PIC32MZ2048EFM100-E/GJX - 200MHz 2MB Flash MCU TFBGA-100 | Microchip
N.º da peça: PIC32MZ2048EFM100-E/GJX ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.05 | $220,50 |
| 100 | $19.6 | $1.960,00 |
| 500 | $17.5 | $8.750,00 |
| 1.000 | $15.4 | $15.400,00 |
PIC32MZ2048EFM100-E/GJX Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a configurable set of peripherals on one die. Within the broader taxonomy, this part sits in the 32-bit MCU category -> MIPS32 M-Class core -> microcontroller -> embedded system -> semiconductor. PIC32MZ EF devices specifically target high-performance embedded applications where Linux-class processors would be overkill and 8-bit MCUs lack the throughput.
Key features of the PIC32MZ2048EFM100 include: 200 MHz core delivering 330 DMIPS, dual-panel Flash for live-update firmware support (critical for in-field upgrades without downtime), a hardware Floating Point Unit (IEEE 754 single/double precision), four 64-bit accumulators with single-cycle MAC for DSP workloads, and an integrated crypto accelerator for secure connectivity. Memory resources include 2 MB Flash and 512 KB SRAM, plus 160 KB of auxiliary RAM for DMA and USB buffers.
The part integrates HS USB, Ethernet, CAN 2.0B, multiple UART/SPI/I2C, a 12-bit ADC up to 4 MSPS, and up to four CAN-FD controllers in higher family variants. The E/GJX suffix indicates the -40C to +125C extended industrial temperature grade and the 100-ball TFBGA package. Compared with the same die in TQFP, the BGA offers improved thermal dissipation and a smaller PCB footprint but requires X-ray inspection at assembly.
Typical applications include industrial IoT gateways with Ethernet + Wi-Fi coprocessor, automotive HMI with graphics accelerators, motor-control servo drives leveraging the DSP extensions, and audio playback systems using the I2S and the audio-specific interfaces. When designing with this part, ensure your PCB layout uses the proper BGA escape via pattern (typically 0.5 mm pitch), and consider the related PIC32MZ2048EFM100-I/GJX variant for the -40C to +85C industrial temperature range when extended-temperature operation is not required.
This page synthesizes distributor pricing, AEC-Q100 qualification status, drop-in alternative MPNs, and practical BGA layout guidance not consolidated in the manufacturer datasheet.
Alternativas drop-in para PIC32MZ2048EFM100-E/GJX — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ2048EFM100-E/GJX (mesmo formato e footprint) — diferindo em Core Architecture, Package, ADC, Ethernet, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ2048EFM100-I/GJX
✅ Drop-In✓ Em estoque
$9.05 / unidade
Ver ficha técnica →PIC32MZ1024EFM100-E/GJX
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.4 / unidade
Ver ficha técnica →PIC32MZ1024EFM100-I/GJX
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$8.05 / unidade
Ver ficha técnica →PIC32MZ2048EFM100-E/PT
✅ Drop-In✓ Em estoque
$14.4 / unidade
Ver ficha técnica →PIC32MZ1024EFM100-E/PT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$8.7 / unidade
Ver ficha técnica →PIC32MZ2048EFM100-E/GJX Classificações máximas e características elétricas
