PIC32MZ1024ECM064-I/MR - 200MHz 32-bit MCU 1MB Flash | Microchip
N.º da peça: PIC32MZ1024ECM064-I/MR ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.45 | $9,45 |
| 10 | $8.85 | $88,50 |
| 100 | $7.95 | $795,00 |
| 500 | $7.1 | $3.550,00 |
| 1.000 | $6.4 | $6.400,00 |
PIC32MZ1024ECM064-I/MR Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and programmable peripherals around a common bus. The PIC32MZ EC family sits in the high-performance tier of Microchip's 32-bit portfolio, positioned between mainstream Cortex-M4/M7 parts and dedicated application processors. Within the broader hierarchy, the PIC32MZ EC is a microcontroller -> 32-bit MCU -> MIPS-based MCU -> embedded connectivity MCU -> semiconductor IC.
Key differentiating features include the hardware crypto engine for AES, 3DES, SHA, and MD5 acceleration, a Hi-Speed USB 2.0 OTG controller with integrated PHY, a 10/100 Mbps Ethernet MAC with RMII/MII interface, and six UART, four I2C, and four SPI peripherals for multi-bus connectivity. The dual-panel Flash architecture enables live firmware updates without CPU stall, critical for industrial and IoT applications that must remain online during OTA rollouts.
The microAptiv core includes a DSP-enhanced pipeline with four 64-bit accumulators, single-cycle MAC, and saturating/fractional math, enabling real-time audio, motor control, and signal-processing workloads. The integrated FPU is absent on this part, but floating-point emulation runs efficiently in microMIPS mode. The 28-channel, 12-bit 1.2 MSPS ADC paired with six analog comparators supports precision sensor acquisition in motor control and instrumentation front-ends.
Typical applications include industrial Ethernet gateways, USB-enabled HMI panels, secure IoT edge nodes with TLS offload, motor control BLDC/PMSM drives, and audio processing front-ends that benefit from the live-update Flash. The 64-VQFN package with 9x9 mm footprint also suits space-constrained designs where TQFP would be impractical. Cryptographic acceleration and TRNG make the EC family a fit for any connected device requiring hardware-rooted identity and TLS 1.2/1.3 handshake acceleration.
When designing with this MCU, allocate decoupling capacitance of at least 0.1 microfarad per Vdd/Vss pair placed within 5 mm of the supply pins, and provide a 12 MHz primary crystal or resonator to drive the PLL that synthesizes the 200 MHz system clock. Do not exceed 3.6 V on any I/O pin; 5 V tolerant pins must be configured and treated as high-voltage inputs only.
This page synthesizes distributor pricing, drop-in same-package alternatives within the PIC32MZ EC family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC32MZ1024ECM064-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ1024ECM064-I/MR (mesmo formato e footprint) — diferindo em ADC, Package, DMA Channels, Ethernet, I/O Pins.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ1024ECM064-E/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1024ECG064-I/MR
✅ Drop-In✓ Em estoque
$8.9 / unidade
Ver ficha técnica →PIC32MZ0512EFK064T-I/MR
✅ Drop-In✓ Em estoque
$5.93 / unidade
Ver ficha técnica →PIC32MZ1024ECG064-I/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1024ECH064-I/PT
✅ Drop-In✓ Em estoque
$7.2 / unidade
Ver ficha técnica →PIC32MX795F512H-80V/MR
✅ Drop-In✓ Em estoque
$8.92 / unidade
Ver ficha técnica →PIC32MZ1024ECM064-I/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv (PIC32MZ) |
