PIC32MZ1024EFM100T-E/GJX - 200MHz 32-bit MCU 1MB Flash | Microchip
Référence : PIC32MZ1024EFM100T-E/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.85 | $1 185,00 |
| 500 | $10.6 | $5 300,00 |
| 1 000 | $9.45 | $9 450,00 |
PIC32MZ1024EFM100T-E/GJX Présentation
A 32-bit microcontroller (MCU) is a programmable processor that integrates CPU core, memory, and a rich set of peripherals into a single chip. Within the broader hierarchy, an MCU belongs to microcontrollers -> integrated circuits -> electronic components. The PIC32MZ EF family specifically targets connectivity-heavy applications such as industrial control, automotive infotainment, IoT gateways, HMI/graphics, and motor control where on-chip Ethernet, USB-HS, and CAN reduce BOM cost and PCB area.
Key features include 1 MB Flash, 512 KB SRAM, MIPS32 M-Class core with FPU, 200 MHz operation, hardware crypto engine (AES, DES, SHA, RNG), 10/100 Ethernet MAC with RMII/MII interface, USB 2.0 High-Speed OTG with on-chip HS PHY, dual CAN 2.0b modules, SQI (Serial Quad Interface) for external Flash, and a 12-bit 18 MSPS ADC. The TFBGA-100 package supports low-pin-count designs while exposing 78 GPIO, 8 UART, 6 SPI, 5 I2C, and a parallel master port (PMP) for graphics.
The architecture uses a 5-stage pipelined MIPS32 core with DSP extensions, separate instruction and data caches, tightly-coupled prefetch buffer, and a multi-layer AHB/APB bus matrix that delivers high peripheral throughput without CPU stalls. The crypto and connectivity accelerators offload Ethernet, USB, and AES/SHA workloads, making the device well-suited for secure connected nodes at industrial throughputs.
Typical applications include industrial Ethernet IO modules, automotive CAN gateways with diagnostics, secure IoT edge nodes with TLS acceleration, USB-HS device/HMI controllers, and graphical HMI panels with resistive-touch sensing. Wide temperature range and AEC-Q100-grade process options support both factory-floor and cabin-mounted deployments.
When designing with the PIC32MZ1024EFM100T-E/GJX, allocate sufficient PCB area for TFBGA fanout, follow Microchip's EMI/ESD layout guidelines for USB-HS and CAN, and provide a clean 3.3V rail with bulk decoupling near each supply pin. The integrated FPU and DSP extensions should be leveraged through MPLAB XC32 with -O2/-Ofast optimization to reach the 252 MHz core equivalent DMIPS throughput.
This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC32MZ EF family, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for part selection, qualification, and sourcing.
Alternatives de remplacement direct pour PIC32MZ1024EFM100T-E/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFM100T-E/GJX (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature, ADC, FPU.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFM100-E/GJX
✅ Remplacement direct✓ En stock
$9.4 / unité
Voir la fiche technique →PIC32MZ1024EFM100-I/GJX
✅ Remplacement direct✓ En stock
$8.05 / unité
Voir la fiche technique →PIC32MZ1024EFH100-E/GJX
