PIC32MX270F256DT-I/ML - 32-bit 256KB Flash MCU, USB, 44-QFN | Microchip
N.º da peça: PIC32MX270F256DT-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.92 | $5,92 |
| 10 | $5.42 | $54,20 |
| 100 | $4.85 | $485,00 |
| 500 | $4.32 | $2.160,00 |
| 1.000 | $3.78 | $3.780,00 |
PIC32MX270F256DT-I/ML Visão geral
A PIC32MX microcontroller belongs to the 32-bit MCU family in the broader taxonomy of microcontrollers -> microprocessors -> embedded controllers -> semiconductors. The PIC32MX1XX/2XX 28/36/44-pin sub-family specifically targets cost-sensitive embedded applications that need 32-bit performance without the cost of higher-end Cortex-M parts. The MIPS32 M4K core delivers deterministic interrupt latency and is supported by Microchip's MPLAB X IDE, MPLAB XC32 toolchain, and Harmony software framework.
Key features of the PIC32MX270F256DT-I/ML include 13 channels of 10-bit ADC with up to 1 Msps conversion, up to five 16-bit timers, two I2C modules, two UART modules, two SPI/I2S modules, a charge time measurement unit (CTMU) for mTouch capacitive touch sensing, an on-chip temperature sensor, and a Parallel Master Port for graphics or external memory interfacing. USB 2.0 full-speed device/host/OTG support with integrated transceiver and PHY simplifies designs that require PC connectivity, HID peripherals, or embedded host functions. PPS remaps most digital peripherals to nearly any I/O pin, drastically simplifying PCB layout.
Typical applications include USB audio peripherals, Bluetooth audio docks, low-cost graphics HMI, mTouch capacitive touch buttons and sliders, sensor hubs, and industrial control front-ends. Its combination of USB, PMP graphics, and CTMU touch support uniquely positions this part for compact consumer and industrial HMI designs.
When designing with this part, ensure that VDD/AVDD pins are properly decoupled with 100nF + 1nF + bulk capacitance and that the USB D+/D- lines are routed as a 90-ohm differential pair. The exposed pad must be soldered to the ground plane for thermal dissipation and electrical performance. The industrial -40C to +85C temperature grade makes this part suitable for outdoor enclosures and industrial environments.
This page synthesizes distributor pricing, drop-in package-identical alternatives, and practical design notes not consolidated on the manufacturer datasheet.
Alternativas drop-in para PIC32MX270F256DT-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX270F256DT-I/ML (mesmo formato e footprint) — diferindo em ADC, Package, USB, Maximum CPU Frequency, mTouch Capacitive Touch.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX270F256DT-50I/ML
✅ Drop-In✓ Em estoque
$4.61 / unidade
Ver ficha técnica →PIC32MX270F256D-I/ML
✅ Drop-In✓ Em estoque
$4.18 / unidade
Ver ficha técnica →PIC32MX270F256D-50I/ML
✅ Drop-In✓ Em estoque
$3.74 / unidade
Ver ficha técnica →PIC32MX230F256DT-I/ML
✅ Drop-In✓ Em estoque
$3.31 / unidade
Ver ficha técnica →PIC32MX230F256D-50I/ML
✅ Drop-In✓ Em estoque
$3.96 / unidade
Ver ficha técnica →PIC32MX130F256DT-I/ML
✅ Drop-In✓ Em estoque
$3.95 / unidade
Ver ficha técnica →PIC32MX270F256DT-I/ML Classificações máximas e características elétricas
| Core | MIPS32 M4K |
| Bit Width | 32-bit |
| Maximum CPU Speed | 50 MHz (83 DMIPS) |
| Flash Program Memory | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Faixa de temperatura de operação | -40C to +85C (Industrial grade) |
| ADC | 10-bit, up to 13 channels |
| USB | USB 2.0 Full-Speed Device/Host/OTG with on-chip transceiver |
| I2S/SPI Modules | 2 |
| UART Modules | 2 |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| Encapsulamento | 44-pin QFN (8x8 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| CTMU (mTouch capacitive touch) | Yes |
Configuração de pinos do PIC32MX270F256DT-I/ML
| Pino 1 | RA0 — I/O port A bit 0 / analog input AN0 / CVREF+/PMA6 |
| Pino 2 | RA1 — I/O port A bit 1 / analog input AN1 / VREF-/PMA7 |
| Pino 3 | RA2 — I/O port A bit 2 / analog input AN2 / VREF+/PMA0 |