| Core Frequency | 200 MHz max |
| Performance | 330 DMIPS, 3.28 CoreMark/MHz |
| Program Flash | 1 MB (1024 KB) |
| Boot Flash | 160 KB (additional) |
| SRAM | 512 KB |
| Operating Voltage | 2.2 V to 3.6 V |
| I/O Pins | 53 (approx.) |
| Encapsulamento | 64-VQFN (9x9 mm) |
| Tipo de montagem | Surface Mount |
| Temperature Range | -40 C to +85 C (Industrial) |
| ADC | 12-bit, up to 28 channels, 1.2 MSPS |
| USB | Hi-Speed USB 2.0 OTG with integrated PHY |
| Ethernet | 10/100 Mbps MAC (RMII/MII) |
| Crypto Engine | AES, 3DES, SHA, MD5, RNG |
| UART / I2C / SPI | 6 / 4 / 4 |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MZ1024ECM064-I/MR
| Pino 1 | RGND — Reference ground for Ethernet PHY |
| Pino 2 | VSS — Digital ground |
| Pino 3 | VDD — Digital supply 2.2-3.6 V |
| Pino 4 | AN0/CVD0 — Analog input 0 / ADC CVD |
| Pino 5 | AN1/CVD1 — Analog input 1 / ADC CVD |
| Pino 6 | AN2/CVD2 — Analog input 2 / ADC CVD |
| Pino 7 | AN3/CVD3 — Analog input 3 / ADC CVD |
| Pino 8 | AN4 — Analog input 4 |
| Pino 9 | AN5 — Analog input 5 |
| Pino 10 | AN6 — Analog input 6 |
| Pino 11 | AN7 — Analog input 7 |
| Pino 12 | AVSS — Analog ground |
| Pino 13 | AVDD — Analog supply |
| Pino 14 | VREF+ — ADC voltage reference positive |
| Pino 15 | VREF- — ADC voltage reference negative |
| Pino 16 | AERFDN/CVD4 — Analog/Ethernet ref or CVD4 |
| Pino 17 | SCL1 — I2C1 clock |
| Pino 18 | SDA1 — I2C1 data |
| Pino 19 | SCL2 — I2C2 clock |
| Pino 20 | SDA2 — I2C2 data |
| Pino 21 | U1RX — UART1 receive |
| Pino 22 | U1TX — UART1 transmit |
| Pino 23 | U1CTS — UART1 clear-to-send |
| Pino 24 | U1RTS — UART1 request-to-send |
| Pino 25 | U2RX — UART2 receive |
| Pino 26 | U2TX — UART2 transmit |
| Pino 27 | U3RX — UART3 receive |
| Pino 28 | U3TX — UART3 transmit |
| Pino 29 | U4RX — UART4 receive |
| Pino 30 | U4TX — UART4 transmit |
| Pino 31 | SDO1 — SPI1 data out |
| Pino 32 | SDI1 — SPI1 data in |
| Pino 33 | SCK1 — SPI1 clock |
| Pino 34 | SS1 — SPI1 slave select |
| Pino 35 | SDO2 — SPI2 data out |
| Pino 36 | SDI2 — SPI2 data in |
| Pino 37 | SCK2 — SPI2 clock |
| Pino 38 | SS2 — SPI2 slave select |
| Pino 39 | OC1 — Output compare 1 / PWM |
| Pino 40 | OC2 — Output compare 2 / PWM |
| Pino 41 | OC3 — Output compare 3 / PWM |
| Pino 42 | OC4 — Output compare 4 / PWM |
| Pino 43 | OC5 — Output compare 5 / PWM |
| Pino 44 | OC6 — Output compare 6 / PWM |
| Pino 45 | IC1 — Input capture 1 |
| Pino 46 | IC2 — Input capture 2 |
| Pino 47 | IC3 — Input capture 3 |
| Pino 48 | IC4 — Input capture 4 |
| Pino 49 | TMS — JTAG test mode select |
| Pino 50 | TCK — JTAG test clock |
| Pino 51 | TDI — JTAG test data in |
| Pino 52 | TDO — JTAG test data out |
| Pino 53 | MCLR — Master clear reset |
| Pino 54 | OSC1 — Crystal oscillator input |
| Pino 55 | OSC2 — Crystal oscillator output |
| Pino 56 | SOSC1 — Secondary oscillator input |
| Pino 57 | SOSC2 — Secondary oscillator output |
| Pino 58 | VBUS — USB VBUS sense |
| Pino 59 | D+ — USB D+ data line |
| Pino 60 | D- — USB D- data line |
| Pino 61 | VUSB3V3 — USB internal 3.3 V LDO bypass |
| Pino 62 | ETHREFCLK — Ethernet reference clock |
| Pino 63 | ERXD0 — Ethernet RX data 0 |
| Pino 64 | EPAD — Exposed thermal pad - connect to VSS |
Aplicações típicas
PIC32MZ1024ECM064-I/MR é adequado para 6 aplicaçãos: Industrial Ethernet Gateway, USB-Enabled HMI Touch Panel, Secure IoT Edge Node, BLDC / PMSM Motor Control, Audio Processing Front-End, Connected Medical Sensor Hub.