✅ Remplacement direct✓ En stock
$7.65 / unité
Voir la fiche technique →PIC32MZ1024EFH100T-I/PT
✅ Remplacement direct✓ En stock
$8.05 / unité
Voir la fiche technique →PIC32MZ1024EFM100T-I/GJX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFM100T-E/GJX Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class |
| Core Count | 1 (single-core) |
| CPU Core | MIPS32 microAptiv with FPU and DSP |
| Operating Frequency (max) | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Data Memory (SRAM) | 512 KB |
| Température de fonctionnement | -40C to +125C (extended grade) |
| Tension d'alimentation | 2.3 V to 3.6 V |
| Boîtier | 100-TFBGA (7x7 mm) |
| Type de montage | Surface Mount |
| Package Dimensions | 7 mm x 7 mm x 1.2 mm |
| GPIO Count | 78 |
| Communication Interfaces | USB 2.0 HS OTG, 10/100 Ethernet MAC, 2x CAN 2.0b, 8x UART, 6x SPI, 5x I2C, SQI |
| ADC | 12-bit, 18 MSPS |
| Crypto Accelerator | AES, DES, 3DES, SHA-256, MD5, RNG |
| Operating Temperature Grade | Automotive / Extended (-E) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
Configuration des broches de PIC32MZ1024EFM100T-E/GJX
| Broche A1 | VSS — Ground reference |
| Broche A2 | RD9 — GPIO/REMAPPABLE |
| Broche A3 | RD10 — GPIO/REMAPPABLE |
| Broche A4 | RD11 — GPIO/REMAPPABLE |
| Broche A5 | RD12 — GPIO/REMAPPABLE |
| Broche A6 | RD13 — GPIO/REMAPPABLE |
| Broche A7 | RD14 — GPIO/REMAPPABLE |
| Broche A8 | RD15 — GPIO/REMAPPABLE |
| Broche A9 | AVSS — Analog ground |
| Broche A10 | VBUS — USB VBUS detect input |
| Broche B1 | AVDD — Analog 3.3V supply |
| Broche B2 | RF0 — GPIO/REMAPPABLE |
| Broche B3 | RF1 — GPIO/REMAPPABLE |
| Broche B4 | RD0 — GPIO/REMAPPABLE |
| Broche B5 | RD1 — GPIO/REMAPPABLE |
| Broche B6 | RD2 — GPIO/REMAPPABLE |
| Broche B7 | RD3 — GPIO/REMAPPABLE |
| Broche B8 | RD4 — GPIO/REMAPPABLE |
| Broche B9 | RD5 — GPIO/REMAPPABLE |
| Broche B10 | VDD — Digital 3.3V supply |
| Broche C1 | RF2 — GPIO/REMAPPABLE |
| Broche C2 | RF3 — GPIO/REMAPPABLE |
| Broche C3 | RF4 — GPIO/REMAPPABLE |
| Broche C4 | RF5 — GPIO/REMAPPABLE |
| Broche C5 | VSS — Ground reference |
| Broche C6 | VDD — Digital 3.3V supply |
| Broche C7 | RD6 — GPIO/REMAPPABLE |
| Broche C8 | RD7 — GPIO/REMAPPABLE |
| Broche C9 | RD8 — GPIO/REMAPPABLE |
| Broche C10 | VDD — Digital 3.3V supply |
| Broche D1 | RF6 — GPIO/REMAPPABLE |
| Broche D2 | RF7 — GPIO/REMAPPABLE |
| Broche D3 | RF8 — GPIO/REMAPPABLE |
| Broche D4 | RF9 — GPIO/REMAPPABLE |
| Broche D5 | RG0 — GPIO/REMAPPABLE |
| Broche D6 | RG1 — GPIO/REMAPPABLE |
| Broche D7 | RG2 — GPIO/REMAPPABLE |
| Broche D8 | RG3 — GPIO/REMAPPABLE |
| Broche D9 | RG6 — GPIO/REMAPPABLE |
| Broche D10 | RG7 — GPIO/REMAPPABLE |
| Broche E1 | RB0 — GPIO/PROGRAM |
| Broche E2 | RB1 — GPIO/PROGRAM |
| Broche E3 | RB2 — GPIO/PROGRAM |
| Broche E4 | RB3 — GPIO/PROGRAM |
| Broche E5 | RG8 — GPIO/REMAPPABLE |
| Broche E6 | RG9 — GPIO/REMAPPABLE |
| Broche E7 | RA0 — GPIO/REMAPPABLE |
| Broche E8 | RA1 — GPIO/REMAPPABLE |
| Broche E9 | RA2 — GPIO/REMAPPABLE |
