PIC32MZ1024ECG100-I/PT - 200MHz 32-bit MCU 1MB Flash TQFP-100
N.º da peça: PIC32MZ1024ECG100-I/PT ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.1441 | $18,14 |
| 10 | $16.32 | $163,20 |
| 100 | $14.51 | $1.451,00 |
| 500 | $12.95 | $6.475,00 |
| 1.000 | $11.62 | $11.620,00 |
PIC32MZ1024ECG100-I/PT Visão geral
A microcontroller (MCU) is a single-chip computer integrating a CPU core, non-volatile program memory (Flash), working memory (RAM), and configurable peripherals. PIC32MZ EC devices target networked and graphically rich embedded products, sitting in the hierarchy PIC32MZ EC -> PIC32MZ family -> PIC32 -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. Compared with smaller 8/16-bit MCUs, PIC32MZ EC parts deliver multi-MIPS processing, large memory, and high-bandwidth peripherals required for IoT gateways and HMI applications.
Key features include the MIPS32 microAptiv core with DSP instructions, hardware cryptographic accelerators, a 12-bit ADC up to 18 Msps, multiple timers and output compare/PWM channels, and a 10-bit/1 Msps ADC capability. The dual-panel Flash architecture enables fail-safe firmware updates while the application continues running, simplifying IEC 60730 Class B functional-safety certification in industrial designs.
The IC supports supply voltages from 2.2V to 3.6V with on-chip LDO regulators, an integrated high-precision oscillator, and a comprehensive DMA engine that offloads data movement from the CPU. Operating temperature range is -40C to +85C for the -I industrial grade. The TQFP-100 (12x12 mm) package gives generous board-routing headroom and good thermal performance for hand-soldering and rework in prototyping.
Typical applications include industrial IoT gateways, Ethernet-connected motor drives, building automation controllers, automotive infotainment and telematics HMIs, and graphics-touchscreen human-machine interfaces. The combination of Ethernet, HS USB and large Flash also suits point-of-sale terminals, multi-protocol sensor hubs, and edge-computing nodes.
When designing with the PIC32MZ1024ECG100-I/PT, allocate at least 4-layer PCB stack-up for the Ethernet PHY interface, place the 12 MHz primary crystal within 8 mm of the OSCI/OSCO pins, and follow the live-update dual-image partitioning scheme documented in the device family reference manual to enable fail-safe over-the-air (OTA) firmware upgrades.
This page consolidates distributor pricing, qualified drop-in alternatives, and application-oriented design notes beyond what appears on a stock product listing, helping engineers evaluate the PIC32MZ1024ECG100-I/PT for high-performance, connectivity-rich embedded designs.
Alternativas drop-in para PIC32MZ1024ECG100-I/PT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ1024ECG100-I/PT (mesmo formato e footprint) — diferindo em ADC, Package, Core Architecture, Ethernet, USB.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ1024ECG100T-I/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1024ECG100-I/PF
✅ Drop-In✓ Em estoque
$9.57 / unidade
Ver ficha técnica →PIC32MZ1024ECG100-E/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1024ECG100-V/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1024EFG100-I/PT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$8.94 / unidade
Ver ficha técnica →PIC32MZ1024ECG100-I/PT Classificações máximas e características elétricas
| Manufacturer | Microchip Technology |
| Series | PIC32MZ EC |
| Core | MIPS32 microAptiv |
| Core Architecture | 32-bit RISC |
| Maximum CPU Speed | 200 MHz |
