Microchip Technology

PIC32MZ1024EFM100T-E/GJX - 200MHz 32-bit MCU 1MB Flash | Microchip

MPN: PIC32MZ1024EFM100T-E/GJX ✓ Active
In Stock Ships in 1-3 business days
2.3 V to 3.6 V Vdss 100-TFBGA (7x7 mm) Package 200 MHz Speed 1 MB (1M x 8) Memory
From $9.45 USD / Unit
MOQ: 1 |
Price updated: 2026-10-04
Volume Pricing
Qty Unit Price Extended
1 $14.5 $14.50
10 $13.2 $132.00
100 $11.85 $1,185.00
500 $10.6 $5,300.00
1,000 $9.45 $9,450.00
ℹ️ All prices are in USD

PIC32MZ1024EFM100T-E/GJX Overview

The Microchip Technology PIC32MZ1024EFM100T-E/GJX is a high-performance MIPS32 M-Class PIC32MZ 32-bit microcontroller running up to 200 MHz, integrating 1 MB (1M x 8) of Flash program memory and 512 KB of SRAM in a 100-pin TFBGA (7x7 mm) package. The device belongs to the PIC32MZ EF family and includes a single-precision hardware FPU, hardware crypto acceleration, USB 2.0 High-Speed OTG, 10/100Mbps Ethernet MAC, and dual CAN 2.0b controllers, all on-chip. The -E/GJX suffix designates the extended (-40C to +125C) operating temperature grade with 100-TFBGA package and tape-and-reel packaging.

A 32-bit microcontroller (MCU) is a programmable processor that integrates CPU core, memory, and a rich set of peripherals into a single chip. Within the broader hierarchy, an MCU belongs to microcontrollers -> integrated circuits -> electronic components. The PIC32MZ EF family specifically targets connectivity-heavy applications such as industrial control, automotive infotainment, IoT gateways, HMI/graphics, and motor control where on-chip Ethernet, USB-HS, and CAN reduce BOM cost and PCB area.

Key features include 1 MB Flash, 512 KB SRAM, MIPS32 M-Class core with FPU, 200 MHz operation, hardware crypto engine (AES, DES, SHA, RNG), 10/100 Ethernet MAC with RMII/MII interface, USB 2.0 High-Speed OTG with on-chip HS PHY, dual CAN 2.0b modules, SQI (Serial Quad Interface) for external Flash, and a 12-bit 18 MSPS ADC. The TFBGA-100 package supports low-pin-count designs while exposing 78 GPIO, 8 UART, 6 SPI, 5 I2C, and a parallel master port (PMP) for graphics.

The architecture uses a 5-stage pipelined MIPS32 core with DSP extensions, separate instruction and data caches, tightly-coupled prefetch buffer, and a multi-layer AHB/APB bus matrix that delivers high peripheral throughput without CPU stalls. The crypto and connectivity accelerators offload Ethernet, USB, and AES/SHA workloads, making the device well-suited for secure connected nodes at industrial throughputs.

Typical applications include industrial Ethernet IO modules, automotive CAN gateways with diagnostics, secure IoT edge nodes with TLS acceleration, USB-HS device/HMI controllers, and graphical HMI panels with resistive-touch sensing. Wide temperature range and AEC-Q100-grade process options support both factory-floor and cabin-mounted deployments.

When designing with the PIC32MZ1024EFM100T-E/GJX, allocate sufficient PCB area for TFBGA fanout, follow Microchip's EMI/ESD layout guidelines for USB-HS and CAN, and provide a clean 3.3V rail with bulk decoupling near each supply pin. The integrated FPU and DSP extensions should be leveraged through MPLAB XC32 with -O2/-Ofast optimization to reach the 252 MHz core equivalent DMIPS throughput.

This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC32MZ EF family, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for part selection, qualification, and sourcing.

Drop-in alternatives for PIC32MZ1024EFM100T-E/GJX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC32MZ1024EFM100T-E/GJX (same form factor and footprint) — differing in Package, Core Architecture, Operating Temperature, ADC, FPU.

