PIC32MZ1024ECG064-I/MR - 200MHz 32-bit MCU 1MB Flash 64-VQFN | Microchip
N.º da peça: PIC32MZ1024ECG064-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $12.85 | $128,50 |
| 100 | $11.4 | $1.140,00 |
| 500 | $10.05 | $5.025,00 |
| 1.000 | $8.9 | $8.900,00 |
PIC32MZ1024ECG064-I/MR Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a wide range of programmable peripherals on one die. Within the broader taxonomy, an MCU is a sub-class of microprocessors that adds on-chip memory and I/O, which itself belongs to the category of embedded processors and, ultimately, semiconductors. The 32-bit class (vs. 8-bit and 16-bit) targets applications that require large code space, high-throughput DSP/algorithm workloads, rich connectivity stacks (Ethernet, USB, CAN), and graphical user interfaces.
Key features include Peripheral Pin Select (PPS) for flexible function remapping, 8 hardware-programmable DMA channels plus 12 dedicated DMA channels with automatic data-size detection, a 12-bit ADC, and 5V-tolerant I/O when configured as inputs (outputs are 3.3V). The dual-panel Flash architecture enables live firmware updates without halting the application, which is critical for industrial and IoT devices that must remain in service across the upgrade. Operating temperature is industrial-grade -40C to +85C.
The PIC32MZ EC family is built on a superscalar MIPS core with a tightly-coupled prefetch cache and a dedicated Flash controller, which delivers deterministic interrupt latency and high code density. The integrated Ethernet MAC plus USB High-Speed OTG removes the need for external connectivity ICs in many designs, while the SQI interface enables external serial NOR Flash up to 80 MB/s for additional code or data storage.
Typical applications include industrial Ethernet gateways, USB host/device peripherals, embedded HMI with TFT displays, IoT edge nodes with secure firmware update, motor control, and high-speed data acquisition. The PIC32MZ1024ECG064-I/MR is well suited to any of these where 1 MB code space, 512 KB RAM and high-throughput connectivity are simultaneously required.
When designing with this device, note that the core supply is 2.3V-3.6V; a clean 3.3V rail with adequate bulk decoupling is essential. Multiple PGECx/PGEDx pairs are available - any pair may be used, but both pins of a chosen pair must be used together for ICSP.
This page synthesizes distributor pricing, package-specific drop-in alternatives, and practical design notes drawn from the Microchip datasheet and reference manual.
Alternativas drop-in para PIC32MZ1024ECG064-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ1024ECG064-I/MR (mesmo formato e footprint) — diferindo em ADC, Package, USB, Ethernet, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ1024ECG064T-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1024ECG064-E/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1024ECG064-V/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1024ECG064-I/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv |
| Core Clock Speed (max) | 200 MHz |
| Performance | 330 DMIPS, 3.28 CoreMark/MHz |
| Program Flash | 1 MB (dual-panel, live-update) |
| SRAM | 512 KB |
| Encapsulamento | 64-pin VQFN (MR), 9x9 mm |
| Contagem de pinos | 64 |
| Tensão de alimentação | 2.3 V to 3.6 V |
| I/O Logic Levels | 5 V tolerant inputs, 3.3 V outputs |
| ADC | 12-bit |
| DMA Channels | 8 programmable + 12 dedicated |
| Connectivity | USB 2.0 High-Speed OTG, 10/100 Ethernet MAC, SQI |
| RTCC | Yes (Real-Time Clock Calendar) |
| Peripheral Pin Select (PPS) | Yes |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MZ1024ECG064-I/MR
| Pino 1 | RB14 — General purpose I/O with PPS |
| Pino 2 | RB15 — General purpose I/O with PPS |
| Pino 3 | AN0/CVD7/RP13 — Analog input 0 / PPS remappable RP13 |
| Pino 4 | AN1/CVD8/RP14 — Analog input 1 / PPS remappable RP14 |
| Pino 5 | AN2/CVD9/RP15 — Analog input 2 / PPS remappable RP15 |
| Pino 6 | AN3/RP16 — Analog input 3 / PPS remappable RP16 |
| Pino 7 | AN4/RP17 — Analog input 4 / PPS remappable RP17 |
| Pino 8 | VREF+/CVREF+ — ADC voltage reference positive input |