Industrial Ethernet Gateway
The PIC32MZ1024ECM064-I/MR fits industrial Ethernet gateway designs because it integrates a 10/100 Mbps MAC with RMII/MII PHY interface and a 200 MHz MIPS32 microAptiv core that closes TCP/IP and TLS handshake workloads in real time. The hardware AES/SHA crypto engine offloads TLS 1.2 handshakes and bulk data encryption, while 512 KB SRAM holds large packet buffers without external memory. Live-update dual-panel Flash lets the gateway apply security patches without rebooting the connected plant - critical for Industry 4.0 uptime targets. Reference companion parts include Microchip's KSZ8081 Ethernet PHY and ATECC608B secure element for certificate storage.
Recomendado
USB-Enabled HMI Touch Panel
The PIC32MZ1024ECM064-I/MR is a strong fit for USB-connected HMI panels thanks to its integrated Hi-Speed USB 2.0 OTG controller with on-chip PHY, eliminating the external PHY and saving roughly 1.5 square centimeters of PCB area versus discrete solutions. The 200 MHz MIPS core drives color TFT displays up to WVGA resolution through the parallel PMP interface while servicing USB HID/touch events. The 12-bit 1.2 MSPS ADC samples touch-sensing electrodes for projected-capacitive touch overlays. Reference companion parts include the FT813 graphics controller for TFT bridging and a TSC2007 resistive touch controller.
Recomendado
Secure IoT Edge Node
The PIC32MZ1024ECM064-I/MR fits secure IoT edge nodes because the on-chip crypto engine accelerates AES-256, SHA-256, and TLS 1.2/1.3 PRNG operations in hardware, offloading the CPU and enabling sub-100 ms cloud handshake latency. The integrated TRNG seeds device-unique keys, while the 1 MB Flash stores TLS stacks, MQTT-SN clients, and OTA payloads. Six UART and four I2C peripherals simultaneously host sensor buses, modem modules, and debug consoles. Reference companion parts include the ATECC608B secure element and a SUB-1 GHz or LoRa transceiver such as the SX1276.
Recomendado
BLDC / PMSM Motor Control
The PIC32MZ1024ECM064-I/MR is well suited to BLDC and PMSM motor drives because the 200 MHz microAptiv core executes single-cycle MAC operations that close field-oriented control (FOC) loops well under 10 microseconds, supporting sensorless FOC for motors up to several kilowatts. The 12-bit 1.2 MSPS ADC samples phase currents at the PWM center point for minimum ripple, while six analog comparators deliver hardware over-current protection independent of the CPU. Center-aligned complementary PWM with dead-band insertion prevents shoot-through on the three-phase inverter. Reference companion parts include the IRS2003S gate driver and ACS712 current sensor.
Recomendado
Audio Processing Front-End
The PIC32MZ1024ECM064-I/MR fits audio processing front-ends because its DSP-enhanced microAptiv pipeline with four 64-bit accumulators and single-cycle MAC executes 16/32-bit audio DSP kernels - filters, equalizers, and codecs - with low interrupt latency. microMIPS mode compresses audio code by up to 35%, leaving more Flash headroom for soundbanks. The I2S peripheral streams 48 kHz / 24-bit audio to external DACs while the 12-bit ADC captures microphone arrays. Reference companion parts include the SGTL5000 audio codec and an external Class-D amplifier such as the TPA3116D2.