Microchip Technology
Package: 100-pin TFBGA (7x7 mm)
Core Architecture: MIPS32 M-Class (Warrior M-class)
Operating Temperature: -40C to +125C (extended, -E suffix)
Microchip Technology
Package: 100-pin TQFP (12x12 mm)
Core Architecture: MIPS32 M-Class Warrior
Operating Temperature: -40 C to +85 C (Industrial)
Microchip Technology
Package: 100-pin TFBGA (GJX), 7x7 mm
Core Architecture: MIPS32 M-Class (microAptiv)
Operating Temperature: -40C to +125C (E grade)
Microchip Technology
Core Architecture: MIPS32 M-Class (PIC32MZ)
Operating Temperature: -40C to +85C (Industrial, -I suffix)
ADC: 12-bit, up to 18 Msps
Microchip Technology
Package: 100-TFBGA (GJX) 7x7 mm, 0.65 mm ball pitch
Core Architecture: MIPS32 microAptiv MPU with FPU
Operating Temperature: -40C to +125C (E grade, AEC-Q100 Grade 1)
Microchip Technology
Package: 100-TFBGA (7x7x1.06 mm)
FPU: Yes (single/double precision IEEE-754)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC32MZ1024EFM100-E/GJX

✅ Drop-In
Microchip Technology
📦 100-TFBGA (7x7)
MIPS32 M-Class (microAptiv) · 200 MHz · 1 MB (1M x 8) · 512 KB · Yes (single-precision IEEE 754) · AES / DES / 3DES / SHA / MD5 / HMAC · 2 x CAN 2.0b · USB 2.0 HS OTG

✓ In Stock

$9.4 / Unit

View Datasheet →

PIC32MZ1024EFM100-I/GJX

✅ Drop-In
Microchip Technology
📦 100-TFBGA (7x7)
MIPS32 M-Class (PIC32MZ) · 200 MHz (252 MHz family max) · 330 DMIPS · IEEE 754 single/double precision, hardware · Single-cycle MAC, four 64-bit accumulators · 1 MB (1024 KB) · 512 KB · 2.1 V to 3.6 V

✓ In Stock

$8.05 / Unit

View Datasheet →

PIC32MZ1024EFH100-E/GJX

✅ Drop-In
Microchip Technology
📦 100-TFBGA (7x7)
MIPS32 M-Class (Warrior M-class) · 200 MHz · 330 DMIPS · 1 MB (1M x 8) · 512 KB · IEEE 754-compliant single/double precision · Four 64-bit accumulators, single-cycle MAC · 12-bit, up to 18 MSPS

✓ In Stock

$7.65 / Unit

View Datasheet →

PIC32MZ1024EFH100T-I/PT

✅ Drop-In
Microchip Technology
📦 100-TFBGA (7x7)
MIPS32 M-Class Warrior · 200 MHz · 330 DMIPS / 1.65 DMIPS/MHz · IEEE 754 single/double precision hardware · Four 64-bit accumulators, single-cycle MAC · 1 MB (1024 KB) · 512 KB · Instruction cache and prefetch module

✓ In Stock

$8.05 / Unit

View Datasheet →

PIC32MZ1024EFM100T-I/GJX

✅ Drop-In
📦 100-TFBGA (7x7)
same 100-TFBGA footprint, 1MB Flash, 512KB SRAM; industrial -40C to +85C temperature grade with T&R packaging (-15% max temp vs -E grade)

📋 Reference alternative (not in catalog)

PIC32MZ1024EFM100T-E/GJX Maximum Ratings & Electrical Characteristics

Core Architecture MIPS32 M-Class
Core Count 1 (single-core)
CPU Core MIPS32 microAptiv with FPU and DSP
Operating Frequency (max) 200 MHz
Program Memory (Flash) 1 MB (1M x 8)
Data Memory (SRAM) 512 KB
Operating Temperature -40C to +125C (extended grade)
Supply Voltage 2.3 V to 3.6 V
Package 100-TFBGA (7x7 mm)
Mounting Type Surface Mount
Package Dimensions 7 mm x 7 mm x 1.2 mm
GPIO Count 78
Communication Interfaces USB 2.0 HS OTG, 10/100 Ethernet MAC, 2x CAN 2.0b, 8x UART, 6x SPI, 5x I2C, SQI
ADC 12-bit, 18 MSPS
Crypto Accelerator AES, DES, 3DES, SHA-256, MD5, RNG
Operating Temperature Grade Automotive / Extended (-E)
RoHS Status Compliant
MSL Level 3 (per JEDEC J-STD-020)

