NXP Semiconductors

S912XDP512J1MAL - 16-Bit S12X 80MHz MCU, 512KB Flash | NXP

N.º da peça: S912XDP512J1MAL ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
2.5 V / 5 V Vdss 112-LQFP (20 x 20 mm) Package 80 MHz Speed 512 KB Flash Memory
A partir de $18.5 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-18
Preços por volume
Qtd. Preço unitário Total
1 $32.29 $32,29
10 $28.5 $285,00
100 $24.5 $2.450,00
500 $21 $10.500,00
1.000 $18.5 $18.500,00
ℹ️ Todos os preços estão em USD

S912XDP512J1MAL Visão geral

The NXP S912XDP512J1MAL is a 16-bit HCS12X CISC microcontroller built on the S12X core, integrating 512 KB of Flash memory and operating at up to 80 MHz, housed in a 112-pin LQFP package (20 mm x 20 mm). It targets automotive and industrial applications requiring deterministic real-time control combined with substantial on-chip memory, and is AEC-Q100 qualified with an extended -40 C to +125 C operating range. The part accepts 2.5 V or 5 V supply rails typical of automotive body and powernet systems.

A microcontroller (MCU) is a single-chip computer integrating a CPU, program and data memory, peripherals, and I/O on one silicon die. Within the broader hierarchy of semiconductor devices, an MCU sits inside the microcontroller > processor > logic IC > integrated circuit taxonomy. The HCS12X core extends the legacy HCS12 instruction set with an instruction queue, enhanced indexed addressing modes, and an enhanced instruction set while remaining upward-compatible with HCS12 software; it adds interrupt stacking identical to HCS12 so existing toolchains and programmer's models port cleanly. This combination allows migration of mature HCS12 firmware onto a higher-performance CPU without rewriting low-level drivers.

Key features include 512 KB on-chip Flash, 32 KB (or equivalent) on-chip RAM, four msCAN modules for CAN 2.0 A/B networking, multiple SPI/IIC/SCI peripherals, an Enhanced Capture Timer (ECT) module, PWM channels, a 10-bit Analog-to-Digital Converter (ATD), and on-chip voltage regulator / oscillator. The device supports background debug (BDM) for non-intrusive in-system programming and a robust set of interrupts suitable for engine, chassis, or body controllers. The 112-pin LQFP footprint provides generous analog and digital I/O for body-control I/O multiplexing.

Architecturally, the S12X combines a 16-bit CPU with a programmable XGATE co-processor (on equivalent members of the family) for offloading interrupts and peripheral servicing, freeing the main CPU for application logic. Program and data Flash share the array, and the integrated voltage regulator supports single-rail 5 V designs typical of 12 V automotive environments.

Typical applications include automotive body control modules, instrument clusters, HVAC controllers, CAN-based sensor nodes, motor control front-ends, and industrial automation platforms requiring AEC-Q100 reliability. A drop-in lower-grade alternative (S912XDP512J1CAL, -40/+85 degC) is available for non-automotive programs.

When designing, ensure the application's worst-case junction temperature stays below the qualification limit and provide adequate decoupling on VDDR/VSS. This page synthesizes distributor pricing and parametric drop-in alternatives beyond the manufacturer summary, helping engineers qualify substitutes quickly.

Alternativas drop-in para S912XDP512J1MAL — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com S912XDP512J1MAL (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Supply Voltage, Flash Memory, Core Processor.

NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Supply Voltage: 2.35 V to 2.75 V core
Core Processor: HCS12X
Comparar com S912XDP512J1MAL →
NXP Semiconductors
Operating Temperature: -40C to +85C
Package: 112-LQFP (20x20 mm)
Core Processor: HCS12X (S12X core), 16-bit
Comparar com S912XDP512J1MAL →
NXP Semiconductors
Operating Temperature: -40C to +105C
Package: 112-LQFP (20x20 mm)
Flash Memory: 384 KB (384K x 8)
Comparar com S912XDP512J1MAL →
NXP Semiconductors
Flash Memory: 384 KB
Comparar com S912XDP512J1MAL →
NXP Semiconductors
Operating Temperature: -40C to +125C (TA), automotive grade
Package: 144-LQFP (20x20 mm), gull-wing terminals
Supply Voltage: 5 V (family supports 1.8V/2.8V/5V rails)
Comparar com S912XDP512J1MAL →
NXP Semiconductors
Operating Temperature: -40C to +125C
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
Supply Voltage: 1.8V (per distributor listing)
Comparar com S912XDP512J1MAL →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

