PIC32MZ2048EFM100-E/GJX - 200MHz 2MB Flash MCU TFBGA-100 | Microchip
Référence : PIC32MZ2048EFM100-E/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.05 | $220,50 |
| 100 | $19.6 | $1 960,00 |
| 500 | $17.5 | $8 750,00 |
| 1 000 | $15.4 | $15 400,00 |
PIC32MZ2048EFM100-E/GJX Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a configurable set of peripherals on one die. Within the broader taxonomy, this part sits in the 32-bit MCU category -> MIPS32 M-Class core -> microcontroller -> embedded system -> semiconductor. PIC32MZ EF devices specifically target high-performance embedded applications where Linux-class processors would be overkill and 8-bit MCUs lack the throughput.
Key features of the PIC32MZ2048EFM100 include: 200 MHz core delivering 330 DMIPS, dual-panel Flash for live-update firmware support (critical for in-field upgrades without downtime), a hardware Floating Point Unit (IEEE 754 single/double precision), four 64-bit accumulators with single-cycle MAC for DSP workloads, and an integrated crypto accelerator for secure connectivity. Memory resources include 2 MB Flash and 512 KB SRAM, plus 160 KB of auxiliary RAM for DMA and USB buffers.
The part integrates HS USB, Ethernet, CAN 2.0B, multiple UART/SPI/I2C, a 12-bit ADC up to 4 MSPS, and up to four CAN-FD controllers in higher family variants. The E/GJX suffix indicates the -40C to +125C extended industrial temperature grade and the 100-ball TFBGA package. Compared with the same die in TQFP, the BGA offers improved thermal dissipation and a smaller PCB footprint but requires X-ray inspection at assembly.
Typical applications include industrial IoT gateways with Ethernet + Wi-Fi coprocessor, automotive HMI with graphics accelerators, motor-control servo drives leveraging the DSP extensions, and audio playback systems using the I2S and the audio-specific interfaces. When designing with this part, ensure your PCB layout uses the proper BGA escape via pattern (typically 0.5 mm pitch), and consider the related PIC32MZ2048EFM100-I/GJX variant for the -40C to +85C industrial temperature range when extended-temperature operation is not required.
This page synthesizes distributor pricing, AEC-Q100 qualification status, drop-in alternative MPNs, and practical BGA layout guidance not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ2048EFM100-E/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2048EFM100-E/GJX (même facteur de forme et même empreinte) — différant par Core Architecture, Package, ADC, Ethernet, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2048EFM100-I/GJX
✅ Remplacement direct✓ En stock
$9.05 / unité
Voir la fiche technique →PIC32MZ1024EFM100-E/GJX
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.4 / unité
Voir la fiche technique →PIC32MZ1024EFM100-I/GJX
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.05 / unité
Voir la fiche technique →PIC32MZ2048EFM100-E/PT
✅ Remplacement direct✓ En stock
$14.4 / unité
Voir la fiche technique →PIC32MZ1024EFM100-E/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.7 / unité
Voir la fiche technique →PIC32MZ2048EFM100-E/GJX Valeurs maximales et caractéristiques électriques
| Core | MIPS32 M-Class |