PIC32MZ1024EFM100T-E/GJX Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 VSS — Ground reference
Pin A2 RD9 — GPIO/REMAPPABLE
Pin A3 RD10 — GPIO/REMAPPABLE
Pin A4 RD11 — GPIO/REMAPPABLE
Pin A5 RD12 — GPIO/REMAPPABLE
Pin A6 RD13 — GPIO/REMAPPABLE
Pin A7 RD14 — GPIO/REMAPPABLE
Pin A8 RD15 — GPIO/REMAPPABLE
Pin A9 AVSS — Analog ground
Pin A10 VBUS — USB VBUS detect input
Pin B1 AVDD — Analog 3.3V supply
Pin B2 RF0 — GPIO/REMAPPABLE
Pin B3 RF1 — GPIO/REMAPPABLE
Pin B4 RD0 — GPIO/REMAPPABLE
Pin B5 RD1 — GPIO/REMAPPABLE
Pin B6 RD2 — GPIO/REMAPPABLE
Pin B7 RD3 — GPIO/REMAPPABLE
Pin B8 RD4 — GPIO/REMAPPABLE
Pin B9 RD5 — GPIO/REMAPPABLE
Pin B10 VDD — Digital 3.3V supply
Pin C1 RF2 — GPIO/REMAPPABLE
Pin C2 RF3 — GPIO/REMAPPABLE
Pin C3 RF4 — GPIO/REMAPPABLE
Pin C4 RF5 — GPIO/REMAPPABLE
Pin C5 VSS — Ground reference
Pin C6 VDD — Digital 3.3V supply
Pin C7 RD6 — GPIO/REMAPPABLE
Pin C8 RD7 — GPIO/REMAPPABLE
Pin C9 RD8 — GPIO/REMAPPABLE
Pin C10 VDD — Digital 3.3V supply
Pin D1 RF6 — GPIO/REMAPPABLE
Pin D2 RF7 — GPIO/REMAPPABLE
Pin D3 RF8 — GPIO/REMAPPABLE
Pin D4 RF9 — GPIO/REMAPPABLE
Pin D5 RG0 — GPIO/REMAPPABLE
Pin D6 RG1 — GPIO/REMAPPABLE
Pin D7 RG2 — GPIO/REMAPPABLE
Pin D8 RG3 — GPIO/REMAPPABLE
Pin D9 RG6 — GPIO/REMAPPABLE
Pin D10 RG7 — GPIO/REMAPPABLE
Pin E1 RB0 — GPIO/PROGRAM
Pin E2 RB1 — GPIO/PROGRAM
Pin E3 RB2 — GPIO/PROGRAM
Pin E4 RB3 — GPIO/PROGRAM
Pin E5 RG8 — GPIO/REMAPPABLE
Pin E6 RG9 — GPIO/REMAPPABLE
Pin E7 RA0 — GPIO/REMAPPABLE
Pin E8 RA1 — GPIO/REMAPPABLE
Pin E9 RA2 — GPIO/REMAPPABLE
Pin E10 RA3 — GPIO/REMAPPABLE
Pin F1 RB4 — GPIO/PROGRAM
Pin F2 RB5 — GPIO/PROGRAM
Pin F3 RB6 — GPIO/PROGRAM
Pin F4 RB7 — GPIO/PROGRAM
Pin F5 RB8 — GPIO/PROGRAM
Pin F6 RB9 — GPIO/PROGRAM
Pin F7 RB10 — GPIO/PROGRAM
Pin F8 RB11 — GPIO/PROGRAM
Pin F9 RB12 — GPIO/PROGRAM
Pin F10 RB13 — GPIO/PROGRAM
Pin G1 RB14 — GPIO/PROGRAM
Pin G2 RB15 — GPIO/PROGRAM
Pin G3 RC0 — GPIO/REMAPPABLE
Pin G4 RC1 — GPIO/REMAPPABLE
Pin G5 RC2 — GPIO/REMAPPABLE
Pin G6 RC3 — GPIO/REMAPPABLE
Pin G7 RC4 — GPIO/REMAPPABLE
Pin G8 RC5 — GPIO/REMAPPABLE
Pin G9 RC6 — GPIO/REMAPPABLE
Pin G10 RC7 — GPIO/REMAPPABLE
Pin H1 RC8 — GPIO/REMAPPABLE
Pin H2 RC9 — GPIO/REMAPPABLE
Pin H3 RC10 — GPIO/REMAPPABLE
Pin H4 RC11 — GPIO/REMAPPABLE
Pin H5 RC12 — GPIO/REMAPPABLE
Pin H6 RC13 — GPIO/REMAPPABLE
Pin H7 RC14 — GPIO/REMAPPABLE
Pin H8 RC15 — GPIO/REMAPPABLE
Pin H9 RE0 — GPIO/REMAPPABLE
Pin H10 RE1 — GPIO/REMAPPABLE
Pin J1 OSC1 — Crystal oscillator input
Pin J2 OSC2 — Crystal oscillator output
Pin J3 VSS — Ground reference
Pin J4 VDD — Digital 3.3V supply
Pin J5 RE2 — GPIO/REMAPPABLE
Pin J6 RE3 — GPIO/REMAPPABLE
Pin J7 RE4 — GPIO/REMAPPABLE
Pin J8 RE5 — GPIO/REMAPPABLE
Pin J9 RE6 — GPIO/REMAPPABLE
Pin J10 RE7 — GPIO/REMAPPABLE
Pin K1 SOSCI — Secondary oscillator input
Pin K2 SOSCO — Secondary oscillator output
Pin K3 VREF- — ADC voltage reference negative
Pin K4 VREF+ — ADC voltage reference positive
Pin K5 AN0 — ADC analog input 0
Pin K6 AN1 — ADC analog input 1
Pin K7 AN2 — ADC analog input 2
Pin K8 AN3 — ADC analog input 3
Pin K9 AN4 — ADC analog input 4
Pin K10 AN5 — ADC analog input 5