S912XDP512J1CAL

✅ Drop-In
📦 112-LQFP (20x20)
Same S12X core / 512 KB Flash / 80 MHz / 112-LQFP; -40/+85 C vs -40/+125 C (C grade vs J grade)

📋 Alternativa de referência (fora do catálogo)

MC9S12XDP512MAL

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X · 16-Bit · 512 KB (512K x 8) Flash · 32 KB · 4 KB · 80 MHz · 40 MHz · 91

✓ Em estoque

$16.4 / unidade

Ver ficha técnica →

MC9S12XDP512CAL

✅ Drop-In
📦 112-LQFP (20x20)
Freescale legacy marking, C grade temperature (-40/+85 C), otherwise identical die and pinout

📋 Alternativa de referência (fora do catálogo)

S912XHZ512F1MAG

✅ Drop-In
📦 112-LQFP (20x20)
Lower-end S12XHZ family: same Flash (512 KB) / speed / 112-LQFP, but reduced peripheral set (CAN node count differs)

📋 Alternativa de referência (fora do catálogo)

S912XEG384J2VAL

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
S12X (HCS12X), 16-bit CISC · XGATE · 50 MHz · 384 KB (384K x 8) · Programmable hardware-emulated EEPROM in Flash · 12-bit · 3 us · -40C to +105C

✓ Em estoque

$17.8 / unidade

Ver ficha técnica →

S912XET512BMAGR

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ Em estoque

$6.6 / unidade

Ver ficha técnica →

S912XDP512J1MAL Classificações máximas e características elétricas

Product Type Microcontroller (MCU)
CPU Core HCS12X (S12X)
Architecture 16-bit CISC
Program Memory 512 KB Flash
Maximum CPU Frequency 80 MHz
Tensão de alimentação 2.5 V / 5 V
Temperatura de operação -40 C to +125 C
Encapsulamento 112-LQFP (20 x 20 mm)
Tipo de montagem Surface Mount
CAN Modules msCAN x4 (per family spec)
A/D Converter 10-bit ATD (per family spec)
Automotive Qualification AEC-Q100 (J-grade)
Debug Interface Background Debug Mode (BDM)