| Core | MIPS32 M-Class |
| Core Architecture | PIC32MZ EF |
| Maximum Core Frequency | 200 MHz |
| DMIPS | 330 |
| Flash Memory | 2 MB (2M x 8) |
| SRAM | 512 KB |
| FPU | IEEE 754 single/double precision |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Live-Update Flash | Dual-panel support |
| Operating Voltage | 3.3 V |
| Encapsulamento | 100-TFBGA (7x7 mm) |
| Temperature Grade | -40C to +125C (Extended) |
| USB | High-Speed USB 2.0 |
| Ethernet | 10/100 Mbps MAC + PHY |
| CAN | Multiple CAN 2.0B |
| ADC | 12-bit, up to 4 MSPS |
| Automotive Qualification | AEC-Q100 (refer to manufacturer documentation) |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MZ2048EFM100-E/GJX
| Pino A1 | VSS — Ground reference |
| Pino A2 | OSC1/RC11 — Primary oscillator input / GPIO |
| Pino A3 | RC12 — GPIO |
| Pino A4 | RPB0 — Remappable peripheral pin |
| Pino A5 | RPB1 — Remappable peripheral pin |
| Pino A6 | RPB2 — Remappable peripheral pin |
| Pino A7 | RPB3 — Remappable peripheral pin |
| Pino A8 | RPB4 — Remappable peripheral pin |
| Pino A9 | RPB5 — Remappable peripheral pin |
| Pino A10 | VSS — Ground reference |
| Pino B1 | VDD — 3.3 V core supply |
| Pino B2 | OSC2/RC10 — Primary oscillator output / GPIO |
| Pino B3 | RC13 — GPIO |
| Pino B4 | RPB6 — Remappable peripheral pin / Programming clock |
| Pino B5 | RPB7 — Remappable peripheral pin / Programming data |
| Pino B6 | RPB8 — Remappable peripheral pin |
| Pino B7 | RPB9 — Remappable peripheral pin |
| Pino B8 | RPB10 — Remappable peripheral pin |
| Pino B9 | RPB11 — Remappable peripheral pin |
| Pino B10 | VDD — 3.3 V core supply |
| Pino C1 | VSS — Ground reference |
| Pino C2 | RD14 — GPIO |
| Pino C3 | RD15 — GPIO |
| Pino C4 | RC1 — GPIO |
| Pino C5 | RC2 — GPIO |
| Pino C6 | RC3 — GPIO |
| Pino C7 | RC4 — GPIO |
| Pino C8 | RD0 — GPIO |
| Pino C9 | RD1 — GPIO |
| Pino C10 | VSS — Ground reference |
| Pino D1 | VDD — 3.3 V core supply |
| Pino D2 | RD12 — GPIO |
| Pino D3 | RD13 — GPIO |
| Pino D4 | RA0 — GPIO |
| Pino D5 | RA1 — GPIO |
| Pino D6 | RA2 — GPIO |
| Pino D7 | RA3 — GPIO |
| Pino D8 | RA4 — GPIO |
| Pino D9 | RA5 — GPIO |
| Pino D10 | VDD — 3.3 V core supply |
| Pino E1 | VSS — Ground reference |
| Pino E2 | RD10 — GPIO |
| Pino E3 | RD11 — GPIO |
| Pino E4 | RA14 — GPIO |
| Pino E5 | RA15 — GPIO |
| Pino E6 | RE0 — GPIO |
| Pino E7 | RE1 — GPIO |
| Pino E8 | RE2 — GPIO |
| Pino E9 | RE3 — GPIO |
| Pino E10 | VSS — Ground reference |
| Pino F1 | VDD — 3.3 V core supply |
| Pino F2 | RD8 — GPIO |
| Pino F3 | RD9 — GPIO |
| Pino F4 | RA6 — GPIO |
| Pino F5 | RA7 — GPIO |
| Pino F6 | RE4 — GPIO |
| Pino F7 | RE5 — GPIO |
| Pino F8 | RE6 — GPIO |
| Pino F9 | RE7 — GPIO |
| Pino F10 | VDD — 3.3 V core supply |
| Pino G1 | VSS — Ground reference |
| Pino G2 | RF0 — GPIO |
| Pino G3 | RF1 — GPIO |
| Pino G4 | RG0 — GPIO |
| Pino G5 | RG1 — GPIO |
| Pino G6 | RF4 — GPIO |
| Pino G7 | RF5 — GPIO |
| Pino G8 | RF6 — GPIO |
| Pino G9 | RF7 — GPIO |
| Pino G10 | VSS — Ground reference |
| Pino H1 | VDD — 3.3 V core supply |
| Pino H2 | RG14 — GPIO |
| Pino H3 | RG15 — GPIO |