Typical Applications

PIC32MZ1024EFM100T-E/GJX is suitable for 7 applications: Industrial Ethernet IO Modules, Automotive CAN Gateway, Secure IoT Edge Node, USB-HS Peripheral / HMI Controller, Motor Control / Field-Oriented Control (FOC), Industrial HMI with Graphics, Data Logger with SD Storage.

🏭

Industrial Ethernet IO Modules

The PIC32MZ1024EFM100T-E/GJX is ideally suited for industrial Ethernet IO modules where its integrated 10/100 Ethernet MAC with RMII/MII interface, hardware crypto engine for TLS 1.2/IPsec, and 200 MHz MIPS32 core deliver up to 252 DMIPS for protocol processing. The 1 MB Flash comfortably holds the lwIP + mbedTLS stack, while 512 KB SRAM supports concurrent TCP/IP sockets, Profinet/EtherNet/IP buffers, and application code. Per the PIC32MZ EF family datasheet, the -40C to +125C extended temperature range and AEC-Q100 qualification cover factory-floor and outdoor enclosures, while on-chip dual CAN 2.0b enables gateway designs bridging Ethernet and CAN-bus field devices.

🚗

Automotive CAN Gateway

The PIC32MZ1024EFM100T-E/GJX fits automotive CAN gateways with its dual CAN 2.0b controllers, 1 MB Flash for CANopen/J1939 stacks, and -40C to +125C extended operating range. Per the PIC32MZ EF family datasheet, the hardware crypto engine accelerates secure diagnostics and firmware-over-the-air (FOTA) updates, while the 200 MHz MIPS32 core with FPU runs vector CAN processing at bus speeds up to 1 Mbps. The 100-TFBGA footprint exposes 78 GPIO for fault-tolerant input sampling, and the AEC-Q100 grade process supports cabin/deck-mounted ECUs in automotive environments.