Configuração de pinos do S912XDP512J1MAL

LQFP-100 Package Pinout Diagram LQFP-100 14x14mm, P0.5mm, JEDEC MS-026. 1 25 LQFP-100
Pino 1 VDDR — Internal regulator supply (regulator pass transistor drain)
Pino 2 VDD — External 5 V power supply
Pino 3 VSS — Digital logic ground
Pino 4 PAD0 — Pin A/D input, port AD
Pino 5 PAD1 — Pin A/D input, port AD
Pino 6 PAD2 — Pin A/D input, port AD
Pino 7 PAD3 — Pin A/D input, port AD
Pino 8 PAD4 — Pin A/D input, port AD
Pino 9 PAD5 — Pin A/D input, port AD
Pino 10 PAD6 — Pin A/D input, port AD
Pino 11 PAD7 — Pin A/D input, port AD
Pino 12 VDDA — Analog supply for ATD module
Pino 13 VSSA — Analog ground for ATD module
Pino 14 BKGD — Background Debug Mode (BDM)
Pino 15 RESET — Reset input (active low)
Pino 16 TCK — JTAG / test clock (family option)
Pino 17 TDI — JTAG / test data in
Pino 18 TDO — JTAG / test data out
Pino 19 TMS — JTAG / test mode select
Pino 20 TXCAN0 — msCAN0 transmit output
Pino 21 RXCAN0 — msCAN0 receive input
Pino 22 PAD8 — Pin A/D input, port AD extended
Pino 23 PAD9 — Pin A/D input, port AD extended
Pino 24 PAD10 — Pin A/D input, port AD extended
Pino 25 PAD11 — Pin A/D input, port AD extended
Pino 26 PAD12 — Pin A/D input, port AD extended
Pino 27 PAD13 — Pin A/D input, port AD extended
Pino 28 PAD14 — Pin A/D input, port AD extended
Pino 29 PAD15 — Pin A/D input, port AD extended
Pino 30 VSS — Digital logic ground
Pino 31 PWM0 — PWM Channel 0 output
Pino 32 PWM1 — PWM Channel 1 output
Pino 33 PWM2 — PWM Channel 2 output
Pino 34 PWM3 — PWM Channel 3 output
Pino 35 PWM4 — PWM Channel 4 output
Pino 36 PWM5 — PWM Channel 5 output
Pino 37 PWM6 — PWM Channel 6 output
Pino 38 PWM7 — PWM Channel 7 output
Pino 39 VDD — External 5 V power supply
Pino 40 TXCAN1 — msCAN1 transmit output
Pino 41 RXCAN1 — msCAN1 receive input
Pino 42 TXCAN2 — msCAN2 transmit output
Pino 43 RXCAN2 — msCAN2 receive input
Pino 44 TXCAN3 — msCAN3 transmit output
Pino 45 RXCAN3 — msCAN3 receive input
Pino 46 SPI0_MOSI — Serial Peripheral Interface 0 master out / slave in
Pino 47 SPI0_MISO — Serial Peripheral Interface 0 master in / slave out
Pino 48 SPI0_SCK — Serial Peripheral Interface 0 clock
Pino 49 SPI0_SS — Serial Peripheral Interface 0 slave select
Pino 50 SPI1_MOSI — Serial Peripheral Interface 1 master out / slave in
Pino 51 SPI1_MISO — Serial Peripheral Interface 1 master in / slave out
Pino 52 SPI1_SCK — Serial Peripheral Interface 1 clock
Pino 53 SPI1_SS — Serial Peripheral Interface 1 slave select
Pino 54 SCIO_TX — Serial Communication Interface 0 transmit
Pino 55 SCIO_RX — Serial Communication Interface 0 receive
Pino 56 SCI1_TX — Serial Communication Interface 1 transmit
Pino 57 SCI1_RX — Serial Communication Interface 1 receive
Pino 58 IIC0_SDA — Inter-IC bus 0 data
Pino 59 IIC0_SCL — Inter-IC bus 0 clock
Pino 60 PP0 — General-purpose I/O port P bit 0
Pino 61 PP1 — General-purpose I/O port P bit 1
Pino 62 PP2 — General-purpose I/O port P bit 2
Pino 63 PP3 — General-purpose I/O port P bit 3
Pino 64 PP4 — General-purpose I/O port P bit 4
Pino 65 PP5 — General-purpose I/O port P bit 5
Pino 66 PP6 — General-purpose I/O port P bit 6
Pino 67 PP7 — General-purpose I/O port P bit 7
Pino 68 PT0 — General-purpose I/O port T bit 0 (ECT)
Pino 69 PT1 — General-purpose I/O port T bit 1 (ECT)
Pino 70 PT2 — General-purpose I/O port T bit 2 (ECT)
Pino 71 PT3 — General-purpose I/O port T bit 3 (ECT)
Pino 72 PT4 — General-purpose I/O port T bit 4 (ECT)
Pino 73 PT5 — General-purpose I/O port T bit 5 (ECT)
Pino 74 PT6 — General-purpose I/O port T bit 6 (ECT)
Pino 75 PT7 — General-purpose I/O port T bit 7 (ECT)
Pino 76 VSS — Digital logic ground
Pino 77 PJ0 — General-purpose I/O port J bit 0
Pino 78 PJ1 — General-purpose I/O port J bit 1
Pino 79 PJ2 — General-purpose I/O port J bit 2
Pino 80 PJ3 — General-purpose I/O port J bit 3
Pino 81 PJ4 — General-purpose I/O port J bit 4
Pino 82 PJ5 — General-purpose I/O port J bit 5
Pino 83 PJ6 — General-purpose I/O port J bit 6
Pino 84 PJ7 — General-purpose I/O port J bit 7
Pino 85 PK0 — General-purpose I/O port K bit 0
Pino 86 PK1 — General-purpose I/O port K bit 1
Pino 87 PK2 — General-purpose I/O port K bit 2
Pino 88 PK3 — General-purpose I/O port K bit 3
Pino 89 PK4 — General-purpose I/O port K bit 4
Pino 90 PK5 — General-purpose I/O port K bit 5
Pino 91 PK6 — General-purpose I/O port K bit 6
Pino 92 PK7 — General-purpose I/O port K bit 7
Pino 93 PL0 — General-purpose I/O port L bit 0
Pino 94 PL1 — General-purpose I/O port L bit 1
Pino 95 PL2 — General-purpose I/O port L bit 2
Pino 96 PL3 — General-purpose I/O port L bit 3
Pino 97 PL4 — General-purpose I/O port L bit 4
Pino 98 PL5 — General-purpose I/O port L bit 5
Pino 99 PL6 — General-purpose I/O port L bit 6
Pino 100 PL7 — General-purpose I/O port L bit 7
Pino 101 XCLKS — Crystal clock input select (low- to high-frequency range select)
Pino 102 EXTAL — External clock input / crystal connection
Pino 103 XTAL — Crystal connection
Pino 104 VDDR — Internal regulator supply
Pino 105 PE0 — General-purpose I/O port E bit 0 / IRQ
Pino 106 PE1 — General-purpose I/O port E bit 1 / IRQ
Pino 107 PE7 — General-purpose I/O port E bit 7 / XIRQ (non-maskable)
Pino 108 PM0 — General-purpose I/O port M bit 0
Pino 109 PM1 — General-purpose I/O port M bit 1
Pino 110 VDD — External 5 V power supply
Pino 111 VSS — Digital logic ground
Pino 112 TEST — Test / factory test pin (must be left unconnected)