| Pino 4 | RA3 — I/O port A bit 3 / analog input AN3 / PMA1 |
| Pino 5 | RA4 — I/O port A bit 4 / analog input AN4 / PMA2 |
| Pino 6 | AVDD — Analog VDD supply |
| Pino 7 | AVSS — Analog VSS ground |
| Pino 8 | RA5 — I/O port A bit 5 / analog input AN5 / PMA3 |
| Pino 9 | RA6 — I/O port A bit 6 / analog input AN6 / PMA4 |
| Pino 10 | RA7 — I/O port A bit 7 / analog input AN7 / PMA5 |
| Pino 11 | RB0 — I/O port B bit 0 / PGED1/AN8/PMA8 |
| Pino 12 | RB1 — I/O port B bit 1 / PGEC1/AN9/PMA9 |
| Pino 13 | RB2 — I/O port B bit 2 / AN10/OC1/CN4 |
| Pino 14 | RB3 — I/O port B bit 3 / AN11/OC2/CN5 |
| Pino 15 | RB4 — I/O port B bit 4 / AN12/OC3/CN6 |
| Pino 16 | RB5 — I/O port B bit 5 / AN13/OC4/CN7 |
| Pino 17 | RB6 — I/O port B bit 6 / OC5/CN8 |
| Pino 18 | RB7 — I/O port B bit 7 / CN9 |
| Pino 19 | VDD — Digital VDD supply |
| Pino 20 | VSS — Digital VSS ground |
| Pino 21 | RB8 — I/O port B bit 8 / U2CTS/CN10 |
| Pino 22 | RB9 — I/O port B bit 9 / U2RTS/CN11 |
| Pino 23 | RB11 — I/O port B bit 11 / AN15/PMA15 |
| Pino 24 | RB10 — I/O port B bit 10 / PMA12 |
| Pino 25 | RB12 — I/O port B bit 12 / PMA11 |
| Pino 26 | RB13 — I/O port B bit 13 / PMA10 |
| Pino 27 | RB14 — I/O port B bit 14 / VBAT |
| Pino 28 | RB15 — I/O port B bit 15 |
| Pino 29 | RC0 — I/O port C bit 0 |
| Pino 30 | RC1 — I/O port C bit 1 |
| Pino 31 | RC2 — I/O port C bit 2 / D1- |
| Pino 32 | RC3 — I/O port C bit 3 / D1+ |
| Pino 33 | RC4 — I/O port C bit 4 / D2- |
| Pino 34 | RC5 — I/O port C bit 5 / D2+ |
| Pino 35 | RC6 — I/O port C bit 6 |
| Pino 36 | RC7 — I/O port C bit 7 |
| Pino 37 | RC8 — I/O port C bit 8 |
| Pino 38 | RC9 — I/O port C bit 9 |
| Pino 39 | OSC1 — Oscillator crystal input |
| Pino 40 | OSC2 — Oscillator crystal output |
| Pino 41 | MCLR — Master clear reset input |
| Pino 42 | VDD — Digital VDD supply |
| Pino 43 | VSS — Digital VSS ground |
| Pino 44 | VDD — Digital VDD supply |
Aplicações típicas
PIC32MX270F256DT-I/ML é adequado para 6 aplicaçãos: USB Audio Peripherals and Headsets, mTouch Capacitive Touch Buttons and Sliders, Low-Cost Graphics HMI Displays, Sensor Hubs and Data Aggregators, Industrial Control Front-Ends, USB HID Peripherals and Consumer Devices.
USB Audio Peripherals and Headsets
The PIC32MX270F256DT-I/ML is purpose-built for USB audio peripherals. Its integrated USB 2.0 full-speed device/host/OTG controller, two I2S modules, and 64 KB SRAM allow direct interfacing with audio codecs and USB hosts without external PHY silicon. The 50 MHz MIPS32 M4K core comfortably runs a USB audio class 1.0 stack at 12 Mbps, while the I2S lines clock-rate converters and DMA channels offload streaming buffers. This part drops into USB headphone DACs, USB microphones, and Bluetooth audio adapter boards that connect to a host PC.
Recomendado
mTouch Capacitive Touch Buttons and Sliders
The PIC32MX270F256DT-I/ML integrates a Charge Time Measurement Unit (CTMU) that enables Microchip's mTouch capacitive touch sensing library, supporting buttons, sliders, and proximity sensors without external touch ICs. Per Microchip datasheet DS60001168L, the CTMU works with the on-chip ADC to measure capacitance with 1 ns resolution, supporting reliable touch through thick glass or plastic overlays. The 13-channel 10-bit ADC provides ample channels for multi-button touch panels and slider configurations in consumer appliances.
Recomendado
Low-Cost Graphics HMI Displays
The Parallel Master Port (PMP) on the PIC32MX270F256DT-I/ML drives graphical LCDs and OLED panels at up to 8-bit parallel data rates, ideal for low-cost HMI panels with monochrome or small color TFTs. The 50 MHz core can sustain full-screen refresh rates on 128x64 graphical LCDs and small 320x240 TFTs without external graphics controllers. Combined with 256 KB Flash for storing fonts and bitmaps and 64 KB SRAM for framebuffers, this part eliminates the need for a separate graphics controller IC in compact HMI designs.
