PIC32MX230F256D-50I/ML - 50MHz 32-bit MCU 256KB Flash USB | Microchip
N.º da peça: PIC32MX230F256D-50I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.45 | $6,45 |
| 10 | $5.81 | $58,10 |
| 100 | $5.16 | $516,00 |
| 500 | $4.52 | $2.260,00 |
| 1.000 | $3.96 | $3.960,00 |
PIC32MX230F256D-50I/ML Visão geral
A 32-bit microcontroller (MCU) is a single-chip computer integrating a CPU core, Flash program memory, SRAM data memory, and peripherals on one silicon die. The PIC32MX family belongs to the broader category of embedded microcontrollers within the semiconductor hierarchy (microcontroller -> embedded processor -> integrated circuit -> semiconductor). It is built on the MIPS32 M4K architecture, a RISC core optimized for deterministic real-time embedded control, and includes the mTouch capacitive touch library, a 1 ns resolution hardware capture timer, and Peripheral Pin Select (PPS) for flexible signal routing.
Key features include a 10-bit 1 Msps ADC with up to 13 channels, two I2S/SPI modules for codec and serial audio, a Parallel Master Port (PMP) for graphics interfaces, five 16-bit timers/counters, and four UART modules. The integrated USB 2.0 full-speed On-The-Go controller eliminates an external PHY and supports device, host, and dual-role operation for HID, CDC, MSD, and vendor class stacks.
The PIC32MX230 architecture combines a 5-stage pipelined MIPS core, a multi-vector interrupt controller with 96 priority levels, a flexible direct-memory-access (DMA) engine, and a wide peripheral mix. This technical depth makes the part suitable for USB-connected industrial, audio, and human-interface designs requiring deterministic response at low BOM cost.
Typical applications include USB audio peripherals, capacitive touch human-interface devices, small graphics interfaces, low-cost embedded web servers, and industrial control terminals. The wide peripheral integration also makes it a fit for sensor hubs and IoT edge nodes with USB connectivity.
When designing with this MCU, the 8x8 mm QFN exposed pad must be soldered to a continuous ground plane for thermal dissipation; derate performance above 70 degrees C and use PPS carefully because each signal can only be mapped to a limited subset of pins.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a faster path from selection to prototype for USB peripherals and embedded control designs.
Alternativas drop-in para PIC32MX230F256D-50I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX230F256D-50I/ML (mesmo formato e footprint) — diferindo em Package, ADC, USB, Operating Temperature, Maximum CPU Frequency.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX230F256D-50I/ML
✅ Drop-In✓ Em estoque
$3.96 / unidade
Ver ficha técnica →PIC32MX250F256D-50I/ML
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC32MX270F256D-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.18 / unidade
Ver ficha técnica →PIC32MX170F256B-I/ML
✅ Drop-In✓ Em estoque
$3.25 / unidade
Ver ficha técnica →PIC32MX230F256D-I/ML
✅ Drop-In✓ Em estoque
$3.05 / unidade
Ver ficha técnica →PIC32MX230F256D-50I/ML Classificações máximas e características elétricas
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 50 MHz (83 DMIPS) |
| Program Flash | 256 KB (256K x 8) |
| Data SRAM | 64 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Temperatura de operação | -40 C to +85 C (Industrial, 'I') |
| ADC | 10-bit, up to 13 channels, 1 Msps |
| USB | USB 2.0 full-speed Device/Host/OTG |
| I2S/SPI Modules | 2 |
| UART Modules | 4 |
| I2C Modules | 2 |
| Timers | 5 x 16-bit |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| DMA Channels | Yes |
| mTouch Capacitive Touch | Supported |
| Input Capture Resolution | 1 ns (16-bit Input Capture) |
| Encapsulamento | 44-pin QFN (8x8 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 |
| Status RoHS | Compliant |
| Active CPU Current (typ) | 0.5 mA/MHz |
Configuração de pinos do PIC32MX230F256D-50I/ML
| Pino 1 | RB0 — General-purpose I/O / programming pin |
| Pino 2 | RB1 — General-purpose I/O |
| Pino 3 | RB2 — General-purpose I/O |