Recomendado
Connected Medical Sensor Hub
The PIC32MZ1024ECM064-I/MR supports connected medical sensor hubs because it integrates USB OTG for tethering to a host PC, Ethernet MAC for bedside monitoring network drops, and a 1.2 MSPS ADC that captures multiple bio-sensor channels at high sample rates. The hardware crypto engine secures patient data over TLS links to comply with HIPAA-grade expectations. Live-update dual-panel Flash lets certified firmware stay current without service windows. Reference companion parts include the ADS1292 medical-grade ECG AFE and an SPX3819 low-noise LDO for analog rails.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ1024ECM064-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ1024ECM064-E/MR | PIC32MZ1024ECG064-I/MR | PIC32MZ0512EFK064T-I/MR | PIC32MX795F512H-80V/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (MR-style) - same | 64-VQFN (MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 252 MHz (+26%) | 80 MHz (-60%) |
| Program Flash | 1 MB (1024 KB) | 1 MB | 1 MB | 512 KB (-50%) | 512 KB (-50%) |
| SRAM | 512 KB | 512 KB | 512 KB | 128 KB (-75%) | 128 KB (-75%) |
| USB | Hi-Speed USB OTG | Hi-Speed USB OTG | Hi-Speed USB OTG | Hi-Speed USB OTG | Full-Speed USB only |
| Ethernet MAC | 10/100 Mbps RMII/MII | 10/100 Mbps RMII/MII | 10/100 Mbps RMII/MII | 10/100 Mbps RMII/MII | None |
| Crypto Engine | AES/3DES/SHA/MD5 + TRNG | AES/3DES/SHA/MD5 + TRNG | AES/3DES/SHA/MD5 + TRNG | AES/3DES/SHA/MD5 + TRNG | None (software only) |
| Temperature Grade | Industrial -40 to +85 C | Extended -40 to +125 C | Industrial -40 to +85 C | Industrial -40 to +85 C | Industrial -40 to +85 C |
| Lifecycle | NRND | NRND | NRND | Active | Active |
Principais diferenciais
- Highest Flash density in 64-VQFN PIC32MZ EC family (vs PIC32MZ0512EFK064T-I/MR)
- Live-update dual-panel Flash (vs PIC32MX795F512H-80V/MR)
- On-chip crypto engine with TRNG (vs PIC32MX795F512H-80V/MR)
- Hi-Speed USB OTG with on-chip PHY (vs PIC32MX795F512H-80V/MR)
Notas de projeto
Place 0.1 microfarad X7R ceramic decoupling capacitors within 5 mm of every Vdd/Vss pair (typically 4-5 pairs on the 64-VQFN layout) and add a single 4.7 microfarad bulk tantalum or ceramic close to the highest-current Vdd pin. The 200 MHz core draws transient currents up to 200 mA during instruction fetches; inadequate bulk decoupling causes Vdd droop and brown-out resets. Keep analog AVDD isolated from digital VDD with a ferrite bead and provide separate decoupling on the AVSS/AVDD pair to preserve ADC accuracy.
The 64-VQFN package has an exposed thermal pad (EPAD, pin 64) that MUST be soldered to a VSS copper pour of at least 1 square centimeter to meet thermal dissipation targets and provide a low-inductance ground return. Do not route signal traces under the EPAD; instead, use thermal vias on a 1.0 mm grid connecting the EPAD to an internal VSS plane. The QFN layout footprint should follow IPC-7351 nominal density with a 0.5 mm pitch land pattern - deviation causes solder bridging between adjacent pins.
Estimated: at 200 MHz full-load with all peripherals active (USB, Ethernet, ADC), the PIC32MZ1024ECM064-I/MR draws approximately 80 mA from 3.3 V, or 264 mW. With a 64-VQFN on a 1 sq-inch 4-layer copper pour, theta_JA is around 30 C/W, giving a 8 C temperature rise above ambient. The industrial -40 to +85 C temperature grade supports 85 C ambient with margin; for 125 C extended-temperature designs choose the -E/MR variant. Provide airflow in enclosed housings to keep junction below 125 C.
Do not apply 5 V to any GPIO - the absolute maximum is 3.6 V and 5 V will permanently damage I/O cells. Configure unused I/O as outputs driving low, not as inputs floating, to avoid spurious interrupts. When using the Ethernet MAC, the ERXD/ETXD traces must be length-matched within 50 mils to the PHY and routed with 50 ohm controlled impedance. The VBUS USB pin requires a 10 kohm pull-down even when USB is unused, or the device may enter an undefined state.
Route the 12 MHz primary crystal traces (OSC1/OSC2) as short as possible, surrounded by a ground guard trace, and keep them away from switching signals like PWM or USB. The crystal load capacitors (typically 15-22 pF) should connect to a quiet ground plane rather than digital VSS noise. For EMI, place a pi-filter (ferrite + capacitor + capacitor) on each external cable connection (USB, Ethernet) and keep the digital section of the PCB at least 10 mm from these connectors.
Informações de conformidade
RoHS and lead-free confirmed by Microchip product page. The PIC32MZ EC family is not AEC-Q100 qualified; for automotive applications consult Microchip about PIC32MZ EF automotive part numbers. REACH compliance follows EU regulations per Microchip standard policy.
