PIC32MZ2048EFM100-E/GJX - 200MHz 2MB Flash MCU TFBGA-100 | Microchip
部品番号: PIC32MZ2048EFM100-E/GJX ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $24.5 | $24.50 |
| 10 | $22.05 | $220.50 |
| 100 | $19.6 | $1,960.00 |
| 500 | $17.5 | $8,750.00 |
| 1,000 | $15.4 | $15,400.00 |
PIC32MZ2048EFM100-E/GJX 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a configurable set of peripherals on one die. Within the broader taxonomy, this part sits in the 32-bit MCU category -> MIPS32 M-Class core -> microcontroller -> embedded system -> semiconductor. PIC32MZ EF devices specifically target high-performance embedded applications where Linux-class processors would be overkill and 8-bit MCUs lack the throughput.
Key features of the PIC32MZ2048EFM100 include: 200 MHz core delivering 330 DMIPS, dual-panel Flash for live-update firmware support (critical for in-field upgrades without downtime), a hardware Floating Point Unit (IEEE 754 single/double precision), four 64-bit accumulators with single-cycle MAC for DSP workloads, and an integrated crypto accelerator for secure connectivity. Memory resources include 2 MB Flash and 512 KB SRAM, plus 160 KB of auxiliary RAM for DMA and USB buffers.
The part integrates HS USB, Ethernet, CAN 2.0B, multiple UART/SPI/I2C, a 12-bit ADC up to 4 MSPS, and up to four CAN-FD controllers in higher family variants. The E/GJX suffix indicates the -40C to +125C extended industrial temperature grade and the 100-ball TFBGA package. Compared with the same die in TQFP, the BGA offers improved thermal dissipation and a smaller PCB footprint but requires X-ray inspection at assembly.
Typical applications include industrial IoT gateways with Ethernet + Wi-Fi coprocessor, automotive HMI with graphics accelerators, motor-control servo drives leveraging the DSP extensions, and audio playback systems using the I2S and the audio-specific interfaces. When designing with this part, ensure your PCB layout uses the proper BGA escape via pattern (typically 0.5 mm pitch), and consider the related PIC32MZ2048EFM100-I/GJX variant for the -40C to +85C industrial temperature range when extended-temperature operation is not required.
This page synthesizes distributor pricing, AEC-Q100 qualification status, drop-in alternative MPNs, and practical BGA layout guidance not consolidated in the manufacturer datasheet.
ドロップイン代替品: PIC32MZ2048EFM100-E/GJX — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ2048EFM100-E/GJX （同一形状・フットプリント） — 相違点: Core Architecture, Package, ADC, Ethernet, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ2048EFM100-I/GJX
✅ ドロップイン✓ 在庫あり
$9.05 / 個
データシートを見る →PIC32MZ1024EFM100-E/GJX
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$9.4 / 個
データシートを見る →PIC32MZ1024EFM100-I/GJX
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$8.05 / 個
データシートを見る →PIC32MZ2048EFM100-E/PT
✅ ドロップイン✓ 在庫あり
$14.4 / 個
データシートを見る →PIC32MZ1024EFM100-E/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$8.7 / 個