| Core Architecture | PIC32MZ EF |
| Maximum Core Frequency | 200 MHz |
| DMIPS | 330 |
| Flash Memory | 2 MB (2M x 8) |
| SRAM | 512 KB |
| FPU | IEEE 754 single/double precision |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Live-Update Flash | Dual-panel support |
| Operating Voltage | 3.3 V |
| Boîtier | 100-TFBGA (7x7 mm) |
| Temperature Grade | -40C to +125C (Extended) |
| USB | High-Speed USB 2.0 |
| Ethernet | 10/100 Mbps MAC + PHY |
| CAN | Multiple CAN 2.0B |
| ADC | 12-bit, up to 4 MSPS |
| Automotive Qualification | AEC-Q100 (refer to manufacturer documentation) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ2048EFM100-E/GJX
| Broche A1 | VSS — Ground reference |
| Broche A2 | OSC1/RC11 — Primary oscillator input / GPIO |
| Broche A3 | RC12 — GPIO |
| Broche A4 | RPB0 — Remappable peripheral pin |
| Broche A5 | RPB1 — Remappable peripheral pin |
| Broche A6 | RPB2 — Remappable peripheral pin |
| Broche A7 | RPB3 — Remappable peripheral pin |
| Broche A8 | RPB4 — Remappable peripheral pin |
| Broche A9 | RPB5 — Remappable peripheral pin |
| Broche A10 | VSS — Ground reference |
| Broche B1 | VDD — 3.3 V core supply |
| Broche B2 | OSC2/RC10 — Primary oscillator output / GPIO |
| Broche B3 | RC13 — GPIO |
| Broche B4 | RPB6 — Remappable peripheral pin / Programming clock |
| Broche B5 | RPB7 — Remappable peripheral pin / Programming data |
| Broche B6 | RPB8 — Remappable peripheral pin |
| Broche B7 | RPB9 — Remappable peripheral pin |
| Broche B8 | RPB10 — Remappable peripheral pin |
| Broche B9 | RPB11 — Remappable peripheral pin |
| Broche B10 | VDD — 3.3 V core supply |
| Broche C1 | VSS — Ground reference |
| Broche C2 | RD14 — GPIO |
| Broche C3 | RD15 — GPIO |
| Broche C4 | RC1 — GPIO |
| Broche C5 | RC2 — GPIO |
| Broche C6 | RC3 — GPIO |
| Broche C7 | RC4 — GPIO |
| Broche C8 | RD0 — GPIO |
| Broche C9 | RD1 — GPIO |
| Broche C10 | VSS — Ground reference |
| Broche D1 | VDD — 3.3 V core supply |
| Broche D2 | RD12 — GPIO |
| Broche D3 | RD13 — GPIO |
| Broche D4 | RA0 — GPIO |
| Broche D5 | RA1 — GPIO |
| Broche D6 | RA2 — GPIO |
| Broche D7 | RA3 — GPIO |
| Broche D8 | RA4 — GPIO |
| Broche D9 | RA5 — GPIO |
| Broche D10 | VDD — 3.3 V core supply |
| Broche E1 | VSS — Ground reference |
| Broche E2 | RD10 — GPIO |
| Broche E3 | RD11 — GPIO |
| Broche E4 | RA14 — GPIO |
| Broche E5 | RA15 — GPIO |
| Broche E6 | RE0 — GPIO |
| Broche E7 | RE1 — GPIO |
| Broche E8 | RE2 — GPIO |
| Broche E9 | RE3 — GPIO |
| Broche E10 | VSS — Ground reference |
| Broche F1 | VDD — 3.3 V core supply |
| Broche F2 | RD8 — GPIO |
| Broche F3 | RD9 — GPIO |
| Broche F4 | RA6 — GPIO |
| Broche F5 | RA7 — GPIO |
| Broche F6 | RE4 — GPIO |
| Broche F7 | RE5 — GPIO |
| Broche F8 | RE6 — GPIO |
| Broche F9 | RE7 — GPIO |
| Broche F10 | VDD — 3.3 V core supply |
| Broche G1 | VSS — Ground reference |
| Broche G2 | RF0 — GPIO |
| Broche G3 | RF1 — GPIO |
| Broche G4 | RG0 — GPIO |
| Broche G5 | RG1 — GPIO |
| Broche G6 | RF4 — GPIO |
| Broche G7 | RF5 — GPIO |
| Broche G8 | RF6 — GPIO |
| Broche G9 | RF7 — GPIO |
| Broche G10 | VSS — Ground reference |
| Broche H1 | VDD — 3.3 V core supply |
| Broche H2 | RG14 — GPIO |
