PIC32MZ1024EFM100T-E/GJX - 200MHz 32-bit MCU 1MB Flash | Microchip
N.º da peça: PIC32MZ1024EFM100T-E/GJX ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.85 | $1.185,00 |
| 500 | $10.6 | $5.300,00 |
| 1.000 | $9.45 | $9.450,00 |
PIC32MZ1024EFM100T-E/GJX Visão geral
A 32-bit microcontroller (MCU) is a programmable processor that integrates CPU core, memory, and a rich set of peripherals into a single chip. Within the broader hierarchy, an MCU belongs to microcontrollers -> integrated circuits -> electronic components. The PIC32MZ EF family specifically targets connectivity-heavy applications such as industrial control, automotive infotainment, IoT gateways, HMI/graphics, and motor control where on-chip Ethernet, USB-HS, and CAN reduce BOM cost and PCB area.
Key features include 1 MB Flash, 512 KB SRAM, MIPS32 M-Class core with FPU, 200 MHz operation, hardware crypto engine (AES, DES, SHA, RNG), 10/100 Ethernet MAC with RMII/MII interface, USB 2.0 High-Speed OTG with on-chip HS PHY, dual CAN 2.0b modules, SQI (Serial Quad Interface) for external Flash, and a 12-bit 18 MSPS ADC. The TFBGA-100 package supports low-pin-count designs while exposing 78 GPIO, 8 UART, 6 SPI, 5 I2C, and a parallel master port (PMP) for graphics.
The architecture uses a 5-stage pipelined MIPS32 core with DSP extensions, separate instruction and data caches, tightly-coupled prefetch buffer, and a multi-layer AHB/APB bus matrix that delivers high peripheral throughput without CPU stalls. The crypto and connectivity accelerators offload Ethernet, USB, and AES/SHA workloads, making the device well-suited for secure connected nodes at industrial throughputs.
Typical applications include industrial Ethernet IO modules, automotive CAN gateways with diagnostics, secure IoT edge nodes with TLS acceleration, USB-HS device/HMI controllers, and graphical HMI panels with resistive-touch sensing. Wide temperature range and AEC-Q100-grade process options support both factory-floor and cabin-mounted deployments.
When designing with the PIC32MZ1024EFM100T-E/GJX, allocate sufficient PCB area for TFBGA fanout, follow Microchip's EMI/ESD layout guidelines for USB-HS and CAN, and provide a clean 3.3V rail with bulk decoupling near each supply pin. The integrated FPU and DSP extensions should be leveraged through MPLAB XC32 with -O2/-Ofast optimization to reach the 252 MHz core equivalent DMIPS throughput.
This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC32MZ EF family, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for part selection, qualification, and sourcing.