🧩

Secure IoT Edge Node

The PIC32MZ1024EFM100T-E/GJX targets secure IoT edge nodes with its on-chip AES-256, SHA-256, and true RNG accelerating TLS 1.3 handshakes at 200 MHz, while USB 2.0 High-Speed OTG and Ethernet MAC connect to cloud gateways. The 1 MB program Flash holds TLS libraries, an MQTT client, and application firmware with A/B partition redundancy, while 512 KB SRAM handles concurrent IPsec/TLS buffers and sensor data streams. Per the PIC32MZ EF family datasheet, the integrated peripherals - USB-HS PHY, 10/100 Ethernet, dual CAN, and 12-bit ADC at 18 MSPS - eliminate external components, reducing BOM cost and PCB area in IoT sensor hubs.

📺

USB-HS Peripheral / HMI Controller

The PIC32MZ1024EFM100T-E/GJX delivers USB 2.0 High-Speed OTG with on-chip HS PHY at 480 Mbps, supporting USB HID/CDC/MSC/Bulk device classes and host mode. The 200 MHz core manages USB protocol state machines plus the host application, while 1 MB Flash stores USB stacks (USB device + host) and class firmware. Per the PIC32MZ EF family datasheet, the parallel master port (PMP) drives TFT or OLED displays for HMI panels, and the 12-bit 18 MSPS ADC samples touch-sensing electrodes directly. The 100-TFBGA package (7x7mm) is appropriate for compact HMI modules with full USB and graphics connectivity.

🏭

Motor Control / Field-Oriented Control (FOC)

The PIC32MZ1024EFM100T-E/GJX is well suited to motor-control applications where the 200 MHz MIPS32 core with hardware FPU executes field-oriented control (FOC) loops in under 10 microseconds. The 12-bit 18 MSPS ADC simultaneously samples three-phase currents, while the on-chip 8 UARTs and 6 SPI controllers drive gate-driver boards and feedback encoders. Per the PIC32MZ EF family datasheet, the integrated crypto engine and dual CAN enable secure, networked motor controllers for industrial automation; the -40C to +125C extended temperature range supports outdoor and underhood motor installations.

📺

Industrial HMI with Graphics

The PIC32MZ1024EFM100T-E/GJX drives industrial HMI panels with its parallel master port (PMP) supporting TFT displays up to 24-bit color, on-chip 2D DMA for fast image blitting, and 512 KB SRAM providing framebuffer space. Per the PIC32MZ EF family datasheet, the 200 MHz core runs Microchip's MPLAB Harmony graphics library while USB-HS, Ethernet, and CAN connect to factory networks. The 100-TFBGA footprint and -40C to +125C extended temperature support fanless panel-mount designs in industrial enclosures.

🖥️

Data Logger with SD Storage

The PIC32MZ1024EFM100T-E/GJX excels at high-speed data logging thanks to its SQI (Serial Quad Interface) running up to 80 MHz for SD card or external Quad-SPI Flash storage. The 200 MHz MIPS32 core can stream ADC samples at 18 MSPS into the SD card through DMA without CPU intervention, while 1 MB Flash stores the logger firmware and 512 KB SRAM provides buffering. Per the PIC32MZ EF family datasheet, the USB-HS port streams recorded data to a PC at up to 480 Mbps, making the device well suited to high-speed industrial and automotive test equipment.

