RV1109 - Dual Cortex-A7 AI Vision SoC | Rockchip
MPN: RV1109 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.5662 | $10.57 |
| 10 | $10 | $100.00 |
| 100 | $9.2 | $920.00 |
| 500 | $8.45 | $4,225.00 |
| 1,000 | $7.8 | $7,800.00 |
RV1109 Overview
An SoC (System-on-Chip) is a single silicon device that integrates a CPU, memory subsystem, specialized accelerators, and I/O peripherals, replacing what would otherwise require a discrete processor plus companion logic. Within the broader taxonomy, the RV1109 sits inside application-specific vision SoCs (a sub-class of microprocessors/MPUs) and below general-purpose SoCs in the processing hierarchy. For AI vision workloads, Rockchip co-integrates a neural-network accelerator alongside the ISP so that inference runs without consuming the A7 cores.
Key features distinguishing the RV1109 include a hardware ISP supporting HDR, 3A (AE/AF/AWB), lens shading correction (LSC), 3DNR, 2DNR, sharpening, dehaze, fisheye correction, gamma correction, and feature-point detection. The integrated encoder supports H.265/H.264 at 5 megapixels, with multi-stream capability to feed both local storage and cloud simultaneously. Operating junction temperature supports commercial/industrial deployment, and the FCCSP-409 (14x14 mm) package balances I/O density with PCB manufacturability.
Architecturally the RV1109 combines Cortex-A7 application cores for control flow, Linux/SDK management and user I/O with dedicated hardware pipelines (ISP, encoder, NPU) that offload pixel-rate and inference tasks. This heterogeneous architecture keeps the application CPU free for OS-level tasks while real-time image processing runs on deterministic hardware.
Typical applications include IP cameras, consumer CCTV, AI dashcams, smart doorbells, biometrics terminals, machine-vision edge devices, and dual-lens AI camera modules. In each case the integrated NPU plus ISP allows on-device analytics such as face recognition or object detection without an external AI accelerator. The RV1126 shares the same FCCSP-409 pinout for higher-resolution variants in the same family.
When designing with the RV1109, ensure the carrier PCB provides the published power-rail sequencing and an exposed thermal copper pour under the BGA; the 1.2 W typical dissipation at 5M30fps remains within the package's thermal envelope but rises quickly under sustained NPU load.
This page synthesizes distributor pricing, drop-in family alternatives (notably the RV1126 and RV1126B), and design considerations compiled from the Rockchip datasheet and community hardware design references.
Drop-in alternatives for RV1109 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with RV1109 (same form factor and footprint) — differing in ISP, Package, Product Type, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
RV1126
✅ Drop-In✓ In Stock
$13.6 / Unit
View Datasheet →RV1126B-P
✅ Drop-In📋 Reference alternative (not in catalog)
RV1109 Maximum Ratings & Electrical Characteristics
| Product Type | AI Vision Processor SoC |
| CPU Core | Dual-core ARM Cortex-A7 32-bit |
| CPU Extensions | NEON + FPU |
| ISP | Hardware-based 5-megapixel ISP |
| Video Encoder | H.265 / H.264 up to 5M@30FPS |
| Multi-Stream Encoding | 1x 5M@30FPS + 1x 720P@30FPS simultaneous |
| Typical Power Consumption | 1.2 W at 5M@30fps |
| ISP Algorithms | HDR, 3A (AE/AF/AWB), LSC, 3DNR, 2DNR, sharpening, dehaze, fisheye, gamma, feature-point detection |
| Package | FCCSP-409 (14x14 mm) |
| Ball Count | 409 |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature (industrial) | -40C to +85C (industrial grade per datasheet) |
| RoHS Status | Compliant (per JLCPCB listing) |
| Primary Application | IP Camera (IPC) / Intelligent Vision |
| Pin-compatible Family Member | RV1126 (same FCCSP-409 footprint, higher ISP resolution) |
RV1109 fccsp-409 (14x14 mm) Pin Configuration Guide
Pin configuration for RV1109 (fccsp-409 (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RV1109.
Refer to the datasheet for full pin configuration.
Typical Applications
RV1109 is suitable for 6 applications: IP Camera (IPC) / Network Surveillance, AI Dashcam / Automotive Recorder, Smart Doorbell / Video Intercom, Face Recognition Terminal / Access Control, Dual-Lens AI Camera Module, Industrial Machine Vision Edge Device.
IP Camera (IPC) / Network Surveillance
The RV1109 is purpose-built for IP cameras, where its hardware ISP plus on-die NPU lets a single SoC handle 5MP sensor processing, H.265/H.264 encoding at 30 FPS, and on-device analytics such as person/vehicle detection. Typical power of 1.2 W at 5M30fps keeps PoE-class thermal envelopes manageable without a heatsink. Multi-stream encoding (5M@30FPS main + 720P@30FPS sub) supports simultaneous local SD-card recording and cloud upload. The FCCSP-409 (14x14 mm) package fits standard compact IPC board outlines. Recommended companion parts include a 5MP CMOS sensor (e.g., Sony IMX335-class), a PoE PD controller, and a Wi-Fi module for wireless variants.
Recommended
AI Dashcam / Automotive Recorder
In dashcam applications the RV1109's integrated NPU runs driver-assistance analytics (lane departure, forward-collision warning) directly on the device while the encoder writes 5M@30fps footage to local storage. The hardware ISP pipeline compensates for windshield glare and low-light tunnels via HDR, 3DNR, and AE/AWB without CPU intervention. Operating temperature up to +85C supports closed automotive cabin environments. Power consumption of approximately 1.2 W at 5M30fps is compatible with vehicle 5V/12V rails after a buck regulator. The FCCSP-409 (14x14 mm) footprint fits behind the rearview mirror in space-constrained dashcam housings. Recommended companion parts include a 5MP image sensor and an automotive-grade PMIC.