| Program Memory (Flash) | 1 MB (1024 KB) |
| SRAM | 512 KB |
| Operating Voltage Range | 2.2 V to 3.6 V |
| Faixa de temperatura de operação | -40 C to +85 C (Industrial) |
| Encapsulamento | 100-pin TQFP (12x12 mm) |
| Tipo de montagem | Surface Mount |
| I/O Pins | 78 |
| Communication Interfaces | Ethernet, HS USB 2.0, CAN, UART, SPI, I2C, I2S, SQI |
| ADC | 12-bit, up to 18 Msps |
| DMA Channels | 32 |
| Timers | 9 x 16-bit / 5 x 32-bit |
| PWM Channels | 9 output compare / 9 PWM |
| Cryptography | Hardware AES, RNG, SHA |
| Performance | 330 DMIPS / 3.28 CoreMark/MHz |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Estilo de montagem | SMD/SMT |
Configuração de pinos do PIC32MZ1024ECG100-I/PT
| Pino 1 | RC12 — General purpose I/O / port pin |
| Pino 2 | RC15 — General purpose I/O / port pin |
| Pino 3 | RD8 — General purpose I/O / port pin |
| Pino 4 | AVDD — Analog supply voltage |
| Pino 5 | AVSS — Analog ground |
| Pino 6 | OSCI — Primary crystal oscillator input |
| Pino 7 | OSCO — Primary crystal oscillator output |
| Pino 8 | VDD — Digital supply voltage |
| Pino 9 | VSS — Digital ground |
| Pino 10 | RB0 — General purpose I/O / PGEC1 |
| Pino 11 | RB1 — General purpose I/O / PGED1 |
| Pino 12 | RB2 — General purpose I/O / AN0 |
| Pino 13 | RB3 — General purpose I/O / AN1 |
| Pino 14 | RB4 — General purpose I/O / AN2 |
| Pino 15 | RB5 — General purpose I/O / AN3 |
| Pino 16 | RB6 — General purpose I/O / AN4 |
| Pino 17 | RB7 — General purpose I/O / AN5 |
| Pino 18 | RB8 — General purpose I/O / AN6 |
| Pino 19 | RB9 — General purpose I/O / AN7 |
| Pino 20 | RB10 — General purpose I/O / AN8 |
| Pino 21 | RB11 — General purpose I/O / AN9 |
| Pino 22 | RB12 — General purpose I/O / AN10 |
| Pino 23 | RB13 — General purpose I/O / AN11 |
| Pino 24 | RB14 — General purpose I/O / AN12 |
| Pino 25 | RB15 — General purpose I/O / AN13 |
| Pino 26 | VDD — Digital supply voltage |
| Pino 27 | VSS — Digital ground |
| Pino 28 | RC0 — General purpose I/O / AN14 |
| Pino 29 | RC1 — General purpose I/O / AN15 |
| Pino 30 | RC2 — General purpose I/O / AN16 |
| Pino 31 | RC3 — General purpose I/O / AN17 |
| Pino 32 | RC4 — General purpose I/O |
| Pino 33 | RC5 — General purpose I/O |
| Pino 34 | RC6 — General purpose I/O |
| Pino 35 | RC7 — General purpose I/O |
| Pino 36 | RC8 — General purpose I/O |
| Pino 37 | RC9 — General purpose I/O |
| Pino 38 | RC10 — General purpose I/O |
| Pino 39 | RC11 — General purpose I/O |
| Pino 40 | VDD — Digital supply voltage |
| Pino 41 | VSS — Digital ground |
| Pino 42 | RD0 — General purpose I/O |
| Pino 43 | RD1 — General purpose I/O |
| Pino 44 | RD2 — General purpose I/O |
| Pino 45 | RD3 — General purpose I/O |
| Pino 46 | RD4 — General purpose I/O |
| Pino 47 | RD5 — General purpose I/O |
| Pino 48 | RD6 — General purpose I/O |
| Pino 49 | RD7 — General purpose I/O |
| Pino 50 | RD9 — General purpose I/O |
| Pino 51 | RD10 — General purpose I/O |
| Pino 52 | RD11 — General purpose I/O |
| Pino 53 | RD12 — General purpose I/O |
| Pino 54 | RD13 — General purpose I/O |
| Pino 55 | RD14 — General purpose I/O |
| Pino 56 | RD15 — General purpose I/O |
| Pino 57 | VDD — Digital supply voltage |
| Pino 58 | VSS — Digital ground |
| Pino 59 | RE0 — General purpose I/O |
| Pino 60 | RE1 — General purpose I/O |
| Pino 61 | RE2 — General purpose I/O |
| Pino 62 | RE3 — General purpose I/O |
| Pino 63 | RE4 — General purpose I/O |
| Pino 64 | RE5 — General purpose I/O |
| Pino 65 | RE6 — General purpose I/O |
| Pino 66 | RE7 — General purpose I/O |
| Pino 67 | RF0 — General purpose I/O |
