RV1126 - Vision Processor SoC, 4x Cortex-A7, 2 TOPS NPU | Rockchip
Référence : RV1126 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.32 | $18,32 |
| 10 | $17.45 | $174,50 |
| 100 | $16.1 | $1 610,00 |
| 500 | $14.85 | $7 425,00 |
| 1 000 | $13.6 | $13 600,00 |
RV1126 Présentation
A vision processor SoC is a class of system-on-chip optimized to ingest high-throughput camera data, perform image signal processing (ISP), optionally run neural-network inference on each frame, and encode/decode video with hardware acceleration. Unlike a general-purpose application processor, a vision SoC typically integrates the ISP, vision DSP, video codec, and AI accelerator alongside the application CPU, reducing bill-of-materials and power versus a discrete multi-chip design. The RV1126 sits in the taxonomy "vision processor SoC -> AI vision SoC -> edge AI SoC -> multimedia SoC -> semiconductor", sharing that niche with Rockchip's own RV1109 and competing parts from Novatek, HiSilicon, and Ambarella.
Key features include the 4x Cortex-A7 application cluster up to 1.5 GHz, a hardware 2 TOPS INT8 NPU, integrated ISP for high-dynamic-range image pipelines, hardware H.264/H.265 4Kp30 decode, and a Pin-to-Pin compatible footprint with the dual-core RV1109 within the same SoC family. The FCCSP-409 (14 x 14 mm) package supports low-cost four-layer PCB designs with on-package DDR3L. Operating temperature range spans -40 C to +125 C (per JLCPCB listing) for automotive and industrial outdoor deployments.
Typical applications include AI IP cameras, automotive dashcams, smart doorbells with on-device AI, video door phones, body-worn cameras, and machine-vision endpoints where 4K video decode, edge inference, and low power must coexist. When designing with this device, prioritize thermal management for the 1.8 W typical load and verify DDR3L PCB layout against the Rockchip hardware design guide to maintain signal integrity at 4K video data rates.
Alternatives de remplacement direct pour RV1126 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec RV1126 (même facteur de forme et même empreinte) — différant par ISP, Package, Product Type, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
RV1109
✅ Remplacement direct✓ En stock
$7.8 / unité
Voir la fiche technique →RV1126B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
RV1126 Valeurs maximales et caractéristiques électriques
| Product Type | Vision Processor SoC (MCU/MPU/SOC) |
| CPU Cores | 4x ARM Cortex-A7 32-bit (with NEON + FPU) |
| CPU Max Frequency | 1.5 GHz |
| MCU Core | RISC-V MCU |
| NPU | 2 TOPS INT8 |
| Video Decoder | H.264 / H.265 4K at 30 fps |
| ISP | Integrated high-performance ISP |
| Typical Power (4K30 fps) | 1.8 W |
| Boîtier | FCCSP-409 (14 x 14 mm) |
| Température de fonctionnement | -40 C to +125 C |
| Type de montage | Surface Mount (BGA) |
| Memory Interface | DDR3L (Samsung K4B4G1646E-BCNB compatible) |
| Peripheral Interfaces | I2C, SPI, PWM, USB |
| Statut RoHS | Compliant |
| Pin Compatibility | Pin-to-Pin compatible with RV1109 |
Guide de configuration des broches du RV1126 fccsp-409 (14 x 14 mm)
Configuration des broches du RV1126 (boîtier fccsp-409 (14 x 14 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour RV1126.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
RV1126 convient pour 6 applications: AI IP Camera (IPC), Automotive Dashcam / CVR, Smart Doorbell with On-Device AI, Video Door Phone / Intercom, Body-Worn / Action Camera, Machine Vision Endpoints.
AI IP Camera (IPC)
The RV1126 fits AI IP cameras because it pairs a quad-core Cortex-A7 host up to 1.5 GHz with a 2 TOPS INT8 NPU, an integrated high-performance ISP, and an H.264/H.265 4Kp30 decoder. Per Rockchip's positioning for IPC/CVR, on-device NPU inference enables person/vehicle detection and face recognition while the ISP handles HDR pipelines, and the FCCSP-409 footprint keeps the camera enclosure compact.
Recommandé
Automotive Dashcam / CVR
For automotive dashcams, the RV1126's -40 C to +125 C operating range (per JLCPCB listing) and 1.8 W typical power at 4K30 enable compact sealed dashcam modules that survive cabin temperatures while recording 4K H.264/H.265. The hardware video codec offloads encoding from the CPU so event-triggered recording and parking surveillance add minimal thermal load versus a software-encoder design.