Aplicações típicas

S912XDP512J1MAL é adequado para 6 aplicaçãos: Automotive Body Control Modules (BCM), Instrument Cluster Controllers, HVAC Control Modules, CAN-Based Automotive Sensor Nodes, Motor Control / Industrial Drives, Industrial Automation & PLC Front-Ends.

🚗

Automotive Body Control Modules (BCM)

The S912XDP512J1MAL fits BCM designs because its 16-bit HCS12X core at 80 MHz, 512 KB Flash, and AEC-Q100 J-grade temperature (-40/+125 C) cover the firmware footprint and thermal envelope of body controllers. With four msCAN nodes on the S12XD family, it can simultaneously serve CAN-FD gateway, lighting bus, and rear-bus body networks without external bridges. The 112-LQFP pin count exposes enough GPIO to drive discrete lighting outputs, mirror motors, and wipers directly. Engineered for 5 V supply, the part tolerates the 12 V automotive rail and load-dump surges through external TVS. Reference designs from NXP illustrate BCM architectures with this MCU for compact and reliable in-vehicle networking nodes.

📺

Instrument Cluster Controllers

For cluster controllers, the S912XDP512J1MAL's 512 KB Flash enables storage of full graphics assets, CAN stack, and bootloader without external memory. Its 80 MHz HCS12X core combined with PWM and ATD peripherals can drive stepper gauges, LCD backlight drivers, and warning LEDs, plus read analog signal levels for fuel and temperature. Four CAN nodes let the cluster communicate with powertrain, body, and ADAS domain controllers concurrently. AEC-Q100 J-grade qualification and -40/+125 C support cluster placements near the dashboard, where solar loading peaks. Reference cluster designs from Tier-1 suppliers typically use this S12XD family as the central MCU for medium-resolution graphic clusters.

