PIC32MZ2025DAB169T-I/HF - 32-bit 200MHz MCU 2MB Flash 169-LFBGA
N.º da peça: PIC32MZ2025DAB169T-I/HF ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $19.34 | $19,34 |
| 10 | $17.4 | $174,00 |
| 100 | $15.47 | $1.547,00 |
| 500 | $13.55 | $6.775,00 |
| 1.000 | $12.62 | $12.620,00 |
PIC32MZ2025DAB169T-I/HF Visão geral
A 32-bit MCU is a microcontroller built around a 32-bit data path and 32-bit registers, which lets it process larger operands and addresses in a single instruction than 8-bit or 16-bit parts. The PIC32MZ DA family sits at the top of the PIC32 hierarchy (PIC32 > 32-bit MCU > MIPS32 microAptiv core > PIC32MZ DA sub-family), giving designers an MCU-style programming model with peripherals, RTOS support, and a wide toolchain while delivering 200 MHz / 330 DMIPS-class throughput that overlaps entry-level MPU workloads.
Three headline features differentiate this part: 2 MB Flash with 640 KB SRAM for full LVGL / emWin stacks and asset storage; an integrated 2D Graphics Processor with parallel RGB interface for TFT up to WXGA, removing external GPU cost; and a 12-bit 18 MSPS ADC with up to 45 analog inputs, enabling multi-sensor data acquisition without an external ADC. The 11x11 mm LFBGA-169 footprint keeps board area compact for handhelds and panel-mount HMIs.
Architecturally the device pairs a MIPS32 microAptiv core with a 5-stage pipeline and tightly-coupled peripherals routed through a multi-layer AHB/APB fabric. Designers get deterministic interrupt latency from the MIPS core, while the on-chip DDR2 controller absorbs the memory bandwidth demanded by frame-buffer refreshes at full panel resolution.
Typical applications include industrial HMI panels, home-automation gateways with touch displays, point-of-sale terminals, medical patient monitors, and CAN/USB-connected sensor hubs. The 200 MHz core and large SRAM make it equally suitable for GUI, motor-control, and audio-processing sub-systems.
When designing with this device, watch the LFBGA escape routing and provide at least four PCB layers with via-in-pad recommended for the inner-row balls. Use Microchip's MPLAB Harmony configurator to initialize the DDR2 controller and Graphics Processor - manual register-level bring-up is rarely practical for production timelines.
This page synthesizes distributor pricing, drop-in LFBGA-169 alternatives, and practical bring-up guidance not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC32MZ2025DAB169T-I/HF — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ2025DAB169T-I/HF (mesmo formato e footprint) — diferindo em Graphics Controller, CAN, USB, Core Architecture, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ2025DAB169-I/HF
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ2025DAB169T-V/HF
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1064DAB169T-I/HF
✅ Drop-In✓ Em estoque
$4.52 / unidade
Ver ficha técnica →PIC32MZ1064DAB169-I/HF
✅ Drop-In✓ Em estoque
$12.4 / unidade
Ver ficha técnica →PIC32MZ1025DAB169T-I/HF
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$12.65 / unidade
Ver ficha técnica →PIC32MZ1025DAB169-I/HF
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.85 / unidade
Ver ficha técnica →PIC32MZ1025DAL169T-I/HF
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$8.3 / unidade
Ver ficha técnica →PIC32MZ2025DAB169T-I/HF Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ DA |
| Largura do barramento de dados | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Flash Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Encapsulamento | 169-LFBGA (11x11 mm) |
| Tensão de alimentação | 3.3 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated (parallel RGB TFT up to WXGA) |
| Graphics Processor | Integrated 2D accelerator |
| External Memory Bus | DDR2 controller, up to 128 MB addressable |
| CAN | Yes |
| USB | Hi-Speed USB |
| Temperatura de operação | -40C to +85C (industrial, I grade) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do PIC32MZ2025DAB169T-I/HF 169-lfbga (11x11 mm)
Configuração de pinos para PIC32MZ2025DAB169T-I/HF (pacote 169-lfbga (11x11 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MZ2025DAB169T-I/HF.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MZ2025DAB169T-I/HF é adequado para 6 aplicaçãos: Industrial HMI Touch Panels, Home-Automation Gateways, Point-of-Sale (POS) Terminals, Medical Patient Monitors, Connected Sensor Hubs, Automotive Infotainment Displays.
Industrial HMI Touch Panels
The PIC32MZ2025DAB169T-I/HF fits industrial HMI panels because its integrated 2D Graphics Processor drives TFT up to WXGA without an external GPU, while 640 KB SRAM and 2 MB Flash host full LVGL/emWin stacks plus assets. The 12-bit 18 MSPS ADC with up to 45 inputs reads analog sensors (pressure, temperature, current) alongside the display. Hi-Speed USB and CAN let the panel appear as a fieldbus gateway to a PLC. The 200 MHz MIPS32 microAptiv core refreshes the framebuffer while still leaving headroom for the touch event loop.