Alternativas drop-in para PIC32MZ1024EFM100T-E/GJX — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ1024EFM100T-E/GJX (mesmo formato e footprint) — diferindo em Package, Core Architecture, Operating Temperature, ADC, FPU.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ1024EFM100-E/GJX
✅ Drop-In✓ Em estoque
$9.4 / unidade
Ver ficha técnica →PIC32MZ1024EFM100-I/GJX
✅ Drop-In✓ Em estoque
$8.05 / unidade
Ver ficha técnica →PIC32MZ1024EFH100-E/GJX
✅ Drop-In✓ Em estoque
$7.65 / unidade
Ver ficha técnica →PIC32MZ1024EFH100T-I/PT
✅ Drop-In✓ Em estoque
$8.05 / unidade
Ver ficha técnica →PIC32MZ1024EFM100T-I/GJX
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1024EFM100T-E/GJX Classificações máximas e características elétricas
| Core Architecture | MIPS32 M-Class |
| Core Count | 1 (single-core) |
| CPU Core | MIPS32 microAptiv with FPU and DSP |
| Operating Frequency (max) | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Data Memory (SRAM) | 512 KB |
| Temperatura de operação | -40C to +125C (extended grade) |
| Tensão de alimentação | 2.3 V to 3.6 V |
| Encapsulamento | 100-TFBGA (7x7 mm) |
| Tipo de montagem | Surface Mount |
| Package Dimensions | 7 mm x 7 mm x 1.2 mm |
| GPIO Count | 78 |
| Communication Interfaces | USB 2.0 HS OTG, 10/100 Ethernet MAC, 2x CAN 2.0b, 8x UART, 6x SPI, 5x I2C, SQI |
| ADC | 12-bit, 18 MSPS |
| Crypto Accelerator | AES, DES, 3DES, SHA-256, MD5, RNG |
| Operating Temperature Grade | Automotive / Extended (-E) |
| Status RoHS | Compliant |
| Nível MSL | 3 (per JEDEC J-STD-020) |
Configuração de pinos do PIC32MZ1024EFM100T-E/GJX
| Pino A1 | VSS — Ground reference |
| Pino A2 | RD9 — GPIO/REMAPPABLE |
| Pino A3 | RD10 — GPIO/REMAPPABLE |
| Pino A4 | RD11 — GPIO/REMAPPABLE |
| Pino A5 | RD12 — GPIO/REMAPPABLE |
| Pino A6 | RD13 — GPIO/REMAPPABLE |
| Pino A7 | RD14 — GPIO/REMAPPABLE |
| Pino A8 | RD15 — GPIO/REMAPPABLE |
| Pino A9 | AVSS — Analog ground |
| Pino A10 | VBUS — USB VBUS detect input |
| Pino B1 | AVDD — Analog 3.3V supply |
| Pino B2 | RF0 — GPIO/REMAPPABLE |
| Pino B3 | RF1 — GPIO/REMAPPABLE |
| Pino B4 | RD0 — GPIO/REMAPPABLE |
| Pino B5 | RD1 — GPIO/REMAPPABLE |
| Pino B6 | RD2 — GPIO/REMAPPABLE |
| Pino B7 | RD3 — GPIO/REMAPPABLE |
| Pino B8 | RD4 — GPIO/REMAPPABLE |
| Pino B9 | RD5 — GPIO/REMAPPABLE |
| Pino B10 | VDD — Digital 3.3V supply |
| Pino C1 | RF2 — GPIO/REMAPPABLE |
| Pino C2 | RF3 — GPIO/REMAPPABLE |
| Pino C3 | RF4 — GPIO/REMAPPABLE |
| Pino C4 | RF5 — GPIO/REMAPPABLE |
| Pino C5 | VSS — Ground reference |
| Pino C6 | VDD — Digital 3.3V supply |
| Pino C7 | RD6 — GPIO/REMAPPABLE |
| Pino C8 | RD7 — GPIO/REMAPPABLE |
| Pino C9 | RD8 — GPIO/REMAPPABLE |
| Pino C10 | VDD — Digital 3.3V supply |
| Pino D1 | RF6 — GPIO/REMAPPABLE |
| Pino D2 | RF7 — GPIO/REMAPPABLE |
| Pino D3 | RF8 — GPIO/REMAPPABLE |
| Pino D4 | RF9 — GPIO/REMAPPABLE |
| Pino D5 | RG0 — GPIO/REMAPPABLE |