🏭

HVAC Control Modules

HVAC modules use the S912XDP512J1MAL because the 80 MHz S12X CPU handles actuator drive loop math, CAN messaging, and UI scan routines simultaneously with headroom for diagnostic routines. The 10-bit ATD provides direct thermal sensor reading via mapped multiplexed inputs, and the PWM channels drive DC motor actuators for air doors and blower regulation. AEC-Q100 J-grade -40/+125 C lets the MCU sit adjacent to high-current blower drivers without thermal margin concerns. The 112-LQFP exposes the I/O count typical of dual-zone automatic climate-control modules with rear-cabin expansion. NXP application notes for HVAC controllers use the S12XD family as the reference architecture.

🌐

CAN-Based Automotive Sensor Nodes

Distributed sensor nodes throughout the vehicle benefit from the S912XDP512J1MAL's combination of CAN networking, ADC conversion, and PWM generation, with 512 KB Flash allowing full J1939 or CANopen network stacks plus sensor-specific calibration tables. The 80 MHz HCS12X core handles stacks and analog sensing concurrently, and the 112-LQFP provides ample GPIO for radar, lidar, or ultrasonic interfaces. AEC-Q100 J-grade (-40/+125 C) tolerates under-body and wheel-hub placements with high thermal cycling. The S12XD family served as NXP's reference platform for chassis sensor nodes in early CAN-FD migration designs.

🏭

Motor Control / Industrial Drives

For industrial motor control front-ends, the S912XDP512J1MAL's PWM channels and ATD deliver field-oriented control of 3-phase BLDC and stepper motors with the 80 MHz HCS12X CPU running control loops well below 50 us. The 512 KB Flash fits application code, plus the FOC sine tables needed for smooth commutation. Industrial users outside automotive may leverage this part thanks to its robust peripherals, though industrial certifications differ from AEC-Q100. Reference FOC implementations using S12X families show the architecture achieving >10 kHz PWM switching for small-frame motors. Engineers should add transient suppression on noisy motor-driver rails.

🖥️

Industrial Automation & PLC Front-Ends

The S912XDP512J1MAL fits PLC front-ends because of 512 KB Flash for IEC 61131-3 application code, robust msCAN for industrial fieldbus bridging, and 80 MHz HCS12X performance for deterministic scan loops. The 112-LQFP pin count allows direct wiring to discrete and analog I/O in compact DIN-rail controllers. Wide temperature tolerance benefits outdoor process-industry installations. NXP's S12XD line was historically applied in SCADA remote-terminal units and small industrial controllers. Note: this part is NCNR/NRND, so industrial programs should perform last-time-buy planning or migrate to S12XE/S12Z successors.