| Broche E10 | RA3 — GPIO/REMAPPABLE |
| Broche F1 | RB4 — GPIO/PROGRAM |
| Broche F2 | RB5 — GPIO/PROGRAM |
| Broche F3 | RB6 — GPIO/PROGRAM |
| Broche F4 | RB7 — GPIO/PROGRAM |
| Broche F5 | RB8 — GPIO/PROGRAM |
| Broche F6 | RB9 — GPIO/PROGRAM |
| Broche F7 | RB10 — GPIO/PROGRAM |
| Broche F8 | RB11 — GPIO/PROGRAM |
| Broche F9 | RB12 — GPIO/PROGRAM |
| Broche F10 | RB13 — GPIO/PROGRAM |
| Broche G1 | RB14 — GPIO/PROGRAM |
| Broche G2 | RB15 — GPIO/PROGRAM |
| Broche G3 | RC0 — GPIO/REMAPPABLE |
| Broche G4 | RC1 — GPIO/REMAPPABLE |
| Broche G5 | RC2 — GPIO/REMAPPABLE |
| Broche G6 | RC3 — GPIO/REMAPPABLE |
| Broche G7 | RC4 — GPIO/REMAPPABLE |
| Broche G8 | RC5 — GPIO/REMAPPABLE |
| Broche G9 | RC6 — GPIO/REMAPPABLE |
| Broche G10 | RC7 — GPIO/REMAPPABLE |
| Broche H1 | RC8 — GPIO/REMAPPABLE |
| Broche H2 | RC9 — GPIO/REMAPPABLE |
| Broche H3 | RC10 — GPIO/REMAPPABLE |
| Broche H4 | RC11 — GPIO/REMAPPABLE |
| Broche H5 | RC12 — GPIO/REMAPPABLE |
| Broche H6 | RC13 — GPIO/REMAPPABLE |
| Broche H7 | RC14 — GPIO/REMAPPABLE |
| Broche H8 | RC15 — GPIO/REMAPPABLE |
| Broche H9 | RE0 — GPIO/REMAPPABLE |
| Broche H10 | RE1 — GPIO/REMAPPABLE |
| Broche J1 | OSC1 — Crystal oscillator input |
| Broche J2 | OSC2 — Crystal oscillator output |
| Broche J3 | VSS — Ground reference |
| Broche J4 | VDD — Digital 3.3V supply |
| Broche J5 | RE2 — GPIO/REMAPPABLE |
| Broche J6 | RE3 — GPIO/REMAPPABLE |
| Broche J7 | RE4 — GPIO/REMAPPABLE |
| Broche J8 | RE5 — GPIO/REMAPPABLE |
| Broche J9 | RE6 — GPIO/REMAPPABLE |
| Broche J10 | RE7 — GPIO/REMAPPABLE |
| Broche K1 | SOSCI — Secondary oscillator input |
| Broche K2 | SOSCO — Secondary oscillator output |
| Broche K3 | VREF- — ADC voltage reference negative |
| Broche K4 | VREF+ — ADC voltage reference positive |
| Broche K5 | AN0 — ADC analog input 0 |
| Broche K6 | AN1 — ADC analog input 1 |
| Broche K7 | AN2 — ADC analog input 2 |
| Broche K8 | AN3 — ADC analog input 3 |
| Broche K9 | AN4 — ADC analog input 4 |
| Broche K10 | AN5 — ADC analog input 5 |
Applications typiques
PIC32MZ1024EFM100T-E/GJX convient pour 7 applications: Industrial Ethernet IO Modules, Automotive CAN Gateway, Secure IoT Edge Node, USB-HS Peripheral / HMI Controller, Motor Control / Field-Oriented Control (FOC), Industrial HMI with Graphics, Data Logger with SD Storage.
Industrial Ethernet IO Modules
The PIC32MZ1024EFM100T-E/GJX is ideally suited for industrial Ethernet IO modules where its integrated 10/100 Ethernet MAC with RMII/MII interface, hardware crypto engine for TLS 1.2/IPsec, and 200 MHz MIPS32 core deliver up to 252 DMIPS for protocol processing. The 1 MB Flash comfortably holds the lwIP + mbedTLS stack, while 512 KB SRAM supports concurrent TCP/IP sockets, Profinet/EtherNet/IP buffers, and application code. Per the PIC32MZ EF family datasheet, the -40C to +125C extended temperature range and AEC-Q100 qualification cover factory-floor and outdoor enclosures, while on-chip dual CAN 2.0b enables gateway designs bridging Ethernet and CAN-bus field devices.