| Broche H3 | RG15 — GPIO |
| Broche H4 | RG12 — GPIO |
| Broche H5 | RG13 — GPIO |
| Broche H6 | RF8 — GPIO |
| Broche H7 | RF9 — GPIO |
| Broche H8 | RF10 — GPIO |
| Broche H9 | RF11 — GPIO |
| Broche H10 | VDD — 3.3 V core supply |
| Broche J1 | VSS — Ground reference |
| Broche J2 | TRCLK — Trace clock |
| Broche J3 | TRD0 — Trace data 0 |
| Broche J4 | TRD1 — Trace data 1 |
| Broche J5 | TRD2 — Trace data 2 |
| Broche J6 | TRD3 — Trace data 3 |
| Broche J7 | RF12 — GPIO |
| Broche J8 | RF13 — GPIO |
| Broche J9 | RF14 — GPIO |
| Broche J10 | VSS — Ground reference |
| Broche K1 | AVDD — Analog 3.3 V supply |
| Broche K2 | AVSS — Analog ground |
| Broche K3 | AN0/RPB12 — Analog input / GPIO |
| Broche K4 | AN1/RPB13 — Analog input / GPIO |
| Broche K5 | AN2/RPB14 — Analog input / GPIO |
| Broche K6 | AN3/RPB15 — Analog input / GPIO |
| Broche K7 | AN4/RK0 — Analog input / GPIO |
| Broche K8 | AN5/RK1 — Analog input / GPIO |
| Broche K9 | AN6/RH0 — Analog input / GPIO |
| Broche K10 | AN7/RH1 — Analog input / GPIO |
Applications typiques
PIC32MZ2048EFM100-E/GJX convient pour 6 applications: Industrial IoT Gateway, Automotive HMI Graphics Controller, Motor Control Servo Drive, Audio Playback and Processing System, Point-of-Sale (POS) Terminal, Building Automation Controller.
Industrial IoT Gateway
The PIC32MZ2048EFM100-E/GJX is well-suited for industrial IoT gateways requiring Ethernet and high-speed USB connectivity. Its 200 MHz MIPS32 M-Class core delivers 330 DMIPS, easily running TCP/IP stacks and TLS libraries, while 2 MB Flash accommodates rich firmware with future over-the-air update capability via the dual-panel live-update Flash architecture. The integrated 10/100 Ethernet MAC and PHY pair eliminates external components, reducing BOM cost for industrial-grade gateway designs. Designers should add an external watchdog timer and ESD protection on the RJ-45 interface.
Recommandé
Automotive HMI Graphics Controller
The PIC32MZ2048EFM100-E/GJX targets automotive HMI with 2 MB Flash for large graphics assets, 512 KB SRAM for frame buffering, and IEEE 754 FPU for smooth rendering. The -40C to +125C extended temperature grade supports under-dash and cabin-mounted instrument clusters, while the dual-panel Flash architecture enables secure in-field firmware updates. The integrated hardware crypto accelerator offloads TLS handshake computations, freeing the M-Class core for UI rendering. Designers should leverage the Peripheral Pin Select (PPS) feature for flexible TFT/LCD interface routing.
Recommandé
Motor Control Servo Drive
The PIC32MZ2048EFM100-E/GJX is a strong fit for motor-control servo drives because its DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math) accelerate field-oriented control loops at the high PWM update rates demanded by modern servo applications. With 200 MHz of processing and 512 KB SRAM, the device can manage multiple feedback loops simultaneously while running Ethernet-based motion-bus protocols. The extended -40C to +125C temperature range supports industrial-cabinet and factory-floor servo drive deployments. Pair this MCU with a Microchip dsPIC33 EP family co-processor for high-resolution PWM if needed.