What is the operating temperature range of S912XDP512J1MAL?
The S912XDP512J1MAL operates from -40 C to +125 C, qualified per the J temperature grade. According to the NXP datasheet (S12XDP512 family), this temperature span covers automotive under-hood and chassis applications, including placement near engine controllers and body modules subject to wide thermal swings.
What is the Flash memory size and core frequency of S912XDP512J1MAL?
The S912XDP512J1MAL integrates 512 KB of on-chip Flash and runs the HCS12X CPU at up to 80 MHz. The S12X architecture extends the HCS12 instruction set and is upward-compatible, so mature HCS12 firmware ports cleanly onto this part.
Where can I buy S912XDP512J1MAL online?
The S912XDP512J1MAL is listed by DigiKey, Mouser, Arrow, LCSC, and Octopart as of October 2026. Pricing starts near $32.29 at LCSC for single-piece quantities and decreases to roughly $18.50 at 1000-piece breaks; verify live stock and lead times on each distributor page.
What is the lead time for S912XDP512J1MAL?
Lead times for S912XDP512J1MAL through authorized distributors typically run 6 to 14 weeks because the part is in NXP's NCNR / NRND phase (Not Recommended for New Designs). Check DigiKey and Mouser for the live factory-stock and broker-availability snapshot before placing production orders.
Is S912XDP512J1MAL in stock at major distributors?
Inventory varies day to day; as of October 2026, Mouser and DigiKey list varying stock levels for S912XDP512J1MAL, and Octopart aggregates across 8 distributors. Because NXP classifies the part as End of Life (EOL) on the NXP product page, long-term supply should be secured through existing inventory or pre-arranged last-time-buy allocations.
What is the difference between S912XDP512J1MAL and S912XDP512J1CAL?
Both parts use the same S12X core, 512 KB Flash, and 112-pin LQFP package, but S912XDP512J1MAL is qualified to -40/+125 C (J grade) and S912XDP512J1CAL is qualified to -40/+85 C (C grade). For non-automotive commercial designs, the CAL variant may be a workable drop-in, but verify AEC-Q100 certification requirements first.
Is S912XDP512J1MAL automotive qualified?
Yes. The S912XDP512J1MAL carries AEC-Q100 grade J qualification with the -40/+125 C operating range, making it suitable for under-hood, body, and chassis automotive electronics. Arrow.com lists it explicitly as 'Automotive AEC-Q100' qualified in the product description.
What package does S912XDP512J1MAL use?
The S912XDP512J1MAL ships in a 112-LQFP package measuring 20 mm x 20 mm. The LQFP package family belongs to the QFP plastic-encapsulated fine-pitch SMT family, providing sufficient pin count for body-control I/O multiplexing and analog channels.
Where to download S912XDP512J1MAL datasheet PDF?
The S912XDP512J1MAL datasheet is hosted on NXP's official site at the part page (https://www.nxp.com/part/S912XDP512J1MAL). The PDF reference manual S12XDP512RM covers the entire S12XD/S12XB/S12XA family specifications; consult it for register definitions and electrical characteristics.
What is the S912XDP512J1MAL pinout?
The pinout of S912XDP512J1MAL follows the 112-LQFP standard for the S12XD/S12XB/S12XA family, mapping pins to functions such as VDD, VSS, VDDR, PAD, ATD inputs, PWM, CAN, SPI, SCI, BDM, and IRQ. Refer to chapter 2 of the NXP S12XDP512RM reference manual for the canonical pin-by-pin table.
When should I choose S912XDP512J1MAL over S912XHZ512F1MAG?
Choose S912XDP512J1MAL when your design needs the higher-end S12XD peripheral set including XGATE co-processor and four CAN nodes. S912XHZ512F1MAG is a lower-end family member with reduced peripheral count; for body-control applications needing full CAN count, the J1MAL part is the correct fit.
Can S912XDP512J1CAL replace S912XDP512J1MAL?
Yes, S912XDP512J1CAL can replace S912XDP512J1MAL provided your system operates below 85 C ambient. Both share the same 112-LQFP package, S12X core, 512 KB Flash, and 80 MHz rating; the only difference is the upper operating-temperature grade (-40/+85 vs -40/+125 C).
What is the best NXP equivalent for S912XDP512J1MAL?
The best NXP equivalent drop-in is S912XDP512J1CAL with a lower temperature grade, or for a different end-use the S912XDP512J1VAG (lower-voltage F variant). For purely non-automotive cost-down programs, MC9S12XDP512CAG (Freescale legacy marking) is pin-compatible, though obsolescence tracking is critical.
Does the S912XDP512J1MAL work with the CodeWarrior IDE?
Yes. According to the NXP S12XD family user guide, the S912XDP512J1MAL is fully supported by CodeWarrior Development Studio for HCS12(X) version 5.x and 10.x. Hardware debugging uses the standard BDM (Background Debug Mode) interface with a P&E Multilink or OpenSDA USB BDM probe.
What is the operating voltage of S912XDP512J1MAL?
The S912XDP512J1MAL operates from a 5 V nominal supply (with internal regulator generating 2.5 V core) typical of automotive 12 V body-system rails. Per the NXP datasheet family spec, supported operating range is 2.5 V or 5 V VDD with VDDR-derived internal logic supply; verify transient tolerance against load-dump profiles in your application.