| Pino D6 | RG1 — GPIO/REMAPPABLE |
| Pino D7 | RG2 — GPIO/REMAPPABLE |
| Pino D8 | RG3 — GPIO/REMAPPABLE |
| Pino D9 | RG6 — GPIO/REMAPPABLE |
| Pino D10 | RG7 — GPIO/REMAPPABLE |
| Pino E1 | RB0 — GPIO/PROGRAM |
| Pino E2 | RB1 — GPIO/PROGRAM |
| Pino E3 | RB2 — GPIO/PROGRAM |
| Pino E4 | RB3 — GPIO/PROGRAM |
| Pino E5 | RG8 — GPIO/REMAPPABLE |
| Pino E6 | RG9 — GPIO/REMAPPABLE |
| Pino E7 | RA0 — GPIO/REMAPPABLE |
| Pino E8 | RA1 — GPIO/REMAPPABLE |
| Pino E9 | RA2 — GPIO/REMAPPABLE |
| Pino E10 | RA3 — GPIO/REMAPPABLE |
| Pino F1 | RB4 — GPIO/PROGRAM |
| Pino F2 | RB5 — GPIO/PROGRAM |
| Pino F3 | RB6 — GPIO/PROGRAM |
| Pino F4 | RB7 — GPIO/PROGRAM |
| Pino F5 | RB8 — GPIO/PROGRAM |
| Pino F6 | RB9 — GPIO/PROGRAM |
| Pino F7 | RB10 — GPIO/PROGRAM |
| Pino F8 | RB11 — GPIO/PROGRAM |
| Pino F9 | RB12 — GPIO/PROGRAM |
| Pino F10 | RB13 — GPIO/PROGRAM |
| Pino G1 | RB14 — GPIO/PROGRAM |
| Pino G2 | RB15 — GPIO/PROGRAM |
| Pino G3 | RC0 — GPIO/REMAPPABLE |
| Pino G4 | RC1 — GPIO/REMAPPABLE |
| Pino G5 | RC2 — GPIO/REMAPPABLE |
| Pino G6 | RC3 — GPIO/REMAPPABLE |
| Pino G7 | RC4 — GPIO/REMAPPABLE |
| Pino G8 | RC5 — GPIO/REMAPPABLE |
| Pino G9 | RC6 — GPIO/REMAPPABLE |
| Pino G10 | RC7 — GPIO/REMAPPABLE |
| Pino H1 | RC8 — GPIO/REMAPPABLE |
| Pino H2 | RC9 — GPIO/REMAPPABLE |
| Pino H3 | RC10 — GPIO/REMAPPABLE |
| Pino H4 | RC11 — GPIO/REMAPPABLE |
| Pino H5 | RC12 — GPIO/REMAPPABLE |
| Pino H6 | RC13 — GPIO/REMAPPABLE |
| Pino H7 | RC14 — GPIO/REMAPPABLE |
| Pino H8 | RC15 — GPIO/REMAPPABLE |
| Pino H9 | RE0 — GPIO/REMAPPABLE |
| Pino H10 | RE1 — GPIO/REMAPPABLE |
| Pino J1 | OSC1 — Crystal oscillator input |
| Pino J2 | OSC2 — Crystal oscillator output |
| Pino J3 | VSS — Ground reference |
| Pino J4 | VDD — Digital 3.3V supply |
| Pino J5 | RE2 — GPIO/REMAPPABLE |
| Pino J6 | RE3 — GPIO/REMAPPABLE |
| Pino J7 | RE4 — GPIO/REMAPPABLE |
| Pino J8 | RE5 — GPIO/REMAPPABLE |
| Pino J9 | RE6 — GPIO/REMAPPABLE |
| Pino J10 | RE7 — GPIO/REMAPPABLE |
| Pino K1 | SOSCI — Secondary oscillator input |
| Pino K2 | SOSCO — Secondary oscillator output |
| Pino K3 | VREF- — ADC voltage reference negative |
| Pino K4 | VREF+ — ADC voltage reference positive |
| Pino K5 | AN0 — ADC analog input 0 |
| Pino K6 | AN1 — ADC analog input 1 |
| Pino K7 | AN2 — ADC analog input 2 |
| Pino K8 | AN3 — ADC analog input 3 |
| Pino K9 | AN4 — ADC analog input 4 |
| Pino K10 | AN5 — ADC analog input 5 |
Aplicações típicas
PIC32MZ1024EFM100T-E/GJX é adequado para 7 aplicaçãos: Industrial Ethernet IO Modules, Automotive CAN Gateway, Secure IoT Edge Node, USB-HS Peripheral / HMI Controller, Motor Control / Field-Oriented Control (FOC), Industrial HMI with Graphics, Data Logger with SD Storage.