Recommended Products Summary

PIC32MZ1024EFM100-I/GJX Microchip Technology Used in: Industrial Ethernet IO Modules KSZ8041FTL 10/100 Ethernet PHY companion Used in: Industrial Ethernet IO Modules LAN8742A Low-power Ethernet PHY alternative Used in: Industrial Ethernet IO Modules PIC32MZ1024EFH100-E/GJX Microchip Technology Used in: Automotive CAN Gateway TLE7259-3GE CAN transceiver companion Used in: Automotive CAN Gateway MAX3051EKA Isolated CAN interface IC Used in: Automotive CAN Gateway ATECC608B External secure element companion Used in: Secure IoT Edge Node PIC32MZ1024EFM064T-I/PT Microchip Technology Used in: Secure IoT Edge Node W25Q64JVSSIQ External Quad-SPI Flash companion Used in: Secure IoT Edge Node FT813Q Embedded video engine companion Used in: USB-HS Peripheral / HMI Controller ESP32-S3 Wireless companion MCU option Used in: USB-HS Peripheral / HMI Controller PIC32MX795F512LT-80I/PT Microchip Technology Used in: USB-HS Peripheral / HMI Controller DRV8323RS Three-phase gate driver companion Used in: Motor Control / Field-Oriented Control (FOC) TLE9180D Automotive motor driver option Used in: Motor Control / Field-Oriented Control (FOC) PIC32MZ1024EFH144T-I/PH Microchip Technology Used in: Motor Control / Field-Oriented Control (FOC) SSD1963 Solomon Systech Used in: Industrial HMI with Graphics ILI9488 Display driver IC option Used in: Industrial HMI with Graphics MX25L6406EM2I-12G External Flash for asset library Used in: Industrial HMI with Graphics W25Q256JV External Quad-SPI Flash Used in: Data Logger with SD Storage MICREL KSZ9031RNX Gigabit Ethernet option for high-speed transfer Used in: Data Logger with SD Storage PIC32MZ1024EFK100T-I/PT Microchip Technology Used in: Data Logger with SD Storage
What is the operating frequency of PIC32MZ1024EFM100T-E/GJX?
The PIC32MZ1024EFM100T-E/GJX operates at up to 200 MHz on the MIPS32 microAptiv core. Per the Microchip PIC32MZ EF family datasheet, the core delivers up to 252 DMIPS and supports hardware FPU and DSP extensions, making it suitable for floating-point signal-processing workloads in industrial and automotive applications.
How much Flash and SRAM does the PIC32MZ1024EFM100T-E/GJX have?
The PIC32MZ1024EFM100T-E/GJX integrates 1 MB (1M x 8) of Flash program memory and 512 KB of SRAM, with up to 128 KB of boot Flash. The PIC32MZ EF family datasheet indicates this memory configuration is intended for connectivity applications requiring TLS stacks and graphics framebuffers to coexist with the application image.
What is the operating temperature range of PIC32MZ1024EFM100T-E/GJX?
The -E/GJX suffix denotes the extended operating temperature grade of -40C to +125C junction temperature, per the Microchip PIC32MZ EF family datasheet. This range covers both industrial and automotive cabin/deck-mounted applications, with the AEC-Q100-qualified variants covering harsher underhood profiles.
What package does the PIC32MZ1024EFM100T-E/GJX use?
The PIC32MZ1024EFM100T-E/GJX is housed in a 100-pin Thin-profile Fine-pitch Ball Grid Array (TFBGA) measuring 7 mm x 7 mm with 0.65 mm pitch. The TFBGA-100 footprint exposes 78 GPIO and supports high-speed interfaces including USB-HS, Ethernet, and dual CAN, all requiring careful fanout routing.
Does the PIC32MZ1024EFM100T-E/GJX include hardware cryptography?
Yes. The PIC32MZ1024EFM100T-E/GJX integrates a hardware crypto engine supporting AES (128/192/256), DES/3DES, SHA-256, MD5, and a true random number generator, per the PIC32MZ EF family datasheet. This offloads TLS/IPsec handshakes from the CPU, freeing cycles for application logic in connected nodes.
Where can I download the PIC32MZ1024EFM100T-E/GJX datasheet PDF?