| Pino 68 | RF1 — General purpose I/O |
| Pino 69 | RF2 — General purpose I/O |
| Pino 70 | RF3 — General purpose I/O |
| Pino 71 | RF4 — General purpose I/O |
| Pino 72 | RF5 — General purpose I/O |
| Pino 73 | RF6 — General purpose I/O |
| Pino 74 | RF7 — General purpose I/O |
| Pino 75 | RF8 — General purpose I/O |
| Pino 76 | VDD — Digital supply voltage |
| Pino 77 | VSS — Digital ground |
| Pino 78 | RG0 — General purpose I/O |
| Pino 79 | RG1 — General purpose I/O |
| Pino 80 | RG2 — General purpose I/O |
| Pino 81 | RG3 — General purpose I/O |
| Pino 82 | RG4 — General purpose I/O |
| Pino 83 | RG5 — General purpose I/O |
| Pino 84 | RG6 — General purpose I/O |
| Pino 85 | RG7 — General purpose I/O |
| Pino 86 | RG8 — General purpose I/O |
| Pino 87 | RG9 — General purpose I/O |
| Pino 88 | VDD — Digital supply voltage |
| Pino 89 | VSS — Digital ground |
| Pino 90 | RH0 — General purpose I/O |
| Pino 91 | RH1 — General purpose I/O |
| Pino 92 | RH2 — General purpose I/O |
| Pino 93 | RH3 — General purpose I/O |
| Pino 94 | RH4 — General purpose I/O |
| Pino 95 | RH5 — General purpose I/O |
| Pino 96 | RH6 — General purpose I/O |
| Pino 97 | RH7 — General purpose I/O |
| Pino 98 | RH8 — General purpose I/O |
| Pino 99 | RH9 — General purpose I/O |
| Pino 100 | MCLR — Master clear (reset) input |
Aplicações típicas
PIC32MZ1024ECG100-I/PT é adequado para 6 aplicaçãos: Industrial IoT Gateway, Building Automation Controller, Automotive Infotainment HMI, Graphics and Touchscreen HMI, Point-of-Sale (POS) Terminal, Ethernet-Connected Motor Drive.
Industrial IoT Gateway
The PIC32MZ1024ECG100-I/PT fits industrial IoT gateways because it integrates a 10/100 Ethernet MAC, HS USB 2.0 host/device/OTG, dual CAN 2.0b and multiple UART/SPI/I2C on a single chip. At 200 MHz and 1 MB Flash / 512 KB SRAM it can run TCP/IP stacks, MQTT, and on-device analytics concurrently while supporting over-the-air firmware updates via the dual-panel live-update Flash, a key requirement for connected industrial equipment operating in the field.
Recomendado
Building Automation Controller
For HVAC and building-automation controllers the PIC32MZ1024ECG100-I/PT delivers the connectivity (Ethernet, CAN, RS-485 over UART) and processing headroom for BACnet or Modbus stacks on top of regulation loops. The 12-bit 18 Msps ADC samples multiple sensor channels directly, while the 9 PWM channels drive fan speed, damper actuators and triac-fired heater elements. Industrial -40C to +85C operation and 512 KB SRAM simplify multi-protocol gateway designs.
Recomendado
Automotive Infotainment HMI
The 200 MHz MIPS32 core, 1 MB Flash and 78 I/O pins make the PIC32MZ1024ECG100-I/PT a fit for automotive HMI / infotainment head units driving TFT displays with touch overlays. HS USB 2.0 enables media and phone-mirroring connections, I2S supports external audio codecs, and the 12-bit ADC handles backlight and temperature monitoring. For higher temperature (-40C to +105C automotive) designs, the same-family PIC32MZ1024ECG100-V/PT keeps the same footprint.
Recomendado
Graphics and Touchscreen HMI
The PIC32MZ1024ECG100-I/PT's 200 MHz performance, 1 MB Flash and 512 KB SRAM allow it to render direct-drive TFT-LCD or drive external graphics controllers with rich HMI assets. Its integrated SQI (Serial Quad Interface) supports high-throughput external Flash for asset storage and screen buffering, while I2S routes digital audio. Combined with capacitive-touch controllers, it delivers responsive industrial-panel UIs at modest cost.