| Pino 9 | VREF-/CVREF- — ADC voltage reference negative input |
| Pino 10 | AVDD — Analog supply voltage |
| Pino 11 | AVSS — Analog ground |
| Pino 12 | AN5 — Analog input 5 |
| Pino 13 | AN6 — Analog input 6 |
| Pino 14 | AN7 — Analog input 7 |
| Pino 15 | AN8/RP18 — Analog input 8 / PPS remappable RP18 |
| Pino 16 | AN9/RP19 — Analog input 9 / PPS remappable RP19 |
| Pino 17 | AN10/RP20 — Analog input 10 / PPS remappable RP20 |
| Pino 18 | AN11/RP21 — Analog input 11 / PPS remappable RP21 |
| Pino 19 | AN12/RP22 — Analog input 12 / PPS remappable RP22 |
| Pino 20 | AN13/RP23 — Analog input 13 / PPS remappable RP23 |
| Pino 21 | AN14/RP24 — Analog input 14 / PPS remappable RP24 |
| Pino 22 | AN15/RP25 — Analog input 15 / PPS remappable RP25 |
| Pino 23 | VDD — Digital supply voltage |
| Pino 24 | VSS — Digital ground |
| Pino 25 | OSC1/RC1 — Crystal oscillator input / external clock input |
| Pino 26 | OSC2/RC2 — Crystal oscillator output |
| Pino 27 | RC3 — General purpose I/O |
| Pino 28 | RC4 — General purpose I/O |
| Pino 29 | RC5 — General purpose I/O |
| Pino 30 | RC6 — General purpose I/O |
| Pino 31 | RC7 — General purpose I/O |
| Pino 32 | RC8 — General purpose I/O |
| Pino 33 | RC9 — General purpose I/O |
| Pino 34 | PGEC1 — In-circuit Serial Programming clock 1 |
| Pino 35 | PGED1 — In-circuit Serial Programming data 1 |
| Pino 36 | VSS — Digital ground |
| Pino 37 | VDD — Digital supply voltage |
| Pino 38 | RD0 — General purpose I/O |
| Pino 39 | RD1 — General purpose I/O |
| Pino 40 | RD2 — General purpose I/O |
| Pino 41 | RD3 — General purpose I/O |
| Pino 42 | RD4 — General purpose I/O |
| Pino 43 | RD5 — General purpose I/O |
| Pino 44 | RD6 — General purpose I/O |
| Pino 45 | RD7 — General purpose I/O |
| Pino 46 | RD8 — General purpose I/O |
| Pino 47 | RD9 — General purpose I/O |
| Pino 48 | RD10 — General purpose I/O |
| Pino 49 | RD11 — General purpose I/O |
| Pino 50 | VSS — Digital ground |
| Pino 51 | VDD — Digital supply voltage |
| Pino 52 | RB0 — General purpose I/O |
| Pino 53 | RB1 — General purpose I/O |
| Pino 54 | RB2 — General purpose I/O |
| Pino 55 | RB3 — General purpose I/O |
| Pino 56 | RB4 — General purpose I/O |
| Pino 57 | RB5 — General purpose I/O |
| Pino 58 | RB6 — General purpose I/O |
| Pino 59 | RB7 — General purpose I/O |
| Pino 60 | RB8 — General purpose I/O |
| Pino 61 | RB9 — General purpose I/O |
| Pino 62 | RB10 — General purpose I/O |
| Pino 63 | RB11 — General purpose I/O |
| Pino 64 | RB12 — General purpose I/O |
Aplicações típicas
PIC32MZ1024ECG064-I/MR é adequado para 6 aplicaçãos: Industrial Ethernet Gateway, USB Host/Device Embedded Peripheral, Embedded HMI with TFT Display, IoT Edge Node with Secure Firmware Update, High-Speed Data Acquisition Front-End, Motor Control and Industrial Drive.
Industrial Ethernet Gateway
The PIC32MZ1024ECG064-I/MR fits industrial Ethernet gateways because it integrates a 10/100 Ethernet MAC, 200 MHz MIPS core (330 DMIPS), and 512 KB SRAM - enough headroom for lwIP + TCP/IP plus Modbus/Profinet stacks. Its 64-pin VQFN footprint keeps the PCB compact while leaving ample GPIO for serial, CAN or RS-485 links. The industrial -40 C to +85 C temperature grade allows deployment in factory-floor cabinets without derating.
Recomendado
USB Host/Device Embedded Peripheral
The integrated USB 2.0 High-Speed OTG controller makes the PIC32MZ1024ECG064-I/MR a natural fit for USB peripherals such as data loggers, programming dongles, HID devices and USB-to-UART bridges. 512 KB SRAM buffers High-Speed isochronous endpoints comfortably, and the 1 MB dual-panel Flash lets you ship firmware update tools that re-flash via USB without an external programmer. PPS reassigns USB pins around board constraints.
Recomendado
Embedded HMI with TFT Display
For embedded HMI panels, the PIC32MZ1024ECG064-I/MR delivers 330 DMIPS at 200 MHz - enough to drive a small TFT via PMP/parallel interface, render menus, and handle touch input in real time. The 1 MB Flash stores fonts, images and UI assets, while 512 KB SRAM holds frame buffers. PPS remaps the parallel data lines to spare pins, simplifying PCB layout around the display connector.
