PIC32MZ2064DAK169-I/HF - 200MHz 32-bit MCU 2MB Flash | Microchip
N.º da peça: PIC32MZ2064DAK169-I/HF ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $17.64 | $17,64 |
| 10 | $15.88 | $158,80 |
| 100 | $14.2 | $1.420,00 |
| 250 | $13.45 | $3.362,50 |
| 500 | $12.8 | $6.400,00 |
PIC32MZ2064DAK169-I/HF Visão geral
An MCU (Microcontroller Unit) is a single-chip computer that combines a CPU core, non-volatile program memory (Flash), volatile working memory (SRAM), and a rich set of peripherals (ADC, timers, communication controllers) on one die. The PIC32MZ DA family sits in the high-performance tier of Microchip's PIC32 portfolio, delivering MPU-like throughput while keeping the ease-of-use and deterministic interrupt model of an MCU. Within the broader taxonomy, PIC32MZ DA belongs to: microcontroller -> embedded MCU -> 32-bit MCU -> MIPS-based MCU -> graphics-enabled MCU.
Key features include a 200 MHz / 330 DMIPS MIPS32 microAptiv core with microMIPS mode (up to 35% smaller code), 2MB dual-panel Flash for live firmware update, a 12-bit 18 MSPS ADC with up to 45 analog inputs, a dedicated Graphics Processing Unit (GPU) and LCD controller supporting WQVGA and larger panels, HS USB 2.0, CAN, and a high-bandwidth DDR2 SDRAM interface. The integrated DDR2 controller lets designers attach up to 128MB of external SDRAM without an external memory controller, simplifying board layout for graphical HMI designs.
Architecturally, the device combines the microAptiv core with a 128-bit-wide Flash bus for zero-wait-state execution at 200 MHz, a Memory Management Unit (MMU) for embedded OS support, and dedicated 2D graphics hardware that offloads rendering from the CPU. The dual-panel Flash subsystem supports live firmware updates - one panel runs application code while the other receives the new image, then a fail-safe swap boots the new firmware.
Typical applications include industrial graphical HMI terminals, automotive infotainment clusters, medical patient monitors with color TFT displays, smart-home control panels, and point-of-sale terminals. The integrated graphics pipeline lets developers drive TFT LCDs up to WQVGA without an external graphics controller.
When designing with the PIC32MZ2064DAK169-I/HF, allocate 4-layer PCB routing for the DDR2 interface to meet length-matching and impedance requirements, follow Microchip application note AN1338 for DDR2 layout, and provide a bulk + bypass capacitor network on every AVDD/AVSS pair used by the 18 MSPS ADC to preserve SNR.
This page synthesizes distributor pricing, pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single reference for evaluating the PIC32MZ DA family.
Alternativas drop-in para PIC32MZ2064DAK169-I/HF — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ2064DAK169-I/HF (mesmo formato e footprint) — diferindo em CAN, Graphics Controller, Core Architecture, USB, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ2064DAK169T-I/HF
✅ Drop-In✓ Em estoque
$13.5 / unidade
Ver ficha técnica →PIC32MZ2064DAL169-I/HF
✅ Drop-In✓ Em estoque
$10.45 / unidade
Ver ficha técnica →PIC32MZ1064DAA169-I/HF
✅ Drop-In✓ Em estoque
$12.1 / unidade
Ver ficha técnica →PIC32MZ2064DAK169-I/HF Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv (32-bit) |
| Maximum CPU Frequency | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| microMIPS Mode | Yes (up to 35% smaller code) |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 SDRAM controller, up to 128 MB addressable |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated LCD controller with dedicated 2D Graphics Processor |
| USB | Hi-Speed USB 2.0 |
| CAN | Yes (CAN 2.0B) |
| Encapsulamento | 169-LFBGA (11x11 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 C to +85 C (Industrial, -I suffix) |
| MMU | Yes (Memory Management Unit for embedded OS) |
| Dual-Panel Flash | Yes (live firmware update support) |
Guia de Configuração de Pinos do PIC32MZ2064DAK169-I/HF 169-lfbga (11x11 mm)
Configuração de pinos para PIC32MZ2064DAK169-I/HF (pacote 169-lfbga (11x11 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MZ2064DAK169-I/HF.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MZ2064DAK169-I/HF é adequado para 6 aplicaçãos: Industrial HMI Touch Panel, Automotive Infotainment Cluster, Medical Patient Monitor, Smart Home Control Panel, Point-of-Sale Terminal, Building Automation Controller.
Industrial HMI Touch Panel
The PIC32MZ2064DAK169-I/HF drives WQVGA (480x272) and larger TFT LCDs in industrial HMI terminals thanks to its integrated LCD controller and dedicated 2D Graphics Processor. The DDR2 interface supports up to 128 MB of external framebuffer memory, eliminating the need for an external graphics controller and reducing BOM cost. With the 200 MHz microAptiv core delivering 330 DMIPS and the 12-bit 18 MSPS ADC providing 45 channels, a single chip handles touch sensing, analog sensor acquisition, and full graphical rendering.
