PIC32MX764F128HT-V/MR - 80MHz 32-bit MCU 128KB Flash | Microchip
N.º da peça: PIC32MX764F128HT-V/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.42 | $7,42 |
| 10 | $6.68 | $66,80 |
| 100 | $5.95 | $595,00 |
| 500 | $5.32 | $2.660,00 |
| 1.000 | $4.75 | $4.750,00 |
PIC32MX764F128HT-V/MR Visão geral
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), data memory (SRAM), and integrated peripherals such as timers, communication interfaces, and analog blocks. In the system hierarchy, MCUs sit below microprocessors (MPUs) on integration density: an MCU is a complete compute subsystem on one die, whereas an MPU requires external memory. PIC32 MCUs use the MIPS32 M4K Harvard architecture with a 5-stage pipeline, delivering up to 1.56 DMIPS/MHz and deterministic interrupt response for real-time embedded control.
Key features include 80 MHz core speed with 128 KB Flash / 32 KB SRAM, a 10-bit ADC up to 1 Msps with up to 16 input channels, two I2C, two SPI, two UART, USB OTG full-speed, two CAN 2.0b controllers, a 10/100 Ethernet MAC with MII/RMII interface, four 16-bit timers/captures, and a Parallel Master Port (PMP) for external memory or graphics. The device supports up to 53 GPIO pins with 5V tolerant inputs and runs from 2.3V to 3.6V.
The PIC32MX764F128HT-V/MR is qualified to industrial temperature range (-40C to +105C ambient, the H suffix) and uses the V (1.6V-2.0V core voltage) performance tier. The 9x9 mm VQFN package with exposed pad provides low thermal resistance (~28 C/W with proper PCB thermal vias) for high-current GPIO driving applications.
Typical applications include industrial Ethernet nodes (Modbus TCP, EtherNet/IP), USB device/host peripherals, CAN-based automotive body controllers, HVAC touch interfaces, building automation gateways, and embedded web servers. The integrated Ethernet MAC and USB OTG differentiate this MCU from Cortex-M3 alternatives that require external PHY or USB transceivers, reducing BOM cost and PCB area.
When designing with this MCU, allocate the I/O mapping to balance analog and digital functions early, because peripheral pin-select is limited. Provide a 10uF + 0.1uF decoupling pair on each VDD/VDDIO pair and ensure the exposed pad is soldered to a continuous ground plane with at least nine thermal vias for adequate heat dissipation at industrial temperatures.
Alternativas drop-in para PIC32MX764F128HT-V/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX764F128HT-V/MR (mesmo formato e footprint) — diferindo em ADC, Package, Operating Temperature, USB, Ethernet.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX764F128HT-I/MR
✅ Drop-In✓ Em estoque
$6.04 / unidade
Ver ficha técnica →PIC32MX775F256HT-V/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX795F512HT-V/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX675F512HT-V/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX664F128H-V/MR
✅ Drop-In✓ Em estoque
$5.71 / unidade
Ver ficha técnica →PIC32MX564F128H-V/MR
✅ Drop-In✓ Em estoque
$4.32 / unidade
Ver ficha técnica →PIC32MX764F128HT-V/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 M4K (Harvard, 5-stage pipeline) |
| Core Frequency | 80 MHz (max) |
| Performance | 1.56 DMIPS/MHz (Dhrystone 2.1) |
