RV1126 - Vision Processor SoC, 4x Cortex-A7, 2 TOPS NPU | Rockchip
N.º da peça: RV1126 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.32 | $18,32 |
| 10 | $17.45 | $174,50 |
| 100 | $16.1 | $1.610,00 |
| 500 | $14.85 | $7.425,00 |
| 1.000 | $13.6 | $13.600,00 |
RV1126 Visão geral
A vision processor SoC is a class of system-on-chip optimized to ingest high-throughput camera data, perform image signal processing (ISP), optionally run neural-network inference on each frame, and encode/decode video with hardware acceleration. Unlike a general-purpose application processor, a vision SoC typically integrates the ISP, vision DSP, video codec, and AI accelerator alongside the application CPU, reducing bill-of-materials and power versus a discrete multi-chip design. The RV1126 sits in the taxonomy "vision processor SoC -> AI vision SoC -> edge AI SoC -> multimedia SoC -> semiconductor", sharing that niche with Rockchip's own RV1109 and competing parts from Novatek, HiSilicon, and Ambarella.
Key features include the 4x Cortex-A7 application cluster up to 1.5 GHz, a hardware 2 TOPS INT8 NPU, integrated ISP for high-dynamic-range image pipelines, hardware H.264/H.265 4Kp30 decode, and a Pin-to-Pin compatible footprint with the dual-core RV1109 within the same SoC family. The FCCSP-409 (14 x 14 mm) package supports low-cost four-layer PCB designs with on-package DDR3L. Operating temperature range spans -40 C to +125 C (per JLCPCB listing) for automotive and industrial outdoor deployments.
Typical applications include AI IP cameras, automotive dashcams, smart doorbells with on-device AI, video door phones, body-worn cameras, and machine-vision endpoints where 4K video decode, edge inference, and low power must coexist. When designing with this device, prioritize thermal management for the 1.8 W typical load and verify DDR3L PCB layout against the Rockchip hardware design guide to maintain signal integrity at 4K video data rates.
Alternativas drop-in para RV1126 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com RV1126 (mesmo formato e footprint) — diferindo em ISP, Package, Product Type, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
RV1109
✅ Drop-In✓ Em estoque
$7.8 / unidade
Ver ficha técnica →RV1126B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
RV1126 Classificações máximas e características elétricas
| Product Type | Vision Processor SoC (MCU/MPU/SOC) |
| CPU Cores | 4x ARM Cortex-A7 32-bit (with NEON + FPU) |
| CPU Max Frequency | 1.5 GHz |
| MCU Core | RISC-V MCU |
| NPU | 2 TOPS INT8 |
| Video Decoder | H.264 / H.265 4K at 30 fps |
| ISP | Integrated high-performance ISP |
| Typical Power (4K30 fps) | 1.8 W |
| Encapsulamento | FCCSP-409 (14 x 14 mm) |
| Temperatura de operação | -40 C to +125 C |
| Tipo de montagem | Surface Mount (BGA) |
| Memory Interface | DDR3L (Samsung K4B4G1646E-BCNB compatible) |
| Peripheral Interfaces | I2C, SPI, PWM, USB |
| Status RoHS | Compliant |
| Pin Compatibility | Pin-to-Pin compatible with RV1109 |
Guia de Configuração de Pinos do RV1126 fccsp-409 (14 x 14 mm)
Configuração de pinos para RV1126 (pacote fccsp-409 (14 x 14 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para RV1126.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
RV1126 é adequado para 6 aplicaçãos: AI IP Camera (IPC), Automotive Dashcam / CVR, Smart Doorbell with On-Device AI, Video Door Phone / Intercom, Body-Worn / Action Camera, Machine Vision Endpoints.
AI IP Camera (IPC)
The RV1126 fits AI IP cameras because it pairs a quad-core Cortex-A7 host up to 1.5 GHz with a 2 TOPS INT8 NPU, an integrated high-performance ISP, and an H.264/H.265 4Kp30 decoder. Per Rockchip's positioning for IPC/CVR, on-device NPU inference enables person/vehicle detection and face recognition while the ISP handles HDR pipelines, and the FCCSP-409 footprint keeps the camera enclosure compact.
Recomendado
Automotive Dashcam / CVR
For automotive dashcams, the RV1126's -40 C to +125 C operating range (per JLCPCB listing) and 1.8 W typical power at 4K30 enable compact sealed dashcam modules that survive cabin temperatures while recording 4K H.264/H.265. The hardware video codec offloads encoding from the CPU so event-triggered recording and parking surveillance add minimal thermal load versus a software-encoder design.