Industrial Ethernet IO Modules
The PIC32MZ1024EFM100T-E/GJX is ideally suited for industrial Ethernet IO modules where its integrated 10/100 Ethernet MAC with RMII/MII interface, hardware crypto engine for TLS 1.2/IPsec, and 200 MHz MIPS32 core deliver up to 252 DMIPS for protocol processing. The 1 MB Flash comfortably holds the lwIP + mbedTLS stack, while 512 KB SRAM supports concurrent TCP/IP sockets, Profinet/EtherNet/IP buffers, and application code. Per the PIC32MZ EF family datasheet, the -40C to +125C extended temperature range and AEC-Q100 qualification cover factory-floor and outdoor enclosures, while on-chip dual CAN 2.0b enables gateway designs bridging Ethernet and CAN-bus field devices.
Recomendado
Automotive CAN Gateway
The PIC32MZ1024EFM100T-E/GJX fits automotive CAN gateways with its dual CAN 2.0b controllers, 1 MB Flash for CANopen/J1939 stacks, and -40C to +125C extended operating range. Per the PIC32MZ EF family datasheet, the hardware crypto engine accelerates secure diagnostics and firmware-over-the-air (FOTA) updates, while the 200 MHz MIPS32 core with FPU runs vector CAN processing at bus speeds up to 1 Mbps. The 100-TFBGA footprint exposes 78 GPIO for fault-tolerant input sampling, and the AEC-Q100 grade process supports cabin/deck-mounted ECUs in automotive environments.
Recomendado
Secure IoT Edge Node
The PIC32MZ1024EFM100T-E/GJX targets secure IoT edge nodes with its on-chip AES-256, SHA-256, and true RNG accelerating TLS 1.3 handshakes at 200 MHz, while USB 2.0 High-Speed OTG and Ethernet MAC connect to cloud gateways. The 1 MB program Flash holds TLS libraries, an MQTT client, and application firmware with A/B partition redundancy, while 512 KB SRAM handles concurrent IPsec/TLS buffers and sensor data streams. Per the PIC32MZ EF family datasheet, the integrated peripherals - USB-HS PHY, 10/100 Ethernet, dual CAN, and 12-bit ADC at 18 MSPS - eliminate external components, reducing BOM cost and PCB area in IoT sensor hubs.
Recomendado
USB-HS Peripheral / HMI Controller
The PIC32MZ1024EFM100T-E/GJX delivers USB 2.0 High-Speed OTG with on-chip HS PHY at 480 Mbps, supporting USB HID/CDC/MSC/Bulk device classes and host mode. The 200 MHz core manages USB protocol state machines plus the host application, while 1 MB Flash stores USB stacks (USB device + host) and class firmware. Per the PIC32MZ EF family datasheet, the parallel master port (PMP) drives TFT or OLED displays for HMI panels, and the 12-bit 18 MSPS ADC samples touch-sensing electrodes directly. The 100-TFBGA package (7x7mm) is appropriate for compact HMI modules with full USB and graphics connectivity.
Recomendado
Motor Control / Field-Oriented Control (FOC)
The PIC32MZ1024EFM100T-E/GJX is well suited to motor-control applications where the 200 MHz MIPS32 core with hardware FPU executes field-oriented control (FOC) loops in under 10 microseconds. The 12-bit 18 MSPS ADC simultaneously samples three-phase currents, while the on-chip 8 UARTs and 6 SPI controllers drive gate-driver boards and feedback encoders. Per the PIC32MZ EF family datasheet, the integrated crypto engine and dual CAN enable secure, networked motor controllers for industrial automation; the -40C to +125C extended temperature range supports outdoor and underhood motor installations.
Recomendado
Industrial HMI with Graphics
The PIC32MZ1024EFM100T-E/GJX drives industrial HMI panels with its parallel master port (PMP) supporting TFT displays up to 24-bit color, on-chip 2D DMA for fast image blitting, and 512 KB SRAM providing framebuffer space. Per the PIC32MZ EF family datasheet, the 200 MHz core runs Microchip's MPLAB Harmony graphics library while USB-HS, Ethernet, and CAN connect to factory networks. The 100-TFBGA footprint and -40C to +125C extended temperature support fanless panel-mount designs in industrial enclosures.