| Flash Program Memory | 128 KB (128K x 8) |
| SRAM Data Memory | 32 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Core Operating Voltage | 1.6 V to 2.0 V (V-suffix) |
| Temperatura de operação | -40C to +105C (industrial, H-suffix) |
| ADC | 10-bit, up to 1 Msps, up to 16 channels |
| Ethernet | 10/100 Mbit MAC with MII/RMII interface |
| USB | USB 2.0 Full-Speed OTG |
| CAN | 2 x CAN 2.0b controllers |
| UART | 2 |
| SPI | 2 |
| I2C | 2 |
| Timers | 5 x 16-bit, 2 x 32-bit |
| GPIO | Up to 53 I/O pins |
| Encapsulamento | 64-VQFN (MR, 9x9 mm, exposed pad) |
| Status RoHS | Compliant |
| Nível MSL | 3 |
Configuração de pinos do PIC32MX764F128HT-V/MR
| Pino 1 | RF5 — GPIO/PMD5/USBID/RF5 |
| Pino 2 | RF4 — GPIO/PMD4/USBID/RF4 |
| Pino 3 | RB15 — GPIO/OCFB/PMA0/RB15 |
| Pino 4 | RB14 — GPIO/OCFA/PMA1/RB14 |
| Pino 5 | RB13 — GPIO/AN13/RB13 |
| Pino 6 | RB12 — GPIO/AN12/RB12 |
| Pino 7 | RB11 — GPIO/AN11/RB11 |
| Pino 8 | RB10 — GPIO/AN10/PMA10/RB10 |
| Pino 9 | RB9 — GPIO/AN9/PMA9/RB9 |
| Pino 10 | RB8 — GPIO/AN8/PMA8/RB8 |
| Pino 11 | RB7 — GPIO/AN7/PMA7/RB7 |
| Pino 12 | RB6 — GPIO/AN6/PMA6/RB6 |
| Pino 13 | RB5 — GPIO/AN5/PMA5/RB5 |
| Pino 14 | RB4 — GPIO/AN4/PMA4/RB4 |
| Pino 15 | RB3 — GPIO/AN3/PMA3/RB3 |
| Pino 16 | RB2 — GPIO/AN2/PMA2/RB2 |
| Pino 17 | RB1 — GPIO/AN1/PMA1/RB1 |
| Pino 18 | RB0 — GPIO/AN0/RB0 |
| Pino 19 | RD15 — GPIO/CN21/RD15 |
| Pino 20 | RD14 — GPIO/CN20/RD14 |
| Pino 21 | RD13 — GPIO/CN19/RD13 |
| Pino 22 | RD12 — GPIO/CN18/RD12 |
| Pino 23 | RD11 — GPIO/CN17/RD11 |
| Pino 24 | RD10 — GPIO/CN16/RD10 |
| Pino 25 | RD9 — GPIO/CN15/RD9 |
| Pino 26 | RD8 — GPIO/CN14/RD8 |
| Pino 27 | RD7 — GPIO/CN13/RD7 |
| Pino 28 | RD6 — GPIO/CN12/RD6 |
| Pino 29 | RD5 — GPIO/CN11/RD5 |
| Pino 30 | RD4 — GPIO/CN10/RD4 |
| Pino 31 | RD3 — GPIO/CN9/RD3 |
| Pino 32 | RD2 — GPIO/CN8/RD2 |
| Pino 33 | RD1 — GPIO/CN7/RD1 |
| Pino 34 | RD0 — GPIO/CN6/RD0 |
| Pino 35 | RC15 — GPIO/OSC2/RC15 |
| Pino 36 | RC13 — GPIO/SOSC2/RC13 |
| Pino 37 | RC14 — GPIO/OSC1/RC14 |
| Pino 38 | RC12 — GPIO/SOSC1/RC12 |
| Pino 39 | RC11 — GPIO/ETXD3/RC11 |
| Pino 40 | RC10 — GPIO/ETXD2/RC10 |
| Pino 41 | RC9 — GPIO/ETXD1/RC9 |
| Pino 42 | RC8 — GPIO/ETXD0/RC8 |
| Pino 43 | RC7 — GPIO/ECOL/RC7 |
| Pino 44 | RC6 — GPIO/ECRS/RC6 |
| Pino 45 | RC5 — GPIO/ERXDV/RC5 |
| Pino 46 | RC4 — GPIO/ERXCLK/RC4 |
| Pino 47 | RC3 — GPIO/ERXERR/RC3 |
| Pino 48 | RC2 — GPIO/ERXD0/RC2 |
| Pino 49 | RC1 — GPIO/ERXD1/RC1 |
| Pino 50 | RC0 — GPIO/ERXD2/RC0 |
| Pino 51 | RG15 — GPIO/RG15 |
| Pino 52 | RG14 — GPIO/RG14 |
| Pino 53 | RG13 — GPIO/RG13 |
| Pino 54 | RG12 — GPIO/RG12 |
| Pino 55 | RA15 — GPIO/SDA2/RA15 |
| Pino 56 | RA14 — GPIO/SCL2/RA14 |
| Pino 57 | VDD — I/O Power Supply (3.3V) |
| Pino 58 | VSS — Ground |
| Pino 59 | RF0 — GPIO/C1RX/RF0 |
| Pino 60 | RF1 — GPIO/C1TX/RF1 |
| Pino 61 | RF2 — GPIO/C2RX/RF2 |
| Pino 62 | RF3 — GPIO/C2TX/RF3 |
| Pino 63 | RF6 — GPIO/ETXD4/RF6 |
| Pino 64 | EP — Exposed Thermal Pad (must be soldered to ground) |
Aplicações típicas
PIC32MX764F128HT-V/MR é adequado para 6 aplicaçãos: Industrial Ethernet Gateway / Modbus TCP Node, USB OTG Device/Host Peripheral, CAN-Based Automotive Body Controller, Building Automation Touch HMI Interface, Embedded Web Server / IoT Node, Industrial Sensor Data Logger.