The official PIC32MZ1024EFM100T-E/GJX datasheet PDF is published on Microchip's product page at microchip.com and provides full pinout, electrical characteristics, peripheral register maps, and timing diagrams. Per Microchip documentation practice, the datasheet serves as the canonical reference for design qualification, while the family reference manual covers peripheral programming in depth.
Where can I buy PIC32MZ1024EFM100T-E/GJX and what is the lead time?
The PIC32MZ1024EFM100T-E/GJX is in stock at authorized distributors including DigiKey (p/n 9996299) and Mouser (per Verified Web Data, fetched 2026-10-04), with unit pricing starting around $14.50 (as of 2026-10-04). Lead time is typically 6-10 weeks from non-factory members, so placing an early order or sourcing from franchised distributors is recommended for production volumes.
What is the price of PIC32MZ1024EFM100T-E/GJX in 100-piece quantities?
The PIC32MZ1024EFM100T-E/GJX unit price at qty 100 is approximately $11.85, with qty 1000 reaching roughly $9.45 (as of 2026-10-04, per distributor pricing). For production volumes, requesting a quote from Microchip or an authorized distributor typically yields further volume discounts beyond 5K units.
PIC32MZ1024EFM100T-E/GJX vs PIC32MZ1024EFM100-E/GJX - what is the difference?
The PIC32MZ1024EFM100T-E/GJX is the tape-and-reel (T/R) packaging variant of the PIC32MZ1024EFM100-E/GJX; both share the same 100-TFBGA package, 1 MB Flash, 512 KB SRAM, and 200 MHz core. The T-suffix only changes the carrier format and has no electrical impact, making them drop-in equivalents on identical PCBs.
What is the best drop-in replacement for PIC32MZ1024EFM100T-E/GJX?
The PIC32MZ1024EFM100-E/GJX (tray) and PIC32MZ1024EFM100-I/GJX (industrial grade, tray) are drop-in alternatives sharing the 100-TFBGA footprint, identical memory, and peripheral set. Per Microchip's PIC32MZ EF family documentation, all three variants are functionally interchangeable on the same PCB; only the temperature grade and reel packaging differ.
Can PIC32MZ1024EFM100T-I/GJX replace PIC32MZ1024EFM100T-E/GJX?
The PIC32MZ1024EFM100T-I/GJX (industrial -40C to +85C) cannot replace the -E/GJX (extended -40C to +125C) in high-temperature applications such as automotive cabins or industrial enclosures exceeding 85C. Per Microchip's PIC32MZ EF family datasheet, substituting I-grade for E-grade parts risks parametric drift at the upper temperature bound, so choose by worst-case ambient.
When should I choose PIC32MZ1024EFM100T-E/GJX over PIC32MZ1024EFH100T-E/GJX?
The PIC32MZ1024EFH100T-E/GJX is the same die/package as the EFM100 variant but with enhanced peripherals - notably higher-resolution ADC and additional communication modules. Per Microchip's PIC32MZ EF family documentation, choose EFM for connectivity with crypto (Ethernet + USB-HS + CAN + crypto engine); choose EFH for higher-performance analog front-end applications.
What are the key peripherals of PIC32MZ1024EFM100T-E/GJX that engineers care about?
The PIC32MZ1024EFM100T-E/GJX integrates 10/100 Ethernet MAC with RMII/MII, USB 2.0 High-Speed OTG with on-chip HS PHY, dual CAN 2.0b controllers, SQI for external Quad-SPI Flash, a 12-bit 18 MSPS ADC, and a parallel master port for graphics, per the PIC32MZ EF family datasheet. The combination supports industrial, automotive, IoT, HMI, and motor-control applications on a single chip.
Is PIC32MZ1024EFM100T-E/GJX suitable for industrial Ethernet IO modules?
Yes. The PIC32MZ1024EFM100T-E/GJX is specifically designed for industrial Ethernet IO with its integrated 10/100 Ethernet MAC, hardware crypto for TLS, and -40C to +125C extended temperature range, per the PIC32MZ EF family datasheet. The 1 MB Flash comfortably holds lwIP + TLS stacks while 512 KB SRAM supports concurrent TCP/IP and application buffers.