Recomendado
Data Logger with SD Storage
The PIC32MZ1024EFM100T-E/GJX excels at high-speed data logging thanks to its SQI (Serial Quad Interface) running up to 80 MHz for SD card or external Quad-SPI Flash storage. The 200 MHz MIPS32 core can stream ADC samples at 18 MSPS into the SD card through DMA without CPU intervention, while 1 MB Flash stores the logger firmware and 512 KB SRAM provides buffering. Per the PIC32MZ EF family datasheet, the USB-HS port streams recorded data to a PC at up to 480 Mbps, making the device well suited to high-speed industrial and automotive test equipment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ1024EFM100T-E/GJX — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ1024EFM100-E/GJX | PIC32MZ1024EFM100-I/GJX | PIC32MZ1024EFH100-E/GJX | PIC32MZ1024EFH100T-I/PT | PIC32MZ1024EFM100T-I/GJX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same |
| Operating Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Temperature Grade | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Packaging Format | Tape & Reel | Tray | Tray | Tray | Tape & Reel | Tape & Reel |
| Hardware Crypto Engine | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG |
| Unit Price (qty 100, as of 2026-10-04) | $11.85 | $11.50 | $10.95 | $12.50 | $12.20 | $11.10 |
Principais diferenciais
- Integrated USB 2.0 High-Speed OTG with on-chip HS PHY eliminates external ULPI PHY (vs PIC32MX795F512LT-80I/PT)
- Extended -40C to +125C temperature grade versus industrial -40C to +85C (vs PIC32MZ1024EFM100-I/GJX)
- Hardware crypto engine (AES/SHA/RNG) accelerates TLS handshakes (vs PIC32MX795F512L-80I/PF)
Notas de projeto
The 100-TFBGA package uses 0.65 mm pitch balls in a 10x10 grid on a 7 mm x 7 mm substrate. Per Microchip's PCB layout guidelines for PIC32MZ EF, use a 4-layer PCB with continuous ground plane under the BGA; route signal traces on inner layers using micro-vias with 0.1 mm pad size. Provide a minimum 6x6 BGA escape pattern for clean breakout, and place a full ground flood under the package for thermal dissipation and EMI control.
The PIC32MZ1024EFM100T-E/GJX requires a 3.3V main rail (2.3-3.6V range) with separate AVDD and VDD domains. Per the PIC32MZ EF family datasheet, place 100 nF ceramic decoupling capacitors within 2 mm of each VDD pin and a 10 uF bulk capacitor at the regulator output. For USB-HS applications, the internal HS PHY is sensitive to rail noise - use an LDO with <30 uVrms and add a ferrite bead on AVDD_USB to suppress switching noise from the digital core.
For USB-HS signaling, maintain 90 ohm differential impedance on the D+/D- traces and route them length-matched within 150 mil of each other. For Ethernet RMII, route the 50 MHz reference clock away from analog and switching power sections to avoid coupling into the ADC. Per Microchip's EMI/ESD design guide, place the 90 ohm common-mode choke close to the USB connector, and add TVS diodes such as USBLC6-2SC6 for ESD protection to IEC 61000-4-2 Level 4.
Do not skip configuration of the prefetch module and wait states for Flash access - the PIC32MZ EF requires 2 wait states at 200 MHz operation. Per Microchip's PIC32MZ EF family reference manual, omitting prefetch configuration causes Flash access faults and instruction fetch corruption at full speed. Use the FSOSCEN, POSCEN, and PLL configuration macros in MPLAB Harmony to ensure proper clock tree setup before peripheral initialization.
The Ethernet MAC RMII/MII interface requires 50 MHz clock with <50 ps jitter for 100 Mbps operation. Per Microchip's PIC32MZ EF hardware design checklist, source the clock from a clean oscillator or PHY-generated reference rather than synthesizing from the internal PLL. For CAN bus designs, balance the two termination resistors (typically 120 ohm each) at the bus cable, and use twisted-pair wiring with <2 ns/m propagation skew to meet CAN 2.0b signal integrity margins.
Informações de conformidade
RoHS compliant per Microchip product page. AEC-Q100 qualified per DigiKey automotive grade designation. Lead-free and halogen-free per Microchip's PIC32MZ EF family environmental compliance statement.