| Pino H4 | RG12 — GPIO |
| Pino H5 | RG13 — GPIO |
| Pino H6 | RF8 — GPIO |
| Pino H7 | RF9 — GPIO |
| Pino H8 | RF10 — GPIO |
| Pino H9 | RF11 — GPIO |
| Pino H10 | VDD — 3.3 V core supply |
| Pino J1 | VSS — Ground reference |
| Pino J2 | TRCLK — Trace clock |
| Pino J3 | TRD0 — Trace data 0 |
| Pino J4 | TRD1 — Trace data 1 |
| Pino J5 | TRD2 — Trace data 2 |
| Pino J6 | TRD3 — Trace data 3 |
| Pino J7 | RF12 — GPIO |
| Pino J8 | RF13 — GPIO |
| Pino J9 | RF14 — GPIO |
| Pino J10 | VSS — Ground reference |
| Pino K1 | AVDD — Analog 3.3 V supply |
| Pino K2 | AVSS — Analog ground |
| Pino K3 | AN0/RPB12 — Analog input / GPIO |
| Pino K4 | AN1/RPB13 — Analog input / GPIO |
| Pino K5 | AN2/RPB14 — Analog input / GPIO |
| Pino K6 | AN3/RPB15 — Analog input / GPIO |
| Pino K7 | AN4/RK0 — Analog input / GPIO |
| Pino K8 | AN5/RK1 — Analog input / GPIO |
| Pino K9 | AN6/RH0 — Analog input / GPIO |
| Pino K10 | AN7/RH1 — Analog input / GPIO |
Aplicações típicas
PIC32MZ2048EFM100-E/GJX é adequado para 6 aplicaçãos: Industrial IoT Gateway, Automotive HMI Graphics Controller, Motor Control Servo Drive, Audio Playback and Processing System, Point-of-Sale (POS) Terminal, Building Automation Controller.
Industrial IoT Gateway
The PIC32MZ2048EFM100-E/GJX is well-suited for industrial IoT gateways requiring Ethernet and high-speed USB connectivity. Its 200 MHz MIPS32 M-Class core delivers 330 DMIPS, easily running TCP/IP stacks and TLS libraries, while 2 MB Flash accommodates rich firmware with future over-the-air update capability via the dual-panel live-update Flash architecture. The integrated 10/100 Ethernet MAC and PHY pair eliminates external components, reducing BOM cost for industrial-grade gateway designs. Designers should add an external watchdog timer and ESD protection on the RJ-45 interface.
Recomendado
Automotive HMI Graphics Controller
The PIC32MZ2048EFM100-E/GJX targets automotive HMI with 2 MB Flash for large graphics assets, 512 KB SRAM for frame buffering, and IEEE 754 FPU for smooth rendering. The -40C to +125C extended temperature grade supports under-dash and cabin-mounted instrument clusters, while the dual-panel Flash architecture enables secure in-field firmware updates. The integrated hardware crypto accelerator offloads TLS handshake computations, freeing the M-Class core for UI rendering. Designers should leverage the Peripheral Pin Select (PPS) feature for flexible TFT/LCD interface routing.
Recomendado
Motor Control Servo Drive
The PIC32MZ2048EFM100-E/GJX is a strong fit for motor-control servo drives because its DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math) accelerate field-oriented control loops at the high PWM update rates demanded by modern servo applications. With 200 MHz of processing and 512 KB SRAM, the device can manage multiple feedback loops simultaneously while running Ethernet-based motion-bus protocols. The extended -40C to +125C temperature range supports industrial-cabinet and factory-floor servo drive deployments. Pair this MCU with a Microchip dsPIC33 EP family co-processor for high-resolution PWM if needed.