Recommended
Smart Doorbell / Video Intercom
Smart doorbells leverage the RV1109's integrated NPU for on-device face recognition, eliminating cloud round-trips and improving privacy response latency. The 5MP ISP with HDR handles backlit entryways and night-time IR illumination, while H.265 encoding keeps bandwidth low for remote-viewer streaming. Multi-stream encoding lets the doorbell push a 720P preview to the phone app while recording 5MP locally. The SoC's 1.2 W typical dissipation runs comfortably on the doorbell's wired power input. The FCCSP-409 (14x14 mm) package supports the small PCB area required for slim doorbell enclosures. Recommended companion parts include a wide-FOV 5MP sensor, an IR-cut switch, and a Wi-Fi/BLE combo module.
Recommended
Face Recognition Terminal / Access Control
Access-control terminals pair the RV1109 with an on-device face-recognition model that runs entirely on the integrated NPU, removing the network dependency for badge-in scenarios. The hardware ISP delivers 3A (AE/AF/AWB) tuning for varied lighting plus 3DNR for noisy indoor scenes, while the encoder logs a 720P audit stream. Industrial-grade variants rated -40C to +85C suit outdoor gate installations. The FCCSP-409 package fits behind the LCD/touch panel in compact terminal enclosures. Typical 1.2 W power keeps the device within PoE or 12V adapter budgets. Recommended companion parts include a 5MP sensor with IR, a Wiegand/RS-485 interface, and a 5-inch LCD panel.
Recommended
Dual-Lens AI Camera Module
Dual-lens AI cameras use the RV1109 to fuse two sensor streams for depth estimation, face anti-spoofing, or wide-angle plus telephoto capture. The hardware ISP pipelines (HDR, 3DNR, sharpening, dehaze) process both sensor feeds without CPU intervention, freeing the Cortex-Aso for the fusion algorithm. Multi-stream encoding supports recording at 5M@30fps while a lower-resolution stream goes to remote viewers. The Firefly CAM-C1109S2U reference design demonstrates this dual-lens topology per cnx-software coverage. The FCCSP-409 (14x14 mm) footprint accommodates the dual-sensor PCB. Recommended companion parts include a pair of 5MP sensors, a sync clock generator, and an M12 lens holder pair.
Recommended
Industrial Machine Vision Edge Device
Factory-floor machine-vision edge devices use the RV1109 to run defect-detection inference on the integrated NPU while streaming inspection imagery to a local NVR or cloud dashboard. The industrial-grade -40C to +85C variant handles unconditioned shop floor temperatures, and the hardware 3A/3DNR pipelines cope with mixed factory lighting. H.265 encoding at 5M@30fps supports visual-logging archival. Typical 1.2 W dissipation avoids active cooling in sealed enclosures. The FCCSP-409 footprint fits inside compact industrial IP67 housings. Recommended companion parts include a global-shutter 5MP sensor, a Gigabit Ethernet PHY, and an M12 industrial connector set.
Recommended
Recommended Products Summary
Engineering reference data for RV1109 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RV1126 | RV1126B-P |
|---|---|---|---|
| Package | FCCSP-409 (14x14 mm) | FCCSP-409 (14x14 mm) - same | FCCSP-409 (14x14 mm) - same |
| Brand | Rockchip | Rockchip - same | Rockchip - same |
| CPU Core | Dual-core ARM Cortex-A7 | Dual-core ARM Cortex-A7 | Dual-core ARM Cortex-A7 |
| Max Sensor / ISP Resolution | 5 MP | >5 MP (higher ISP throughput) | 5 MP class |
| Encoder | H.265 / H.264 up to 5M@30FPS | H.265 / H.264 up to higher tier | H.265 / H.264 up to 5M@30FPS |
| Typical Power @ 5M30fps | ~1.2 W | Higher (larger ISP workload) | ~1.2 W |
| Pin-to-Pin Compatible | N/A (this product) | Yes - FCCSP-409 shared | Yes - core board variant |
| Primary Use Case | 5MP IP camera, AI dashcam, smart doorbell | Higher-resolution IPC, 4K dashcam | 5MP IPC on core board |
Key Differentiators
- Optimized 5MP ISP pipeline with lower typical power than higher-tier siblings (vs RV1126)
- Pin-compatible upgrade path to higher-resolution family member (vs RV1126)
Design Notes
The RV1109 dissipates ~1.2 W at 5M@30fps, but NPU-heavy inference workloads push dissipation higher. Design the carrier PCB with a continuous copper pour under the FCCSP-409 footprint and thermal vias to the inner layers. For sealed IP65/IP67 housings, derate to 80% of the SoC's maximum junction temperature to avoid thermal throttling during sustained AI workloads.
The FCCSP-409 (14x14 mm) BGA requires a 4-6 layer PCB with 0.8 mm ball pitch microvia fan-out. Reference schematics and design files are available in the cnchens/RV1126_RV1109_Hardware_Design_Template community GitHub repository. Ensure all power rails use the recommended decoupling capacitor network per the Rockchip datasheet and sequence the A7 core voltage rail before the I/O rails to avoid latch-up.
Do not assume the RV1126 firmware is binary-compatible with the RV1109 - despite shared FCCSP-409 pinout, the larger ISP and encoder pipelines require a different device tree and SDK build. When substituting RV1126 into an RV1109 design, reflash the boot image and validate the power-rail sequencing per the RV1126 datasheet before production ramp.
Compliance Information
RoHS compliance per JLCPCB part listing; REACH, halogen-free, and conflict-minerals status not stated in the provided data - flagged as unknown.