Recomendado
Home-Automation Gateways
For home-automation gateways with a small touchscreen, the PIC32MZ2025DAB169T-I/HF combines an integrated DDR2 controller (up to 128 MB) for icon/asset caching with Hi-Speed USB and CAN for bridging to Wi-Fi/Ethernet modules and HVAC busses. The 2 MB Flash stores rich UI assets and the Zigbee/Thread stack glue. The 169-LFBGA 11x11 mm footprint keeps the gateway PCB slim enough for wall-mount enclosures, and the 200 MHz MIPS32 microAptiv core runs the GUI plus TLS handshake without RTOS jitter.
Recomendado
Point-of-Sale (POS) Terminals
The PIC32MZ2025DAB169T-I/HF suits POS terminals because its WXGA-capable Graphics Controller drives the merchant-facing color display while Hi-Speed USB connects to barcode scanners, receipt printers, and PIN pads. The 640 KB SRAM buffers transaction UIs and signature images; the 2 MB Flash holds fonts, logos, and the payment-app stub. The 12-bit 18 MSPS ADC samples battery telemetry or analog tamper sensors. The industrial -40C to +85C temperature grade handles retail-environment thermal swings.
Recomendado
Medical Patient Monitors
For portable patient monitors the PIC32MZ2025DAB169T-I/HF delivers 200 MHz throughput with 640 KB SRAM to render real-time waveforms, while the 12-bit 18 MSPS ADC digitizes ECG, SpO2, and respiration channels simultaneously. CAN bus connectivity links bedside modules, and Hi-Speed USB streams waveform data to a host PC for analysis. The 2 MB Flash holds the device firmware plus multilingual UI assets. The integrated 2D Graphics Processor accelerates scrolling waveforms without taxing the CPU.
Recomendado
Connected Sensor Hubs
The PIC32MZ2025DAB169T-I/HF serves as a CAN/USB-connected sensor hub by aggregating up to 45 analog inputs through the 12-bit 18 MSPS ADC and pushing processed data upstream via Hi-Speed USB. The 2 MB Flash stores configuration and calibration tables; the 640 KB SRAM buffers time-series data. The 200 MHz MIPS32 microAptiv core runs lightweight DSP filters on incoming samples while leaving headroom for protocol conversion. Industrial temperature grade supports factory-floor deployment.
Recomendado
Automotive Infotainment Displays
For aftermarket and lower-tier automotive infotainment displays, the PIC32MZ2025DAB169T-I/HF integrates a parallel RGB TFT controller for WVGA/WXGA panels plus CAN for vehicle network access. The 2 MB Flash hosts boot logos and simple navigation UI assets; the 640 KB SRAM drives the framebuffer. For designs needing AEC-Q100 qualification, the PIC32MZ2025DAB169T-V/HF (105C V grade) is a drop-in alternative in the same 169-LFBGA footprint.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ2025DAB169T-I/HF — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ2025DAB169-I/HF | PIC32MZ2025DAB169T-V/HF | PIC32MZ1064DAB169T-I/HF | PIC32MZ1025DAB169T-I/HF |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Core | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | ARM Cortex-M4 |
| Flash Memory | 2 MB | 2 MB | 2 MB | 1 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 256 KB |
| Maximum Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C |
| Graphics Controller | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated (no 2D GPU) |
| Packaging Media | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
Principais diferenciais
- Integrated 2D Graphics Processor at the same footprint (vs PIC32MZ1025DAB169T-I/HF)
- Doubled Flash density versus 1064 part in same package (vs PIC32MZ1064DAB169T-I/HF)
- Higher temperature grade available as drop-in (vs PIC32MZ2025DAB169T-V/HF)
Notas de projeto
The 169-LFBGA 11x11 mm package has balls on a 0.8 mm pitch, with inner rows requiring via-in-pad escape on at least 4 PCB layers. Per Microchip PIC32MZ DA design notes, use 0.4 mm laser-drilled microvias and a 1 oz copper ground flood directly under the BGA to keep the inner-row return paths continuous. Skip solder-mask-defined pads on the BGA - use non-solder-mask-defined (NSMD) with a 0.3 mm pad diameter for higher assembly yield.
The PIC32MZ DA device requires a low-noise 3.3 V core rail plus 1.8 V for the DDR2 controller; Microchip recommends decoupling with 100 nF X7R ceramic capacitors within 2 mm of every VDDCORE/VDDIO power ball, plus four 10 uF X5R bulk capacitors near the package perimeter. Power-on sequencing requires VDDIO before VDDCORE; failure to observe the order risks latch-up. Use Microchip's MCP16502 multi-rail PMIC for an integrated solution.
Do not assume the DDR2 controller self-initializes: the MPLAB Harmony configurator must generate the DDR2 timing block per the chosen SDRAM datasheet (tRCD, tRP, tRFC, MR settings). Engineers attempting manual DDR2 bring-up frequently hit data-eye failures from uncalibrated output impedance. Also verify the Graphics Processor source clock - the default 30 MHz LPRC is insufficient for WXGA panels and must be switched to the 24 MHz primary oscillator with the on-chip PLL.
Informações de conformidade
RoHS compliance confirmed by Microchip product page. The I grade is not AEC-Q100; the V grade (PIC32MZ2025DAB169T-V/HF) is also not AEC-Q100 but supports a wider -40C to +105C range. Halogen-free status not explicitly stated in the provided data.