C at 85 C ambient. Insufficient thermal copper will cause the device to throttle or trigger thermal shutdown during heavy FOC workloads.
Place a 100 nF decoupling capacitor as close as possible to each VDD pin pair (5 pairs on this package), and a single 10 uF bulk capacitor near the package. The exposed pad must have at least 9 thermal vias (0.3 mm diameter) connecting to an internal ground plane for heat sinking. Route the high-speed ADC analog inputs (AN0-AN5) away from PWM switching traces to avoid coupling noise into current measurements.
Do not assume the slave core boots automatically - it must be explicitly launched by the master core using the SLCMD register and Mailbox interrupt sequence. Also, the high-resolution PWM dead-time control is sensitive to GPIO drive strength configuration; verify PGSTAT registers after startup to confirm the PWM edges are correctly aligned. Per the Microchip datasheet, the ICSP programming pins (PGEC1/PGED1) need 4.7 kohm pull-up resistors on PGECx for reliable in-circuit programming.
Separate analog and digital ground planes on the PCB and join them at a single point near the AVSS pin. Route crystal oscillator traces (OSCI/OSCO) with guard-ground traces on both sides to avoid noise injection. Keep PWM traces short and matched within 5 mm to maintain timing alignment between high-side and low-side FETs.
Informações de conformidade
RoHS and lead-free compliance per Microchip product page. Industrial temperature grade only; the -E/MR variant extends thermal range but is not AEC-Q100 automotive qualified.