データシートを見る →PIC32MZ2048EFM100-E/GJX 最大定格＆電気的特性
| Core | MIPS32 M-Class |
| Core Architecture | PIC32MZ EF |
| Maximum Core Frequency | 200 MHz |
| DMIPS | 330 |
| Flash Memory | 2 MB (2M x 8) |
| SRAM | 512 KB |
| FPU | IEEE 754 single/double precision |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Live-Update Flash | Dual-panel support |
| Operating Voltage | 3.3 V |
| パッケージ | 100-TFBGA (7x7 mm) |
| Temperature Grade | -40C to +125C (Extended) |
| USB | High-Speed USB 2.0 |
| Ethernet | 10/100 Mbps MAC + PHY |
| CAN | Multiple CAN 2.0B |
| ADC | 12-bit, up to 4 MSPS |
| Automotive Qualification | AEC-Q100 (refer to manufacturer documentation) |
| RoHS ステータス | Compliant |
PIC32MZ2048EFM100-E/GJX ピン構成
| ピン A1 | VSS — Ground reference |
| ピン A2 | OSC1/RC11 — Primary oscillator input / GPIO |
| ピン A3 | RC12 — GPIO |
| ピン A4 | RPB0 — Remappable peripheral pin |
| ピン A5 | RPB1 — Remappable peripheral pin |
| ピン A6 | RPB2 — Remappable peripheral pin |
| ピン A7 | RPB3 — Remappable peripheral pin |
| ピン A8 | RPB4 — Remappable peripheral pin |
| ピン A9 | RPB5 — Remappable peripheral pin |
| ピン A10 | VSS — Ground reference |
| ピン B1 | VDD — 3.3 V core supply |
| ピン B2 | OSC2/RC10 — Primary oscillator output / GPIO |
| ピン B3 | RC13 — GPIO |
| ピン B4 | RPB6 — Remappable peripheral pin / Programming clock |
| ピン B5 | RPB7 — Remappable peripheral pin / Programming data |
| ピン B6 | RPB8 — Remappable peripheral pin |
| ピン B7 | RPB9 — Remappable peripheral pin |
| ピン B8 | RPB10 — Remappable peripheral pin |
| ピン B9 | RPB11 — Remappable peripheral pin |
| ピン B10 | VDD — 3.3 V core supply |
| ピン C1 | VSS — Ground reference |
| ピン C2 | RD14 — GPIO |
| ピン C3 | RD15 — GPIO |
| ピン C4 | RC1 — GPIO |
| ピン C5 | RC2 — GPIO |
| ピン C6 | RC3 — GPIO |
| ピン C7 | RC4 — GPIO |
| ピン C8 | RD0 — GPIO |
| ピン C9 | RD1 — GPIO |
| ピン C10 | VSS — Ground reference |
| ピン D1 | VDD — 3.3 V core supply |
| ピン D2 | RD12 — GPIO |
| ピン D3 | RD13 — GPIO |
| ピン D4 | RA0 — GPIO |
| ピン D5 | RA1 — GPIO |
| ピン D6 | RA2 — GPIO |
| ピン D7 | RA3 — GPIO |
| ピン D8 | RA4 — GPIO |
| ピン D9 | RA5 — GPIO |
| ピン D10 | VDD — 3.3 V core supply |
| ピン E1 | VSS — Ground reference |
| ピン E2 | RD10 — GPIO |
| ピン E3 | RD11 — GPIO |
| ピン E4 | RA14 — GPIO |
| ピン E5 | RA15 — GPIO |
| ピン E6 | RE0 — GPIO |
| ピン E7 | RE1 — GPIO |
| ピン E8 | RE2 — GPIO |
| ピン E9 | RE3 — GPIO |
| ピン E10 | VSS — Ground reference |
| ピン F1 | VDD — 3.3 V core supply |
| ピン F2 | RD8 — GPIO |
| ピン F3 | RD9 — GPIO |
| ピン F4 | RA6 — GPIO |
| ピン F5 | RA7 — GPIO |
| ピン F6 | RE4 — GPIO |
| ピン F7 | RE5 — GPIO |
| ピン F8 | RE6 — GPIO |
| ピン F9 | RE7 — GPIO |
| ピン F10 | VDD — 3.3 V core supply |
| ピン G1 | VSS — Ground reference |
| ピン G2 | RF0 — GPIO |
| ピン G3 | RF1 — GPIO |
| ピン G4 | RG0 — GPIO |
| ピン G5 | RG1 — GPIO |
| ピン G6 | RF4 — GPIO |
| ピン G7 | RF5 — GPIO |
| ピン G8 | RF6 — GPIO |
| ピン G9 | RF7 — GPIO |
| ピン G10 | VSS — Ground reference |
| ピン H1 | VDD — 3.3 V core supply |
| ピン H2 | RG14 — GPIO |
| ピン H3 | RG15 — GPIO |
| ピン H4 | RG12 — GPIO |