Recomendado
Smart Doorbell with On-Device AI
The RV1126's 2 TOPS NPU allows a doorbell to run face recognition, package detection, and visitor classification fully on-device, avoiding cloud upload and reducing latency. With its hardware H.264/H.265 decoder and ISP, the same SoC handles the wide-angle HDR camera pipeline and two-way audio, letting product designers ship a single-SoC doorbell that replaces a discrete application-processor-plus-AI-accelerator pair.
Recomendado
Video Door Phone / Intercom
Indoor video intercom stations benefit from the RV1126's 4Kp30 decode and quad-core Cortex-A7 host, which can drive a touch-panel UI plus simultaneous video stream decoding. The integrated peripherals (I2C, SPI, PWM, USB) cover the touch controller, audio codec, keypad scan, and Wi-Fi/Bluetooth companion module, while the FCCSP-409 keeps the indoor unit slim.
Recomendado
Body-Worn / Action Camera
Body-worn cameras rely on the RV1126's hardware H.264/H.265 encoder to record 4K at low power, extending battery life during extended shifts. The integrated ISP supports electronic image stabilization pipelines and HDR, while the 2 TOPS NPU can tag recordings in real time with officer/location metadata, all in a BGA package small enough for clip-on form factors.
Recomendado
Machine Vision Endpoints
Industrial machine-vision endpoints (defect inspection, OCR, robotic pick-and-place feed) leverage the RV1126's combination of high-throughput ISP, 2 TOPS INT8 NPU, and 1.5 GHz Cortex-A7 host. The -40 C to +125 C rating supports factory-floor enclosures, while the FCCSP-409 four-layer PCB capability eases integration into machine-vision carriers that already use Vision-ready reference designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para RV1126 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | RV1109 | RV1126B |
|---|---|---|---|
| Brand | Rockchip | Rockchip | Rockchip |
| Package | FCCSP-409 (14x14) | FCCSP-409 (14x14) - same | FCCSP-409 (14x14) - same family |
| CPU Cores | 4x Cortex-A7 up to 1.5 GHz | 2x Cortex-A7 up to 1.5 GHz | Upgraded multi-core Cortex-A |
| NPU TOPS | 2 TOPS INT8 | 1.2 TOPS-class | Higher TOPS (successor) |
| Video Decoder | H.264/H.265 4Kp30 | H.264/H.265 4Kp30 | H.264/H.265 (improved) |
| Pin-to-Pin Compatible | Pin-compatible with RV1109 | Yes (this is the reference) | Functional upgrade - PCB changes likely |
Principais diferenciais
- Quad-core Cortex-A7 + RISC-V MCU + 2 TOPS NPU in one SoC (vs RV1109)
- First-generation RV1126 with established SDK and reference designs (vs RV1126B)
- Pin-to-Pin compatible with RV1109 for two-tier SKUs (vs RV1109)
Notas de projeto
Estimated: at 1.8 W typical dissipation the FCCSP-409 (14x14 mm) package requires thermal relief from the main PCB copper pour to keep junction temperature below 125 C in automotive cabins. Recommended thermal pattern: a continuous top-layer copper flood under the BGA with multiple thermal vias to inner-plane copper and a bottom-layer flood under the camera housing. Validate with a hot-spot thermal probe at 4K30 fps encode plus AI inference, the realistic worst-case workload.
Estimated: place the DDR3L (Samsung K4B4G1646E-BCNB-compatible) traces within the Rockchip-recommended length/width envelope, keep reference-plane continuity under the BGA escape region, and route the high-speed video/USB differential pairs over a continuous ground reference. Use a four-layer stack-up where the second layer is a solid ground and the third is a solid power, and provide stitching vias every 5 mm around the SoC perimeter to suppress edge radiation.
Do not assume RV1126B is a drop-in: per Rockchips.net, RV1126B adds USB 3.0, RGMII Ethernet, an audio codec, and RTC, which can require PCB and power-rail adjustments. Engineers treating RV1126B as a strict pin-to-pin replacement for RV1126 may overlook the need for new power sequencing or magnetics, leading to no-boot prototypes.
Estimated: at 4Kp30 H.265 the SoC memory bandwidth approaches the practical ceiling of DDR3L-1866, so memory trace matching (within the manufacturer-published tolerance, typically within +/-25 ps) and reference-plane stitching are mandatory. Avoid routing high-speed traces across plane splits; route the MIPI CSI-2 lanes to the sensor with the shortest possible length and keep them length-matched within the sensor vendor's skew budget.
Informações de conformidade
RoHS compliance per JLCPCB listing. AEC-Q100 not qualified per public Rockchip documentation; automotive designs must validate reliability against vendor data. Reach, lead-free, halogen-free, and conflict-minerals status not explicitly stated in the verified data and left as unknown.