| Pino 4 | RB3 — General-purpose I/O |
| Pino 5 | RB4 — General-purpose I/O |
| Pino 6 | RB5 — General-purpose I/O |
| Pino 7 | RB6 — General-purpose I/O / ICD PGC |
| Pino 8 | RB7 — General-purpose I/O / ICD PGD |
| Pino 9 | VSS — Ground |
| Pino 10 | VDD — Supply voltage (2.3 V to 3.6 V) |
| Pino 11 | RA0 — General-purpose I/O / AN0 |
| Pino 12 | RA1 — General-purpose I/O / AN1 |
| Pino 13 | RA2 — General-purpose I/O / AN2 |
| Pino 14 | RA3 — General-purpose I/O / AN3 |
| Pino 15 | RA4 — General-purpose I/O / AN4 |
| Pino 16 | RA5 — General-purpose I/O / AN5 |
| Pino 17 | RA6 — General-purpose I/O / AN6 |
| Pino 18 | RA7 — General-purpose I/O / AN7 |
| Pino 19 | VSS — Ground |
| Pino 20 | AVDD — Analog supply voltage |
| Pino 21 | AVSS — Analog ground |
| Pino 22 | RC0 — General-purpose I/O / AN8 |
| Pino 23 | RC1 — General-purpose I/O / AN9 |
| Pino 24 | RC2 — General-purpose I/O / AN10 |
| Pino 25 | RC3 — General-purpose I/O / AN11 |
| Pino 26 | RC4 — General-purpose I/O / AN12 |
| Pino 27 | RC5 — General-purpose I/O / AN13 |
| Pino 28 | RC6 — General-purpose I/O / AN14 |
| Pino 29 | RC7 — General-purpose I/O / AN15 |
| Pino 30 | RC8 — General-purpose I/O |
| Pino 31 | RC9 — General-purpose I/O |
| Pino 32 | VDD — Supply voltage (2.3 V to 3.6 V) |
| Pino 33 | VSS — Ground |
| Pino 34 | RD0 — General-purpose I/O |
| Pino 35 | RD1 — General-purpose I/O |
| Pino 36 | RD2 — General-purpose I/O |
| Pino 37 | RD3 — General-purpose I/O |
| Pino 38 | RD4 — General-purpose I/O |
| Pino 39 | RD5 — General-purpose I/O |
| Pino 40 | RD6 — General-purpose I/O |
| Pino 41 | RD7 — General-purpose I/O |
| Pino 42 | D+ — USB D+ data line |
| Pino 43 | D- — USB D- data line |
| Pino 44 | VDD — Supply voltage (2.3 V to 3.6 V) |
Aplicações típicas
PIC32MX230F256D-50I/ML é adequado para 6 aplicaçãos: USB Audio Peripherals, Capacitive Touch HMI, Industrial Control Terminals, Low-Cost Embedded Web Servers, Sensor Hubs and Data Loggers, USB HID Input Devices.
USB Audio Peripherals
The PIC32MX230F256D-50I/ML fits USB audio peripherals because its integrated USB 2.0 full-speed OTG controller eliminates an external PHY while two I2S/SPI modules directly interface with S/PDIF or audio codecs. With 256 KB Flash and 64 KB SRAM, the part runs a full USB audio stack plus a 48 kHz/16-bit audio pipeline without external memory. At 50 MHz/83 DMIPS it handles USB isochronous transfers and audio rendering concurrently. Place the chip adjacent to the USB connector with the exposed pad soldered to a continuous ground plane for EMI suppression. Performance consideration: USB full-speed tops out at 12 Mbps, so designers targeting 24-bit/96 kHz hi-res audio should move to a USB high-speed part.
Recomendado
Capacitive Touch HMI
The PIC32MX230F256D-50I/ML's mTouch capacitive touch library, 1 ns hardware capture timer, and PPS flexibility make it a strong fit for capacitive touch human-machine interfaces. The 50 MHz MIPS M4K core runs touch scanning and graphics rendering on the integrated PMP simultaneously. With 256 KB Flash, the part supports a full touch + GUI stack without external memory. Place sensor electrodes within 50 mm of the chip and use guard traces to suppress water-wake false positives. Performance consideration: capacitive touch scan time scales linearly with electrode count, so designs above 20 buttons should consider the PIC32MX450 family.
Recomendado
Industrial Control Terminals
The PIC32MX230F256D-50I/ML fits industrial control terminals because of its 2.3 V to 3.6 V supply range, -40 C to +85 C industrial temperature grade, 5 x 16-bit timers, four UARTs, two I2C buses, and PMP graphics interface. With 256 KB Flash, the part runs a full Modbus RTU or CANopen slave stack plus an LCD GUI on PMP without external memory. The hardware DMA engine and multi-vector interrupt controller with 96 priority levels deliver deterministic real-time response for closed-loop control. Performance consideration: at high peripheral bus loads, engineers should disable unused peripherals and route PPS carefully because each signal maps only to a subset of pins.