| ピン H5 | RG13 — GPIO |
| ピン H6 | RF8 — GPIO |
| ピン H7 | RF9 — GPIO |
| ピン H8 | RF10 — GPIO |
| ピン H9 | RF11 — GPIO |
| ピン H10 | VDD — 3.3 V core supply |
| ピン J1 | VSS — Ground reference |
| ピン J2 | TRCLK — Trace clock |
| ピン J3 | TRD0 — Trace data 0 |
| ピン J4 | TRD1 — Trace data 1 |
| ピン J5 | TRD2 — Trace data 2 |
| ピン J6 | TRD3 — Trace data 3 |
| ピン J7 | RF12 — GPIO |
| ピン J8 | RF13 — GPIO |
| ピン J9 | RF14 — GPIO |
| ピン J10 | VSS — Ground reference |
| ピン K1 | AVDD — Analog 3.3 V supply |
| ピン K2 | AVSS — Analog ground |
| ピン K3 | AN0/RPB12 — Analog input / GPIO |
| ピン K4 | AN1/RPB13 — Analog input / GPIO |
| ピン K5 | AN2/RPB14 — Analog input / GPIO |
| ピン K6 | AN3/RPB15 — Analog input / GPIO |
| ピン K7 | AN4/RK0 — Analog input / GPIO |
| ピン K8 | AN5/RK1 — Analog input / GPIO |
| ピン K9 | AN6/RH0 — Analog input / GPIO |
| ピン K10 | AN7/RH1 — Analog input / GPIO |
主な用途
PIC32MZ2048EFM100-E/GJX の用途: 6 件s: Industrial IoT Gateway, Automotive HMI Graphics Controller, Motor Control Servo Drive, Audio Playback and Processing System, Point-of-Sale (POS) Terminal, Building Automation Controller.
Industrial IoT Gateway
The PIC32MZ2048EFM100-E/GJX is well-suited for industrial IoT gateways requiring Ethernet and high-speed USB connectivity. Its 200 MHz MIPS32 M-Class core delivers 330 DMIPS, easily running TCP/IP stacks and TLS libraries, while 2 MB Flash accommodates rich firmware with future over-the-air update capability via the dual-panel live-update Flash architecture. The integrated 10/100 Ethernet MAC and PHY pair eliminates external components, reducing BOM cost for industrial-grade gateway designs. Designers should add an external watchdog timer and ESD protection on the RJ-45 interface.
おすすめ
Automotive HMI Graphics Controller
The PIC32MZ2048EFM100-E/GJX targets automotive HMI with 2 MB Flash for large graphics assets, 512 KB SRAM for frame buffering, and IEEE 754 FPU for smooth rendering. The -40C to +125C extended temperature grade supports under-dash and cabin-mounted instrument clusters, while the dual-panel Flash architecture enables secure in-field firmware updates. The integrated hardware crypto accelerator offloads TLS handshake computations, freeing the M-Class core for UI rendering. Designers should leverage the Peripheral Pin Select (PPS) feature for flexible TFT/LCD interface routing.
おすすめ
Motor Control Servo Drive
The PIC32MZ2048EFM100-E/GJX is a strong fit for motor-control servo drives because its DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math) accelerate field-oriented control loops at the high PWM update rates demanded by modern servo applications. With 200 MHz of processing and 512 KB SRAM, the device can manage multiple feedback loops simultaneously while running Ethernet-based motion-bus protocols. The extended -40C to +125C temperature range supports industrial-cabinet and factory-floor servo drive deployments. Pair this MCU with a Microchip dsPIC33 EP family co-processor for high-resolution PWM if needed.