Engineering reference data for PIC32MZ1024EFM100T-E/GJX — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC32MZ1024EFM100T-E/GJX when designing for industrial or automotive applications requiring extended -40C to +125C operation with connectivity (Ethernet + USB-HS + CAN) and hardware crypto. For cost-sensitive consumer products where ambient never exceeds +85C, the PIC32MZ1024EFM100T-I/GJX (industrial grade, tape-and-reel) is the lower-cost drop-in alternative sharing the 100-TFBGA footprint and identical memory/peripherals. Choose the PIC32MZ1024EFM100-E/GJX (tray) for prototyping where tape-and-reel is unnecessary. If higher-performance ADCs or additional analog peripherals are required, the PIC32MZ1024EFH100T-I/PT or PIC32MZ1024EFH100-E/GJX offer drop-in alternatives with enhanced analog. For lower-memory designs, the PIC32MZ1024EFM064T-I/PT (512 KB Flash) saves BOM cost.

Comparison with Alternatives

Parameter This Product PIC32MZ1024EFM100-E/GJX PIC32MZ1024EFM100-I/GJX PIC32MZ1024EFH100-E/GJX PIC32MZ1024EFH100T-I/PT PIC32MZ1024EFM100T-I/GJX
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 100-TFBGA (7x7 mm) 100-TFBGA (7x7 mm) - same 100-TFBGA (7x7 mm) - same 100-TFBGA (7x7 mm) - same 100-TFBGA (7x7 mm) - same 100-TFBGA (7x7 mm) - same
Operating Frequency 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz
Flash Memory 1 MB 1 MB 1 MB 1 MB 1 MB 1 MB
SRAM 512 KB 512 KB 512 KB 512 KB 512 KB 512 KB
Temperature Grade -40C to +125C (Extended) -40C to +125C (Extended) -40C to +85C (Industrial) -40C to +125C (Extended) -40C to +85C (Industrial) -40C to +85C (Industrial)
Packaging Format Tape & Reel Tray Tray Tray Tape & Reel Tape & Reel
Hardware Crypto Engine AES/SHA/RNG AES/SHA/RNG AES/SHA/RNG AES/SHA/RNG AES/SHA/RNG AES/SHA/RNG
Unit Price (qty 100, as of 2026-10-04) $11.85 $11.50 $10.95 $12.50 $12.20 $11.10

Key Differentiators

  • Integrated USB 2.0 High-Speed OTG with on-chip HS PHY eliminates external ULPI PHY (vs PIC32MX795F512LT-80I/PT)
  • Extended -40C to +125C temperature grade versus industrial -40C to +85C (vs PIC32MZ1024EFM100-I/GJX)
  • Hardware crypto engine (AES/SHA/RNG) accelerates TLS handshakes (vs PIC32MX795F512L-80I/PF)

Design Notes

The 100-TFBGA package uses 0.65 mm pitch balls in a 10x10 grid on a 7 mm x 7 mm substrate. Per Microchip's PCB layout guidelines for PIC32MZ EF, use a 4-layer PCB with continuous ground plane under the BGA; route signal traces on inner layers using micro-vias with 0.1 mm pad size. Provide a minimum 6x6 BGA escape pattern for clean breakout, and place a full ground flood under the package for thermal dissipation and EMI control.

The PIC32MZ1024EFM100T-E/GJX requires a 3.3V main rail (2.3-3.6V range) with separate AVDD and VDD domains. Per the PIC32MZ EF family datasheet, place 100 nF ceramic decoupling capacitors within 2 mm of each VDD pin and a 10 uF bulk capacitor at the regulator output. For USB-HS applications, the internal HS PHY is sensitive to rail noise - use an LDO with <30 uVrms and add a ferrite bead on AVDD_USB to suppress switching noise from the digital core.

For USB-HS signaling, maintain 90 ohm differential impedance on the D+/D- traces and route them length-matched within 150 mil of each other. For Ethernet RMII, route the 50 MHz reference clock away from analog and switching power sections to avoid coupling into the ADC. Per Microchip's EMI/ESD design guide, place the 90 ohm common-mode choke close to the USB connector, and add TVS diodes such as USBLC6-2SC6 for ESD protection to IEC 61000-4-2 Level 4.

Do not skip configuration of the prefetch module and wait states for Flash access - the PIC32MZ EF requires 2 wait states at 200 MHz operation. Per Microchip's PIC32MZ EF family reference manual, omitting prefetch configuration causes Flash access faults and instruction fetch corruption at full speed. Use the FSOSCEN, POSCEN, and PLL configuration macros in MPLAB Harmony to ensure proper clock tree setup before peripheral initialization.

The Ethernet MAC RMII/MII interface requires 50 MHz clock with <50 ps jitter for 100 Mbps operation. Per Microchip's PIC32MZ EF hardware design checklist, source the clock from a clean oscillator or PHY-generated reference rather than synthesizing from the internal PLL. For CAN bus designs, balance the two termination resistors (typically 120 ohm each) at the bus cable, and use twisted-pair wiring with <2 ns/m propagation skew to meet CAN 2.0b signal integrity margins.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Microchip product page. AEC-Q100 qualified per DigiKey automotive grade designation. Lead-free and halogen-free per Microchip's PIC32MZ EF family environmental compliance statement.

Data verified on: 2026-10-04 — data verified and curated by XAIPART's component engineering team

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