Recomendado
Sensor Hubs and Data Aggregators
The PIC32MX270F256DT-I/ML serves as a low-power sensor hub aggregating data from I2C sensors, SPI peripherals, and analog sensors. Two I2C and two SPI/I2S interfaces support multiple sensor buses simultaneously, while 13 channels of 10-bit ADC handle analog sensor inputs. The 0.5 mA/MHz typical active current consumption enables battery-powered sensor nodes. USB OTG support lets the same device act as either USB device reporting to a host or USB host collecting data from USB sensor peripherals.
Recomendado
Industrial Control Front-Ends
The PIC32MX270F256DT-I/ML industrial -40C to +85C temperature range, 2.3 V to 3.6 V supply, and integrated USB make it suitable for industrial control front-ends, PLC communication modules, and HMI panels. The Peripheral Pin Select (PPS) remaps peripherals to nearly any I/O pin, simplifying PCB layout for industrial enclosures. Combined with on-chip temperature sensor and CTMU for capacitive user input, this part handles operator panels, machine status displays, and protocol converters in factory automation systems.
Recomendado
USB HID Peripherals and Consumer Devices
The PIC32MX270F256DT-I/ML is well-suited for USB HID peripherals such as keyboards, mice, game controllers, custom input devices, and consumer electronics that present as USB devices to a host PC. Per Microchip datasheet DS60001168L, USB device mode is supported with on-chip pull-up resistors and integrated transceiver, requiring only external ESD protection and a USB connector. The 256 KB Flash accommodates HID report descriptors, vendor-specific report formats, and boot-up features, while PPS simplifies PCB routing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX270F256DT-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX270F256DT-50I/ML | PIC32MX270F256D-I/ML | PIC32MX270F256D-50I/ML | PIC32MX230F256DT-I/ML | PIC32MX230F256D-50I/ML | PIC32MX130F256DT-I/ML |
|---|---|---|---|---|---|---|---|
| Package | 44-pin QFN (8x8 mm) | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Maximum CPU Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 40 MHz |
| USB Support | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device only | USB 2.0 FS Device only | USB 2.0 FS Device only |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging | Tape & Reel | Tape & Reel | Tray | Tray | Tape & Reel | Tray | Tape & Reel |
Principais diferenciais
- Integrated USB 2.0 Full-Speed Device/Host/OTG with on-chip transceiver (vs PIC32MX230F256DT-I/ML)
- Peripheral Pin Select (PPS) provides flexible I/O mapping (vs PIC32MX130F256DT-I/ML)
- Tape-and-reel packaging for automated SMT production (vs PIC32MX270F256D-I/ML)
Notas de projeto
Decouple each VDD/AVDD pin with a 100 nF ceramic capacitor placed within 5 mm of the pin, plus a 1 nF high-frequency cap and a bulk 4.7 uF or 10 uF tantalum/ceramic capacitor. Per Microchip datasheet DS60001168L, separate analog and digital ground planes are recommended; AVDD should be filtered through a ferrite bead from VDD. The USB VBUS pin requires a 4.7 uF decoupling capacitor if USB host mode is used.
The 44-pin QFN package has an exposed thermal pad (EP) that MUST be soldered to a ground copper pour on the PCB for both electrical performance and thermal dissipation. The thermal pad should be connected to VSS through at least 9 thermal vias in a 3x3 grid pattern. This provides the lowest thermal resistance path and improves USB signal integrity by reducing ground bounce on the substrate.
Route the D+/D- USB data signals as a 90-ohm differential pair with continuous reference to the VSS plane. Per Microchip layout guidelines, keep trace lengths matched within 2 mm and avoid routing near high-frequency switching signals. Place the 27-ohm series termination resistors close to the MCU pins for USB device mode. For crystal oscillator traces, keep them short and surrounded by a grounded guard trace.
Do not exceed 3.6 V on any VDD pin - this will damage the part. Ensure the MCLR pin is properly pulled up to VDD through a 10 kohm resistor for normal operation, and that the in-circuit serial programming (ICSP) connector is isolated when not in use. When migrating from the PIC32MX1XX to PIC32MX2XX 44-pin variant, verify that your Peripheral Pin Select (PPS) mapping matches the target device's pinout table - PPS registers are not interchangeable across package variants.
Informações de conformidade
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - this part is intended for industrial and consumer applications, not automotive. PIC32MX270F256DT-I/ML is part of the PIC32MX1XX/2XX family covered by datasheet DS60001168L.