Recomendado
Point-of-Sale (POS) Terminal
POS terminals benefit from the PIC32MZ1024ECG100-I/PT's Ethernet for LAN connectivity, USB host for keyboards/scanners, hardware AES/SHA for payment encryption, and 1 MB Flash to host application code plus customer-facing UI logic. The 78 I/O pins easily handle printers, NFC readers, displays and keypads from a single MCU, and the dual-panel Flash simplifies regulatory firmware-update certification.
Recomendado
Ethernet-Connected Motor Drive
The PIC32MZ1024ECG100-I/PT is well suited for networked motor drives because it pairs 9 PWM channels and a 12-bit 18 Msps ADC for field-oriented control (FOC) with an integrated Ethernet MAC for industrial networking (EtherNet/IP, Modbus TCP). 512 KB SRAM accommodates state estimators and communication buffers without external memory, while 32 DMA channels offload time-critical sample transfers from the CPU.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ1024ECG100-I/PT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ1024ECG100T-I/PT | PIC32MZ1024ECG100-I/PF | PIC32MZ1024ECG100-E/PT | PIC32MZ1024ECG100-V/PT | PIC32MZ1024EFG100-I/PT |
|---|---|---|---|---|---|---|
| Package | 100-pin TQFP (12x12 mm) | 100-pin TQFP (12x12 mm) - same | 100-pin TQFP (14x14 mm) | 100-pin TQFP (12x12 mm) - same | 100-pin TQFP (12x12 mm) - same | 100-pin TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 180 MHz | 252 MHz |
| Program Memory (Flash) | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +105C (Automotive) | -40C to +85C (Industrial) |
| FPU | No | No | No | No | No | Yes (double-precision) |
| Lifecycle Status | NRND | NRND | NRND | Active | Active | Active |
| Approx. Unit Price (USD, 100+ qty) | ~$14.50 | ~$14.50 | ~$14.50 | ~$16.00 | ~$15.50 | ~$15.00 |
Principais diferenciais
- Dual-panel Flash with live update (vs PIC32MX795F512L-80I/PT)
- On-chip Ethernet MAC and HS USB 2.0 (vs PIC32MX575F512L-80I/PT)
- 12-bit 18 Msps ADC (vs PIC32MX764F128L-I/PT)
Notas de projeto
Estimated: at 200 MHz with all peripherals active, the PIC32MZ1024ECG100-I/PT typical core current is roughly 80-100 mA from VDD (2.2V-3.6V). Place one 100 nF decoupling capacitor within 3 mm of every VDD/VSS pair and one bulk 4.7 uF ceramic on each VDD rail. Place the AVDD pin decoupling (10 uF + 100 nF) close to the analog supply to keep ADC SNR within datasheet specs.
Route the Ethernet MII/RMII signals on an inner layer with ground reference, keeping pair-to-pair length mismatch under 50 mil for the 25 MHz RMII reference clock and 100 ohm differential impedance for MII signals. Place the 12 MHz crystal within 8 mm of OSCI/OSCO (pins 6-7), guard-ring the crystal traces with ground, and avoid routing signals under the crystal. Per IEEE 802.3, isolate analog ground (AVSS) from digital ground (VSS) with a single-point connection under the IC.
Do not omit the MCLR pull-up on pin 100; an unconfigured MCLR causes the part to fail programming via ICSP. When using the dual-panel live-update feature, partition the Flash such that the bootloader occupies a fixed region of panel 0 - misallocation causes OTA corruption. The HS USB 2.0 ULPI/PHY interface requires a 48 MHz reference clock on REFO; without it the USB enumeration fails silently. Finally, expose only pins needed to external traces - the TQFP-100 12x12 mm body has fine 0.5 mm pitch leads vulnerable to solder bridges during reflow.
Estimated: the TQFP-100 12x12 mm package has a typical theta_JA of approximately 45 C/W on a 4-layer JEDEC test board with no airflow. At 1.0 W dissipation this yields a 45 C junction-temperature rise above ambient; at 85 C ambient the junction reaches 130 C, within the -I industrial 85 C spec. For continuous full-speed operation in a sealed enclosure, derate peripheral use, add a copper thermal pad under the exposed die attach area, or consider migrating to the -E variant rated to 125 C.
Informações de conformidade
RoHS and lead-free per Microchip ordering information. Standard -I industrial grade is not AEC-Q100 qualified - choose /V variant for AEC-Q100 Grade 2 automotive. Halogen-free status not explicitly published; default to unknown.