Recommandé
Smart Doorbell with On-Device AI
The RV1126's 2 TOPS NPU allows a doorbell to run face recognition, package detection, and visitor classification fully on-device, avoiding cloud upload and reducing latency. With its hardware H.264/H.265 decoder and ISP, the same SoC handles the wide-angle HDR camera pipeline and two-way audio, letting product designers ship a single-SoC doorbell that replaces a discrete application-processor-plus-AI-accelerator pair.
Recommandé
Video Door Phone / Intercom
Indoor video intercom stations benefit from the RV1126's 4Kp30 decode and quad-core Cortex-A7 host, which can drive a touch-panel UI plus simultaneous video stream decoding. The integrated peripherals (I2C, SPI, PWM, USB) cover the touch controller, audio codec, keypad scan, and Wi-Fi/Bluetooth companion module, while the FCCSP-409 keeps the indoor unit slim.
Recommandé
Body-Worn / Action Camera
Body-worn cameras rely on the RV1126's hardware H.264/H.265 encoder to record 4K at low power, extending battery life during extended shifts. The integrated ISP supports electronic image stabilization pipelines and HDR, while the 2 TOPS NPU can tag recordings in real time with officer/location metadata, all in a BGA package small enough for clip-on form factors.
Recommandé
Machine Vision Endpoints
Industrial machine-vision endpoints (defect inspection, OCR, robotic pick-and-place feed) leverage the RV1126's combination of high-throughput ISP, 2 TOPS INT8 NPU, and 1.5 GHz Cortex-A7 host. The -40 C to +125 C rating supports factory-floor enclosures, while the FCCSP-409 four-layer PCB capability eases integration into machine-vision carriers that already use Vision-ready reference designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour RV1126 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | RV1109 | RV1126B |
|---|---|---|---|
| Brand | Rockchip | Rockchip | Rockchip |
| Package | FCCSP-409 (14x14) | FCCSP-409 (14x14) - same | FCCSP-409 (14x14) - same family |
| CPU Cores | 4x Cortex-A7 up to 1.5 GHz | 2x Cortex-A7 up to 1.5 GHz | Upgraded multi-core Cortex-A |
| NPU TOPS | 2 TOPS INT8 | 1.2 TOPS-class | Higher TOPS (successor) |
| Video Decoder | H.264/H.265 4Kp30 | H.264/H.265 4Kp30 | H.264/H.265 (improved) |
| Pin-to-Pin Compatible | Pin-compatible with RV1109 | Yes (this is the reference) | Functional upgrade - PCB changes likely |
Principaux différenciateurs
- Quad-core Cortex-A7 + RISC-V MCU + 2 TOPS NPU in one SoC (vs RV1109)
- First-generation RV1126 with established SDK and reference designs (vs RV1126B)
- Pin-to-Pin compatible with RV1109 for two-tier SKUs (vs RV1109)
Notes de conception
Estimated: at 1.8 W typical dissipation the FCCSP-409 (14x14 mm) package requires thermal relief from the main PCB copper pour to keep junction temperature below 125 C in automotive cabins. Recommended thermal pattern: a continuous top-layer copper flood under the BGA with multiple thermal vias to inner-plane copper and a bottom-layer flood under the camera housing. Validate with a hot-spot thermal probe at 4K30 fps encode plus AI inference, the realistic worst-case workload.
Estimated: place the DDR3L (Samsung K4B4G1646E-BCNB-compatible) traces within the Rockchip-recommended length/width envelope, keep reference-plane continuity under the BGA escape region, and route the high-speed video/USB differential pairs over a continuous ground reference. Use a four-layer stack-up where the second layer is a solid ground and the third is a solid power, and provide stitching vias every 5 mm around the SoC perimeter to suppress edge radiation.
Do not assume RV1126B is a drop-in: per Rockchips.net, RV1126B adds USB 3.0, RGMII Ethernet, an audio codec, and RTC, which can require PCB and power-rail adjustments. Engineers treating RV1126B as a strict pin-to-pin replacement for RV1126 may overlook the need for new power sequencing or magnetics, leading to no-boot prototypes.
Estimated: at 4Kp30 H.265 the SoC memory bandwidth approaches the practical ceiling of DDR3L-1866, so memory trace matching (within the manufacturer-published tolerance, typically within +/-25 ps) and reference-plane stitching are mandatory. Avoid routing high-speed traces across plane splits; route the MIPI CSI-2 lanes to the sensor with the shortest possible length and keep them length-matched within the sensor vendor's skew budget.
Informations de conformité
RoHS compliance per JLCPCB listing. AEC-Q100 not qualified per public Rockchip documentation; automotive designs must validate reliability against vendor data. Reach, lead-free, halogen-free, and conflict-minerals status not explicitly stated in the verified data and left as unknown.