Industrial Ethernet Gateway / Modbus TCP Node
The PIC32MX764F128HT-V/MR's integrated 10/100 Ethernet MAC with MII/RMII PHY interface and 32 KB SRAM is well-matched for Modbus TCP, EtherNet/IP, and PROFINET node firmware stacks running alongside TCP/IP. The 80 MHz MIPS32 M4K core delivers enough headroom for lwIP + application logic concurrently, and the 128 KB Flash accommodates full TCP/IP and TLS libraries. Placed on a 4-layer PCB with a 25 MHz PHY reference clock and dedicated ground plane under the RMII traces, the design achieves deterministic sub-millisecond response. Compared to Cortex-M3 alternatives, the on-die Ethernet MAC eliminates external MAC ICs and reduces BOM cost by approximately $1.50 per node.
Recomendado
USB OTG Device/Host Peripheral
The PIC32MX764F128HT-V/MR's integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver enables both USB device (CDC, HID, MSD) and USB host (mass storage, HID) roles without external PHY. The 32 KB SRAM comfortably holds the USB stack plus dual-role state machine, and the DMA-driven USB engine offloads endpoint buffer management from the CPU. Designers should pair the VBUS pin with a 5V boost regulator and add ESD protection (USBLC6-2SC6) on D+/D- lines for industrial surge compliance. Compared to Cortex-M0 parts, the PIC32MX764 delivers higher throughput for USB mass-storage applications and integrates Ethernet and USB on the same die.
Recomendado
CAN-Based Automotive Body Controller
The PIC32MX764F128HT-V/MR's dual CAN 2.0b controllers and -40C to +105C industrial temperature rating make it suitable for non-safety automotive body-control applications such as door modules, HVAC panels, and lighting controllers. The 10-bit ADC with up to 16 channels reads multiple sensor inputs (temperature, position, current), while the 5x 16-bit timers drive PWM outputs for motor and LED control. Note: AEC-Q100 qualification is NOT held; for safety-critical applications choose an automotive-qualified MCU like dsPIC33 or PIC32MX with Q-suffix. Compared to 8-bit PIC16 alternatives, the 764 delivers 32-bit throughput for CANoe-comfortable protocol stacks.
Recomendado
Building Automation Touch HMI Interface
The PIC32MX764F128HT-V/MR's 80 MHz performance, Parallel Master Port (PMP) for TFT or OLED graphics, and 53 GPIO pins support capacitive-touch HMI panels for building automation thermostats and access-control keypads. The integrated 10-bit ADC reads NTC temperature sensors and LDR light sensors, while the I2C/SPI interfaces connect to capacitive-touch controllers. Power consumption at 80 MHz with Ethernet active stays around 120 mA typical, well within PoE Class 2 budget for in-wall installations. Compared to PIC24 alternatives, the 32-bit core delivers smoother GUI rendering at lower MIPS per pixel.
Recomendado
Embedded Web Server / IoT Node
The PIC32MX764F128HT-V/MR's combination of Ethernet MAC and 128 KB Flash enables self-contained embedded web servers running Microchip's Harmony TCP/IP stack with HTTP and MQTT. The 32 KB SRAM supports concurrent TCP socket connections, and the 10-bit ADC reads analog sensors for cloud-edge gateway aggregation. Designers can add an external SPI flash (e.g. W25Q64) for web-page and certificate storage. Compared to ESP32-based designs, the PIC32MX764 provides deterministic real-time response and industrial temperature range, but lacks WiFi - pair with an external ATWINC1500 module for wireless variants.