Recomendado
Low-Cost Embedded Web Servers
The PIC32MX230F256D-50I/ML's integrated USB device port, 64 KB SRAM, and 256 KB Flash make it a fit for low-cost embedded web servers and IoT edge nodes. Designers run a lightweight TCP/IP stack with a USB-CDC or USB-RNDIS bridge, exposing the device as a network node without external Ethernet PHYs. The 50 MHz MIPS core handles HTML rendering and JSON serialization for small RESTful endpoints. Place the part near the USB connector with bulk capacitance on VBUS and a ferrite bead on VDD. Performance consideration: at >10 concurrent connections, upgrade to a PIC32MX with Ethernet MAC.
Recomendado
Sensor Hubs and Data Loggers
The PIC32MX230F256D-50I/ML's 10-bit 1 Msps ADC, two I2C buses, four UARTs, and DMA engine make it a strong fit for multi-sensor data loggers and sensor hubs. With 256 KB Flash, the part runs local logging firmware plus a USB mass-storage bridge for SD-cardless data offload. The mTouch capacitive library also enables touch-activated wake events for battery-powered deployments. Performance consideration: ADC sample rate degrades when the CPU enters sleep, so designers targeting continuous sampling must keep the part in run mode or use DMA-driven conversions.
Recomendado
USB HID Input Devices
The PIC32MX230F256D-50I/ML's USB 2.0 full-speed OTG controller and DMA engine make it a clean fit for USB HID input devices such as keyboards, mice, game controllers, and programmable keypads. With 256 KB Flash, the part runs USB HID class stacks plus macro programming logic without external memory. The mTouch library supports touch sliders for gesture input, while the PMP interface can drive a small OLED for status display. Place the part near the USB connector with the exposed pad soldered to a continuous ground plane for EMI compliance. Performance consideration: USB polling intervals below 1 ms require careful ISR prioritization because the MIPS M4K has no hardware preemption.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX230F256D-50I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX250F256D-50I/ML | PIC32MX270F256D-I/ML | PIC32MX170F256B-I/ML | PIC32MX230F256D-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| Maximum CPU Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 40 MHz (max for non-50I speed bin) |
| Program Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Data SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG + CAN | USB 2.0 FS OTG | USB 2.0 FS Device only | USB 2.0 FS OTG |
| I2S/SPI Modules | 2 | 2 | 2 | 0 (no I2S on B suffix) | 2 |
| CAN 2.0B | No | Yes (1 controller) | No | No | No |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principais diferenciais
- Higher CPU speed within the same package (vs PIC32MX230F256D-I/ML)
- Adds CAN 2.0B controller (vs PIC32MX270F256D-I/ML)
- Integrated USB 2.0 full-speed OTG (vs PIC32MX170F256B-I/ML)
Notas de projeto
Estimated: the PIC32MX230F256D-50I/ML in a 44-QFN (8x8 mm) package dissipates up to 0.5 mA/MHz at 3.3 V, yielding about 82.5 mW at full 50 MHz CPU load. Solder the exposed thermal pad to a continuous ground plane with at least 4 thermal vias (0.3 mm drill, 0.5 mm pitch) to keep junction temperature below 125 C across the -40 C to +85 C industrial range. Do not place the part near hot components; verify with a thermocouple measurement during prototype bring-up.
Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD pin (pins 10, 32, 44) plus a 4.7 uF bulk capacitor on the same net. Route USB D+ and D- as a 90 ohm differential pair with controlled impedance, and place the 15 kohm pull-down resistor on D- within 5 mm of the connector. Keep the crystal traces short and surrounded by a ground guard ring to suppress EMI. The 44-QFN exposed pad must be soldered to a continuous ground plane for electrical and thermal performance per Microchip's recommended PCB layout in the family datasheet.
PPS (Peripheral Pin Select) signals can only be mapped to a limited subset of pins; not every GPIO can host every peripheral function. Carefully review the PPS input/output mapping table in the Microchip datasheet before locking the PCB layout to avoid last-minute rework. Also, the part's USB transceiver requires 3.0 V to 3.6 V on AVDD when USB is active; designs using a 2.3 V to 2.9 V supply must disable USB or add a separate 3.3 V rail for the analog USB block.
Estimated: route JTAG/ICD pins (RB6/PGC, RB7/PGD, MCLR) to a 6-pin header on a separate ground island to keep in-circuit debug noise from coupling into sensitive analog traces. Keep analog input traces (AN0-AN15) away from switching signals like PWM outputs and USB differential pair, and use a separate AVSS ground island tied to VSS at a single point under the part. The PMP bus for graphics displays should be routed as short, parallel traces with matched lengths (within 2 mm) to avoid timing skew.
Informações de conformidade
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose AEC-Q100 automotive grade PIC32 variants for automotive designs. Halogen-free status not stated on the verified Microchip page.