Recomendado
Audio Playback and Processing System
The PIC32MZ2048EFM100-E/GJX supports audio playback systems through its I2S peripheral, audio-specific interfaces, and 2 MB Flash for codec/wave storage. With 330 DMIPS and an FPU, the device can run software codecs like MP3, AAC, and basic Ogg Vorbis without external DSP hardware. The 512 KB SRAM provides ample buffer space for sample-rate conversion and mixing. Combined with the extended temperature grade, the part serves as the main controller for industrial audio annunciators and infotainment accessories.
Recomendado
Point-of-Sale (POS) Terminal
The PIC32MZ2048EFM100-E/GJX fits POS terminal designs by combining Ethernet for IP-based payment processing, HS USB for barcode scanners and receipt printers, and crypto acceleration for secure transaction encryption. The 2 MB Flash stores payment application firmware, while 512 KB SRAM supports concurrent display rendering and transaction queue management. The BGA package's small 7x7 mm footprint allows compact terminal form factors, and the extended temperature range suits kitchen and outdoor retail kiosk environments.
Recomendado
Building Automation Controller
The PIC32MZ2048EFM100-E/GJX serves building automation controllers that aggregate BACnet/Modbus traffic from HVAC, lighting, and access-control subsystems. Its integrated Ethernet MAC/PHY and CAN 2.0B controllers allow the controller to bridge IP and field-bus networks in a single chip, while 2 MB Flash stores the automation logic and BACnet object database. The -40C to +125C extended temperature grade ensures reliability in mechanical rooms and rooftop enclosures. The crypto accelerator secures IP-based building-to-cloud telemetry links.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ2048EFM100-E/GJX — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ2048EFM100-I/GJX | PIC32MZ1024EFM100-E/GJX | PIC32MZ1024EFM100-I/GJX | PIC32MZ2048EFM100-E/PT | PIC32MZ1024EFM100-E/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TQFP (12x12 mm) - different footprint | 100-TQFP (12x12 mm) - different footprint |
| Flash Memory | 2 MB | 2 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| FPU | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double |
| Ethernet MAC+PHY | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) |
Principais diferenciais
- Extended -40C to +125C temperature grade in BGA (vs PIC32MZ2048EFM100-I/GJX)
- 2 MB dual-panel Flash for live firmware updates (vs PIC32MZ1024EFM100-E/GJX)
- TFBGA package for compact PCB footprint (vs PIC32MZ2048EFM100-E/PT (TQFP version))
Notas de projeto
The 100-ball TFBGA package uses a 0.5 mm ball pitch and requires via-in-pad or dog-bone fanout routing on a minimum 4-layer PCB stackup. According to Microchip application notes on BGA layout, place a continuous ground plane on layer 2 directly beneath the device to provide thermal spreading and a low-impedance reference for the high-speed Ethernet and USB signals. Maintain a minimum 0.5 mm keep-away under BGA balls and use Microchip's reference design footprint as the layout starting point.
The PIC32MZ2048EFM100-E/GJX at 200 MHz core frequency dissipates up to approximately 1.0 W peak; in -40C to +125C environments, ensure adequate copper pour beneath and around the TFBGA for heat spreading. The TFBGA package offers better thermal dissipation than the equivalent TQFP-100 due to bottom-side ball attach, but still requires a thermal via array to inner ground/power planes. Do not block thermal vias with solder mask on inner layers.
When migrating firmware between the -E (extended) and -I (industrial) temperature grades, verify that the upper temperature limit still meets your system's thermal envelope. A common design pitfall is treating the -I grade as automotive-qualified; the -I grade is not AEC-Q100 qualified, so automotive deployments must use the -E (extended) grade or an explicitly qualified Q1 variant. According to the Microchip PIC32MZ EF datasheet, AEC-Q100 qualification status varies by part number suffix and must be confirmed at order entry.
Informações de conformidade
RoHS and lead-free compliance per Microchip product page. AEC-Q100 qualification status for this specific MPN must be confirmed with Microchip; the standard -E/GJX grade is not explicitly AEC-Q100 marked, so automotive deployments should request the AEC-Q100 lot documentation or use an explicitly qualified variant.