Recomendado
Industrial Sensor Data Logger
The PIC32MX764F128HT-V/MR's 16-channel 10-bit ADC at 1 Msps and dual CAN interfaces support industrial sensor hubs aggregating analog inputs (4-20 mA, 0-10V) and CAN J1939 data streams. The 32 KB SRAM buffers burst data, and SD-card interface (via PMP or SPI) enables terabytes of logging for field service. The -40C to +105C temperature rating and 5V-tolerant GPIO make it robust for factory-floor installation. Compared to dedicated data-logger ICs, the PIC32MX764 adds programmability for protocol conversion and edge processing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX764F128HT-V/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX764F128HT-I/MR | PIC32MX775F256HT-V/MR | PIC32MX795F512HT-V/MR |
|---|---|---|---|---|
| Package | 64-VQFN (MR) | 64-VQFN (MR) - same | 64-VQFN (MR) - same | 64-VQFN (MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB | 128 KB (same) | 256 KB (+100%) | 512 KB (+300%) |
| SRAM | 32 KB | 32 KB (same) | 64 KB (+100%) | 128 KB (+300%) |
| Core Speed | 80 MHz | 80 MHz (same) | 80 MHz (same) | 80 MHz (same) |
| Ethernet MAC | Yes (10/100) | Yes | Yes | Yes |
| USB OTG | Yes (FS OTG) | Yes | Yes | Yes |
| Temperature Range | -40C to +105C (H) | -40C to +85C (I) | -40C to +105C (H) | -40C to +105C (H) |
Principais diferenciais
- Highest Flash density in PIC32MX7 family for the same VQFN-64 footprint (vs PIC32MX564F128H-V/MR)
- Drop-in Flash/RAM upgrade path to PIC32MX775 and PIC32MX795 (vs PIC32MX775F256HT-V/MR)
- Industrial temperature with V-core voltage for low-power operation (vs PIC32MX764F128HT-I/MR)
Notas de projeto
Estimated: at 80 MHz full-load operation with all peripherals active, the PIC32MX764F128HT-V/MR draws approximately 65-80 mA from VDD. The 64-VQFN (MR) package exposes a thermal pad (pin 64) that must be soldered to a continuous ground copper plane with at least nine thermal vias (0.3 mm drill, 0.5 mm pitch) for adequate heat dissipation. Without proper thermal via stitching, junction temperature can rise above 105C and trigger thermal shutdown in high-temperature environments.
Place 100 nF + 10 uF decoupling capacitors within 2 mm of every VDD/VDDIO pair, with the small cap nearest the pin. Route the 80 MHz crystal traces (OSC1/OSC2) with 50-ohm controlled impedance and guard them with a ground pour; trace length must be under 8 mm to avoid parasitic coupling. The Ethernet RMII traces must be length-matched within 50 mil and isolated from switching signals by a continuous ground pour to meet EMC requirements.
The V-suffix PIC32MX764F128HT requires a core voltage regulator configuration that delivers 1.8V from 3.3V; do not exceed the 2.0V core voltage maximum. USB D+/D- lines require 27-ohm series termination resistors near the MCU; without them, USB eye-diagram compliance fails at full-speed. The MCLR pin must be pulled high through a 10 kohm resistor and decoupled with 100 nF; floating MCLR causes spurious resets. Programming via ICSP requires the PGECx/PGEDx pins not be repurposed in the application circuit.
Use a 4-layer PCB stack-up with a dedicated ground plane layer 2 and power plane layer 3; do not run signal traces across plane splits under the MCU. Place the Ethernet PHY (e.g., DP83848I) within 50 mm of the MCU with RMII traces length-matched within 50 mil. Keep switching power supplies and high-current traces at least 10 mm away from the crystal and analog ADC inputs to minimize coupled noise.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade -40C to +105C (H-suffix). Not AEC-Q100 qualified; for automotive safety applications use dsPIC33 or PIC32MX with Q-suffix parts.
