PIC32MZ2025DAB169T-I/HF - 32-bit 200MHz MCU 2MB Flash 169-LFBGA
Référence : PIC32MZ2025DAB169T-I/HF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $19.34 | $19,34 |
| 10 | $17.4 | $174,00 |
| 100 | $15.47 | $1 547,00 |
| 500 | $13.55 | $6 775,00 |
| 1 000 | $12.62 | $12 620,00 |
PIC32MZ2025DAB169T-I/HF Présentation
A 32-bit MCU is a microcontroller built around a 32-bit data path and 32-bit registers, which lets it process larger operands and addresses in a single instruction than 8-bit or 16-bit parts. The PIC32MZ DA family sits at the top of the PIC32 hierarchy (PIC32 > 32-bit MCU > MIPS32 microAptiv core > PIC32MZ DA sub-family), giving designers an MCU-style programming model with peripherals, RTOS support, and a wide toolchain while delivering 200 MHz / 330 DMIPS-class throughput that overlaps entry-level MPU workloads.
Three headline features differentiate this part: 2 MB Flash with 640 KB SRAM for full LVGL / emWin stacks and asset storage; an integrated 2D Graphics Processor with parallel RGB interface for TFT up to WXGA, removing external GPU cost; and a 12-bit 18 MSPS ADC with up to 45 analog inputs, enabling multi-sensor data acquisition without an external ADC. The 11x11 mm LFBGA-169 footprint keeps board area compact for handhelds and panel-mount HMIs.
Architecturally the device pairs a MIPS32 microAptiv core with a 5-stage pipeline and tightly-coupled peripherals routed through a multi-layer AHB/APB fabric. Designers get deterministic interrupt latency from the MIPS core, while the on-chip DDR2 controller absorbs the memory bandwidth demanded by frame-buffer refreshes at full panel resolution.
Typical applications include industrial HMI panels, home-automation gateways with touch displays, point-of-sale terminals, medical patient monitors, and CAN/USB-connected sensor hubs. The 200 MHz core and large SRAM make it equally suitable for GUI, motor-control, and audio-processing sub-systems.
When designing with this device, watch the LFBGA escape routing and provide at least four PCB layers with via-in-pad recommended for the inner-row balls. Use Microchip's MPLAB Harmony configurator to initialize the DDR2 controller and Graphics Processor - manual register-level bring-up is rarely practical for production timelines.
This page synthesizes distributor pricing, drop-in LFBGA-169 alternatives, and practical bring-up guidance not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ2025DAB169T-I/HF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2025DAB169T-I/HF (même facteur de forme et même empreinte) — différant par Graphics Controller, CAN, USB, Core Architecture, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2025DAB169-I/HF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ2025DAB169T-V/HF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1064DAB169T-I/HF
✅ Remplacement direct✓ En stock
$4.52 / unité
Voir la fiche technique →PIC32MZ1064DAB169-I/HF
✅ Remplacement direct✓ En stock
$12.4 / unité
Voir la fiche technique →PIC32MZ1025DAB169T-I/HF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$12.65 / unité
Voir la fiche technique →PIC32MZ1025DAB169-I/HF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7.85 / unité
Voir la fiche technique →PIC32MZ1025DAL169T-I/HF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.3 / unité
Voir la fiche technique →PIC32MZ2025DAB169T-I/HF Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ DA |
| Largeur du bus de données | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Flash Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Boîtier | 169-LFBGA (11x11 mm) |
| Tension d'alimentation | 3.3 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated (parallel RGB TFT up to WXGA) |
| Graphics Processor | Integrated 2D accelerator |
| External Memory Bus | DDR2 controller, up to 128 MB addressable |
| CAN | Yes |
| USB | Hi-Speed USB |
| Température de fonctionnement | -40C to +85C (industrial, I grade) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MZ2025DAB169T-I/HF 169-lfbga (11x11 mm)
Configuration des broches du PIC32MZ2025DAB169T-I/HF (boîtier 169-lfbga (11x11 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ2025DAB169T-I/HF.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ2025DAB169T-I/HF convient pour 6 applications: Industrial HMI Touch Panels, Home-Automation Gateways, Point-of-Sale (POS) Terminals, Medical Patient Monitors, Connected Sensor Hubs, Automotive Infotainment Displays.
Industrial HMI Touch Panels
The PIC32MZ2025DAB169T-I/HF fits industrial HMI panels because its integrated 2D Graphics Processor drives TFT up to WXGA without an external GPU, while 640 KB SRAM and 2 MB Flash host full LVGL/emWin stacks plus assets. The 12-bit 18 MSPS ADC with up to 45 inputs reads analog sensors (pressure, temperature, current) alongside the display. Hi-Speed USB and CAN let the panel appear as a fieldbus gateway to a PLC. The 200 MHz MIPS32 microAptiv core refreshes the framebuffer while still leaving headroom for the touch event loop.