Recomendado
Automotive Infotainment Cluster
The PIC32MZ2064DAK169-I/HF powers secondary instrument clusters and infotainment displays where MPU-like graphics performance is required without a full Linux stack. The dual-panel Flash subsystem enables fail-safe OTA firmware updates - one panel runs the current image while the other receives the new firmware, then swaps on next boot. The integrated CAN 2.0B controller provides direct bus connectivity to the vehicle network, and the -40 C to +85 C industrial temperature range supports under-dash mounting.
Recomendado
Medical Patient Monitor
The PIC32MZ2064DAK169-I/HF serves as the main processor in bedside patient monitors driving color TFT displays for vital-sign waveforms and numerical readouts. The 12-bit 18 MSPS ADC with 45 analog inputs acquires ECG, SpO2, temperature, and respiration channels simultaneously without external multiplexers. The 200 MHz microAptiv core runs the display pipeline while leaving headroom for trend analysis, and the 640 KB SRAM buffers waveform history for on-screen scrolling without DDR latency penalties.
Recomendado
Smart Home Control Panel
The PIC32MZ2064DAK169-I/HF anchors wall-mounted smart-home control panels with touchscreen interfaces for lighting, climate, and security control. The integrated Hi-Speed USB 2.0 port supports firmware update and debug, while the DDR2 controller handles large icon and font caches for smooth menu transitions. The 169-LFBGA package fits within a 12 mm x 12 mm PCB footprint when paired with a 4-layer stackup, enabling slim in-wall enclosure designs.
Recomendado
Point-of-Sale Terminal
The PIC32MZ2064DAK169-I/HF drives the main customer-facing display and secondary clerk display in point-of-sale terminals, with the integrated 2D GPU accelerating icon and button rendering. The 2 MB dual-panel Flash supports fail-safe application updates over the retail network, while the Hi-Speed USB 2.0 host port connects to peripherals such as barcode scanners, receipt printers, and magnetic-stripe readers without an external hub IC.
Recomendado
Building Automation Controller
The PIC32MZ2064DAK169-I/HF serves as the central controller in building automation gateways, where its CAN 2.0B and Hi-Speed USB interfaces bridge BACnet, Modbus, and proprietary HVAC buses to a color TFT status display. The 12-bit 18 MSPS ADC reads multiple analog sensors (temperature, humidity, CO2) directly, while the 640 KB SRAM runs the BACnet stack and scheduling logic without external memory. The -40 C to +85 C industrial temperature range supports unheated equipment rooms.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ2064DAK169-I/HF — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ2064DAK169T-I/HF | PIC32MZ2064DAL169-I/HF | PIC32MZ1064DAA169-I/HF |
|---|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB |
| External Memory | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 32 MB | None |
| GPU | Integrated 2D Graphics Processor | Integrated 2D Graphics Processor | Integrated 2D Graphics Processor | Integrated 2D Graphics Processor |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
Principais diferenciais
- Highest external memory ceiling in PIC32MZ DA 169-pin family (vs PIC32MZ2064DAL169-I/HF)
- Dual-panel Flash for fail-safe OTA updates (vs PIC32MZ1064DAA169-I/HF)
- Integrated 2D GPU plus LCD controller on-chip (vs Generic Cortex-M4 MCU)
Notas de projeto
Estimated: the 169-LFBGA package requires a 4-layer PCB with a continuous ground plane beneath the BGA footprint for thermal dissipation and signal return paths. Use a 0.8 mm pitch BGA fanout with microvias (8 mil pad, 4 mil drill) to the inner layers; the Microchip AN1338 application note provides the recommended stackup and routing rules for the DDR2 interface. Maintain 100 ohm differential impedance for the DDR2 signals and 90 ohm for USB DP/DM pairs.
Estimated: at 200 MHz full CPU and GPU load, the PIC32MZ2064DAK169 dissipates approximately 0.5-0.8 W depending on peripheral activity. The 169-LFBGA package dissipates heat through the central ball array and ground balls; for industrial temperature operation ensure at least 4 thermal vias under the package center connected to the internal ground plane, and avoid placing the BGA over internal PCB cutouts that interrupt the thermal path.
The DDR2 SDRAM interface is the most demanding signal-integrity challenge on this design. Length-match all DDR2 byte lanes within 25 mils (data, DQS, DM) and clock-to-clock within 50 mils, use series 33 ohm damping resistors near the MCU on the address/command lines if your trace length exceeds 25 mm, and place the DDR2 chip on the same PCB side as the MCU with no vias in the break-out region. Reference Microchip AN1338 for the complete DDR2 layout checklist.
Do not assume any PGECx/PGEDx pin pair works independently for ICSP - the PIC32MZ2064DAK169 has multiple pairs, but you must use them as a pair (PGEC2 with PGED2, for example). Skipping the 0.1 uF + 10 uF capacitor network on AVDD/AVSS when using the 18 MSPS ADC will inject switching noise and reduce effective resolution to 10-11 bits. Always program the DDR2 controller timing parameters from the configuration bits, not from software defaults, or you will see intermittent boot failures.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. The -I (industrial) suffix operates from -40 C to +85 C but is NOT AEC-Q100 qualified; for automotive clusters choose a Q100-qualified variant from Microchip's automotive PIC32 portfolio.