Recomendado
IoT Edge Node with Secure Firmware Update
The dual-panel Flash architecture is the PIC32MZ1024ECG064-I/MR's headline advantage for IoT edge nodes: one Flash bank can be erased and reprogrammed while the other runs the application, enabling live firmware updates without downtime. Combined with Ethernet or USB connectivity and 512 KB SRAM, this supports OTA upgrades in installed-base devices like smart meters, building automation controllers and remote sensors.
Recomendado
High-Speed Data Acquisition Front-End
The PIC32MZ1024ECG064-I/MR suits high-speed data acquisition front-ends thanks to its 12-bit ADC, 8 programmable + 12 dedicated DMA channels, and 200 MHz core for on-chip DSP/filtering. Streaming ADC data over USB High-Speed or Ethernet to a host PC is feasible given 512 KB SRAM buffering. PPS keeps analog and digital signal paths isolated by remapping digital functions away from sensitive analog pins.
Recomendado
Motor Control and Industrial Drive
In motor control and small industrial drives the PIC32MZ1024ECG064-I/MR's 200 MHz MIPS core runs field-oriented control (FOC) loops within the PWM period of typical 3-phase inverters. Its 12-bit ADC captures phase currents via synchronized sampling, and PPS routes PWM, QEI and fault inputs to convenient pins. The 64-pin VQFN keeps the controller board small enough to integrate inside an integrated servo or BLDC drive module.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ1024ECG064-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ1024ECG064T-I/MR | PIC32MZ1024ECG064-E/MR | PIC32MZ1024ECG064-V/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (MR, 9x9 mm) | 64-VQFN (MR, 9x9 mm) - same | 64-VQFN (MR, 9x9 mm) - same | 64-VQFN (MR, 9x9 mm) - same |
| Core Clock (max) | 200 MHz | 200 MHz | 200 MHz | 180 MHz |
| Flash | 1 MB dual-panel | 1 MB dual-panel | 1 MB dual-panel | 1 MB dual-panel |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) |
| USB 2.0 HS OTG | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated |
| Packaging Form | Tray | Tape & Reel | Tray (Extended temp) | Tray (180 MHz) |
| Pinout Compatibility | Reference | Drop-in identical | Drop-in identical | Drop-in identical |
Principais diferenciais
- Dual-panel live-update Flash at 200 MHz in 64-pin VQFN (vs PIC32MX570F512H-I/MR)
- Integrated 10/100 Ethernet MAC and USB 2.0 High-Speed OTG (vs PIC32MX470F512H-I/MR)
- Industrial-grade -40 C to +85 C with full Peripheral Pin Select remap (vs PIC32MZ1024ECG064-V/MR (180 MHz variant))
Notas de projeto
The PIC32MZ1024ECG064-I/MR core supply is 2.3 V to 3.6 V (decoded 2.3 V - 3.6 V). Use a low-dropout 3.3 V regulator with at least 200 mA actual supplies. Place a 10 uF bulk plus 0.1 uF ceramic decoupling capacitor on each VDD pin pair, and route a star ground with separate analog/digital returns converging at the exposed thermal pad. AVSS and VSS must be tied together at one point only.
At 200 MHz with all peripherals active, the device can dissipate around 400 mW. The 64-pin VQFN 9x9 mm package depends on its exposed thermal pad for heat removal. Solder the e-pad to a continuous ground copper pour on top and inner layers, with at least 25 thermal vias to the opposite copper plane. Without this, junction temperature can exceed 125 C in a sealed enclosure.
Route the analog signals (ANx, VREF+/-, AVSS) away from switching digital lines and PWM outputs to preserve ADC accuracy. Use PPS to remap noisy digital functions (timer outputs, PWM, SPI clocks) onto pins physically separated from analog inputs. Place a guard ring connected to AVSS around the analog section for best 12-bit ADC performance.
When using ICSP, any of the multiple PGECx/PGEDx pin pairs may be used, but both pins of the selected pair must be wired together - you cannot mix PGEC1 with PGED2. Forgetting this is a frequent cause of programmer-not-detected failures on first prototypes.
If USB High-Speed is used, the 90 ohm differential D+/D- traces must be length-matched within 150 mil and routed over a continuous ground plane. The USB DP/DN pins on the PIC32MZ are not ULPI; for true High-Speed (480 Mbps) an external ULPI PHY such as USB3300 is required - the integrated transceiver is Full-Speed-capable without PHY.
Informações de conformidade
Industrial -I grade (not AEC-Q100 qualified - choose PIC32MZ1024ECG064-E/MR for automotive-adjacent extended temperature). RoHS and REACH compliant per Microchip product page.