Recommandé
Audio Playback and Processing System
The PIC32MZ2048EFM100-E/GJX supports audio playback systems through its I2S peripheral, audio-specific interfaces, and 2 MB Flash for codec/wave storage. With 330 DMIPS and an FPU, the device can run software codecs like MP3, AAC, and basic Ogg Vorbis without external DSP hardware. The 512 KB SRAM provides ample buffer space for sample-rate conversion and mixing. Combined with the extended temperature grade, the part serves as the main controller for industrial audio annunciators and infotainment accessories.
Recommandé
Point-of-Sale (POS) Terminal
The PIC32MZ2048EFM100-E/GJX fits POS terminal designs by combining Ethernet for IP-based payment processing, HS USB for barcode scanners and receipt printers, and crypto acceleration for secure transaction encryption. The 2 MB Flash stores payment application firmware, while 512 KB SRAM supports concurrent display rendering and transaction queue management. The BGA package's small 7x7 mm footprint allows compact terminal form factors, and the extended temperature range suits kitchen and outdoor retail kiosk environments.
Recommandé
Building Automation Controller
The PIC32MZ2048EFM100-E/GJX serves building automation controllers that aggregate BACnet/Modbus traffic from HVAC, lighting, and access-control subsystems. Its integrated Ethernet MAC/PHY and CAN 2.0B controllers allow the controller to bridge IP and field-bus networks in a single chip, while 2 MB Flash stores the automation logic and BACnet object database. The -40C to +125C extended temperature grade ensures reliability in mechanical rooms and rooftop enclosures. The crypto accelerator secures IP-based building-to-cloud telemetry links.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2048EFM100-E/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2048EFM100-I/GJX | PIC32MZ1024EFM100-E/GJX | PIC32MZ1024EFM100-I/GJX | PIC32MZ2048EFM100-E/PT | PIC32MZ1024EFM100-E/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TQFP (12x12 mm) - different footprint | 100-TQFP (12x12 mm) - different footprint |
| Flash Memory | 2 MB | 2 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| FPU | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double |
| Ethernet MAC+PHY | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) |
Principaux différenciateurs
- Extended -40C to +125C temperature grade in BGA (vs PIC32MZ2048EFM100-I/GJX)
- 2 MB dual-panel Flash for live firmware updates (vs PIC32MZ1024EFM100-E/GJX)
- TFBGA package for compact PCB footprint (vs PIC32MZ2048EFM100-E/PT (TQFP version))
Notes de conception
The 100-ball TFBGA package uses a 0.5 mm ball pitch and requires via-in-pad or dog-bone fanout routing on a minimum 4-layer PCB stackup. According to Microchip application notes on BGA layout, place a continuous ground plane on layer 2 directly beneath the device to provide thermal spreading and a low-impedance reference for the high-speed Ethernet and USB signals. Maintain a minimum 0.5 mm keep-away under BGA balls and use Microchip's reference design footprint as the layout starting point.
The PIC32MZ2048EFM100-E/GJX at 200 MHz core frequency dissipates up to approximately 1.0 W peak; in -40C to +125C environments, ensure adequate copper pour beneath and around the TFBGA for heat spreading. The TFBGA package offers better thermal dissipation than the equivalent TQFP-100 due to bottom-side ball attach, but still requires a thermal via array to inner ground/power planes. Do not block thermal vias with solder mask on inner layers.
When migrating firmware between the -E (extended) and -I (industrial) temperature grades, verify that the upper temperature limit still meets your system's thermal envelope. A common design pitfall is treating the -I grade as automotive-qualified; the -I grade is not AEC-Q100 qualified, so automotive deployments must use the -E (extended) grade or an explicitly qualified Q1 variant. According to the Microchip PIC32MZ EF datasheet, AEC-Q100 qualification status varies by part number suffix and must be confirmed at order entry.
Informations de conformité
RoHS and lead-free compliance per Microchip product page. AEC-Q100 qualification status for this specific MPN must be confirmed with Microchip; the standard -E/GJX grade is not explicitly AEC-Q100 marked, so automotive deployments should request the AEC-Q100 lot documentation or use an explicitly qualified variant.