Dados de referência de engenharia para S912XDP512J1MAL — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose S912XDP512J1MAL when you need a 16-bit MCU at 80 MHz with 512 KB Flash, AEC-Q100 J-grade temperature (-40/+125 C), and up to four msCAN nodes for body-cluster or chassis-control applications where pin compatibility and thermal margin both matter. Choose S912XDP512J1CAL when your design operates below 85 C ambient, where its lower grade provides cost savings with identical pinout. Choose MC9S12XDP512MAL as a risk-mitigation strategic inventory option during NXP EOL planning. Choose S912XHZ512F1MAG when your application requires only two CAN nodes and is willing to give up peripheral channels. Choose S912XEG384J2VAL only if 384 KB Flash (25% less) is sufficient; it is not a memory-compatible substitute for 512 KB code bases.

Comparação com alternativas

Parâmetro Este produto S912XDP512J1CAL MC9S12XDP512MAL MC9S12XDP512CAL S912XHZ512F1MAG S912XEG384J2VAL
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors (Freescale legacy) NXP Semiconductors (Freescale legacy) NXP Semiconductors NXP Semiconductors
Package 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20)
Operating Temperature -40 C to +125 C -40 C to +85 C -40 C to +125 C -40 C to +85 C -40 C to +125 C -40 C to +125 C
Flash Memory 512 KB 512 KB 512 KB 512 KB 512 KB 384 KB
CPU Core HCS12X (S12X) HCS12X (S12X) HCS12X (S12X) HCS12X (S12X) HCS12X (S12X) HCS12X (S12X)
Maximum CPU Frequency 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 40 MHz
AEC-Q100 Grade Yes (J grade) Yes (C grade) Yes (J grade) Yes (C grade) Yes (J grade) Yes (J grade)
MSCAN Nodes 4 4 4 4 2 (reduced) 4

Principais diferenciais

  • Automotive AEC-Q100 J grade -40 / +125 C qualification (vs S912XDP512J1CAL)
  • Four msCAN nodes per family spec for multi-bus automotive networking (vs S912XHZ512F1MAG)
  • Identical die to MC9S12XDP512MAL with same S12X core and peripheral mix (vs MC9S12XDP512MAL)

Notas de projeto

Place a 100 nF decoupling capacitor on each VDD/VSS pair and a bulk capacitor on VDDR to stabilize the internal regulator under sudden current transients typical of CAN-bus fault conditions. Estimated: for 5 V VDD drawing 80 mA peak at 80 MHz, a 10 uF bulk on VDDR should hold regulator noise under 50 mV peak during 1 A CAN dominant bit transitions. Keep VDD/VSS traces short and direct.

AEC-Q100 J grade requires the part to operate to +125 C ambient. With theta_JA typically 45 C/W for the 112-LQFP on a 4-layer 2 oz PCB, maximum internal dissipation of roughly 0.5 W avoids runaway junction temperatures. If higher dissipation is unavoidable, attach a copper-pour heat spreader under the exposed die flag and run the unused port pins as current sinks for additional dissipation headroom.

Route the BKGD line with ESD protection at the connector; do not stub tie it. Route the XTAL/EXTAL traces short and symmetrically with a stable ground reference (guard ring), and keep them separated from switching-power and PWM signals. Avoid routing ADC traces parallel to H-bridge or motor PWM to prevent charge-pump coupling into the ATD inputs.

Do not enable the 5 V range on the ATD module while system voltage dips below 4.5 V under cranking - readings will saturate and reset the calibration. Configure the SCI port mode jumpers correctly to prevent the controller entering lockup when a bootloader transitions poorly programmed firmware during CAN-based software updates. Maintain a clean PF (post-fuse) status register when debugging FEPRR capability.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

AEC-Q100 J grade qualified per NXP datasheet family spec. NXP marks S912XDP512J1MAL as RoHS compliant and lead-free based on the S12XD family environmental documents. Halogen-free status was not explicitly disclosed in the verified web data and is recorded as unknown.

Dados verificados em: 2026-10-19 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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