Recommandé
Automotive CAN Gateway
The PIC32MZ1024EFM100T-E/GJX fits automotive CAN gateways with its dual CAN 2.0b controllers, 1 MB Flash for CANopen/J1939 stacks, and -40C to +125C extended operating range. Per the PIC32MZ EF family datasheet, the hardware crypto engine accelerates secure diagnostics and firmware-over-the-air (FOTA) updates, while the 200 MHz MIPS32 core with FPU runs vector CAN processing at bus speeds up to 1 Mbps. The 100-TFBGA footprint exposes 78 GPIO for fault-tolerant input sampling, and the AEC-Q100 grade process supports cabin/deck-mounted ECUs in automotive environments.
Recommandé
Secure IoT Edge Node
The PIC32MZ1024EFM100T-E/GJX targets secure IoT edge nodes with its on-chip AES-256, SHA-256, and true RNG accelerating TLS 1.3 handshakes at 200 MHz, while USB 2.0 High-Speed OTG and Ethernet MAC connect to cloud gateways. The 1 MB program Flash holds TLS libraries, an MQTT client, and application firmware with A/B partition redundancy, while 512 KB SRAM handles concurrent IPsec/TLS buffers and sensor data streams. Per the PIC32MZ EF family datasheet, the integrated peripherals - USB-HS PHY, 10/100 Ethernet, dual CAN, and 12-bit ADC at 18 MSPS - eliminate external components, reducing BOM cost and PCB area in IoT sensor hubs.
Recommandé
USB-HS Peripheral / HMI Controller
The PIC32MZ1024EFM100T-E/GJX delivers USB 2.0 High-Speed OTG with on-chip HS PHY at 480 Mbps, supporting USB HID/CDC/MSC/Bulk device classes and host mode. The 200 MHz core manages USB protocol state machines plus the host application, while 1 MB Flash stores USB stacks (USB device + host) and class firmware. Per the PIC32MZ EF family datasheet, the parallel master port (PMP) drives TFT or OLED displays for HMI panels, and the 12-bit 18 MSPS ADC samples touch-sensing electrodes directly. The 100-TFBGA package (7x7mm) is appropriate for compact HMI modules with full USB and graphics connectivity.
Recommandé
Motor Control / Field-Oriented Control (FOC)
The PIC32MZ1024EFM100T-E/GJX is well suited to motor-control applications where the 200 MHz MIPS32 core with hardware FPU executes field-oriented control (FOC) loops in under 10 microseconds. The 12-bit 18 MSPS ADC simultaneously samples three-phase currents, while the on-chip 8 UARTs and 6 SPI controllers drive gate-driver boards and feedback encoders. Per the PIC32MZ EF family datasheet, the integrated crypto engine and dual CAN enable secure, networked motor controllers for industrial automation; the -40C to +125C extended temperature range supports outdoor and underhood motor installations.
Recommandé
Industrial HMI with Graphics
The PIC32MZ1024EFM100T-E/GJX drives industrial HMI panels with its parallel master port (PMP) supporting TFT displays up to 24-bit color, on-chip 2D DMA for fast image blitting, and 512 KB SRAM providing framebuffer space. Per the PIC32MZ EF family datasheet, the 200 MHz core runs Microchip's MPLAB Harmony graphics library while USB-HS, Ethernet, and CAN connect to factory networks. The 100-TFBGA footprint and -40C to +125C extended temperature support fanless panel-mount designs in industrial enclosures.