Recommandé
Home-Automation Gateways
For home-automation gateways with a small touchscreen, the PIC32MZ2025DAB169T-I/HF combines an integrated DDR2 controller (up to 128 MB) for icon/asset caching with Hi-Speed USB and CAN for bridging to Wi-Fi/Ethernet modules and HVAC busses. The 2 MB Flash stores rich UI assets and the Zigbee/Thread stack glue. The 169-LFBGA 11x11 mm footprint keeps the gateway PCB slim enough for wall-mount enclosures, and the 200 MHz MIPS32 microAptiv core runs the GUI plus TLS handshake without RTOS jitter.
Recommandé
Point-of-Sale (POS) Terminals
The PIC32MZ2025DAB169T-I/HF suits POS terminals because its WXGA-capable Graphics Controller drives the merchant-facing color display while Hi-Speed USB connects to barcode scanners, receipt printers, and PIN pads. The 640 KB SRAM buffers transaction UIs and signature images; the 2 MB Flash holds fonts, logos, and the payment-app stub. The 12-bit 18 MSPS ADC samples battery telemetry or analog tamper sensors. The industrial -40C to +85C temperature grade handles retail-environment thermal swings.
Recommandé
Medical Patient Monitors
For portable patient monitors the PIC32MZ2025DAB169T-I/HF delivers 200 MHz throughput with 640 KB SRAM to render real-time waveforms, while the 12-bit 18 MSPS ADC digitizes ECG, SpO2, and respiration channels simultaneously. CAN bus connectivity links bedside modules, and Hi-Speed USB streams waveform data to a host PC for analysis. The 2 MB Flash holds the device firmware plus multilingual UI assets. The integrated 2D Graphics Processor accelerates scrolling waveforms without taxing the CPU.
Recommandé
Connected Sensor Hubs
The PIC32MZ2025DAB169T-I/HF serves as a CAN/USB-connected sensor hub by aggregating up to 45 analog inputs through the 12-bit 18 MSPS ADC and pushing processed data upstream via Hi-Speed USB. The 2 MB Flash stores configuration and calibration tables; the 640 KB SRAM buffers time-series data. The 200 MHz MIPS32 microAptiv core runs lightweight DSP filters on incoming samples while leaving headroom for protocol conversion. Industrial temperature grade supports factory-floor deployment.
Recommandé
Automotive Infotainment Displays
For aftermarket and lower-tier automotive infotainment displays, the PIC32MZ2025DAB169T-I/HF integrates a parallel RGB TFT controller for WVGA/WXGA panels plus CAN for vehicle network access. The 2 MB Flash hosts boot logos and simple navigation UI assets; the 640 KB SRAM drives the framebuffer. For designs needing AEC-Q100 qualification, the PIC32MZ2025DAB169T-V/HF (105C V grade) is a drop-in alternative in the same 169-LFBGA footprint.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2025DAB169T-I/HF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2025DAB169-I/HF | PIC32MZ2025DAB169T-V/HF | PIC32MZ1064DAB169T-I/HF | PIC32MZ1025DAB169T-I/HF |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Core | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | ARM Cortex-M4 |
| Flash Memory | 2 MB | 2 MB | 2 MB | 1 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 256 KB |
| Maximum Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C |
| Graphics Controller | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated (no 2D GPU) |
| Packaging Media | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
Principaux différenciateurs
- Integrated 2D Graphics Processor at the same footprint (vs PIC32MZ1025DAB169T-I/HF)
- Doubled Flash density versus 1064 part in same package (vs PIC32MZ1064DAB169T-I/HF)
- Higher temperature grade available as drop-in (vs PIC32MZ2025DAB169T-V/HF)
Notes de conception
The 169-LFBGA 11x11 mm package has balls on a 0.8 mm pitch, with inner rows requiring via-in-pad escape on at least 4 PCB layers. Per Microchip PIC32MZ DA design notes, use 0.4 mm laser-drilled microvias and a 1 oz copper ground flood directly under the BGA to keep the inner-row return paths continuous. Skip solder-mask-defined pads on the BGA - use non-solder-mask-defined (NSMD) with a 0.3 mm pad diameter for higher assembly yield.
The PIC32MZ DA device requires a low-noise 3.3 V core rail plus 1.8 V for the DDR2 controller; Microchip recommends decoupling with 100 nF X7R ceramic capacitors within 2 mm of every VDDCORE/VDDIO power ball, plus four 10 uF X5R bulk capacitors near the package perimeter. Power-on sequencing requires VDDIO before VDDCORE; failure to observe the order risks latch-up. Use Microchip's MCP16502 multi-rail PMIC for an integrated solution.
Do not assume the DDR2 controller self-initializes: the MPLAB Harmony configurator must generate the DDR2 timing block per the chosen SDRAM datasheet (tRCD, tRP, tRFC, MR settings). Engineers attempting manual DDR2 bring-up frequently hit data-eye failures from uncalibrated output impedance. Also verify the Graphics Processor source clock - the default 30 MHz LPRC is insufficient for WXGA panels and must be switched to the 24 MHz primary oscillator with the on-chip PLL.
Informations de conformité
RoHS compliance confirmed by Microchip product page. The I grade is not AEC-Q100; the V grade (PIC32MZ2025DAB169T-V/HF) is also not AEC-Q100 but supports a wider -40C to +105C range. Halogen-free status not explicitly stated in the provided data.