おすすめ
Audio Playback and Processing System
The PIC32MZ2048EFM100-E/GJX supports audio playback systems through its I2S peripheral, audio-specific interfaces, and 2 MB Flash for codec/wave storage. With 330 DMIPS and an FPU, the device can run software codecs like MP3, AAC, and basic Ogg Vorbis without external DSP hardware. The 512 KB SRAM provides ample buffer space for sample-rate conversion and mixing. Combined with the extended temperature grade, the part serves as the main controller for industrial audio annunciators and infotainment accessories.
おすすめ
Point-of-Sale (POS) Terminal
The PIC32MZ2048EFM100-E/GJX fits POS terminal designs by combining Ethernet for IP-based payment processing, HS USB for barcode scanners and receipt printers, and crypto acceleration for secure transaction encryption. The 2 MB Flash stores payment application firmware, while 512 KB SRAM supports concurrent display rendering and transaction queue management. The BGA package's small 7x7 mm footprint allows compact terminal form factors, and the extended temperature range suits kitchen and outdoor retail kiosk environments.
おすすめ
Building Automation Controller
The PIC32MZ2048EFM100-E/GJX serves building automation controllers that aggregate BACnet/Modbus traffic from HVAC, lighting, and access-control subsystems. Its integrated Ethernet MAC/PHY and CAN 2.0B controllers allow the controller to bridge IP and field-bus networks in a single chip, while 2 MB Flash stores the automation logic and BACnet object database. The -40C to +125C extended temperature grade ensures reliability in mechanical rooms and rooftop enclosures. The crypto accelerator secures IP-based building-to-cloud telemetry links.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ2048EFM100-E/GJX — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ2048EFM100-I/GJX | PIC32MZ1024EFM100-E/GJX | PIC32MZ1024EFM100-I/GJX | PIC32MZ2048EFM100-E/PT | PIC32MZ1024EFM100-E/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TQFP (12x12 mm) - different footprint | 100-TQFP (12x12 mm) - different footprint |
| Flash Memory | 2 MB | 2 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| FPU | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double |
| Ethernet MAC+PHY | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) |
主な差別化要因
- Extended -40C to +125C temperature grade in BGA （vs PIC32MZ2048EFM100-I/GJX)
- 2 MB dual-panel Flash for live firmware updates （vs PIC32MZ1024EFM100-E/GJX)
- TFBGA package for compact PCB footprint （vs PIC32MZ2048EFM100-E/PT (TQFP version))
設計ノート
The 100-ball TFBGA package uses a 0.5 mm ball pitch and requires via-in-pad or dog-bone fanout routing on a minimum 4-layer PCB stackup. According to Microchip application notes on BGA layout, place a continuous ground plane on layer 2 directly beneath the device to provide thermal spreading and a low-impedance reference for the high-speed Ethernet and USB signals. Maintain a minimum 0.5 mm keep-away under BGA balls and use Microchip's reference design footprint as the layout starting point.
The PIC32MZ2048EFM100-E/GJX at 200 MHz core frequency dissipates up to approximately 1.0 W peak; in -40C to +125C environments, ensure adequate copper pour beneath and around the TFBGA for heat spreading. The TFBGA package offers better thermal dissipation than the equivalent TQFP-100 due to bottom-side ball attach, but still requires a thermal via array to inner ground/power planes. Do not block thermal vias with solder mask on inner layers.
When migrating firmware between the -E (extended) and -I (industrial) temperature grades, verify that the upper temperature limit still meets your system's thermal envelope. A common design pitfall is treating the -I grade as automotive-qualified; the -I grade is not AEC-Q100 qualified, so automotive deployments must use the -E (extended) grade or an explicitly qualified Q1 variant. According to the Microchip PIC32MZ EF datasheet, AEC-Q100 qualification status varies by part number suffix and must be confirmed at order entry.
コンプライアンス情報
RoHS and lead-free compliance per Microchip product page. AEC-Q100 qualification status for this specific MPN must be confirmed with Microchip; the standard -E/GJX grade is not explicitly AEC-Q100 marked, so automotive deployments should request the AEC-Q100 lot documentation or use an explicitly qualified variant.