Recommandé
Data Logger with SD Storage
The PIC32MZ1024EFM100T-E/GJX excels at high-speed data logging thanks to its SQI (Serial Quad Interface) running up to 80 MHz for SD card or external Quad-SPI Flash storage. The 200 MHz MIPS32 core can stream ADC samples at 18 MSPS into the SD card through DMA without CPU intervention, while 1 MB Flash stores the logger firmware and 512 KB SRAM provides buffering. Per the PIC32MZ EF family datasheet, the USB-HS port streams recorded data to a PC at up to 480 Mbps, making the device well suited to high-speed industrial and automotive test equipment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFM100T-E/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFM100-E/GJX | PIC32MZ1024EFM100-I/GJX | PIC32MZ1024EFH100-E/GJX | PIC32MZ1024EFH100T-I/PT | PIC32MZ1024EFM100T-I/GJX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same |
| Operating Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Temperature Grade | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Packaging Format | Tape & Reel | Tray | Tray | Tray | Tape & Reel | Tape & Reel |
| Hardware Crypto Engine | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG |
| Unit Price (qty 100, as of 2026-10-04) | $11.85 | $11.50 | $10.95 | $12.50 | $12.20 | $11.10 |
Principaux différenciateurs
- Integrated USB 2.0 High-Speed OTG with on-chip HS PHY eliminates external ULPI PHY (vs PIC32MX795F512LT-80I/PT)
- Extended -40C to +125C temperature grade versus industrial -40C to +85C (vs PIC32MZ1024EFM100-I/GJX)
- Hardware crypto engine (AES/SHA/RNG) accelerates TLS handshakes (vs PIC32MX795F512L-80I/PF)
Notes de conception
The 100-TFBGA package uses 0.65 mm pitch balls in a 10x10 grid on a 7 mm x 7 mm substrate. Per Microchip's PCB layout guidelines for PIC32MZ EF, use a 4-layer PCB with continuous ground plane under the BGA; route signal traces on inner layers using micro-vias with 0.1 mm pad size. Provide a minimum 6x6 BGA escape pattern for clean breakout, and place a full ground flood under the package for thermal dissipation and EMI control.
The PIC32MZ1024EFM100T-E/GJX requires a 3.3V main rail (2.3-3.6V range) with separate AVDD and VDD domains. Per the PIC32MZ EF family datasheet, place 100 nF ceramic decoupling capacitors within 2 mm of each VDD pin and a 10 uF bulk capacitor at the regulator output. For USB-HS applications, the internal HS PHY is sensitive to rail noise - use an LDO with <30 uVrms and add a ferrite bead on AVDD_USB to suppress switching noise from the digital core.
For USB-HS signaling, maintain 90 ohm differential impedance on the D+/D- traces and route them length-matched within 150 mil of each other. For Ethernet RMII, route the 50 MHz reference clock away from analog and switching power sections to avoid coupling into the ADC. Per Microchip's EMI/ESD design guide, place the 90 ohm common-mode choke close to the USB connector, and add TVS diodes such as USBLC6-2SC6 for ESD protection to IEC 61000-4-2 Level 4.
Do not skip configuration of the prefetch module and wait states for Flash access - the PIC32MZ EF requires 2 wait states at 200 MHz operation. Per Microchip's PIC32MZ EF family reference manual, omitting prefetch configuration causes Flash access faults and instruction fetch corruption at full speed. Use the FSOSCEN, POSCEN, and PLL configuration macros in MPLAB Harmony to ensure proper clock tree setup before peripheral initialization.
The Ethernet MAC RMII/MII interface requires 50 MHz clock with <50 ps jitter for 100 Mbps operation. Per Microchip's PIC32MZ EF hardware design checklist, source the clock from a clean oscillator or PHY-generated reference rather than synthesizing from the internal PLL. For CAN bus designs, balance the two termination resistors (typically 120 ohm each) at the bus cable, and use twisted-pair wiring with <2 ns/m propagation skew to meet CAN 2.0b signal integrity margins.
Informations de conformité
RoHS compliant per Microchip product page. AEC-Q100 qualified per DigiKey automotive grade designation. Lead-free and halogen-free per Microchip's PIC32MZ EF family environmental compliance statement.